JP2019127434A - 懸架する二次元ナノ材料の製造方法 - Google Patents
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- 239000002086 nanomaterial Substances 0.000 title claims abstract description 129
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000002238 carbon nanotube film Substances 0.000 claims abstract description 175
- 239000000758 substrate Substances 0.000 claims abstract description 110
- 239000002131 composite material Substances 0.000 claims abstract description 30
- 238000004140 cleaning Methods 0.000 claims abstract description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 62
- 239000002041 carbon nanotube Substances 0.000 claims description 48
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 48
- 229920000642 polymer Polymers 0.000 claims description 35
- 229920006254 polymer film Polymers 0.000 claims description 34
- 210000000707 wrist Anatomy 0.000 claims description 18
- 238000004132 cross linking Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 27
- 238000005260 corrosion Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 5
- 238000005304 joining Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 96
- 239000000243 solution Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 15
- 229910021389 graphene Inorganic materials 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 8
- 229910021426 porous silicon Inorganic materials 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 238000003917 TEM image Methods 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 2
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 239000002048 multi walled nanotube Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 238000000879 optical micrograph Methods 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- -1 polymethylsiloxane Polymers 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
- B32B37/025—Transfer laminating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
- B81C1/00373—Selective deposition, e.g. printing or microcontact printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0042—Assembling discrete nanostructures into nanostructural devices
- B82B3/0047—Bonding two or more elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B3/0061—Methods for manipulating nanostructures
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- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
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- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/0183—Selective deposition
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Abstract
【解決手段】S1:第一基板101の表面に二次元ナノ材料層102を形成する。S2:カーボンナノチューブフィルム構造体103で二次元ナノ材料層102を覆う。S3:腐食溶液で第一基板101を除去し、二次元ナノ材料層102及びカーボンナノチューブフィルム構造体103からなる二次元ナノ材料層/カーボンナノチューブフィルム構造体の複合構造体を獲得し、洗浄液に置き、洗浄する。S4:少なくとも一つのスルーホール105を有するターゲット基板104を提供し、洗浄液から複合構造体を掬い上げ、二次元ナノ材料層102をターゲット基板104と接合させ、ターゲット基板104の少なくとも一つのスルーホール105を覆う。S5:カーボンナノチューブフィルム構造体103を除去し、二次元ナノ材料層102がターゲット基板104の表面に転写されてスルーホール105の位置に懸架される。
【選択図】図1
Description
102 二次元ナノ材料層
103 カーボンナノチューブフィルム構造体
104 ターゲット基板
105 スルーホール
Claims (4)
- 第一基板を提供して、前記第一基板の表面に二次元ナノ材料層が形成されるステップと、
カーボンナノチューブフィルム構造体で前記二次元ナノ材料層を覆うステップと、
腐食溶液で前記第一基板を除去し、前記二次元ナノ材料層及び前記カーボンナノチューブフィルム構造体からなる二次元ナノ材料層/カーボンナノチューブフィルム構造体の複合構造体を獲得し、前記二次元ナノ材料層/カーボンナノチューブフィルム構造体の複合構造体を洗浄液に置き、洗浄するステップと、
少なくとも一つのスルーホールを有するターゲット基板を提供し、前記ターゲット基板を利用し、洗浄液から前記二次元ナノ材料層/カーボンナノチューブフィルム構造体の複合構造体を掬い上げ、前記二次元ナノ材料層を前記ターゲット基板と接合させ、前記ターゲット基板の少なくとも一つのスルーホールを覆わせるステップと、
前記カーボンナノチューブフィルム構造体を除去し、前記二次元ナノ材料層が前記ターゲット基板の表面に転写されてスルーホールの位置に懸架されるステップと、
を含むことを特徴とする懸架する二次元ナノ材料の製造方法。 - 前記カーボンナノチューブフィルム構造体は、自立構造であり、積層して設置された少なくとも二層のカーボンナノチューブフィルムからなって、前記カーボンナノチューブフィルムは、分子間力で端と端とが接続され、基本的に同一方向に沿って配列されている複数のカーボンナノチューブを含み、複数のカーボンナノチューブの配列方向が前記カーボンナノチューブフィルムの表面に基本的に平行であり、隣接するカーボンナノチューブフィルムにおけるカーボンナノチューブの配列方向が互いに交差し、角度αを形成して、角度αが0°より大きく、且つ90°以下であることを特徴とする、請求項1に記載の懸架する二次元ナノ材料の製造方法。
- 前記カーボンナノチューブフィルム構造体を除去し、前記二次元ナノ材料層が前記ターゲット基板の表面に転写されてスルーホールの位置に懸架されるステップは、
前記カーボンナノチューブフィルム構造体の前記ターゲット基板から離れた表面に、高分子のポリマーフィルムを形成するステップ(1)と、
前記高分子のポリマーフィルムを加熱し、該高分子のポリマーフィルムの内部の架橋度を高くするステップ(2)と、
前記高分子のポリマーフィルムを引き剥がして、前記カーボンナノチューブフィルム構造体が前記高分子のポリマーフィルムと共に引き剥がされるステップ(3)と、
を含むことを特徴とする、請求項1に記載の懸架する二次元ナノ材料の製造方法。 - 前記カーボンナノチューブフィルム構造体を除去し、前記二次元ナノ材料層が前記ターゲット基板の表面に転写されてスルーホールの位置に懸架されるステップは、
前記カーボンナノチューブフィルム構造体が、互いに積層されたn層のカーボンナノチューブフィルムからなる場合には、ピンセットのような工具で、前記カーボンナノチューブフィルム構造体におけるカーボンナノチューブの配列方向に沿って、前記カーボンナノチューブフィルム構造体の第一層のカーボンナノチューブフィルム〜第n−1層のカーボンナノチューブフィルムを順に引き剥がすステップ(A)と、
少なくとも一つのリスト構造を提供して、該リスト構造を第n層のカーボンナノチューブフィルムの表面に設置して、前記リスト構造を前記二次元ナノ材料層のある区域の側部に置き、且つ前記リスト構造の長手方向を前記第n層のカーボンナノチューブフィルムにおけるカーボンナノチューブの配列方向と垂直にするステップ(B)と、
前記カーボンナノチューブの配列方向に沿って、前記リスト構造を引き剥がし、前記第n層のカーボンナノチューブフィルムが前記リスト構造の引き剥がされたことにつれて、除去されるステップ(C)と、
を含むことを特徴とする、請求項1に記載の懸架する二次元ナノ材料の製造方法。
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