TW202017878A - Device for preventing dust scattering and substrate machining apparatus having the same - Google Patents

Abstract

Provided is a substrate processing device having a device for preventing dust scattering and a device for preventing dust scattering capable of preventing minute foreign substances such as dust in a substrate processing process from adhering to a substrate, thereby obtaining a high quality product. The present invention has the device for preventing dust scattering (15A) for a processing part and the device for preventing dust scattering (14A, 16A) for a transferring part. The device for preventing dust scattering has a cover (15) covering a substrate processing part with a space therebetween and a pressure reducing means for always reducing a pressure in the space in the cover (15). The devices for preventing dust scattering (14A, 16A) for the transferring part have covers (14, 16) for covering a surface of the substrate (W) with a space therebetween and a pressing means for always pressing the spaces in the covers (14, 16).

Description

Device for preventing dust scattering and substrate processing device provided with the device for preventing dust scattering

The present invention relates to a dust scattering prevention device suitable for a substrate processing device for processing a scribe line (groove) on a brittle material substrate such as glass, or for cutting a substrate along the scribe line, and the dust scattering prevention device Substrate processing device. In particular, the present invention relates to a dust scattering prevention device used for a substrate processing device which is flexible during the manufacturing process of a flexible OLED (Organic Light Emitting Diode) display and has a flexibility to a surface area layer on a glass substrate The mother substrate of the resin film (polyimide film (also called PI film)) of the base material is processed with a scribe line, or the mother substrate is broken.

In the process of cutting a brittle material substrate such as a glass substrate, it is known to press a cutter wheel against the surface of the substrate to form a scribe line, and then apply it along the scribe line from the surface opposite to the scribe line forming surface An external force deflects the substrate, thereby breaking it into individual unit substrates (see Patent Document 1).

In recent years, since the display is required to be more precise, it is necessary to further improve the surface quality and end strength of the substrate. In addition, from the viewpoint of expanding the use of displays, there is also a need to make displays flexible, thereby manufacturing OLEDs using flexible substrates. In such an OLED display, a resin film (PI film) is formed on a glass substrate during the manufacturing process, and then an organic film having an electrode layer or an organic EL layer is formed thereon. The thickness of the electrode layer, organic EL layer, etc. is thin and the composition is very fine. Therefore, even if the foreign matter adhering to the surface of the resin film is extremely small, it will also cause defects and cause a decrease in yield.

In order to obtain high-quality and highly productive OLED display manufacturing technology, it is necessary to avoid damage to the glass plate on which the resin film (PI film) is formed before the organic film is formed, or the attachment of tiny foreign objects such as dust. In other words, damage to the glass plate may cause deterioration of strength, and the attached foreign matter may be carried until the organic film formation step and cause deterioration of the working environment. In addition, if damage or tiny foreign matter adheres to the back of the glass plate, it is likely to cause a peeling defect in the lift-off step of separating the glass substrate and the resin film of the product after forming the organic film, Therefore, it is necessary not only to avoid damage or adhesion of dust on the front side (organic film forming side) of the glass substrate, but also to avoid damage or adhesion of dust on the back side. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 5210356

[Problems to be solved by the invention]

In general substrate processing equipment, fine dust and other dust generated during scribing or cutting will adhere to the front and back sides of the substrate and be carried to the next step, thus becoming the product quality deterioration A big reason. In addition, when the substrate to be processed is moved to the scribing position, the substrate is placed on the upper surface of the conveyor belt or the stage and transported, so the back surface of the substrate is in contact with the surface of the conveyor belt or the stage at any time. In addition, during scoring, the back surface of the substrate on the left and right sides of the substrate is also held by the conveyor belt or the stage, so the back surface of the substrate is still in contact with the conveyor belt or the stage surface. In this case, the longer the contact time or the longer the moving distance in the contact state, the greater the probability of small damage on the back of the substrate, and tiny foreign objects such as dust on the conveyor belt or stage are attached to The greater the probability of the back of the substrate, which leads to a decrease in yield, which hinders the manufacture of high-precision and high-quality products.

