JP6914211B2 - プラズマ処理装置及び状態予測装置 - Google Patents

プラズマ処理装置及び状態予測装置 Download PDF

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Publication number
JP6914211B2
JP6914211B2 JP2018013338A JP2018013338A JP6914211B2 JP 6914211 B2 JP6914211 B2 JP 6914211B2 JP 2018013338 A JP2018013338 A JP 2018013338A JP 2018013338 A JP2018013338 A JP 2018013338A JP 6914211 B2 JP6914211 B2 JP 6914211B2
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data
plasma processing
plasma
processing apparatus
principal component
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Japanese (ja)
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JP2019133785A5 (https=
JP2019133785A (ja
Inventor
義人 釜地
義人 釜地
角屋　誠浩
誠浩 角屋
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Hitachi High Tech Corp
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Hitachi High Tech Corp
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Priority to JP2018013338A priority Critical patent/JP6914211B2/ja
Priority to KR1020180083771A priority patent/KR102101222B1/ko
Priority to TW107127537A priority patent/TWI684843B/zh
Priority to US16/123,176 priority patent/US11107664B2/en
Publication of JP2019133785A publication Critical patent/JP2019133785A/ja
Publication of JP2019133785A5 publication Critical patent/JP2019133785A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0283—Predictive maintenance, e.g. involving the monitoring of a system and, based on the monitoring results, taking decisions on the maintenance schedule of the monitored system; Estimating remaining useful life [RUL]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
JP2018013338A 2018-01-30 2018-01-30 プラズマ処理装置及び状態予測装置 Active JP6914211B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018013338A JP6914211B2 (ja) 2018-01-30 2018-01-30 プラズマ処理装置及び状態予測装置
KR1020180083771A KR102101222B1 (ko) 2018-01-30 2018-07-19 플라스마 처리 장치 및 상태 예측 장치
TW107127537A TWI684843B (zh) 2018-01-30 2018-08-08 電漿處理裝置及狀態預測裝置
US16/123,176 US11107664B2 (en) 2018-01-30 2018-09-06 Plasma processing apparatus and prediction apparatus of the condition of plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018013338A JP6914211B2 (ja) 2018-01-30 2018-01-30 プラズマ処理装置及び状態予測装置

Publications (3)

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JP2019133785A JP2019133785A (ja) 2019-08-08
JP2019133785A5 JP2019133785A5 (https=) 2020-05-28
JP6914211B2 true JP6914211B2 (ja) 2021-08-04

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JP2018013338A Active JP6914211B2 (ja) 2018-01-30 2018-01-30 プラズマ処理装置及び状態予測装置

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US (1) US11107664B2 (https=)
JP (1) JP6914211B2 (https=)
KR (1) KR102101222B1 (https=)
TW (1) TWI684843B (https=)

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Publication number Priority date Publication date Assignee Title
CN113454766B (zh) 2018-12-10 2024-07-19 朗姆研究公司 低温铜-铜直接接合
KR102791775B1 (ko) 2019-05-07 2025-04-03 램 리써치 코포레이션 폐루프 다중 출력 rf 매칭
CN112424911B (zh) * 2019-06-20 2023-09-22 株式会社日立高新技术 等离子体处理装置以及等离子体处理方法
WO2021022303A1 (en) 2019-07-31 2021-02-04 Lam Research Corporation Radio frequency power generator having multiple output ports
WO2021065295A1 (ja) * 2019-09-30 2021-04-08 パナソニックＩｐマネジメント株式会社 プラズマ処理の異常判定システムおよび異常判定方法
JP7569858B2 (ja) 2019-12-02 2024-10-18 ラム リサーチ コーポレーション 無線周波数支援プラズマ生成におけるインピーダンス変換
JP2021144832A (ja) * 2020-03-11 2021-09-24 東京エレクトロン株式会社 プラズマ計測装置、及びプラズマ計測方法
US11994542B2 (en) * 2020-03-27 2024-05-28 Lam Research Corporation RF signal parameter measurement in an integrated circuit fabrication chamber
WO2021252353A1 (en) 2020-06-12 2021-12-16 Lam Research Corporation Control of plasma formation by rf coupling structures
US11784028B2 (en) 2020-12-24 2023-10-10 Applied Materials, Inc. Performing radio frequency matching control using a model-based digital twin
US20240096599A1 (en) * 2021-02-08 2024-03-21 Hitachi High-Tech Corporation Plasma processing device
JP7710398B2 (ja) * 2022-03-17 2025-07-18 東京エレクトロン株式会社 予測方法及び情報処理装置
TW202406412A (zh) * 2022-07-15 2024-02-01 日商東京威力科創股份有限公司 電漿處理系統、支援裝置、支援方法及支援程式
JP2024016522A (ja) * 2022-07-26 2024-02-07 パナソニックＩｐマネジメント株式会社 プラズマ処理装置およびプラズマ処理方法
JP2025066441A (ja) * 2023-10-11 2025-04-23 東京エレクトロン株式会社 プラズマ処理装置およびシャワーヘッド

