JP2019073399A - Surface treatment method and device, and glass substrate - Google Patents

Abstract

To strike balance between adhesiveness to a part to be left of a film pasted on a subject to be treated, and peeling easiness to a part to be peeled off.SOLUTION: Such a subject 9 to be treated that a film 7 containing a part 7a to be left and a part 7b to be peeled off is pasted on a surface 9s to be treated through an adhesive 8, is subjected to surface treatment before pasting. Process gas is changed to plasma and blown off from a treatment head 10 so as to have a contact with the surface 9s to be treated. Each surface energy of a remaining corresponding part 9a where the part 7a to be left is pasted, and of a peeling corresponding part 9b where the part 7b to be peeled off is pasted is differentiated mutually.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method and apparatus for surface treating a substrate to be treated such as a glass substrate, and a glass substrate, and in particular, an optical film such as a polarizing plate including a remaining portion and a peeling portion The present invention relates to a surface treatment method and apparatus suitable for a substrate to be treated and a glass substrate.

For example, in a liquid crystal panel, liquid crystal is sealed between two laminated glasses. A polarizing plate is provided on the surface of each glass.
In the current manufacturing process, after processing such as circuit formation is performed on the surfaces of the two mother glass substrates to be opposite to each other, mother cells are formed by bonding. The mother cell is divided into a plurality of liquid crystal panels by scribing break, and after cleaning, a film-like polarizing plate is attached (see Patent Document 1 etc.). An adhesive is applied to the affixing surface of the polarizing plate and covered with a peeling film. The peeling film is peeled off, and a polarizing plate is adhered to the glass surface of the liquid crystal panel (see Patent Document 2 and the like).

  In patent document 3, the wettability of the surface of a liquid crystal cell is improved by irradiating UV light, supplying ozone to a liquid crystal cell, and the adhesiveness of a polarizing plate is improved.

Not only adhesiveness but reworkability (peelability, reusability) is also required for the polarizing plate (patent documents 4 to 6).
In Patent Document 4, after a polarizing plate is attached to a liquid crystal cell and a rework film is attached thereto, the rework property is improved by simultaneously peeling off the polarizing plate and the rework film.
In Patent Document 5, reworkability is improved by applying water to a glass plate and laminating a polarizing plate thereon.
In patent document 6, rework property is improved by using a polyvinyl acetal containing composition as an adhesive of a polarizing plate.

JP, 2017-142316, A Japanese Patent Application Laid-Open No. 2003-131211 Unexamined-Japanese-Patent No. 09-281472 JP, 2008-268255, A JP, 2014-112232, A Patent No. 4421714

The inventors are in the process of improving the efficiency of the liquid crystal panel manufacturing process. We proposed an end cut process as one of the ideas. That is, a mother polarizing plate having substantially the same size as the mother cell is prepared, and after forming the mother cell, the mother polarizing plate is attached to the mother cell before scribing break, and then the unnecessary portion of the mother polarizing plate is laser cut and peeled off. And scribe break. By doing so, advantages such as a drastic reduction in the number of lines, a reduction in the number of workers, suppression of particles, and easy handling of various sizes can be obtained.
On the other hand, in such an end cut process, it is required that the mother polarizing plate of the part to be a product part be firmly attached and the mother polarizing plate of the unnecessary part be easy to peel off. As described above, various techniques have been proposed for improving adhesion (Patent Document 3 and the like as described above) and techniques for improving reworkability (Patent Documents 4 to 6 described above), but adhesion and reworkability (peelability) It is not easy to improve both).
In the present invention, in view of such circumstances, when affixing a film such as a polarizing plate including a remaining part and a part to be peeled off to a substrate to be treated such as glass, coexistence of adhesiveness and reworkability (peelability) is achieved. With the goal.

In order to solve the above-mentioned problems, the method of the present invention is a method of surface-treating a substrate to be treated on which a film including a remaining portion and a portion to be peeled is attached to a surface to be treated via an adhesive. ,
A plasma processing step of plasmatizing a process gas and contacting the surface to be processed;
A treatment step of performing treatment to make the surface energy of the remaining portion corresponding to the remaining portion to be attached and the peeling corresponding portion to which the portion to be peeled be different from each other during or before or after the plasma treatment step ,
It is characterized by having.
The apparatus according to the present invention is an apparatus for surface-treating a substrate to be treated on which a film including a remaining part and a part to be peeled off is attached to a surface to be treated through an adhesive before the attachment.
A plasma processing unit configured to plasmat a process gas and contact the processing surface;
A treatment is performed to make the surface energy of the remaining portion on the surface to be treated to be attached be different from the surface energy of the peeling corresponding portion to be attached, during or before or after the processing by the plasma processing unit. Department,
It is characterized by having.
By this, adhesiveness and peelability can be made to make compatible.
Preferably, the surface energy of the corresponding portions is differentiated or contrasted such that the adhesion is relatively high for the remaining portion, and the peelability is relatively high for the peeling portion. By doing so, adhesiveness and peelability can be reliably achieved.
The treatment step may be performed before the plasma treatment step, may be performed in parallel with the plasma treatment during the plasma treatment step, or may be performed after the plasma treatment step.
In the treatment step before the plasma treatment step, it is preferable to apply treatment (e.g., a mask) in which contrast is not obtained in the treatment step but is obtained when the plasma treatment step is performed after the treatment step.
When the treatment step is performed after the plasma treatment step, it is preferable that no contrast is given in the plasma treatment step and the contrast is given in the subsequent treatment step.