Therefore, an object of the present invention is to provide a dust scattering prevention device capable of preventing dust from scattering and adhering to a substrate during the transportation or processing of a substrate, thereby obtaining high-quality products, and a substrate processing device provided with the dust scattering prevention device . [Technical means to solve the problem]

In order to solve the above-mentioned problems, in the present invention, the following technical means are adopted. That is, the dust scattering prevention device of the present invention is configured to prevent dust from being generated in the substrate processing portion and the substrate transport portion of the substrate processing device, and includes a processing portion formed in the substrate processing portion A dust scattering prevention device, and a dust scattering prevention device for a conveying part formed in the substrate conveying part, wherein the dust scattering prevention device for a processing part includes an outer cover covering the substrate processing part with a space, and an inner cover of the outer cover at any time The decompression means for decompression of the space, the dust scattering prevention device for the conveying section includes an outer cover that covers the surface of the substrate to be conveyed by a space, and a pressure means that pressurizes the space in the cover at any time. Here, it is preferable that the above-mentioned decompression means is formed to perform decompression by a gas vacuum mechanism that sucks the gas in the housing, and the above-mentioned pressure means is formed by the gas from the opening of the housing The inflow port injects pressurized gas into the housing to apply pressure. [Effect of invention]

As described above, the internal space of the outer cover covering the substrate processing portion is depressurized by the gas vacuum mechanism at any time, so the gas vacuum mechanism can be used to suck and remove fine foreign objects such as dust floating in the interior, keeping the inside of the outer cover clean and preventing Dust and other dust generated during the processing of the substrate adhere to the substrate. In addition, even if the substrate is in the process of being transported by the substrate, the space inside the outer cover of the dust scattering prevention device for the transfer portion is pressurized at any time, so that the dust can be prevented from flowing into the outer cover from the outside. Thereby, there is an effect that, in addition to the effect of the above-mentioned processing portion, it is possible to prevent fine foreign matters such as dust from adhering to the substrate, and it is possible to process products with high accuracy and excellent quality.

In addition, the present invention is a substrate processing device for processing a scribe line on a substrate, characterized by comprising a scoring mechanism section for processing a scribe line on the substrate, and the scoring mechanism section is provided with dust for the processing section The anti-scattering device is provided with an anti-dust scattering device for the transport part in the upstream transport part that transports the substrate to the scoring mechanism part, the downstream transport part that transports the substrate from the scoring mechanism part, or both. In this case, a breaking mechanism for breaking the substrate may be set instead of the scribing mechanism, and a substrate processing device equipped with these two mechanisms may be used.

In the substrate processing apparatus, the scoring mechanism part or the breaking mechanism part as the processing part is covered with the dust cover of the processing part by the dust scattering prevention device, and its internal space is decompressed by the gas vacuum mechanism at any time, so the gas vacuum mechanism can be used to Dust and other small foreign objects floating inside are sucked and removed to keep the inside of the cover clean. In addition, even if the substrate is in the process of being transported by the substrate, the space inside the outer cover of the dust scattering prevention device for the transfer portion is pressurized at any time, so that the dust can be prevented from flowing into the outer cover from the outside. This has the effect of preventing fine foreign matters such as dust from adhering to the substrate during the transportation process and the processing process, so that products with high accuracy and excellent quality can be processed.

Preferably, the configuration is such that the scoring mechanism includes: a cutter wheel that rotates while pressing one surface of the substrate; and a support roller that faces the cutter wheel and supports the surface on the opposite side of the substrate; In addition, the gas suction port of the gas vacuum mechanism is disposed in a position along the moving path of the cutter wheel. Thereby, dust such as cutting powder generated by the rotation of the cutter wheel during the scribing process can be efficiently sucked, and contamination in the outer cover can be suppressed.

Hereinafter, an embodiment of the dust scattering prevention device and the substrate processing device of the present invention will be described in detail with reference to the drawings. FIG. 1 is a side view schematically showing the entire substrate processing apparatus A including the dust scattering prevention devices 14A, 15A, and 16A of the present invention, and FIG. 2 is a plan view thereof.

