JP2019102795A - チップ抵抗器の抵抗層形成用ペースト及びチップ抵抗器 - Google Patents
チップ抵抗器の抵抗層形成用ペースト及びチップ抵抗器 Download PDFInfo
- Publication number
- JP2019102795A JP2019102795A JP2018187636A JP2018187636A JP2019102795A JP 2019102795 A JP2019102795 A JP 2019102795A JP 2018187636 A JP2018187636 A JP 2018187636A JP 2018187636 A JP2018187636 A JP 2018187636A JP 2019102795 A JP2019102795 A JP 2019102795A
- Authority
- JP
- Japan
- Prior art keywords
- chip resistor
- electrode
- resistive layer
- layer
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 32
- 239000000956 alloy Substances 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- 239000010949 copper Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000011521 glass Substances 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 8
- NWLCFADDJOPOQC-UHFFFAOYSA-N [Mn].[Cu].[Sn] Chemical compound [Mn].[Cu].[Sn] NWLCFADDJOPOQC-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910018645 Mn—Sn Inorganic materials 0.000 claims abstract 3
- 239000010410 layer Substances 0.000 claims description 103
- 239000011241 protective layer Substances 0.000 claims description 29
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000012298 atmosphere Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000005245 sintering Methods 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910000896 Manganin Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- UTICYDQJEHVLJZ-UHFFFAOYSA-N copper manganese nickel Chemical compound [Mn].[Ni].[Cu] UTICYDQJEHVLJZ-UHFFFAOYSA-N 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06526—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Non-Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Details Of Resistors (AREA)
- Conductive Materials (AREA)
Abstract
Description
121 第1電極
122 第2電極
123 第3電極
124 第4電極
130 抵抗層
140 保護層
141 第1保護層
142 第2保護層
151 第1上面電極
152 第2上面電極
161 第1金属カバー
162 第2金属カバー
c 介在部
d 延長部
R 溝
1000、2000 チップ抵抗器
Claims (10)
- 銅系合金粉末を含むチップ抵抗器の抵抗層形成用ペーストにおいて、
前記銅系合金粉末対比0wt%超過10wt%以下のニッケル粉末をさらに含み、
ガラスを含まない、チップ抵抗器の抵抗層形成用ペースト。 - 前記銅系合金は、銅−マンガン−錫(Cu−Mn−Sn)を含む請求項1に記載のチップ抵抗器の抵抗層形成用ペースト。
- 前記ニッケル粉末の直径は、300nm以下である請求項1または2に記載のチップ抵抗器の抵抗層形成用ペースト。
- 基板と、
前記基板の一面に配置された第1電極と、
前記基板の一面に、前記第1電極と分離されるように配置された第2電極と、
前記第1電極と前記第2電極とを互いに接続するように、前記基板の一面に配置される抵抗層と、
前記抵抗層を保護するために前記抵抗層の一面に配置される保護層と、を含み、
前記抵抗層は、
銅系合金と、前記銅系合金対比0wt%超過10wt%以下のニッケルとを含み、ガラスを含まないチップ抵抗器。 - 前記銅系合金は、銅−マンガン−錫(Cu−Mn−Sn)を含む請求項4に記載のチップ抵抗器。
- 前記保護層は、
前記抵抗層の一面に形成される第1保護層と、
前記第1保護層の一面に形成される第2保護層と、を含む請求項4または5に記載のチップ抵抗器。 - 前記抵抗層は、溝(groove)を有する請求項4から6のいずれか一項に記載のチップ抵抗器。
- 前記第1電極及び第2電極にそれぞれ形成される上面電極をさらに含む請求項4から6のいずれか一項に記載のチップ抵抗器。
- 前記上面電極のそれぞれは、
前記第1電極または前記第2電極と前記抵抗層との間に介在される介在部と、
前記介在部から前記抵抗層の一面の少なくとも一部に延長される延長部と、を含む請求項8に記載のチップ抵抗器。 - 前記保護層は、
前記抵抗層の一面及び前記延長部に形成される第1保護層と、
前記第1保護層に形成される第2保護層と、を含む請求項9に記載のチップ抵抗器。
Priority Applications (1)
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JP2023130572A JP2023159217A (ja) | 2017-11-28 | 2023-08-10 | チップ抵抗器の抵抗層形成用ペースト及びチップ抵抗器 |
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---|---|---|---|
KR10-2017-0160854 | 2017-11-28 | ||
KR1020170160854A KR102356802B1 (ko) | 2017-11-28 | 2017-11-28 | 칩 저항기 저항층 형성용 페이스트 및 칩 저항기 |
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JP2023130572A Division JP2023159217A (ja) | 2017-11-28 | 2023-08-10 | チップ抵抗器の抵抗層形成用ペースト及びチップ抵抗器 |
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JP2019102795A true JP2019102795A (ja) | 2019-06-24 |