The process gas converted into plasma is blown out from a processing head movable relative to the substrate to be brought into contact with the processing surface,
It is preferable that the degree of plasma processing be different when the processing head is directed to the remaining portion and the portion corresponding to the peeling.
Thus, the treatment step can be performed during the plasma treatment step to contrast the surface energy of the treated surface. The surface energy is preferably increased by strengthening the degree of plasma treatment for the remaining portion. It is preferable to suppress the increase in the surface energy by weakening the degree of plasma treatment for the part corresponding to peeling.
As a method of adjusting the degree of plasma processing, the processing time for the remaining portion corresponding portion may be extended, and the processing time for the portion corresponding to peeling may be shortened.
For example, when the processing head is directed to the remaining position, the relative moving speed between the processing head and the processing substrate is reduced, and when the processing head is directed to the peeling position, the processing head and the processing substrate The relative movement speed of may be increased.
If the processing head is directed to the remaining part, increase the process gas flow rate, and if the processing head is directed to the peeling part, reduce the process gas flow or stop the process gas from blowing out. Good.
The composition of the process gas may be different between when the processing head is directed to the residual corresponding portion and when directed to the peeling corresponding portion.

The process gas preferably contains nitrogen (N ₂ ) and oxygen (O ₂ ). Adhesiveness can be improved by this. Instead of nitrogen, a rare gas such as helium (He), neon (Ne), argon (Ar) or the like, or another inert gas may be used.
The process gas is preferably plasmatized in a discharge space near atmospheric pressure. The plasma is preferably an atmospheric pressure plasma near atmospheric pressure.
In the present specification, the vicinity of the atmospheric pressure means a range of 1.013 × 10 ^{4 to} 50.663 × 10 ⁴ Pa, and in consideration of facilitation of pressure adjustment and simplification of the device configuration, 1.333 × 10 ⁴ ~10.664 × ¹⁰ 4 Pa, and more preferably from ^{9.331 × 10 4 ~10.397 × 10 4} Pa.

The process gas converted into plasma is blown out from a processing head movable relative to the substrate to be brought into contact with the processing surface,
The composition of the process gas may be different from each other when the processing head is directed to the remaining portion and the portion corresponding to the peeling.
For example, using N ₂ and O ₂ as a process gas component, and leaving time processing corresponding portion is a mixed gas of N ₂ and O ₂ as a process gas by supplying O _2, when processing of the peeling corresponding parts O the process gas N ₂ only by stopping the supply of _2. As a result, it is possible to increase the surface energy of the remaining portion corresponding portion and to suppress the increase of the surface energy of the peeling portion.

It is preferable to perform the plasma treatment step after covering one of the peeling corresponding portion and the remaining portion corresponding portion with a protective mask.
As a result, the portion with the protective mask is not plasma treated, and only the portion without the protective mask is plasma treated. Therefore, the surface energy of the surface to be treated can be contrasted.
The step of covering with the protective mask is a treatment step before the plasma treatment step.

The treatment step may be performed after the plasmatized process gas is uniformly brought into contact with the entire area of the surface to be treated. That is, the surface energy of these remaining parts is once equalized by plasma treating the remaining parts and the peeling parts uniformly by the plasma processing step, and then the surface energy of the remaining parts and the peeling parts is obtained by the treatment process. You may add contrast. As a result, even if the surface condition of the surface to be treated is uneven, the entire area of the remaining portion can be made uniform and high in surface energy, and the whole area of the peeling portion can be made uniform and low in surface energy. And it is possible to prevent variations in ease of peeling.
Examples of the treatment process after the plasma treatment include plasma treatment using the treatment head, plasma treatment using the protective mask, and air blowing only on the remaining corresponding part.

