JP2019133785A5 - - Google Patents

Download PDF

Info

Publication number
JP2019133785A5
JP2019133785A5 JP2018013338A JP2018013338A JP2019133785A5 JP 2019133785 A5 JP2019133785 A5 JP 2019133785A5 JP 2018013338 A JP2018013338 A JP 2018013338A JP 2018013338 A JP2018013338 A JP 2018013338A JP 2019133785 A5 JP2019133785 A5 JP 2019133785A5
Authority
JP
Japan
Prior art keywords
data
processing apparatus
plasma processing
plasma
prediction device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018013338A
Other languages
English (en)
Japanese (ja)
Other versions
JP6914211B2 (ja
JP2019133785A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018013338A priority Critical patent/JP6914211B2/ja
Priority claimed from JP2018013338A external-priority patent/JP6914211B2/ja
Priority to KR1020180083771A priority patent/KR102101222B1/ko
Priority to TW107127537A priority patent/TWI684843B/zh
Priority to US16/123,176 priority patent/US11107664B2/en
Publication of JP2019133785A publication Critical patent/JP2019133785A/ja
Publication of JP2019133785A5 publication Critical patent/JP2019133785A5/ja
Application granted granted Critical
Publication of JP6914211B2 publication Critical patent/JP6914211B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018013338A 2018-01-30 2018-01-30 プラズマ処理装置及び状態予測装置 Active JP6914211B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018013338A JP6914211B2 (ja) 2018-01-30 2018-01-30 プラズマ処理装置及び状態予測装置
KR1020180083771A KR102101222B1 (ko) 2018-01-30 2018-07-19 플라스마 처리 장치 및 상태 예측 장치
TW107127537A TWI684843B (zh) 2018-01-30 2018-08-08 電漿處理裝置及狀態預測裝置
US16/123,176 US11107664B2 (en) 2018-01-30 2018-09-06 Plasma processing apparatus and prediction apparatus of the condition of plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018013338A JP6914211B2 (ja) 2018-01-30 2018-01-30 プラズマ処理装置及び状態予測装置

Publications (3)

Publication Number Publication Date
JP2019133785A JP2019133785A (ja) 2019-08-08
JP2019133785A5 true JP2019133785A5 (https=) 2020-05-28
JP6914211B2 JP6914211B2 (ja) 2021-08-04

Family

ID=67392349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018013338A Active JP6914211B2 (ja) 2018-01-30 2018-01-30 プラズマ処理装置及び状態予測装置

Country Status (4)

Country Link
US (1) US11107664B2 (https=)
JP (1) JP6914211B2 (https=)
KR (1) KR102101222B1 (https=)
TW (1) TWI684843B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113454766B (zh) 2018-12-10 2024-07-19 朗姆研究公司 低温铜-铜直接接合
KR102791775B1 (ko) 2019-05-07 2025-04-03 램 리써치 코포레이션 폐루프 다중 출력 rf 매칭
CN112424911B (zh) * 2019-06-20 2023-09-22 株式会社日立高新技术 等离子体处理装置以及等离子体处理方法
WO2021022303A1 (en) 2019-07-31 2021-02-04 Lam Research Corporation Radio frequency power generator having multiple output ports
WO2021065295A1 (ja) * 2019-09-30 2021-04-08 パナソニックＩｐマネジメント株式会社 プラズマ処理の異常判定システムおよび異常判定方法
JP7569858B2 (ja) 2019-12-02 2024-10-18 ラム リサーチ コーポレーション 無線周波数支援プラズマ生成におけるインピーダンス変換
JP2021144832A (ja) * 2020-03-11 2021-09-24 東京エレクトロン株式会社 プラズマ計測装置、及びプラズマ計測方法
US11994542B2 (en) * 2020-03-27 2024-05-28 Lam Research Corporation RF signal parameter measurement in an integrated circuit fabrication chamber
WO2021252353A1 (en) 2020-06-12 2021-12-16 Lam Research Corporation Control of plasma formation by rf coupling structures
US11784028B2 (en) 2020-12-24 2023-10-10 Applied Materials, Inc. Performing radio frequency matching control using a model-based digital twin
US20240096599A1 (en) * 2021-02-08 2024-03-21 Hitachi High-Tech Corporation Plasma processing device
JP7710398B2 (ja) * 2022-03-17 2025-07-18 東京エレクトロン株式会社 予測方法及び情報処理装置
TW202406412A (zh) * 2022-07-15 2024-02-01 日商東京威力科創股份有限公司 電漿處理系統、支援裝置、支援方法及支援程式
JP2024016522A (ja) * 2022-07-26 2024-02-07 パナソニックＩｐマネジメント株式会社 プラズマ処理装置およびプラズマ処理方法
JP2025066441A (ja) * 2023-10-11 2025-04-23 東京エレクトロン株式会社 プラズマ処理装置およびシャワーヘッド