JP7380980B2 JP7380980B2 (ja) | 2023-11-15 |
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JP2018187636A Active JP7380980B2 (ja) | 2017-11-28 | 2018-10-02 | チップ抵抗器の抵抗層形成用ペースト及びチップ抵抗器 |
JP2023130572A Pending JP2023159217A (ja) | 2017-11-28 | 2023-08-10 | チップ抵抗器の抵抗層形成用ペースト及びチップ抵抗器 |
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Country Status (3)
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US (1) | US10541069B2 (ja) |
JP (2) | JP7380980B2 (ja) |
KR (1) | KR102356802B1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US10763018B2 (en) * | 2017-04-14 | 2020-09-01 | Panasonic Intellectual Property Management Co., Ltd. | Chip resistor |
KR102231104B1 (ko) * | 2019-12-27 | 2021-03-23 | 삼성전기주식회사 | 저항 부품 |
KR20230121405A (ko) | 2022-02-11 | 2023-08-18 | 삼성전기주식회사 | 저항 부품 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003045703A (ja) * | 2001-07-31 | 2003-02-14 | Koa Corp | チップ抵抗器及びその製造方法 |
JP2007220858A (ja) * | 2006-02-16 | 2007-08-30 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
JP2016018814A (ja) * | 2014-07-04 | 2016-02-01 | パナソニックIpマネジメント株式会社 | チップ抵抗器 |
JP2017112353A (ja) * | 2015-12-18 | 2017-06-22 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | チップ抵抗器 |
JP2017123453A (ja) * | 2016-01-08 | 2017-07-13 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | チップ抵抗素子 |
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JP2004119692A (ja) * | 2002-09-26 | 2004-04-15 | Koa Corp | 抵抗体組成物および抵抗器 |
US8242878B2 (en) * | 2008-09-05 | 2012-08-14 | Vishay Dale Electronics, Inc. | Resistor and method for making same |
US20110089025A1 (en) * | 2009-10-20 | 2011-04-21 | Yageo Corporation | Method for manufacturing a chip resistor having a low resistance |
KR101412951B1 (ko) | 2012-08-17 | 2014-06-26 | 삼성전기주식회사 | 칩 저항기 및 이의 제조 방법 |
KR102103711B1 (ko) * | 2012-09-12 | 2020-04-23 | 엠. 테크닉 가부시키가이샤 | 금속 미립자의 제조 방법 |
US20160143145A1 (en) * | 2014-11-13 | 2016-05-19 | E I Du Pont De Nemours And Company | Electrical device |
JP2016152301A (ja) * | 2015-02-17 | 2016-08-22 | ローム株式会社 | チップ抵抗器およびその製造方法 |
KR101883040B1 (ko) * | 2016-01-08 | 2018-07-27 | 삼성전기주식회사 | 칩 저항 소자 |
-
2017
- 2017-11-28 KR KR1020170160854A patent/KR102356802B1/ko active IP Right Grant
-
2018
- 2018-10-02 JP JP2018187636A patent/JP7380980B2/ja active Active
- 2018-11-16 US US16/193,608 patent/US10541069B2/en active Active
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2023
- 2023-08-10 JP JP2023130572A patent/JP2023159217A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003045703A (ja) * | 2001-07-31 | 2003-02-14 | Koa Corp | チップ抵抗器及びその製造方法 |
JP2007220858A (ja) * | 2006-02-16 | 2007-08-30 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
JP2016018814A (ja) * | 2014-07-04 | 2016-02-01 | パナソニックIpマネジメント株式会社 | チップ抵抗器 |
JP2017112353A (ja) * | 2015-12-18 | 2017-06-22 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | チップ抵抗器 |
JP2017123453A (ja) * | 2016-01-08 | 2017-07-13 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | チップ抵抗素子 |
Also Published As
Publication number | Publication date |
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KR102356802B1 (ko) | 2022-01-28 |
JP7380980B2 (ja) | 2023-11-15 |
JP2023159217A (ja) | 2023-10-31 |
US20190164672A1 (en) | 2019-05-30 |
US10541069B2 (en) | 2020-01-21 |
KR20190061946A (ko) | 2019-06-05 |
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