TW201529495A - Scribe device for brittle material substrate - Google Patents

Abstract

The present invention provides a scribe device capable of having better precision scribing performed by an upper cutter wheel and a lower cutter wheel without making a mother substrate drop off and move up and down of. The scribe device comprises: a front belt conveyor 1a and a rear belt conveyor 1b, which are serially connected and disposed on the same plane and spaced apart at a preset gap P for loading and transporting the brittle material substrate M as a processed target; the upper cutter wheel 2a and the lower cutter wheel 2b, provided at the gap P of the above-described front belt conveyor 1a and rear belt conveyor 1b; and an upper air election member 8a and a lower air ejection member 8b, provided in the interior of the gap P, and on lateral side portions of the upper cutter wheel 2a and the lower cutter wheel 2b in order to eject air toward the upper and lower sides of the brittle material substrate M.

Description

Scribing device for fragile material substrate

The present invention relates to a scribing device for a brittle material substrate such as a glass substrate or a semiconductor substrate. More particularly, the present invention relates to a scribing apparatus for a mother substrate for a liquid crystal display panel to which a glass substrate is bonded.

The mother substrate for the liquid crystal display panel uses two large-area glass substrates to form a color filter on one substrate, and a TFT (Thin Film Transistor) and a terminal region for driving the liquid crystal on the other substrate. The substrate is bonded together. Further, through the scribing step and the severing step, the unit display panels are separated into one unit, and the liquid crystal display panel as a product is cut out.

In general, in the step of cutting out the unit display panel from the mother substrate, the cutter wheel (also referred to as a scoring wheel) is relatively moved while being pressed against the surface of the mother substrate and the back surface by pressing the predetermined line. A scribe step of forming a scribe line in the X direction and the Y direction orthogonal to each other. Thereafter, the substrate is deflected by applying an external force along the scribe line to completely break the mother substrate into a breaking step of each unit display panel.

For example, Patent Document 1 and Patent Document 2 disclose a scribing device that performs the above-described scribing step in such a manner that the above-described scribing step is performed simultaneously on both the upper and lower surfaces without reversing the large-area substrate.

Fig. 6 is a view schematically showing a conventional step of performing a scribing step on both upper and lower sides A front view of the scoring device.

In the scribing device, a pair of front and rear conveyor belts 21a and 21b for transporting the mother substrate M and transporting them in the Y direction are disposed in series at intervals. Between the front and rear conveyor belts 21a and 21b, an upper cutter wheel 22a and a lower cutter wheel 22b for processing the scribe lines orthogonal to each other on the front and back surfaces of the mother substrate M are disposed. The upper cutter wheel 22a and the lower cutter wheel 22b are simultaneously pressed in the X direction (the front and rear directions in FIG. 6) while simultaneously pressing the front surface and the back surface of the mother substrate M, and are processed on the front and back surfaces of the mother substrate M as shown in FIG. (a) The scribe line S1 in the X direction as shown. Thereafter, the mother substrate M is rotated by 90 degrees, and the cutter wheels 22a and 22b are rolled in the same manner as described above, and the scribe line S2 in the Y direction as shown in Fig. 7(b) is processed. The processing of the scribe line S2 in the Y direction may be performed by rotating the scribe line S1 in the X direction and rotating the orientation of the cutter wheels 22a and 22b by 90 degrees to roll. Further, in this case, after the scribing line S2 in the Y direction is processed, the orientation of the cutter wheels 22a and 22b may be rotated by 90 degrees to process the scribing line S1 in the X direction.

The mother substrate M in which the scribe lines S1 and S2 in the X direction and the Y direction are formed in this manner is sent to the rupture device and is cut off from each scribe line. After the unit product M1 is taken out, the edge portion is taken out. The end material area M2 is discarded.

