JP2019083328A5 - - Google Patents

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Publication number
JP2019083328A5
JP2019083328A5 JP2019003096A JP2019003096A JP2019083328A5 JP 2019083328 A5 JP2019083328 A5 JP 2019083328A5 JP 2019003096 A JP2019003096 A JP 2019003096A JP 2019003096 A JP2019003096 A JP 2019003096A JP 2019083328 A5 JP2019083328 A5 JP 2019083328A5
Authority
JP
Japan
Prior art keywords
carrier
substrate
metal
led
heat spreader
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019003096A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019083328A (ja
Filing date
Publication date
Priority claimed from DE102014115375.8A external-priority patent/DE102014115375A1/de
Application filed filed Critical
Publication of JP2019083328A publication Critical patent/JP2019083328A/ja
Publication of JP2019083328A5 publication Critical patent/JP2019083328A5/ja
Pending legal-status Critical Current

Links

JP2019003096A 2014-08-08 2019-01-11 Ｌｅｄ用担体 Pending JP2019083328A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102014111363.2 2014-08-08
DE102014111363 2014-08-08
DE102014115375.8 2014-10-22
DE102014115375.8A DE102014115375A1 (de) 2014-08-08 2014-10-22 Träger für eine LED

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2017506875A Division JP2017524261A (ja) 2014-08-08 2015-08-07 Ｌｅｄ用担体

Publications (2)

Publication Number Publication Date
JP2019083328A JP2019083328A (ja) 2019-05-30
JP2019083328A5 true JP2019083328A5 (enExample) 2020-09-03

Family

ID=55134667

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017506875A Pending JP2017524261A (ja) 2014-08-08 2015-08-07 Ｌｅｄ用担体
JP2019003096A Pending JP2019083328A (ja) 2014-08-08 2019-01-11 Ｌｅｄ用担体

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2017506875A Pending JP2017524261A (ja) 2014-08-08 2015-08-07 Ｌｅｄ用担体

Country Status (6)

Country Link
US (1) US9978912B2 (enExample)
EP (1) EP3178117B1 (enExample)
JP (2) JP2017524261A (enExample)
CN (1) CN106575692B (enExample)
DE (2) DE102014115375A1 (enExample)
WO (1) WO2016020537A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016122014A1 (de) * 2016-11-16 2018-05-17 Epcos Ag Leistungsmodul mit verringerter Defektanfälligkeit und Verwendung desselben
DE102017118490B4 (de) * 2017-08-14 2025-03-27 Tdk Electronics Ag Anordnung mit LED-Modul
DE102017126268A1 (de) 2017-11-09 2019-05-09 Osram Opto Semiconductors Gmbh Träger, Anordnung mit einem Substrat und einem Träger und Verfahren zum Herstellen eines Trägers

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3475910B2 (ja) 2000-05-24 2003-12-10 株式会社村田製作所 電子部品、電子部品の製造方法および回路基板
JP4580633B2 (ja) * 2003-11-14 2010-11-17 スタンレー電気株式会社 半導体装置及びその製造方法
US7279724B2 (en) 2004-02-25 2007-10-09 Philips Lumileds Lighting Company, Llc Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection
JP4915058B2 (ja) * 2005-06-06 2012-04-11 パナソニック株式会社 Ｌｅｄ部品およびその製造方法
US20070200133A1 (en) * 2005-04-01 2007-08-30 Akira Hashimoto Led assembly and manufacturing method
JP4146849B2 (ja) 2005-04-14 2008-09-10 Ｔｄｋ株式会社 発光装置
US7505239B2 (en) 2005-04-14 2009-03-17 Tdk Corporation Light emitting device
WO2007058438A1 (en) * 2005-11-18 2007-05-24 Amosense Co., Ltd. Electronic parts packages
JP2008109079A (ja) * 2006-09-26 2008-05-08 Kyocera Corp 表面実装型発光素子用配線基板および発光装置
JP2008270325A (ja) 2007-04-17 2008-11-06 Matsushita Electric Ind Co Ltd 静電気対策部品およびこれを用いた発光ダイオードモジュール
US20090020876A1 (en) 2007-07-20 2009-01-22 Hertel Thomas A High temperature packaging for semiconductor devices
US8536584B2 (en) * 2007-11-14 2013-09-17 Cree, Inc. High voltage wire bond free LEDS
DE102008024480A1 (de) * 2008-05-21 2009-12-03 Epcos Ag Elektrische Bauelementanordnung
DE102008024479A1 (de) 2008-05-21 2009-12-03 Epcos Ag Elektrische Bauelementanordnung
JP2011187855A (ja) 2010-03-11 2011-09-22 Panasonic Corp 多層セラミック基板の製造方法
TWI533483B (zh) * 2010-08-09 2016-05-11 Ｌｇ伊諾特股份有限公司 發光裝置
JP5735245B2 (ja) * 2010-09-28 2015-06-17 スタンレー電気株式会社 光半導体素子、発光ダイオード、およびそれらの製造方法
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung
JP2014116411A (ja) 2012-12-07 2014-06-26 Kyocera Corp 発光素子搭載用基板および発光装置

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