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU87812A1 (fr) 1990-09-26 1992-05-25 Arbed Dispositif de manutention automatique d'objets
US6151532A (en) * 1998-03-03 2000-11-21 Lam Research Corporation Method and apparatus for predicting plasma-process surface profiles
TW508693B (en) * 1999-08-31 2002-11-01 Tokyo Electron Limted Plasma treating apparatus and plasma treating method
TW492106B (en) * 2000-06-20 2002-06-21 Hitachi Ltd Inspection method for thickness of film to be processed using luminous beam-splitter and method of film processing
JP4570736B2 (ja) * 2000-07-04 2010-10-27 東京エレクトロン株式会社 運転状態の監視方法
TW499702B (en) 2000-07-04 2002-08-21 Tokyo Electron Ltd Method for monitoring operation of processing apparatus
TW529085B (en) * 2000-09-22 2003-04-21 Alps Electric Co Ltd Method for evaluating performance of plasma treatment apparatus or performance confirming system of plasma treatment system
US6908529B2 (en) * 2002-03-05 2005-06-21 Hitachi High-Technologies Corporation Plasma processing apparatus and method
US7557591B2 (en) * 2002-03-28 2009-07-07 Tokyo Electron Limited System and method for determining the state of a film in a plasma reactor using an electrical property
JP2004039952A (ja) * 2002-07-05 2004-02-05 Tokyo Electron Ltd プラズマ処理装置の監視方法およびプラズマ処理装置
WO2004019396A1 (ja) 2002-08-13 2004-03-04 Tokyo Electron Limited プラズマ処理方法及びプラズマ処理装置
JP2004349419A (ja) * 2003-05-21 2004-12-09 Tokyo Electron Ltd プラズマ処理装置の異常原因判定方法及び異常原因判定装置
JP4448335B2 (ja) * 2004-01-08 2010-04-07 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
CN102156443B (zh) * 2011-03-17 2012-06-27 浙江大学 一种等离子体裂解煤工艺过程的三维可视化数据监控方法
TWI604495B (zh) * 2014-12-26 2017-11-01 Ａ Ｓａｔ股份有限公司 Measurement of the gas inlet hole provided on the electrode of the plasma etching apparatus Method, electrode and plasma etching apparatus
JP6328071B2 (ja) 2015-03-31 2018-05-23 東芝メモリ株式会社 異常予兆検知システム及び半導体デバイスの製造方法
CN106298502B (zh) * 2015-05-18 2019-04-09 中微半导体设备(上海)股份有限公司 一种利用等离子体对多层材料刻蚀的方法
JP6446334B2 (ja) * 2015-06-12 2018-12-26 東京エレクトロン株式会社 プラズマ処理装置、プラズマ処理装置の制御方法及び記憶媒体

Similar Documents

Publication Publication Date Title
JP2019133785A5 (https=)
Hu et al. On the risks of using double precision in numerical simulations of spatio-temporal chaos
Wen et al. Degradation modeling and RUL prediction using Wiener process subject to multiple change points and unit heterogeneity
CN109697207B (zh) 时序数据的异常监控方法及系统
JP2016191719A5 (https=)
JP6777069B2 (ja) 情報処理装置、情報処理方法、及び、プログラム
SG11202005823VA (en) Abnormal sample prediction method and apparatus
TW201129936A (en) Methods and apparatus to predict etch rate uniformity for qualification of a plasma chamber
Zhou et al. Semi-supervised PLVR models for process monitoring with unequal sample sizes of process variables and quality variables
EP3777083A1 (en) Anomaly detection and processing for seasonal data
JP6620290B2 (ja) 振動音響解析方法及び装置と機器異常部位推定方法及び装置
EP2880578A2 (en) Estimating remaining useful life from prognostic features discovered using genetic programming
US20190198405A1 (en) Statistical framework for tool chamber matching in semiconductor manufacturing processes
EP3989499A4 (en) SYMBOL PROCESSING METHOD AND APPARATUS
ATE525703T1 (de) Bildverarbeitungsvorrichtung und bildverarbeitungsverfahren
JP2018022216A5 (https=)
EP4538894A4 (en) OPERATION PREDICTION METHOD AND ASSOCIATED APPARATUS
CN107015875A (zh) 一种电子整机贮存寿命评估方法及装置
JP2015191521A5 (https=)
JP2016099938A5 (https=)
JP2015130494A5 (https=)
CN106575118A (zh) 过程工厂中一致的稳定状态行为的检测
Manghi et al. Generalized additive partial linear models for analyzing correlated data
CN108020761B (zh) 一种局部放电去噪方法
TWI682456B (zh) 電漿處理裝置及解析電漿處理資料的解析方法