JP2019134068A - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP2019134068A JP2019134068A JP2018015120A JP2018015120A JP2019134068A JP 2019134068 A JP2019134068 A JP 2019134068A JP 2018015120 A JP2018015120 A JP 2018015120A JP 2018015120 A JP2018015120 A JP 2018015120A JP 2019134068 A JP2019134068 A JP 2019134068A
- Authority
- JP
- Japan
- Prior art keywords
- electrode layer
- electrode
- layer
- main surface
- conductive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 68
- 229920005989 resin Polymers 0.000 claims description 68
- 239000002184 metal Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000003990 capacitor Substances 0.000 description 47
- 229910000679 solder Inorganic materials 0.000 description 16
- 238000007747 plating Methods 0.000 description 13
- 230000007423 decrease Effects 0.000 description 10
- 239000000843 powder Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010953 base metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/252—Terminals the terminals being coated on the capacitive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
Claims (6)
- 直方体形状を呈しており、実装面とされる第一主面と、第一方向で前記第一主面と対向している第二主面と、第二方向で互いに対向している一対の側面と、第三方向で互いに対向している一対の端面と、を有している素体と、
前記第三方向での前記素体の両端部にそれぞれ配置されている外部電極と、を備え、
前記外部電極は、前記第一主面の一部と前記端面の一部と前記一対の側面の各一部とを連続して覆うように形成されている導電性樹脂層を有しており、
前記導電性樹脂層の前記第三方向での長さは、前記導電性樹脂層の前記第一方向での長さより小さい、電子部品。 - 前記外部電極は、前記素体と前記導電性樹脂層との間に位置するように前記素体の前記端部上に配置されている焼結金属層を有し、
前記導電性樹脂層は、前記焼結金属層上と前記第一主面の前記一部上とに配置されており、
前記第三方向での前記導電性樹脂層の前記第一主面上に位置する部分における最大厚み位置から前記導電性樹脂層の端縁までの長さは、前記第三方向での前記導電性樹脂層の前記最大厚み位置から前記焼結金属層の端縁までの長さより大きい、請求項1に記載の電子部品。 - 前記導電性樹脂層の前記第一主面上に位置する前記部分の厚みは、前記最大厚み位置から前記導電性樹脂層の端縁に向けて徐々に小さくなっている、請求項2に記載の電子部品。
- 前記導電性樹脂層の前記第一方向での前記長さは、前記第三方向での前記焼結金属層の前記端縁から前記導電性樹脂層の前記端縁までの長さより大きい、請求項2又は3に記載の電子部品。
- 前記導電性樹脂層の前記端面上に位置する部分の面積は、前記導電性樹脂層の前記第一主面上に位置する部分の面積より大きい、請求項1〜4のいずれか一項に記載の電子部品。
- 前記導電性樹脂層の前記第一主面上に位置する部分の最大厚みは、前記導電性樹脂層の前記端面上に位置する部分の最大厚みより大きい、請求項1〜5のいずれか一項に記載の電子部品。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018015120A JP7040063B2 (ja) | 2018-01-31 | 2018-01-31 | 電子部品 |
US16/250,505 US10971306B2 (en) | 2018-01-31 | 2019-01-17 | Electronic component having an external electrode with a conductive resin layer |
KR1020190011270A KR102420683B1 (ko) | 2018-01-31 | 2019-01-29 | 전자 부품 |
CN201910091123.3A CN110098046B (zh) | 2018-01-31 | 2019-01-30 | 电子部件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018015120A JP7040063B2 (ja) | 2018-01-31 | 2018-01-31 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019134068A true JP2019134068A (ja) | 2019-08-08 |
JP7040063B2 JP7040063B2 (ja) | 2022-03-23 |
Family
ID=67392319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018015120A Active JP7040063B2 (ja) | 2018-01-31 | 2018-01-31 | 電子部品 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10971306B2 (ja) |
JP (1) | JP7040063B2 (ja) |
KR (1) | KR102420683B1 (ja) |
CN (1) | CN110098046B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018056319A1 (ja) | 2016-09-23 | 2018-03-29 | Tdk株式会社 | 電子部品及び電子部品装置 |
JP2020202220A (ja) * | 2019-06-07 | 2020-12-17 | 株式会社村田製作所 | 積層セラミック電子部品 |
JP7358828B2 (ja) * | 2019-08-09 | 2023-10-11 | Tdk株式会社 | 電子部品 |
JP7408975B2 (ja) * | 2019-09-19 | 2024-01-09 | Tdk株式会社 | セラミック電子部品 |