Patent Document 1: International Publication WO2005/087458

Patent Document 2: Japanese Laid-Open Patent Publication No. 2010-052995

In the above-described scribing apparatus, a certain interval for arranging the upper and lower cutter wheels 22a and 22b is necessary between the front conveyor belt 21a and the rear conveyor belt 21b before the mother substrate M is conveyed. Since the mother substrate M is supported by the front and rear conveyor belts 21a and 21b at the time of scribing, when the thickness of the mother substrate M is thin, there is a case where the mother substrate M is dropped downward (downward). Further, the surface of the wheel body or the belt of the belt of the bridge conveyor belt is difficult to improve the machining accuracy and the fine unevenness remains. Therefore, when the mother substrate M spanning between the conveyor belts is thin, it is affected by the unevenness of the belt. High and low fluctuations, etc.

When the mother substrate M is sagged by the upper and lower cutter wheels 22a and 22b in a state in which the mother substrate M is sagged or swelled, the cracks are irregularly generated, and damage such as a notch occurs, which is a cause of defective products. In particular, in recent years, the mother substrate for a liquid crystal display panel to be processed has been required to be a thin plate having a thickness of 0.1 to 0.15 mm for low power, high efficiency, and precision, and this problem has been solved.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a mother substrate which can be scribed without any accuracy as described above, even if it is a mother substrate having a thickness of about 0.1 mm, for example, without causing drooping or high and low undulations as described above. Device.

In order to solve the above problems, the scribing device of the present invention includes the following members: a front conveyor belt and a rear conveyor belt, which are arranged in series at a predetermined interval on the same horizontal surface, and are placed in a processing target. The brittle material substrate is transported; the upper cutter wheel and the lower cutter wheel are disposed between the front conveyor belt and the rear conveyor belt; and the upper air discharge member and the lower air discharge member are disposed at the front conveyor A side portion of each of the belt and the rear conveyor belt, the upper cutter wheel and the lower cutter wheel, ejects air toward the upper and lower surfaces of the brittle material substrate.

It is preferable that the air ejection pressure generated by the upper and lower air ejection members is set such that the air ejection pressure generated by the lower air ejection member is stabilized so that the brittle material substrate to be processed is stable in a floating state. The air ejection pressure generated by the upper air ejecting member is equivalent to the amount of pressure against the substrate itself, and can be contactless and horizontally Maintain a brittle material substrate.

According to the present invention, when the scribing is performed by the upper and lower cutter wheels, the mother substrate between the front and rear conveyor belts can be non-contacted and horizontally held by the ejection air from the upper and lower air ejecting members. Since it is supported, even if the mother substrate is as thin as the one itself, it can be horizontally positioned and accurately scribed. In addition, it is possible to alleviate the adverse effects due to the accuracy of processing or adjustment of the conveyor belt before and after the adjacent connection. Further, the substrate is not sandwiched by a clamp, and the substrate is floated, whereby uneven stress is generated in the vicinity of the clip, and high-precision processing can be performed.

In the above invention, the upper and lower air ejection members may be formed along a gap between the front conveyor belt and the rear conveyor belt, and fixed to the frame of the scoring device, or may be set to be ejected around the cutter wheel. The length is installed on the scribe head of the retaining cutter wheel to move together with the cutter wheel. In particular, in the latter case, there is also an effect of being able to suppress the amount of air consumption in a large-area substrate which is difficult to adjust the position.

A‧‧‧ scoring device

M‧‧‧ mother substrate (brittle material substrate)

S1‧‧‧X direction marking

Scribing in the direction of S2‧‧‧Y

Gap between conveyor belts before and after P‧‧

1a‧‧‧Front conveyor belt

1b‧‧‧ rear conveyor belt

2a‧‧‧ upper cutter wheel

2b‧‧‧ lower cutter wheel

3a, 3b‧‧‧holding

4a, 4b‧‧‧ scratched head

8a‧‧‧Upper air ejection member

8b‧‧‧Lower air ejection member

9‧‧‧Architecture

10‧‧‧Air venting holes

11a, 11b‧‧‧ support arm

Fig. 1 is a perspective view showing an example of a scoring apparatus of the present invention.

Figure 2 is a front elevational view of the scoring apparatus shown in Figure 1.

Figure 3 is a plan view of the scoring apparatus shown in Figure 1.

Fig. 4 is a cross-sectional front elevational view showing the principal part of another embodiment of the scoring apparatus of the present invention.

Figure 5 is a plan view of the scoring apparatus shown in Figure 4.