After the water repellent mask is provided on the peeling corresponding portion, the plasma treatment step may be performed using a process gas that raises the surface energy of the surface to be treated by plasmatization. The water repelling mask preferably has a reduced surface energy by interaction with the plasmatized process gas.
Examples of the water repellent mask include a black matrix and a bank. The Examples of the process gas in the case, for example, a mixed gas of fluorine-containing compound and N ₂ and the like. As the fluorine-containing compound, PFC (perfluorocarbon) such as CF ₄ , C ₂ F ₄ , C ₂ F ₆ , C ₃ F ₈ or the like, HFC (hydrofluorocarbon) such as CHF ₃ , CH ₂ F ₂ , CH ₃ F or the like SF ₆ , NF ₃ and XeF ₂ can be mentioned. By converting the process gas into plasma, fluorine-based active species and nitrogen-based active species are generated. The surface energy of the water repellent mask is reduced by the interaction with the fluorine-based active species, and the surface corresponding to the remaining part is increased by the contact with the nitrogen-based active species.
The step of providing the water repellent mask is a treatment step before the plasma treatment step.

Moreover, this invention is a glass substrate which has a to-be-adhered surface to which the film containing the part left and the part to peel off is affixed via an adhesive agent,
It is characterized in that surface energy of a remaining corresponding portion to which the remaining portion is pasted and a peeling corresponding portion to which the peeled portion is pasted on the surface to be attached are different from each other.
It is preferable that the surface energy of the remaining portion corresponding to the glass substrate is higher than the surface energy of the peeling corresponding portion.
As a result, the remaining corresponding portion has a relatively high hydrophilicity (small contact angle to water), and the adhesion to the water-based adhesive and hence the adhesion to the remaining portion of the film can be secured. On the other hand, the part corresponding to peeling has a relatively low hydrophilicity (a large contact angle to water), and the peelability of the film to the peeled part can be ensured.

  ADVANTAGE OF THE INVENTION According to this invention, the adhesiveness with respect to the remaining part of the film affixed on a to-be-processed board | substrate and the ease of peeling with respect to the part to peel off are compatible.

FIG. 1 is a front cross-sectional view showing a schematic configuration of a surface treatment apparatus according to a first embodiment of the present invention. FIG. 2 is a perspective view of the surface treatment apparatus. Fig.3 (a) is front sectional drawing which shows the affixing process of a polarizing plate. FIG.3 (b) is a front view which shows a laser cutting process. FIG.3 (c) is front sectional drawing which shows a peeling process. FIG. 4 is a perspective view schematically showing a surface treatment apparatus according to a second embodiment of the present invention. FIG. 5 is a side sectional view of the surface treatment apparatus according to the second embodiment. FIG. 6 is a perspective view schematically showing a surface treatment apparatus according to a third embodiment of the present invention. FIG. 7 is a front view of the surface treatment apparatus according to the third embodiment. FIG. 8 is a perspective view schematically showing a surface treatment apparatus according to a fourth embodiment of the present invention. FIG. 9 is a perspective view schematically showing a surface treatment apparatus according to a fifth embodiment of the present invention. FIG. 10 is a front view of the surface treatment apparatus according to the fifth embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 to 3 show a first embodiment of the present invention. The glass substrate 9 to be processed is a mother cell to be a plurality of liquid crystal panels. As shown in FIG. 3A, the mother polarizing plate 7 (film) is attached to the surface to be processed 9s (surface to be attached) of the glass substrate 9 with the adhesive 8 interposed therebetween. The mother polarizing plate 7 is made of, for example, an optical laminated resin film such as TAC (cellulose triacetate) / PVA (polyvinyl alcohol) / TAC, TAC / PVA / COP (cycloolefin polymer), or TAC / PVA / acrylic resin. ing. The adhesive 8 is made of, for example, a water-soluble polyvinyl butyral (PVB) -containing composition. In addition, the material of the polarizing plate of this invention and an adhesive agent is not limited to these things.

  As shown in FIG. 3C, the mother polarizing plate 7 includes a remaining portion 7a and a portion 7b to be peeled off. On the processing surface 9s, a remaining corresponding portion 9a to which the remaining portion 7a is attached and a peeling corresponding portion 9b to which the peeled portion 7b is attached are set. Preferably, from the viewpoint of productivity, the plurality of remaining corresponding parts 9a are regularly arranged at equal intervals in the longitudinal and lateral directions. The remaining part of the surface 9s to be treated is the peeling corresponding part 9b.

The following surface treatment is performed on the glass substrate 9 before the mother polarizing plate 7 is attached.
Generally speaking, plasma treatment is performed on the surface 9s to be treated to improve the adhesion of the polarizing plate 7 (plasma treatment step). In the plasma processing step, the treatment for making the surface energy of the remaining corresponding portion 9 and the surface energy of the peeling corresponding portion 9b different from each other by making the plasma treatment degree for the remaining corresponding portion 9a different from the plasma treatment degree for the peeling corresponding portion 9b. Apply (treatment process).