JP2023041357A (ja) * | 2021-09-13 | 2023-03-24 | 太陽誘電株式会社 | 積層セラミック電子部品及び回路基板 |
KR20230089377A (ko) * | 2021-12-13 | 2023-06-20 | 주식회사 아모텍 | 세라믹 커패시터 및 이의 제조방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08203770A (ja) * | 1995-01-27 | 1996-08-09 | Murata Mfg Co Ltd | セラミック電子部品 |
JP2001076957A (ja) * | 1999-09-08 | 2001-03-23 | Murata Mfg Co Ltd | セラミック電子部品 |
JP2010226017A (ja) * | 2009-03-25 | 2010-10-07 | Tdk Corp | 電子部品の製造方法 |
JP2017216288A (ja) * | 2016-05-30 | 2017-12-07 | Tdk株式会社 | 積層コイル部品 |
JP2018088451A (ja) * | 2016-11-28 | 2018-06-07 | 株式会社村田製作所 | 積層セラミックコンデンサ |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3694767A (en) | 1970-09-02 | 1972-09-26 | Bell Telephone Labor Inc | Broad spectrum selenium ion laser |
JP3267067B2 (ja) | 1994-10-06 | 2002-03-18 | 株式会社村田製作所 | セラミック電子部品 |
US5750264A (en) * | 1994-10-19 | 1998-05-12 | Matsushita Electric Industrial Co., Inc. | Electronic component and method for fabricating the same |
JP2008181956A (ja) | 2007-01-23 | 2008-08-07 | Tdk Corp | セラミック電子部品 |
JP5211970B2 (ja) * | 2008-09-17 | 2013-06-12 | 株式会社村田製作所 | セラミック電子部品の製造方法 |
KR101761936B1 (ko) * | 2012-03-13 | 2017-07-26 | 삼성전기주식회사 | 적층 세라믹 전자 부품 |
KR101792268B1 (ko) * | 2012-03-13 | 2017-11-01 | 삼성전기주식회사 | 적층 세라믹 전자 부품 |
KR20140090466A (ko) * | 2013-01-09 | 2014-07-17 | 삼성전기주식회사 | 도전성 수지 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법 |
KR101565639B1 (ko) * | 2013-02-20 | 2015-11-03 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
KR102067175B1 (ko) * | 2013-09-17 | 2020-01-15 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조방법 |
JP2015109411A (ja) * | 2013-10-25 | 2015-06-11 | 株式会社村田製作所 | セラミック電子部品 |
JP2015053495A (ja) * | 2014-10-07 | 2015-03-19 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
KR102150558B1 (ko) | 2015-05-29 | 2020-09-01 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 제조 방법 |
KR102212641B1 (ko) | 2015-11-26 | 2021-02-05 | 삼성전기주식회사 | 커패시터 및 그 제조방법 |
JP6693125B2 (ja) | 2015-12-28 | 2020-05-13 | Tdk株式会社 | 電子部品 |
JP2018014447A (ja) * | 2016-07-22 | 2018-01-25 | 株式会社村田製作所 | 積層セラミック電子部品 |
JP2018041761A (ja) * | 2016-09-05 | 2018-03-15 | 株式会社村田製作所 | チップ状電子部品 |
-
2018
- 2018-01-31 JP JP2018015120A patent/JP7040063B2/ja active Active
-
2019
- 2019-01-17 US US16/250,505 patent/US10971306B2/en active Active
- 2019-01-29 KR KR1020190011270A patent/KR102420683B1/ko active IP Right Grant
- 2019-01-30 CN CN201910091123.3A patent/CN110098046B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08203770A (ja) * | 1995-01-27 | 1996-08-09 | Murata Mfg Co Ltd | セラミック電子部品 |
JP2001076957A (ja) * | 1999-09-08 | 2001-03-23 | Murata Mfg Co Ltd | セラミック電子部品 |
JP2010226017A (ja) * | 2009-03-25 | 2010-10-07 | Tdk Corp | 電子部品の製造方法 |
JP2017216288A (ja) * | 2016-05-30 | 2017-12-07 | Tdk株式会社 | 積層コイル部品 |
JP2018088451A (ja) * | 2016-11-28 | 2018-06-07 | 株式会社村田製作所 | 積層セラミックコンデンサ |
Also Published As
Publication number | Publication date |
---|---|
JP7040063B2 (ja) | 2022-03-23 |
KR20190093149A (ko) | 2019-08-08 |
CN110098046A (zh) | 2019-08-06 |
KR102420683B1 (ko) | 2022-07-15 |
US10971306B2 (en) | 2021-04-06 |
CN110098046B (zh) | 2022-02-22 |
US20190237250A1 (en) | 2019-08-01 |
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