JP2019130765A - 圧電デバイス、液体噴射ヘッド、および、液体噴射装置 - Google Patents
圧電デバイス、液体噴射ヘッド、および、液体噴射装置 Download PDFInfo
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- JP2019130765A JP2019130765A JP2018014564A JP2018014564A JP2019130765A JP 2019130765 A JP2019130765 A JP 2019130765A JP 2018014564 A JP2018014564 A JP 2018014564A JP 2018014564 A JP2018014564 A JP 2018014564A JP 2019130765 A JP2019130765 A JP 2019130765A
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- zirconium oxide
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Abstract
Description
図1は、本発明の実施形態1に係る液体噴射ヘッドであるインクジェット式記録ヘッドの分解斜視図であり、図2は、記録ヘッドの流路形成基板の平面図であり、図3は、図2のA−A′線断面図であり、図4は、図3の要部を拡大した図であり、図5は、図2のB−B′線断面図である。
第1マニホールド部17は、連通板15を第3の方向Zに貫通して設けられている。
第2マニホールド部18は、連通板15を第3の方向Zに貫通することなく、連通板15のノズルプレート20側に開口して設けられている。
図6は、本発明の実施形態2に係る液体噴射ヘッドの一例であるインクジェット式記録ヘッドの要部断面図であって、図2のB−B′線に準じた断面図である。なお、上述した実施形態と同様の部材には同一の符号を付して重複する説明は省略する。
図7は、本発明の実施形態3に係る液体噴射ヘッドの一例であるインクジェット式記録ヘッドの要部断面図であって、図2のB−B′線に準じた断面図である。なお、上述した実施形態と同様の部材には同一の符号を付して重複する説明は省略する。
図8は、本発明の実施形態4に係る液体噴射ヘッドの一例であるインクジェット式記録ヘッドの要部断面図であって、図2のB−B′線に準じた断面図である。なお、上述した実施形態と同様の部材には同一の符号を付して重複する説明は省略する。
図9は、本発明の実施形態5に係る液体噴射ヘッドの一例であるインクジェット式記録ヘッドの要部断面図であって、図2のB−B′線に準じた断面図である。なお、上述した実施形態と同様の部材には同一の符号を付して重複する説明は省略する。
図10は、本発明の実施形態6に係る液体噴射ヘッドの一例であるインクジェット式記録ヘッドの要部断面図であって、図2のB−B′線に準じた断面図である。なお、上述した実施形態と同様の部材には同一の符号を付して重複する説明は省略する。
図11は、本発明の実施形態7に係る液体噴射ヘッドの一例であるインクジェット式記録ヘッドの要部断面図であって、図2のB−B′線に準じた断面図である。なお、上述した実施形態と同様の部材には同一の符号を付して重複する説明は省略する。
以上、本発明の各実施形態について説明したが、本発明の基本的な構成は上述したものに限定されるものではない。
Claims (12)
- 複数の第1凹部が形成された基板と、
前記基板の一方面側に設けられた振動板と、
前記基板の一方面側に前記振動板を介して設けられた第1電極、
前記第1電極上に設けられた圧電体層、
前記圧電体層上に設けられた第2電極を有する圧電素子と、
を具備し、
前記圧電素子には、前記圧電体層の前記第1電極と前記第2電極とで挟まれた活性部が前記第1凹部毎に独立して設けられており、
前記第1電極は、前記活性部の各々に独立して設けられた個別電極を構成し、
前記第2電極は、複数の前記活性部に共通して設けられた共通電極を構成し、
前記圧電体層には、前記活性部の外側に設けられて前記基板とは反対側に開口する第2凹部が設けられており、
前記基板と前記圧電素子との積層方向において、前記振動板は、少なくとも前記第2凹部の底面に重なる領域の前記第2電極側の最上層に窒化膜を有することを特徴とする圧電デバイス。 - 前記振動板は、前記積層方向において、前記圧電体層が形成される領域に重なる領域のうち、前記第2凹部の底面に重ならない領域であって、少なくとも前記活性部と重なる領域に、酸化ジルコニウムを含む酸化ジルコニウム膜を有し、
前記酸化ジルコニウム膜は、前記窒化膜よりも前記圧電体層側に設けられていることを特徴とする請求項1記載の圧電デバイス。 - 前記第2凹部の内面上には、前記第2電極が形成されていることを特徴とする請求項2記載の圧電デバイス。
- 前記酸化ジルコニウム膜は、前記活性部と前記第2凹部の底面との間に重なる領域に、前記第2凹部の側面上に形成された前記第2電極と接触することなく延設されていることを特徴とする請求項3記載の圧電デバイス。
- 前記酸化ジルコニウム膜は、前記積層方向において、前記活性部に重なる領域のみに設けられていることを特徴とする請求項2記載の圧電デバイス。
- 複数の前記活性部が第1の方向に並設され、
前記活性部の前記第1の方向の両側に前記第2凹部が設けられていることを特徴とする請求項1〜5の何れか一項に記載の圧電デバイス。 - 前記積層方向において、前記第2凹部と前記第1凹部とは、少なくとも一部が重なる位置に配置されていることを特徴とする請求項1〜6の何れか一項に記載の圧電デバイス。
- 前記第2凹部は、前記圧電体層を前記積層方向に貫通して設けられていることを特徴とする請求項1〜7の何れか一項に記載の圧電デバイス。
- 前記振動板は、前記基板側に酸化シリコンを含む酸化膜を有することを特徴とする請求項1〜8の何れか一項に記載の圧電デバイス。
- 前記酸化膜は、前記第1凹部に連通する開口部を有することを特徴とする請求項9記載の圧電デバイス。
- 請求項1〜10の何れか一項に記載の圧電デバイスを具備することを特徴とする液体噴射ヘッド。
- 請求項11記載の液体噴射ヘッドを具備することを特徴とする液体噴射装置。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002370354A (ja) * | 1992-04-23 | 2002-12-24 | Seiko Epson Corp | 液体噴射ヘッド |
JP2005129670A (ja) * | 2003-10-23 | 2005-05-19 | Canon Inc | ユニモルフ型圧電膜素子とその作製方法及びユニモルフ型インクジェットヘッド |
US20120162320A1 (en) * | 2010-12-28 | 2012-06-28 | Seiko Epson Corporation | Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus |
JP2014176985A (ja) * | 2013-03-13 | 2014-09-25 | Seiko Epson Corp | 液体噴射ヘッド、液体噴射装置、圧電素子、超音波トランスデューサー及び超音波デバイス |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3379106B2 (ja) * | 1992-04-23 | 2003-02-17 | セイコーエプソン株式会社 | 液体噴射ヘッド |
EP0800920B1 (en) * | 1996-04-10 | 2002-02-06 | Seiko Epson Corporation | Ink jet recording head |
US6336717B1 (en) * | 1998-06-08 | 2002-01-08 | Seiko Epson Corporation | Ink jet recording head and ink jet recording apparatus |
ATE483586T1 (de) * | 1999-08-04 | 2010-10-15 | Seiko Epson Corp | Tintenstrahlaufzeichnungskopf, verfahren zur herstellung und vorrichtung zum tintenstrahlaufzeichnen |
JP3812658B2 (ja) * | 2002-03-15 | 2006-08-23 | セイコーエプソン株式会社 | インクジェット式記録ヘッド及びその製造方法並びにインクジェット式記録装置 |
JP4337096B2 (ja) | 2004-03-23 | 2009-09-30 | セイコーエプソン株式会社 | 圧電アクチュエータ及びこれを備えた液体噴射装置並びに圧電アクチュエータの製造方法 |
JP4847039B2 (ja) * | 2004-05-28 | 2011-12-28 | 日本碍子株式会社 | 圧電/電歪構造体及び圧電/電歪構造体の製造方法 |
JP2008066623A (ja) | 2006-09-11 | 2008-03-21 | Matsushita Electric Ind Co Ltd | 圧電体素子、インクジェットヘッド、およびインクジェット式記録装置 |
US20080024563A1 (en) | 2006-07-25 | 2008-01-31 | Matsushita Electric Industrial Co., Ltd. | Piezoelectric thin film element, ink jet head, and ink jet type recording apparatus |
JP5278654B2 (ja) * | 2008-01-24 | 2013-09-04 | セイコーエプソン株式会社 | 液体噴射ヘッド及び液体噴射装置 |
JP2009214522A (ja) | 2008-03-13 | 2009-09-24 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射ヘッドの製造方法並びに液体噴射装置 |
JP5305017B2 (ja) | 2009-03-26 | 2013-10-02 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置及びアクチュエーター装置 |
JP2012059770A (ja) * | 2010-09-06 | 2012-03-22 | Seiko Epson Corp | 圧電素子、液滴噴射ヘッドおよび液滴噴射装置ならびにそれらの製造方法 |
JP2013201198A (ja) * | 2012-03-23 | 2013-10-03 | Ricoh Co Ltd | 電気機械変換素子及びその製造方法、圧電型アクチュエータ、液滴吐出ヘッド、インクジェット記録装置 |
US10032977B2 (en) * | 2014-08-05 | 2018-07-24 | Rohm Co., Ltd. | Device using a piezoelectric element and method for manufacturing the same |
US9553251B2 (en) * | 2014-10-10 | 2017-01-24 | Seiko Epson Corporation | Piezoelectric device, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of piezoelectric device |
JP6551773B2 (ja) | 2015-02-16 | 2019-07-31 | 株式会社リコー | 液滴吐出ヘッドおよび画像形成装置 |
JP2017052254A (ja) * | 2015-09-11 | 2017-03-16 | セイコーエプソン株式会社 | 圧電デバイス、液体噴射ヘッド、液体噴射装置及び圧電デバイスの製造方法 |
JP6582803B2 (ja) * | 2015-09-25 | 2019-10-02 | セイコーエプソン株式会社 | 電子デバイス、液体吐出ヘッド、および、電子デバイスの製造方法 |
JP6948763B2 (ja) * | 2015-12-21 | 2021-10-13 | セイコーエプソン株式会社 | 圧電素子応用デバイス |
-
2018
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- 2019-01-30 EP EP19154429.5A patent/EP3521037A1/en not_active Withdrawn
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002370354A (ja) * | 1992-04-23 | 2002-12-24 | Seiko Epson Corp | 液体噴射ヘッド |
JP2005129670A (ja) * | 2003-10-23 | 2005-05-19 | Canon Inc | ユニモルフ型圧電膜素子とその作製方法及びユニモルフ型インクジェットヘッド |
US20120162320A1 (en) * | 2010-12-28 | 2012-06-28 | Seiko Epson Corporation | Piezoelectric element, liquid ejecting head, and liquid ejecting apparatus |
JP2014176985A (ja) * | 2013-03-13 | 2014-09-25 | Seiko Epson Corp | 液体噴射ヘッド、液体噴射装置、圧電素子、超音波トランスデューサー及び超音波デバイス |
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