<Surface treatment device>
FIG. 1 shows a surface treatment apparatus 1 for performing the plasma treatment step and the treatment step. The surface treatment apparatus 1 includes a substrate support unit 2, a local treatment head 10, and a moving unit 20.
The glass substrate 9 is horizontally supported by the substrate supporting unit 2 with the surface 9s to be treated facing upward. The substrate support means 2 may be a stage on which the glass substrate 9 is mounted, or may be a holder for gripping the edge of the glass substrate 9.

As shown in FIGS. 1 and 2, the local processing head 10 is disposed above the glass substrate 9 supported by the substrate support means 2. The local processing head 10 is shaped like a spot nozzle.
As shown in FIG. 1, double cylindrical electrodes 11H and 11E are provided inside the local processing head 10. The center electrode 11H is connected to, for example, a high frequency power supply 12 that supplies high frequency power of pulse wave form. The cylindrical outer electrode 11E surrounding the center electrode 11H is electrically grounded. A solid dielectric is provided on the opposing surface of at least one of the electrodes (for example, the inner peripheral surface of the outer electrode 11E). A cylindrical inter-electrode space 15 (discharge space) is formed between the outer peripheral surface of the center electrode 11H and the inner peripheral surface of the outer electrode 11E.

At the upstream end of the inter-electrode space 15, a process gas supply unit 13 is connected. The process gas supply unit 13 supplies a process gas to the interelectrode space 15. As a process gas, a mixed gas obtained by adding a trace amount of oxygen (O ₂ ) to nitrogen (N ₂ ) is used. The amount of oxygen added to nitrogen is, for example, on the order of ppm (1 ppm or more and less than 1%), and preferably about 250 ppm.

At the downstream end of the interelectrode space 15, a spot-like outlet 14 is connected. The outlet 14 is disposed at the lower end of the local processing head 10 and is in close proximity to the glass substrate 9 supported by the substrate support means 2.
Furthermore, a suction port (not shown) may be provided at the lower end portion of the local processing head 10.

The local processing head 10 is moved relative to the glass substrate 9 in the x direction and the y direction (two directions orthogonal to the processing surface 9s) by moving means 20 schematically illustrated in FIG.
The glass substrate 9 may be fixed, the local processing head 10 may be moved, the local processing head 10 may be fixed, and the glass substrate 9 may be moved.
The moving means 20 may be an XY stage which doubles as the substrate support means 2, or may be an articulated arm robot which doubles as a support means of the local processing head 10.

The surface treatment apparatus 1 operates as follows.
<Plasma treatment process>
Power is supplied from the power source 12 to the electrode 11, and a process gas is supplied from the process gas supply unit 13 to the processing head 10. By the power supply, an atmospheric pressure glow discharge is generated between the pair of electrodes 11, and the interelectrode space 15 becomes a discharge space near the atmospheric pressure. The process gas from the process gas supply unit 13 is introduced into the discharge space 15, and the process gas is plasmatized (including excitation, activation, radicalization, ionization) in the discharge space 15.
A process gas (hereinafter appropriately referred to as “plasma gas”) converted into plasma flows from the discharge space 15 to the outlet 14 and is blown out from the outlet 14. The plasma gas is brought into contact with the surface 9 s of the glass substrate 9 to perform plasma surface treatment of the surface 9 s.

<Treatment process>
In parallel, the degree of plasma treatment for the remaining portion corresponding portion 9a is relatively strong, and the degree of plasma treatment for the peeling corresponding portion 9b is relatively weak, so that the degree of plasma treatment is adjusted.
Specifically, the moving means 20 mainly directs the processing head 10 being blown out to the remaining corresponding part 9a among the remaining corresponding part 9a and the peeling corresponding part 9b of the processing surface 9s. Then, for example, as shown by the white arrow a in FIG. 2, the processing head 10 is relatively moved in an annular manner along the inner portion of the contour of each remaining portion 9a. As a result, the plasma gas is brought into contact with the remaining portion corresponding portion 9a, whereby the remaining portion corresponding portion 9a is subjected to plasma surface treatment. Specifically, the surface energy is increased by the hydrophilization treatment. Therefore, the wettability is enhanced and the contact angle to water is reduced.
On the other hand, when the processing head 10 is on the peeling corresponding portion 9b or when the processing head 10 passes over the peeling corresponding portion 9b to move to the next remaining corresponding portion 9a, the flow rate of plasma gas is restricted. Do. That is, the blowing flow rate is made smaller than that of the remaining portion corresponding portion 9a, or the blowing is stopped. As a result, the hydrophilization treatment of the peeling corresponding portion 9b is suppressed, and the increase in surface energy is suppressed.
As a result, the surface energy of the remaining corresponding portion 9 and the peeling corresponding portion 9b are different from each other, and a treatment with contrast is performed.