The substrate processing apparatus A includes: an upstream conveying section B that linearly conveys the substrate W to be processed from upstream to downstream in a horizontal posture; and a scoring/breaking mechanism section C as a substrate processing section that is orthogonal to the conveying direction A scribe line is processed on the back surface of the substrate W that has been transported in the direction of the scribe line, and the substrate W is divided along the scribe line; and a downstream transfer section D, which transfers the divided substrate W downstream. Further, on the upstream side of the upstream conveyance section B, a substrate supply section E for supplying the substrate W to be processed to the upstream conveyance section B of the substrate processing apparatus A is arranged. In addition, hereinafter, let the conveyance direction of the board W be X direction, and let the direction orthogonal to it be Y direction.

The substrate W processed by the substrate processing device A is used as a mother substrate in the manufacturing process of the OLED display. As shown in FIG. 5, an organic film for forming a flexible substrate is formed on the upper surface of the glass plate W2 With a thin resin film W1. In addition, a region where the resin film W1 is not provided is formed in a strip shape along the planned scribe line L. As the resin film W1, a polyimide film (PI film) is used.

The upstream conveying section B of the substrate processing apparatus A includes: a floating table 1 that floats the substrate W in a horizontal posture by ejecting air pressure; and a jig 2 that holds the upstream edge of the floating substrate W and holds the substrate W is transported downstream. The jig 2 is supported by a beam member 2a extending in the Y direction, and the beam member 2a is mounted so as to be movable with respect to left and right rails 2b, 2b arranged in parallel along the transport direction (X direction) of the substrate W. In this embodiment, as a floating mechanism (air floatation means) for ejecting gas from the floating table 1 to float the substrate W to float the substrate W, although a plurality of small openings formed on the upper surface of the floating table 1 are formed The hole 1a constitutes a nozzle for gas ejection, but a gas ejection nozzle may be separately provided along the floating table 1. In addition, the floating platform 1 is installed on the base frame 10.

The scoring/breaking mechanism portion C includes a gate-shaped bridge 3 arranged so as to cross the substrate W to be transported. As shown in FIGS. 3 and 4, on the bridge 3, a pair of upper and lower guide rails 4 a and 4 b are arranged along the Y direction in such a way that the substrate W is transported from above and below. The upper scoring head 5a is installed in a manner of moving up and down and can be adjusted by a lifting mechanism (not shown), and can be moved in the Y direction and can be moved up and down by a lifting mechanism (not shown) on the lower rail 4b The lower scoring head 5b is installed in the manner of movement adjustment.

In addition, on the upper scoring head 5a, a support roller 6 having a flat outer peripheral surface is installed in such a manner that it can be adjusted up and down by a lifting mechanism (not shown), and on the lower scoring head 5b, the lifting mechanism can be used (Not shown) A cutter wheel 7 for scoring and a roller 8 for breaking are installed in the way of vertical adjustment. The breaking roller 8 has a V-shaped groove 8a on the outer peripheral surface (see FIG. 9 ). Furthermore, the upper guide 4a is provided with a cleaner 9 that sucks and removes minute foreign substances after the scribe line is formed so as to be movable in the Y direction through the head 9a. As shown in FIG. 6, the cleaner 9 includes an elongated gas suction port 9b whose longitudinal direction is the X direction, and a plurality of gas blowout ports 9c for blowing gas around the gas suction port 9b. 9 Move along the scribe line above the scribe line of the substrate W, use the gas suction port 9b to suck fine foreign matters such as dust, and use the blow-out gas from the gas blowout port 9c to prevent the substrate W and the lower surface of the cleaner 9 Closed. This prevents the dust from flowing into the outer cover, thereby reducing the internal scattering of dust and other small foreign objects, preventing the dust from adhering to the substrate, and thereby obtaining high-precision and high-quality products.

The downstream conveying section D of the substrate processing apparatus A, like the above-described upstream conveying section B, includes: a floating table 11 that floats the substrate W in a horizontal posture by the ejected air pressure from the small hole 11a; and a jig 12 that holds The downstream end of the floating substrate W conveys the substrate W downstream. The jig 12 is supported by a beam member 12a extending in the Y direction, and the beam member 12a is mounted so as to be movable relative to the left and right rails 12b, 12b arranged in parallel along the X direction. In addition, on the downstream side of the floating table 11, a discharge conveyor 13 for discharging the separated substrates Wa and Wb to the outside of the substrate processing apparatus A is provided.

