JP2019141141A5 - - Google Patents

Download PDF

Info

Publication number
JP2019141141A5
JP2019141141A5 JP2018025744A JP2018025744A JP2019141141A5 JP 2019141141 A5 JP2019141141 A5 JP 2019141141A5 JP 2018025744 A JP2018025744 A JP 2018025744A JP 2018025744 A JP2018025744 A JP 2018025744A JP 2019141141 A5 JP2019141141 A5 JP 2019141141A5
Authority
JP
Japan
Prior art keywords
electronic components
wiring
connects
layer
interlayer connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018025744A
Other languages
English (en)
Japanese (ja)
Other versions
JP7130319B2 (ja
JP2019141141A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018025744A priority Critical patent/JP7130319B2/ja
Priority claimed from JP2018025744A external-priority patent/JP7130319B2/ja
Publication of JP2019141141A publication Critical patent/JP2019141141A/ja
Publication of JP2019141141A5 publication Critical patent/JP2019141141A5/ja
Application granted granted Critical
Publication of JP7130319B2 publication Critical patent/JP7130319B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018025744A 2018-02-16 2018-02-16 遊技機 Active JP7130319B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018025744A JP7130319B2 (ja) 2018-02-16 2018-02-16 遊技機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018025744A JP7130319B2 (ja) 2018-02-16 2018-02-16 遊技機

Publications (3)

Publication Number Publication Date
JP2019141141A JP2019141141A (ja) 2019-08-29
JP2019141141A5 true JP2019141141A5 (enExample) 2021-10-07
JP7130319B2 JP7130319B2 (ja) 2022-09-05

Family

ID=67771508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018025744A Active JP7130319B2 (ja) 2018-02-16 2018-02-16 遊技機

Country Status (1)

Country Link
JP (1) JP7130319B2 (enExample)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000300813A (ja) 1999-04-22 2000-10-31 Sankyo Kk 遊技機
JP2001113014A (ja) 1999-10-15 2001-04-24 Seiko Epson Corp 遊技機の制御装置
JP2001198326A (ja) 2000-01-24 2001-07-24 Sophia Co Ltd 遊技機
JP2002210179A (ja) 2001-01-19 2002-07-30 Japan Radio Co Ltd 遊技機用（不正防止）端子板及び検査機
JP4053741B2 (ja) 2001-01-19 2008-02-27 日本無線株式会社 遊技機回路基板ユニット、改造検出機、真贋判定機、および遊技機
JP2004237113A (ja) 2004-03-15 2004-08-26 Seiko Epson Corp 遊技機の制御装置
JP2008168161A (ja) 2008-04-04 2008-07-24 Sophia Co Ltd 遊技機
JP2008183465A (ja) 2008-05-07 2008-08-14 Sophia Co Ltd 遊技機
JP2011156342A (ja) 2010-01-06 2011-08-18 Sammy Corp 電子回路基板及び遊技機
JP5701258B2 (ja) 2012-07-18 2015-04-15 株式会社ソフイア 遊技機
JP5555884B2 (ja) 2012-07-18 2014-07-23 株式会社ソフイア 遊技機
JP2013077842A (ja) 2013-01-17 2013-04-25 Dainippon Printing Co Ltd 配線板、配線板の検査方法

Similar Documents

Publication Publication Date Title
US9839128B2 (en) Solder void reduction between electronic packages and printed circuit boards
JP2010510665A (ja) 誘電体層を用いてデバイスをパッケージングする方法
EP2808890A1 (en) Multilayer printed board
JP2014033169A (ja) プリント回路基板の製造方法
WO2009011419A1 (ja) 電子部品実装装置及びその製造方法
JP2010050298A5 (enExample)
JP2016100599A (ja) プリント回路基板、その製造方法、及び電子部品モジュール
CN106358379A (zh) 印刷电路板及其制造方法
JP2016002200A5 (enExample)
WO2016075547A1 (en) Backdrill reliability anchors
JP2016012702A (ja) ソルダコートの濡れ性と耐食性を両立させたプリント基板およびその製造方法
JP2019141140A5 (enExample)
JP2019141141A5 (enExample)
JP6023556B2 (ja) 電気接続箱の接地構造
KR20170022208A (ko) 인쇄회로기판 및 그 제조방법
JP6661681B2 (ja) 回路基板及びその製造方法
JP5999249B2 (ja) フレキシブル多層基板
US9426900B2 (en) Solder void reduction for component attachment to printed circuit boards
JP2019150201A5 (enExample)
JP5418262B2 (ja) 制御基板とこれを用いた多軸用モータ制御装置
JP2009099837A (ja) フレキシブル配線基板
JP2017103278A5 (ja) 電子機器、配線板
JP2013254869A5 (enExample)
JP2012069813A5 (ja) プリント配線板及びプリント回路板
JP5384197B2 (ja) 放熱構造を有するプリント配線板