As a method of limiting the flow rate of the plasma gas or removing the limitation in order to apply the contrast, in addition to the method of adjusting the flow rate of the process gas from the supply unit 13, the flow rate of the process gas is made constant. There is a method of mechanically changing the flow of the process gas (plasma gas) after being plasmatized or changing the relative velocity of the processing head 10 to the glass substrate 9 while holding it. From the viewpoint of avoiding the temperature rise of the electrodes 11H and 11E, it is preferable to keep the process gas supply flow rate constant.
As a method of mechanically changing the flow of plasma gas, a shielding plate is provided below the blowout port 14 so as to be able to move forward and backward, and the shielding plate is retracted from the blowout port 14 on the remaining corresponding portion 9a. The plasma gas is interrupted by the shielding plate and deviated from the glass substrate 9 by being sprayed onto the glass substrate 9 and the shielding plate being interposed between the blowout port 14 and the glass substrate 9 on the peeling corresponding portion 9 b It may flow in the direction. Alternatively, a valve may be used to mechanically change the flow path of plasma gas.
When the relative velocity of the processing head 10 to the glass substrate 9 is changed, the processing head 10 is moved at a low speed when the processing head 10 is on the remaining corresponding portion 9a while blowing the plasma gas at a constant flow rate. It is good to move at high speed when you are in
According to the first embodiment, by changing the control program of the apparatus 1, it is possible to cope with various layouts of the remaining corresponding portion 9a and the peeling corresponding portion 9b. Further, according to the first embodiment, the masks 5 and 6 are unnecessary.
A plurality of processing heads 10 may be provided, and the plurality of processing heads 10 may be operated at the same time to simultaneously treat a plurality of locations on the processing surface 9s.

<Glass substrate 9 after treatment>
The surface energy of the residual corresponding portion 9a and the peeling corresponding portion 9b on the surface to be treated 9s (the surface to be attached) is different from each other, and the surface energy of the residual corresponding portion 9a is that of the peeling corresponding portion 9b. It is higher than the surface energy. Therefore, hydrophilicity (wettability) can be made high about remaining corresponding part 9a, and it can control that hydrophilicity (wettability) increases about exfoliation corresponding part 9b. Thus, the water contact angle of the remaining portion 9a is smaller than the water contact angle of the peeling portion 9b. There is a correlation between the contact angle to water and the adhesion of the water-soluble adhesive 8.

<Paste process>
As shown in FIG. 3A, after the processing step with adjustment of the processing degree, the mother polarizing plate 7 is attached to the entire surface of the surface 9s to be processed of the glass substrate 9. Of the processed surface 9s, the remaining corresponding portion 9a is sufficiently hydrophilized, so the adhesive 8 on the back surface of the mother polarizing plate 7 is firmly bonded.

<Laser cutting process>
As shown in FIG. 3B, next, the laser cutting machine 4 irradiates the laser 4a along the boundary between the remaining part 7a and the part 7b to be peeled off in the mother polarizing plate 7 to make a cut 7c.

<Peeling process>
Next, as shown in FIG. 3C, the peeling portion 7b of the mother polarizing plate 7 is peeled off. The peeling corresponding portion 9b is hardly subjected to the hydrophilization treatment, and thus can be easily peeled.
As a result, good adhesion to the remaining portion 7a and releasability (reworkability) to the peeled portion 7b can be compatible.

<Scribe Break Process>
Although illustration is omitted, a scribing line then enters a scribe line into the peeling corresponding portion 9b after peeling. Subsequently, a break device breaks the glass substrate 9 along the scribe line. Thereby, the glass substrate 9 (mother cell) is divided into a plurality of liquid crystal panels. Since a polarizing plate is already attached to each liquid crystal panel, the number of lines after that is drastically reduced, the manufacturing efficiency of the liquid crystal panel can be improved, the number of working personnel is reduced, particles are suppressed, and various sizes are easily handled You can get the benefits of
Since the remaining parts 9a are regularly arranged at equal intervals in the vertical and horizontal directions on the glass substrate 9 (mother cell), the liquid crystal panel can be easily cut out. This can improve productivity.

Next, another embodiment of the present invention will be described. The same numerals are given to a drawing about a configuration which overlaps with a form as stated above in the following embodiments, and explanation is omitted.
Second Embodiment
4 and 5 show a second embodiment of the present invention. In the surface treatment apparatus 1B of the second embodiment, the treatment head 10B has a width which is about a fraction of the width of the glass substrate 9. In the processing head 10B, a pair of electrodes 11 having a parallel plate electrode structure is provided. The downstream end of the inter-electrode space 15 is in communication with the outlet 14B at the lower end of the processing head 10B. The blower outlet 14B is in the form of a slit extending in the width direction of the processing head 10B (the direction orthogonal to the paper surface in FIG. 5). The width dimension of the blower outlet 14B is substantially equal to the width dimension W _9a of the remaining corresponding portion 9a.