Further, in the substrate processing apparatus A, the upstream conveying section B, the scoring/breaking mechanism section C, and the downstream conveying section D are provided with a dust scattering preventing device 14A for the upstream conveying section that prevents the scattering of minute foreign substances such as dust 1. A dust scattering prevention device 15A for the processing section and a dust scattering prevention device 16A for the downstream conveying section. These dust scattering prevention devices 14A, 15A, 16A are provided with outer covers 14, 15, 16 covering the upstream conveying part B, the scoring/breaking mechanism part C, and the downstream conveying part D, and are provided in the respective outer covers 14, 15, 16 There are entrances 14a, 15a, and 16a for taking in the substrate W. In addition, shutters 14b, 15b, and 16b that can be opened and closed are attached to each entrance.

The dust scattering prevention devices 14A and 16A in the upstream conveying part B and the downstream conveying part D are provided with pressurizing means for pressurizing the internal spaces of the outer covers 14 and 16 at any time. As this pressurizing means, in this embodiment, it is constructed in such a manner that pressure gas inlets 17 and 18 for injecting pressure gas are provided on the tops of the housings 14 and 16 and from the pressure gas inlets 17 and 18 The pressurized gas is injected into the covers 14 and 16. In addition, in order to allow the gas to be continuously supplied, a small slit-shaped opening (not shown) is formed in the side walls of the housings 14 and 16 to discharge a part of the gas. This prevents dust from flowing in from the scoring/breaking mechanism portion C or the outside, reduces internal scattering of dust and other minute foreign substances, and prevents dust and the like from adhering to the substrate W. In addition, in the dust scattering prevention device 15A for the processing section of the scoring/breaking mechanism section C, the internal space of the cover 15 is decompressed by decompression means at any time. As this decompression means, in this embodiment, it is configured such that a gas vacuum mechanism 19 is arranged in the internal space, and gas suction by the gas vacuum mechanism 19 is used to decompress the inside of the outer cover 15. By this, fine foreign matters such as dust and the like generated during the processing of the scribe line and the breaking step are sucked and removed to prevent contamination inside the outer cover 15. In particular, the generation of dust occurs more frequently when the scribing process is performed by the cutter wheel 7, so as shown in FIGS. 2 and 4, it is preferable to arrange the gas of the gas vacuum mechanism 19 at a position along the movement path of the cutter wheel 7 Suction port. With such a design, dust such as cutting powder generated during the scoring process can be efficiently sucked, and the pollution in the outer cover 15 can be reduced.

Furthermore, inside the outer covers 14 and 16 of the upstream conveying portion B and the downstream conveying portion D, a charge prevention device (Ionizer) 20 is provided to prevent the substrate W or flying dust from being charged. The charge prevention device 20 is preferably a photo-ionizer that uses soft X-rays that do not generate ozone, and the charge prevention device 20 is provided with pluralities along the conveyance direction of the substrate W on the lower surface of the top of the outer covers 14 and 16 Pcs. By installing the charge prevention device 20 in the sealed outer covers 14 and 16, it is possible to achieve efficiency in removing electricity and prevent external leakage of soft X-rays.

In addition, a plurality of sensors 21 that detect the distance between the floating substrate W and the floating tables 1 and 11, that is, the amount of floating, are provided at fixed intervals in the substrate transport area of the upstream transport unit B and the downstream transport unit D. If an abnormality of the floating amount is detected, the pressure of gas ejection is increased or decreased, so that the floating position can be maintained at any time. In addition, if the floating platforms 1, 11 are divided into a plurality of blocks, the sensor 21 and the plurality of small holes 1a, 11a are formed in each block, and the amount of gas ejected can be adjusted for each block, the floating can be adjusted more finely posture.

In this embodiment, a lifter having a hook claw 22 is used for the substrate supply part E that supplies the substrate W to the floating table 1 of the upstream transfer part B. The hook claw 22 can be moved up and down and forward and backward by a driving mechanism (not shown). And the contact surface with the substrate W is small. Alternatively, for example, the substrate W may be fed by a conveyor belt, crank claw, or the like.

