JP2019119086A5 - - Google Patents

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Publication number
JP2019119086A5
JP2019119086A5 JP2017254137A JP2017254137A JP2019119086A5 JP 2019119086 A5 JP2019119086 A5 JP 2019119086A5 JP 2017254137 A JP2017254137 A JP 2017254137A JP 2017254137 A JP2017254137 A JP 2017254137A JP 2019119086 A5 JP2019119086 A5 JP 2019119086A5
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JP
Japan
Prior art keywords
joining
substrate
substrates
thin film
metal oxide
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JP2017254137A
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English (en)
Japanese (ja)
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JP2019119086A (ja
JP7045186B2 (ja
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Priority claimed from JP2017254137A external-priority patent/JP7045186B2/ja
Priority to JP2017254137A priority Critical patent/JP7045186B2/ja
Priority to EP18897427.3A priority patent/EP3736134B1/en
Priority to CN201880087846.XA priority patent/CN111655490B/zh
Priority to PCT/JP2018/047204 priority patent/WO2019131490A1/ja
Priority to KR1020207021853A priority patent/KR102690513B1/ko
Priority to US16/958,955 priority patent/US12351511B2/en
Publication of JP2019119086A publication Critical patent/JP2019119086A/ja
Publication of JP2019119086A5 publication Critical patent/JP2019119086A5/ja
Publication of JP7045186B2 publication Critical patent/JP7045186B2/ja
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JP2017254137A 2017-12-28 2017-12-28 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス Active JP7045186B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2017254137A JP7045186B2 (ja) 2017-12-28 2017-12-28 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス
KR1020207021853A KR102690513B1 (ko) 2017-12-28 2018-12-21 기판의 접합 방법, 투명기판 적층체 및 기판 적층체를 구비하는 디바이스
CN201880087846.XA CN111655490B (zh) 2017-12-28 2018-12-21 基板的接合方法、基板层叠体和具备基板层叠体的器件
PCT/JP2018/047204 WO2019131490A1 (ja) 2017-12-28 2018-12-21 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス
EP18897427.3A EP3736134B1 (en) 2017-12-28 2018-12-21 Method for bonding substrate
US16/958,955 US12351511B2 (en) 2017-12-28 2018-12-21 Method for bonding substrate, transparent substrate laminate, and device provided with substrate laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017254137A JP7045186B2 (ja) 2017-12-28 2017-12-28 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス

Publications (3)

Publication Number Publication Date
JP2019119086A JP2019119086A (ja) 2019-07-22
JP2019119086A5 true JP2019119086A5 (show.php) 2020-11-26
JP7045186B2 JP7045186B2 (ja) 2022-03-31

Family

ID=67067315

Family Applications (1)

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JP2017254137A Active JP7045186B2 (ja) 2017-12-28 2017-12-28 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス

Country Status (6)

Country Link
US (1) US12351511B2 (show.php)
EP (1) EP3736134B1 (show.php)
JP (1) JP7045186B2 (show.php)
KR (1) KR102690513B1 (show.php)
CN (1) CN111655490B (show.php)
WO (1) WO2019131490A1 (show.php)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7287772B2 (ja) 2018-11-26 2023-06-06 ランテクニカルサービス株式会社 透明基板の接合方法及び積層体
EP4026644A4 (en) * 2019-09-05 2023-09-27 Tohoku University CHEMICAL BONDING METHOD AND BONDED STRUCTURE
GB2599393B (en) * 2020-09-30 2024-12-18 Dyson Technology Ltd Method and apparatus for sputter deposition
JP2022071958A (ja) * 2020-10-29 2022-05-17 コミヤマエレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
CN112897899B (zh) * 2021-01-21 2022-06-14 杭州中科神光科技有限公司 一种玻璃组件键合的方法
CN112919815B (zh) * 2021-01-21 2022-06-03 杭州中科神光科技有限公司 一种玻璃组件键合的方法
US20220336405A1 (en) * 2021-04-15 2022-10-20 Apple Inc. Method of Fine Pitch Hybrid Bonding with Dissimilar CTE Wafers and Resulting Structures
WO2022242879A1 (en) * 2021-05-21 2022-11-24 Applied Materials, Inc. Apparatus and method for manufacturing a composite film
CN118900765A (zh) 2022-03-25 2024-11-05 富士胶片株式会社 层叠体及层叠体的制造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3848989B2 (ja) 2003-05-15 2006-11-22 唯知 須賀 基板接合方法および基板接合装置
JP2008094063A (ja) * 2006-10-16 2008-04-24 Asahi Kasei Chemicals Corp 金属酸化物積層体
JP5070557B2 (ja) 2007-02-27 2012-11-14 武仁 島津 常温接合方法
JP2009199902A (ja) 2008-02-21 2009-09-03 Seiko Epson Corp 有機発光装置および電子機器
CN104245280B (zh) * 2012-04-10 2017-03-29 须贺唯知 接合高分子薄膜与高分子薄膜的方法、接合高分子薄膜与无机材料基板的方法、高分子薄膜层叠体及高分子薄膜与无机材料基板的层叠体
CN105965990B (zh) * 2012-05-29 2018-06-01 旭硝子株式会社 玻璃层叠体和电子器件的制造方法
KR102082954B1 (ko) 2012-06-15 2020-02-28 랜 테크니컬 서비스 가부시키가이샤 전자 소자의 봉지 방법 및 기판 접합체
CN102941712B (zh) * 2012-10-23 2015-07-22 江南大学 一种高分子材料-金属氧化物薄膜复合材料及其制备方法
JP2014123514A (ja) 2012-12-21 2014-07-03 Ran Technical Service Kk 電子素子の封止方法及び封止構造
US9703011B2 (en) * 2013-05-07 2017-07-11 Corning Incorporated Scratch-resistant articles with a gradient layer
JP6387780B2 (ja) 2013-10-28 2018-09-12 日亜化学工業株式会社 発光装置及びその製造方法
JP6282142B2 (ja) 2014-03-03 2018-02-21 日東電工株式会社 赤外線反射基板およびその製造方法
JP6349904B2 (ja) 2014-04-18 2018-07-04 日亜化学工業株式会社 半導体発光装置およびその製造方法
KR102202977B1 (ko) * 2014-08-22 2021-01-14 동우 화인켐 주식회사 터치 센서의 제조 방법
CN107532281B (zh) * 2015-04-28 2020-01-24 三井金属矿业株式会社 表面处理铜箔及其制造方法、印刷电路板用覆铜层叠板、以及印刷电路板
US10675842B2 (en) * 2016-02-26 2020-06-09 Konica Minolta, Inc. Transparent electrode and organic electronic device including the same
JP6414104B2 (ja) 2016-02-29 2018-10-31 日亜化学工業株式会社 発光装置の製造方法

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