  The process gas supply source 13 of the surface treatment apparatus 1B has a nitrogen supply unit 13a and an oxygen supply unit 13b separately. The supply line from the oxygen supply unit 13b joins the supply line from the nitrogen supply unit 13a via the on-off valve 13v, and is connected to the interelectrode space 15 of the processing head 10B.

The processing head 10B is moved relative to the glass substrate 9 in the moving direction (direction along the white arrow b in FIG. 4) with respect to the glass substrate 9 after being aligned with each row of the remaining corresponding portions 9a. . Thus, the processing head 10B alternately crosses over the remaining corresponding portion 9a and the peeling corresponding portion 9b. At the same time, the process gas is plasmatized in the interelectrode space 15 and blown out from the outlet 14B to be in contact with the surface 9s to be treated (plasma treatment step). In addition, the composition of the process gas is adjusted to be different from each other when the processing head 10B is on the remaining corresponding portion 9a and on the peeling corresponding portion 9b (treatment step). That is, the supply of O ₂ gas is on / off controlled in accordance with the relative position of the processing head 10 B to the glass substrate 9. More specifically, when on the remaining portion corresponding portion 9a, the process gas is made to be a mixed gas of N ₂ and O ₂ by opening the on-off valve 13v. Meanwhile, when in the peeling corresponding portion 9b is a process gas and only N ₂ by closing the opening and closing valve 13v. As a result, the remaining corresponding portion 9a can lower the surface energy, the peeling corresponding portion 9b can suppress the decrease in the surface energy, and the surface energy can be contrasted on the surface 9s to be processed.
The on-off control is easy because the remaining parts 9a are regularly arranged at equal intervals.
After the processing head 10B is moved along one row of the remaining portion 9a, the same processing is performed by shifting to another adjacent row. By reciprocating the processing head 10B the number of times corresponding to the number of rows of the remaining corresponding portion 9a, the entire area of the processing surface 9s can be processed, and the tact can be shortened compared to the first embodiment (FIGS. 1 and 2).
In the second embodiment, as in the first embodiment, the treatment step of contrasting is performed during the plasma treatment step.

Third Embodiment
6 and 7 show a third embodiment of the present invention. In the third embodiment, a treatment step for contrasting surface energy is performed prior to the plasma treatment step. That is, before the plasma treatment process, the protection mask 5 is provided on the peeling corresponding portion 9 b of the glass substrate 9 as the treatment process. The remaining portion 9a is not masked.
The material of the protective mask 5 may be metal, resin, or ceramic.
The protective mask 5 may be placed on the glass substrate 9 to be in contact with the processing surface 9 s or may be slightly floating from the glass substrate 9. It is not necessary to bond the protective mask 5 to the glass substrate 9.

After the mask, a plasma treatment process is performed by the surface treatment apparatus 1C. The processing head 10C of the surface treatment apparatus 1C and hence the electrodes 11 and the slit-like outlet 14C have a width equal to the width of the glass substrate 9. As the process gas, a mixed gas of N ₂ and O ₂ can be used as in the first embodiment. There is no need to adjust the composition as in the second embodiment. A plasma gas formed by plasma of the process gas is uniformly blown out from the entire region in the width direction of the processing head 10C.

At the same time as the blowout, the processing head 10C is moved relative to the glass substrate 9 in the moving direction b orthogonal to the width direction by the moving means 20 schematically shown in FIG. Thereby, the plasma gas contacts the remaining corresponding portion 9a, and the remaining corresponding portion 9a is subjected to plasma hydrophilization treatment. The peeling corresponding portion 9 b is not subjected to a hydrophilization treatment because the mask 5 prevents the plasma gas from contacting the plasma gas. Thereby, in the plasma treatment process after the treatment process (after mask formation), the surface energy is contrasted on the surface 9s to be treated. As a result, good adhesion to the remaining portion 7a and releasability (reworkability) to the peeled portion 7b can be compatible.
In the third embodiment, the wide remaining processing portion 10a of the entire area in the width direction of the glass substrate 9 can be processed at one time by the wide processing head 10C. By moving the processing head 10 </ b> C one-way in the length direction of the glass substrate 9, the remaining corresponding portion 9 a of the entire glass substrate 9 can be processed. Therefore, the required time (tact) of the plasma treatment process can be shortened.

  After the plasma treatment process, the mask 5 is removed. The procedure after the attachment process of the mother polarizing plate 7 thereafter is the same as that of the first embodiment.