Fig. 6 is a front elevational view showing an example of a conventional scoring apparatus.

Fig. 7 is a plan view showing the order in which the brittle material substrate (mother substrate) is scribed.

Hereinafter, details of the scoring apparatus of the present invention will be described with reference to Figs.

In addition, the scribing device of the present invention is not particularly limited as long as it is processed on both sides of the substrate to be processed, but a mother substrate for a liquid crystal display panel having a large area in which a glass substrate is bonded is described as an example. . Hereinafter, the bonded mother substrate for a liquid crystal display panel will be simply referred to as "mother substrate M".

The scribing apparatus A includes a pair of front conveyor belts 1a and a rear conveyor belt 1b for carrying the mother substrate M and transporting it in the Y direction of FIG. The front conveyor belt 1a and the rear conveyor belt 1b are disposed in series on the same horizontal plane and in the Y direction so as to be disposed with the gaps P between the cutter wheels 2a and 2b and the air ejection members 8a and 8b described below. The front conveyor belt 1a and the rear conveyor belt 1b are conveyor belts for the belt to rotate between the wheel bodies.

Between the front conveyor belt 1a and the rear conveyor belt 1b, an upper cutter wheel 2a and a lower portion for machining the scribe lines S1 and S2 (see FIG. 7) in the X direction and the Y direction on the front and back surfaces of the mother substrate M are disposed. Knife wheel 2b. The upper cutter wheel 2a and the lower cutter wheel 2b are respectively attached to the upper and lower scribe heads 4a and 4b so as to be movable up and down through the holders 3a and 3b. Further, the scribing heads 4a, 4b are mounted to reciprocate in the X direction along the guide members 7 formed on the horizontal beams (beams) 6a, 6b of the portal type bridge 5. For example, once the scribe heads 4a, 4b are moved in the X direction along the beams 6a, 6b, the scribe lines in the X direction can be processed, and further, once the mother substrate M is made by the front conveyor belt 1a and the rear conveyor belt 1b When moving in the vertical direction (Y direction) with respect to the beams 6a and 6b, the scribe line in the Y direction can be processed. Further, in the case where the mother substrate M is disposed to be inclined with respect to the beams 6a, 6b, the movement of the scribe heads 4a, 4b in the direction of the beams 6a, 6b is combined with the mother substrate M with respect to the beam 6a, 6b moves in the vertical direction, and can process the scribe lines in the X direction and the Y direction.

Further, in the present invention, in the gap P between the front conveyor belt 1a and the rear conveyor belt 1b, the upper air discharge member 8a and the lower discharge member 8b are provided at the side portions of the upper cutter wheel 2a and the lower cutter wheel 2b. .

The air ejecting members 8a and 8b are extended in the X direction along the traveling direction of the upper and lower cutter wheels 2a and 2b, and are fixed to the left and right frames 9 of the scribing device A. In addition, the air ejection hole 10 is provided so as to face the mother substrate M to be processed, and high-pressure air from an air supply source (not shown) such as a compressor is ejected from the air ejection hole 10.

In addition, the air from the air ejection holes 10 of the upper and lower air ejection members 8a and 8b is set so as to be equal to the discharge pressure of the mother substrate M to be processed, so that the air can be supported without contact and horizontally. The mother substrate M between the front and rear conveyor belts 1a, 1b.

In the above configuration, the mother substrate M is placed on the front conveyor belt 1a and the rear conveyor belt 1b during the machining, so that the upper cutter wheel 2a and the lower cutter wheel 2b are pressed against the front and back of the mother substrate M. The two-sided state is rolled in the X direction, thereby processing the scribe line S1 in the X direction. Once all the processing of the scribe line S1 in the X direction is completed, the mother substrate M is rotated by 90 degrees and placed on the conveyor belts 1a, 1b again, and the upper and lower cutter wheels 2a, 2b are made in the same manner as described above. The paper is rolled while being pressed against both sides of the front and back of the mother substrate M to process the score line S2 in the Y direction. Further, the cutter wheels 2a and 2b may be rotated by 90 degrees without rotating the mother substrate M, and the cutter wheels 2a and 2b may be rolled by moving the mother substrate M in the Y direction.