The small holes 1a, 11a for gas ejection on the floating tables 1, 11 in the substrate processing apparatus A, the gas suction port 9b and the gas blowing port 9c of the cleaner 9, the upstream conveying section B, and the downstream conveying section D The pressure gas inlets 17, 18 of the 14 and 16 and the gas vacuum mechanism 19 of the outer cover 15 are connected to a gas source (not shown) via pipes.

Next, based on FIGS. 2 and 8 to 17, the operation of the substrate processing apparatus A will be described in order. 2 shows a state where the substrate W is about to be fed into the substrate processing apparatus A, and the substrate W is placed on the substrate with the posture of the predetermined line L facing the Y direction and the glass plate W2 of the substrate W (see FIG. 5) as the lower side The hook claw 22 of the supply part E. Then, the shutter 14b of the upstream port 14a of the upstream transport section B is opened, the hook 22 is extended, and the substrate W is transported onto the floating table 1 of the upstream transport section B. Thereafter, the claw 22 is returned to the original position, the shutter 14b is closed, the substrate W is floated, and the upstream end portion is held by the jig 2 (see FIG. 11 ).

Next, the shutters of the downstream port 14a of the upstream conveying section B, the ports 15a, 15a on both sides of the scoring/breaking mechanism section C, and the upstream port 16a of the downstream conveying section D are opened, so that the jig 2 is directed downstream By this movement, the substrate W is lifted while being conveyed, until the planned scribing line L of the substrate W reaches the position directly above the cutter wheel 7 of the scribing/breaking mechanism portion C. At this position, the downstream end of the substrate W is held by the downstream jig 12 and the substrate W is held in a horizontally floating posture on the upstream and downstream sides with good stability (see FIGS. 12 and 7) .

Next, as shown in FIG. 8, the cutter wheel 7 and the support roller 6 of the scoring/breaking mechanism portion C are brought into contact with the surface of the floating substrate W, and the upper and lower scoring heads 5 a are pressed while pressing the cutter wheel 7. 5b moves along the guide rails 4a and 4b, thereby processing the scribe line L1 along the Y direction (see FIG. 13).

Next, as shown in FIG. 9, the scoring heads 5 a and 5 b are moved to the original position together with the upper support roller 6 while the cutter wheel 7 is retracted and the breaking roller 8 is pressed against the scoring line L1. As a result, the substrate W flexes and is broken along the scribe line L1 (see FIG. 14 ). In this way, by one round trip of the scribe heads 5a, 5b, the processing of the moving scribe line L1 and the breaking along the scribe line L1 can be performed.

Thereafter, as shown in FIGS. 10 and 15, the cleaner 9 is moved along the scribe line L1 of the substrate W in the Y direction so as not to come into contact with the substrate W, whereby the scoring is performed by the gas suction port 9b Dust and other small foreign substances generated during wire processing or breaking are sucked and removed. At this time, by blowing gas from the gas blowing port 9c, the substrate W is prevented from being in close contact with the lower surface of the cleaner 9.

The substrate Wa on the downstream side after being cut maintains a floating posture, is transported in the downstream direction by the jig 12, and then is discharged by the discharge conveyor 13 from the downstream port 16 b (see FIG. 16 ). The substrate Wb on the upstream side that has been divided is also taken over by the returning downstream jig 12 and is discharged by the discharge conveyor 13 in the same manner as the preceding downstream substrate Wa (see FIG. 17 ).

As described above, in the upstream conveying section B and the downstream conveying section D, the substrate to be conveyed is floated by the floating mechanism (air floatation means), that is, the pressure gas ejected from the plurality of small holes 1a, 11a, so It can minimize the occurrence of damage caused by contact or the adhesion of tiny foreign objects on the back of the glass plate before the organic film is formed.

In addition, the upstream conveying part B and the downstream conveying part D are provided with dust scattering prevention devices 14A and 16A for the conveying part, and the inside of the outer covers 14 and 16 are pressurized by the pressurized gas at any time, thus preventing self-scoring of floating dust/ The inflow of the breaking mechanism part C or the outside can prevent tiny foreign matters from adhering to the surface of the substrate during the transportation.