Family Cites Families (18)

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LU87812A1 (fr) 1990-09-26 1992-05-25 Arbed Dispositif de manutention automatique d'objets
US6151532A (en) * 1998-03-03 2000-11-21 Lam Research Corporation Method and apparatus for predicting plasma-process surface profiles
TW508693B (en) * 1999-08-31 2002-11-01 Tokyo Electron Limted Plasma treating apparatus and plasma treating method
TW492106B (en) * 2000-06-20 2002-06-21 Hitachi Ltd Inspection method for thickness of film to be processed using luminous beam-splitter and method of film processing
JP4570736B2 (ja) * 2000-07-04 2010-10-27 東京エレクトロン株式会社 運転状態の監視方法
TW499702B (en) 2000-07-04 2002-08-21 Tokyo Electron Ltd Method for monitoring operation of processing apparatus
TW529085B (en) * 2000-09-22 2003-04-21 Alps Electric Co Ltd Method for evaluating performance of plasma treatment apparatus or performance confirming system of plasma treatment system
US6908529B2 (en) * 2002-03-05 2005-06-21 Hitachi High-Technologies Corporation Plasma processing apparatus and method
US7557591B2 (en) * 2002-03-28 2009-07-07 Tokyo Electron Limited System and method for determining the state of a film in a plasma reactor using an electrical property
JP2004039952A (ja) * 2002-07-05 2004-02-05 Tokyo Electron Ltd プラズマ処理装置の監視方法およびプラズマ処理装置
WO2004019396A1 (ja) 2002-08-13 2004-03-04 Tokyo Electron Limited プラズマ処理方法及びプラズマ処理装置
JP2004349419A (ja) * 2003-05-21 2004-12-09 Tokyo Electron Ltd プラズマ処理装置の異常原因判定方法及び異常原因判定装置
JP4448335B2 (ja) * 2004-01-08 2010-04-07 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
CN102156443B (zh) * 2011-03-17 2012-06-27 浙江大学 一种等离子体裂解煤工艺过程的三维可视化数据监控方法
TWI604495B (zh) * 2014-12-26 2017-11-01 Ａ Ｓａｔ股份有限公司 Measurement of the gas inlet hole provided on the electrode of the plasma etching apparatus Method, electrode and plasma etching apparatus
JP6328071B2 (ja) 2015-03-31 2018-05-23 東芝メモリ株式会社 異常予兆検知システム及び半導体デバイスの製造方法
CN106298502B (zh) * 2015-05-18 2019-04-09 中微半导体设备(上海)股份有限公司 一种利用等离子体对多层材料刻蚀的方法
JP6446334B2 (ja) * 2015-06-12 2018-12-26 東京エレクトロン株式会社 プラズマ処理装置、プラズマ処理装置の制御方法及び記憶媒体

Also Published As

Publication number Publication date
US20190237309A1 (en) 2019-08-01
TW201933016A (zh) 2019-08-16
TWI684843B (zh) 2020-02-11
US11107664B2 (en) 2021-08-31
JP2019133785A (ja) 2019-08-08
KR102101222B1 (ko) 2020-04-17
KR20190092218A (ko) 2019-08-07

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