Fourth Embodiment
FIG. 8 shows a fourth embodiment of the present invention. In the fourth embodiment, after the plasma treatment step, a treatment step for contrasting surface energy is performed.
The surface treatment apparatus 1D of the fourth embodiment has a wide processing head 10D similar to that of the third embodiment. While relatively moving the processing head 10D in the moving direction b along the longitudinal direction of the glass substrate 9, a process gas consisting of a mixed gas of N ₂ and O ₂ is supplied to the processing head 10D to be plasmatized and blown out. Contact with 9s (plasma treatment step). This increases the surface energy of the surface 9s to be treated. In addition, the plasma gas is uniformly brought into contact with the entire area of the surface 9s to be treated, whereby the entire area of the surface 9s to be treated is brought into a substantially uniform surface energy state. Therefore, even if the degree of hydrophilicity (water contact angle) of the surface 9s to be treated before the plasma treatment step varies depending on the location, the variation can be eliminated. The plasma processing step of the fourth embodiment is also a homogenization step.
Preferably, the degree of plasma treatment in the plasma treatment step (homogenization step) is weaker than the degree of plasma treatment as a treatment step described later. For example, by increasing the moving speed of the processing head 10D with respect to the glass substrate 9, the plasma processing degree can be weakened.
Alternatively, in the plasma treatment step (homogenization step), a fluorine-containing compound such as CF ₄ is contained as a process gas component, and the entire surface of the surface 9a to be treated is treated to be water repellent to reduce surface energy. Good.

  After the plasma treatment step (homogenization step), a treatment step is performed. In the treatment step, the same treatment as the plasma treatment of the first to third embodiments may be performed. For example, using the spot nozzle processing head 10 of the first embodiment (FIGS. 1 and 2), only the remaining corresponding portion 9a is subjected to plasma processing. As a result, the surface energy of the remaining portion corresponding portion 9a becomes higher than that at the end of the plasma treatment step (uniformization step). The surface energy of the peeling corresponding portion 9 b remains at the size at the end of the plasma treatment step (homogenization step). Therefore, the surface energy of the surface 9s to be treated can be contrasted.

Alternatively, as the treatment process of the fourth embodiment, as in the second embodiment (FIG. 4 and FIG. 5), the short width processing head 10B is used, and the supply of O ₂ gas is on / off controlled. The surface energy of the surface 9s may be contrasted.
Alternatively, as in the treatment process of the fourth embodiment, as in the third embodiment (FIGS. 6 and 7), after covering the protection mask 5 on the surface 9s to be treated, the plasma gas is sprayed from the wide treatment head 10C. Then, the surface energy of the surface 9s to be treated may be contrasted.

  Furthermore, the treatment process of the fourth embodiment is not necessarily limited to plasma treatment, and may be non-plasma treatment. For example, although not shown, a non-plasma gas such as air may be sprayed only on the remaining corresponding portion 9a using a spot-like nozzle. A component such as oxygen in the non-plasma gas interacts with the surface component of the remaining corresponding portion 9a activated in the plasma processing step (homogenization step) to contrast the surface energy of the processing surface 9s. Can be attached.

  As a result, the adhesion to the remaining portion 7a can be improved, and the removability (reworkability) to the peeled portion 7b can be ensured. And since the surface state of exfoliation corresponding part 9b is uniform, exfoliation part 7b can be exfoliated without the bias by a place.

Fifth Embodiment
9 and 10 show a fifth embodiment of the present invention. In the fifth embodiment, a treatment step for contrasting surface energy is performed prior to the plasma treatment step.
Specifically, the water repellent mask 6 is coated on the peeling corresponding portion 9b (treatment step). Examples of the water repellent mask 6 include resin masks such as a black matrix and a bank.

Next, a plasma treatment process is performed by the surface treatment apparatus 1E. The surface treatment apparatus 1E has a wide processing head 10E similar to that of the third embodiment (FIG. 6). As a process gas, a mixed gas of CF ₄ and N ₂ is used. The process gas is supplied from the process gas supply source 13E to the processing head 10E to be plasmatized, thereby generating a plasma gas containing fluorine-based active species and nitrogen-active species.
Instead of CF ₄ , C ₂ F ₄ , C ₂ F ₆ , C ₃ F _{8 and} other fluorine-containing compounds may be used.

  While relatively moving the processing head 10E in the moving direction b along the longitudinal direction of the glass substrate 9, the plasma gas is blown out and brought into contact with the whole area of the processing surface 9s (plasma processing step). As a result, the remaining uncorresponded portion 9a which is not masked is enhanced in surface energy by interaction with mainly nitrogen-based active species in the plasma gas and is hydrophilized. On the other hand, the surface energy of the surface of the mask 6 is reduced by the interaction with mainly the fluorine-based active species in the plasma gas, and the surface of the mask 6 is made water repellent. The peeling corresponding portion 9b below the mask 6 maintains the original surface condition.