Further, in the scoring/breaking mechanism portion C, a dust scattering prevention device 15A for the processing portion is provided, and the inside of the cover 15 is decompressed by the gas vacuum mechanism 19 at any time, so the gas vacuum mechanism 19 can be used to float inside Dust and other small foreign objects are sucked and removed to keep the inside of the outer cover 15 clean. In particular, in this embodiment, the gas suction port of the gas vacuum mechanism 19 is arranged near the moving path of the cutter wheel 7 where dust and other dust are frequent, so it can efficiently suck the scribing process. The generated dust suppresses the pollution in the outer cover 15. This complements the operation of the cleaner 9 to directly suck and remove dust and dust along the scribe line L1, so that it is possible to prevent fine foreign matters from adhering to the substrate surface.

The representative embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments. For example, in the above embodiment, the cleaner 9 is arranged on the upper side of the substrate W, but it may be on the lower side. In addition, regarding the scoring/breaking mechanism portion C, contrary to the above-described embodiment, the cutter wheel 7 and the breaking roller 8 are arranged on the upper side of the substrate W, and the support roller 6 is arranged on the lower side to perform scoring and Breaking is also possible.

Furthermore, in the above embodiment, the scoring/breaking mechanism portion C performs the processing of the scribe line L1 and the cutting along the scribe line L1, but the substrate is processed only after the processing of the scribe line Send out, and then use another breaking device to break the substrate along the scribe line. On the contrary, only the breaking mechanism is provided and the scoring mechanism is omitted. In this case, the scoring line may be processed using another scoring device. Moreover, in the above-mentioned embodiment, the processing example of the mother substrate for OLED which formed the resin film (PI film) W1 which becomes a flexible base material on the upper surface of the glass substrate W2 was demonstrated, but it can also be used for Processing of glass substrates for other purposes. In addition, in the present invention, it is possible to make appropriate corrections and changes within the scope that can achieve the purpose without departing from the scope of the patent application. [Industry availability]

The dust scattering prevention device of the present invention is mainly used for processing a scribe line for a brittle material substrate such as glass, or a substrate processing device for cutting a brittle material substrate such as glass along a scribe line.

1: Floating table 2: Fixture 2a: Beam member 3: Bridge 5a: Upper scoring head 5b: Lower scoring head 6: Support roller 7: Cutter wheel 8: Breaking roller 9: Cleaner 9b: Gas suction port 9c: Gas outlet 10: Base frame 11: Floating platform 12: Clamp 13: Conveyor belt 14 for discharge: Outer cover of upstream conveying section 14A: Dust scattering prevention device for upstream conveying section 14a: Entrance 14b: Baffle 15: Scribing /Fragment mechanism part outer cover 15A: Dust scattering prevention device for processing part 15a: Outlet 15b: Baffle 16: Downstream conveying part outer cover 16A: Dust scattering prevention device for downstream conveying part 16a: Outlet 16b: Baffle 17: Pressure Gas inlet 18: Pressure gas inlet 19: Gas vacuum mechanism 20: Charge prevention device 21: Sensor 22: Claw A: Substrate processing device B: Upstream conveying section C: Scribing/breaking mechanism section D: Downstream conveying Part W: Substrate

FIG. 1 is a schematic side view of a substrate processing apparatus including the dust scattering prevention device of the present invention. FIG. 2 is a schematic plan view of the substrate processing apparatus in FIG. 1. 3 is an enlarged front view of the scoring/breaking mechanism portion of the substrate processing apparatus in FIG. 1. Fig. 4 is an enlarged side view similar to Fig. 3. 5 is a perspective view showing a substrate to be processed of the present invention. 6 is a cross-sectional view and a bottom view of the cleaner in the present invention. 7 is a perspective view showing a state where the substrate is held by the upstream jig and the downstream jig. Fig. 8 is a cross-sectional view showing the scoring/breaking mechanism portion during scoring process. Fig. 9 is a cross-sectional view showing the breaking operation of the scoring/breaking mechanism portion. 10 is a cross-sectional view showing the operation of the cleaner. 11 is a plan view showing the first step of the operation of the substrate processing apparatus. 12 is a plan view showing the second step of the operation of the substrate processing apparatus. 13 is a plan view showing the third step of the operation of the substrate processing apparatus. 14 is a plan view showing a fourth step of the operation of the substrate processing apparatus. 15 is a plan view showing the fifth step of the operation of the substrate processing apparatus. 16 is a plan view showing a sixth step of the operation of the substrate processing apparatus. 17 is a plan view showing a seventh step of the operation of the substrate processing apparatus.