At the time of the processing of the scribe lines S1 and S2, the mother substrate M is supported without being contacted and horizontally by being ejected by the air ejected from the upper and lower air ejecting members 8a and 8b, so that the mother substrate is, for example, thick. For a thin plate of 0.1 mm, it is also possible to perform the horizontal posture without sagging, and the scribe can be accurately performed. In addition, it will not be processed by adjacent conveyor belts 1a, 1b. The impact of accuracy. Further, the substrate itself is free from being clamped by the clip, and is not affected by local stress.

4 and 5 are views showing a scribing device according to another embodiment of the present invention, FIG. 4 is a cross-sectional view of a main portion, and FIG. 5 is a plan view.

In this embodiment, the upper and lower air ejection members 8a and 8b are set to be ejected only around the cutter wheels 2a and 2b, and are formed to move together with the cutter wheels 2a and 2b. Specifically, the upper and lower air ejection members 8a and 8b are attached to the upper and lower scribed heads 4a and 4b through the support arms 11a and 11b, respectively.

By this, the upper and lower air ejection members 8a and 8b are moved together with the movement of the upper and lower cutter wheels 2a and 2b, and the portion of the mother substrate M to which the cutter wheels 2a and 2b are pressed can be horizontally held without contact. The scribing is performed with high precision as in the above embodiment. Especially in the case of this embodiment, there is an effect that the amount of air consumption can be suppressed. Further, in the apparatus for a large-area substrate, in the apparatus described in FIGS. 1 to 3, since the length of the air ejecting member is long, the adjustment work becomes difficult, but if it is attached to the scribing head, In the embodiment, since the air ejection member can be made short, it is suitable for a large area.

Although the representative embodiments of the present invention have been described above, the present invention is not limited to the configuration of the above-described embodiments. For example, in the above embodiment, the air ejecting members 8a and 8b are respectively provided at the side portions on both sides of the upper and lower cutter wheels 2a and 2b, but they may be omitted from one side and provided only on the one side side portion.

Further, the air ejection holes 10 of the air ejection members 8a and 8b may be formed by vent holes of a porous plate material having gas permeability.

In addition, in the present invention, it is possible to achieve the purpose without departing from the scope of the patent application. Local corrections and changes.

The present invention can be applied to a scribing device for scribing two sides of a brittle material substrate such as a glass substrate, a semiconductor substrate, or a bonded substrate for a liquid crystal display panel.

A‧‧‧ scoring device

M‧‧‧ mother substrate (brittle material substrate)

Gap between conveyor belts before and after P‧‧

1a‧‧‧Front conveyor belt

1b‧‧‧ rear conveyor belt

2a‧‧‧ upper cutter wheel

2b‧‧‧ lower cutter wheel

3a, 3b‧‧‧holding

4a, 4b‧‧‧ scratched head

6a, 6b‧‧ ‧ beams (beams)

8a‧‧‧Upper air ejection member

8b‧‧‧Lower air ejection member

Claims (4)

A scribing device comprising: a front conveyor belt and a rear conveyor belt, which are arranged in series at a predetermined interval on the same horizontal surface to carry and transport the brittle material substrate to be processed; the upper cutter wheel and the lower portion a cutter wheel disposed between the front conveyor belt and the rear conveyor belt; and an upper air ejection member and a lower air ejection member disposed between the front conveyor belt and the rear conveyor belt, the upper cutter wheel and The side portions of each of the lower cutter wheels are sprayed with air toward the upper and lower sides of the brittle material substrate. The scoring device of the first aspect of the invention, wherein the air ejection pressure generated by the lower air ejecting member is set to be higher than that of the brittle material substrate to be processed in a state of being floated The air ejection pressure generated by the upper air ejecting member is equivalent to the amount of pressure against the substrate itself. The scoring device of claim 1 or 2, wherein the upper and lower air ejecting members are formed along a gap between the front conveyor belt and the rear conveyor belt and are fixed to the frame of the scoring device. The scoring device of claim 1 or 2, wherein the upper and lower air ejecting members are set to a length ejected around the cutter wheel, and are mounted on the scribing head of the retaining cutter wheel to The wheel moves together.