Thereafter, the polarizing plate 7 is attached to the entire area of the processing surface 9s without removing the mask 6. The subsequent procedure is the same as that of the first embodiment.
The portion 7b of the polarizing plate 7 which covers the mask 6 can be easily peeled off by the water repellency of the mask 6, and the portion 7a of which the remaining portion 9a which is not masked is covered is the remaining portion 9a which is hydrophilized. Can be firmly attached to the

The present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention.
For example, by making the process gas composition at the time of plasma processing to the remaining corresponding portion 9a and the process gas composition at the time of plasma processing to the peeling corresponding portion 9b different from each other, the remaining corresponding portion 9a is subjected to hydrophilic treatment Water repellent treatment may be performed on the corresponding portion 9b.
Depending on the material of the adhesive and the composition of the process gas, the degree of plasma treatment of the peeling corresponding portion 9b may be larger than the plasma treatment degree of the remaining corresponding portion 9a, and the remaining corresponding portion 9a is not subjected to plasma treatment but the peeling corresponding portion Only 9b may be plasma treated. The protective mask 5 may be provided on the remaining portion corresponding portion 9a.
The film to be attached to the glass substrate 9 is not limited to the polarizing plate 7, and may be a retardation film or other optical film, and may be a protective film, a decorative film, or other various films.
The glass substrate 9 to be treated or to which a film is to be attached is not limited to the mother cell for a liquid crystal panel, and may be a glass substrate of the liquid crystal panel itself, another optical glass substrate, or a general-purpose glass substrate.
The substrate to be treated is not limited to the mother cell of the liquid crystal panel and other glass substrates, and may be an optical film, a wafer or the like.

  The present invention can be applied to, for example, a production line of a liquid crystal panel.

1, 1 B to 1 E Surface treatment apparatus 2 Substrate support means 4 Laser cutting machine 5 Mask 7 Polarizer (film)
7a Remaining part 7b Peeling part 8 Adhesive 9 Glass substrate (substrate to be treated)
9a Remaining corresponding portion 9b Peeling corresponding portion 9c Cut 9s treated surface (surface to be stuck)
10, 10 B to 10 E Processing Heads 11, 11 H, 11 E Electrodes 12 Power Source 13 Process Gas Supply Source 14, 14 B, 14 C Outlet 20 Moving Means

Claims (9)

A method of surface-treating a substrate to be treated, to which a film including a remaining portion and a portion to be peeled is attached to a surface to be treated via an adhesive before the attachment,
A plasma processing step of plasmatizing a process gas and contacting the surface to be processed;
A treatment step of performing treatment to make the surface energy of the remaining portion corresponding to the remaining portion to be attached and the peeling corresponding portion to which the portion to be peeled be different from each other during or before or after the plasma treatment step ,
A surface treatment method comprising: The process gas converted into plasma is blown out from a processing head movable relative to the substrate to be brought into contact with the processing surface,
The surface treatment method according to claim 1, wherein the degree of plasma treatment is made different between when the treatment head is directed to the remaining portion corresponding portion and when it is directed to the peeling portion. The process gas converted into plasma is blown out from a processing head movable relative to the substrate to be brought into contact with the processing surface,
The surface treatment method according to claim 1, wherein the composition of the process gas is made different from each other when the processing head is directed to the remaining corresponding portion and when directed to the peeling corresponding portion.   The surface treatment method according to claim 1, wherein the plasma treatment step is performed after covering one of the peeling corresponding portion and the remaining portion corresponding portion with a protective mask.   The surface treatment method according to any one of claims 1 to 4, wherein the treatment step is performed after the plasmatized process gas is uniformly brought into contact with the entire area of the surface to be treated. After providing a water repellent mask on the part corresponding to peeling,
Performing the plasma treatment step with a process gas that raises the surface energy of the surface to be treated by plasmatization;
The surface treatment method according to claim 1, wherein the water repelling mask has a reduced surface energy due to the interaction with the plasmatized process gas. An apparatus for surface-treating a substrate to be treated on which a film including a remaining portion and a portion to be peeled is attached to a surface to be treated through an adhesive before the attachment,
A plasma processing unit configured to plasmat a process gas and contact the processing surface;
A treatment is performed to make the surface energy of the remaining portion on the surface to be treated to be attached be different from the surface energy of the peeling corresponding portion to be attached, during or before or after the processing by the plasma processing unit. Department,
A surface treatment apparatus comprising: It is a glass substrate which has a to-be-adhered surface on which a film including a remaining part and a part to be peeled off is attached via an adhesive,
The glass substrate characterized in that surface energy of a remaining corresponding portion to which the remaining portion is pasted and a peeling corresponding portion to which the peeled portion is pasted in the bonded surface are different from each other.   The glass substrate according to claim 7, wherein the surface energy of the remaining corresponding portion is higher than the surface energy of the peeling corresponding portion.

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