1: floating platform

2: fixture

2a: beam member

3: bridge

5a: Upper scoring head

5b: Lower scoring head

10: base frame

12: Fixture

12a: beam member

13: Conveyor belt for discharge

14: Outer cover of upstream transport section

14A: Dust scattering prevention device for upstream conveying section

14a: entrance

14b: bezel

15: Scribing/breaking mechanism cover

15A: Dust scattering prevention device for processing department

15a: entrance

15b: bezel

16: Outer cover of downstream transport section

16A: Dust scattering prevention device for downstream conveyor

16a: entrance

16b: bezel

17: Pressure gas inlet

18: Pressure gas inlet

19: Gas vacuum mechanism

20: Charge prevention device

21: Sensor

22: Hook

A: Substrate processing device

B: Upstream transfer department

C: Scribing/breaking mechanism department

D: Downstream transport department

E: substrate supply section

W: substrate

Claims (9)

A dust scattering prevention device that prevents dust generated by a substrate processing portion and a substrate transport portion of a substrate processing device, and includes: a dust scattering prevention device for a processing portion formed in the substrate processing portion; and formed in the above A dust scattering preventing device for the conveying part of the substrate conveying part; wherein the dust scattering preventing device for the processing part includes a decompression means for covering the outer cover of the substrate processing part with a space and depressurizing the space in the outer cover at any time; The dust scattering prevention device for the conveying section includes an outer cover that covers the surface of the substrate to be conveyed by a space, and a pressurizing means that pressurizes the space in the outer cover at any time. The dust scattering prevention device according to claim 1, wherein the decompression means is formed to perform decompression by a gas vacuum mechanism that sucks gas in the housing, and the pressurization means is formed by opening from the housing The gas inflow port injects pressurized gas into the housing to implement pressurization. The dust scattering prevention device according to claim 2, wherein the substrate is a mother substrate for an OLED display having a resin film for forming an organic film on a surface layer of a glass plate. A substrate processing device, which is used for processing a scribe line to a substrate, and is provided with: a scoring mechanism part for processing a scribe line to a substrate; wherein, the scoring mechanism part is provided with a dust scattering prevention device for a processing part A dust scattering prevention device for the transfer section is provided in the upstream transfer section that transfers the substrate to the scoring mechanism section, or the downstream transfer section that transfers the substrate from the scoring mechanism section, or both. A substrate processing device for breaking a substrate, and comprising: a breaking mechanism portion for breaking the substrate along a scribe line formed on the substrate; wherein the breaking mechanism portion is provided with processing A dust scattering prevention device for the part; an upstream conveying part that conveys the substrate to the fracturing mechanism part, or a downstream conveying part that takes the substrate out of the fracturing mechanism part, or both, a dust fray preventing device for the conveying part is provided . A substrate processing device for breaking a substrate, and comprising: a scoring mechanism portion for processing a scoring line on the substrate; and the substrate along the scoring line processed by the scoring mechanism portion A breaking mechanism part for breaking; wherein, in the breaking mechanism part, a dust scattering preventing device for a processing part is provided, an upstream conveying part that conveys the substrate to the scoring mechanism part and the breaking mechanism part, or from the above The scribing mechanism portion and the downstream transport portion where the above-mentioned breaking mechanism portion carries out the substrate, or both of them, is provided with a dust scattering prevention device for the transport portion. The substrate processing apparatus according to any one of claims 4 to 6, wherein the scoring mechanism section includes: a cutter wheel that rotates while pressing one surface of the substrate; and a support roller that faces the cutter wheel, The surface supporting the opposite side of the substrate; and the gas suction port of the gas vacuum mechanism is disposed in a position along the moving path of the cutter wheel. The substrate processing apparatus according to any one of claims 4 to 6, wherein the substrate is a mother substrate for an OLED display having a resin film for forming an organic film on a surface layer on a glass plate. The substrate processing apparatus according to claim 7, wherein the substrate is a mother substrate for an OLED display having a resin film for forming an organic film on a surface layer on a glass plate.

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