TW201919836A - Device for preventing dust scattering and substrate machining apparatus having the same - Google Patents

Abstract

Provided are a device for preventing dust scattering and a substrate processing device having the same, capable of preventing minute foreign substances such as dust or the like in a substrate processing step from adhering to a substrate, thereby obtaining a high quality product. The device (15A) for preventing dust scattering to prevent dust, from scattering, generated at a processing site in a substrate processing device includes: a cover (15) covering a processing part for processing the substrate (W) with a space therebetween; and a decompression means for always reducing the space in the cover (15), wherein the decompression means is configured by air vacuum equipment (19) for suctioning air inside the cover (15).

Description

Dust scattering prevention device and substrate processing device provided with the same

The invention relates to a dust scattering prevention device suitable for a substrate processing device for processing a scribe line (groove) for a substrate of a brittle material such as glass, or cutting a substrate along the scribe line, and a dust scattering prevention device provided with the same. Substrate processing device. In particular, the present invention relates to a dust scattering prevention device for a substrate processing device which is flexible in the manufacturing process of a flexible OLED (Organic Light Emitting Diode) display and has a surface area layer that is flexible on a glass substrate. The mother substrate of the resin film (polyimide film (also referred to as PI film)) of the substrate is processed to scribe or sever the mother substrate.

In the process of breaking a substrate of a brittle material such as a glass substrate, it is known to press the cutter wheel against the surface of the substrate to form a score line, and then apply it along the score line from the side opposite to the plane where the score line is formed. The substrate is deflected by an external force, thereby being divided into individual substrates (see Patent Document 1).

In recent years, since high definition of a display is required, it is necessary to further improve the surface quality and the end face strength of a substrate. In addition, from the viewpoint of expanding the use of the display, there is also a need to make the display flexible, so that an OLED using a flexible substrate is manufactured. In such an OLED display, a resin film (PI film) is formed on a glass substrate during a manufacturing process, and an organic film having an electrode layer or an organic EL layer is formed thereon. The film thickness of the electrode layer or the organic EL layer is thin, and the composition is very slim. Therefore, even if the foreign matter adhered to the surface of the resin film is extremely small, it may cause defects and cause a decrease in yield.

In order to obtain high-quality and high-productivity OLED display manufacturing technology, it is necessary to avoid damage to the glass plate on which the resin film (PI film) was formed before the organic film was formed or the adhesion of fine foreign matter such as dust. In other words, damage to the glass plate may cause deterioration of the strength, and the attached foreign matter may be carried until the organic film formation step, thereby causing deterioration of the working environment. In addition, if there are damages or small foreign matter on the back of the glass plate, it is likely that it will become a cause of poor peeling in the Lift-Off step of separating the glass substrate and the resin film of the product after the organic film is formed. Therefore, not only must the front side (organic film formation side) of the glass substrate be prevented from being damaged or dust adhered, but also the back side can be prevented from being damaged or dust attached. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 5210356

[Problems to be Solved by the Invention]

In general substrate processing equipment, fine cutting powder and other dust generated during scribe processing or cutting will adhere to the front and back surfaces of the substrate and be carried to the next step, thus becoming a quality degradation product. One big reason. In addition, when the substrate to be processed is moved to the scoring position, the substrate is transported by being placed on the upper surface of the conveyor belt or the stage, so the back surface of the substrate is in contact with the conveyor belt or the stage surface at any time. In addition, during the scoring, the back surface of the substrate on the left and right sides of the substrate is also held by the conveyor belt or the stage, so the back surface of the substrate is still in contact with the conveyor belt or the stage surface. In this case, the longer the contact time, or the longer the moving distance in the contact state, the greater the probability of small damage on the back of the substrate, and the small foreign matter such as dust on the conveyor belt or the stage adheres to The probability of the back surface of the substrate is increasing, which leads to a decrease in yield and hinders the manufacture of high-precision and excellent-quality products.

Therefore, an object of the present invention is to provide a method for reducing the scattering of fine foreign matters such as dust and the like during the processing of scoring a substrate or cutting the substrate along the scribe line, thereby preventing dust from adhering to the substrate. Substrate, and a dust scattering prevention device for obtaining a high-quality product, and a substrate processing device provided with the dust scattering prevention device. [Technical means to solve the problem]

In order to solve the above-mentioned problems, in the present invention, the following technical measures are adopted. That is, the dust scattering prevention device of the present invention is a person who prevents dust from being generated at the processing part of the substrate processing device, and has a cover for the processing section that covers the processing substrate with a space to separate the space inside the cover and reduces the pressure at any time. The pressure reducing means is configured to reduce the pressure by a gas vacuum mechanism that sucks a gas in the cover. [Effect of the invention]

According to the present invention, as described above, the internal space of the outer cover covering the processing section is decompressed by the gas vacuum mechanism at any time, so the gas vacuum mechanism can be used to suck and remove minute foreign matters such as dust floating inside, and keep the inside of the outer cover clean. This has the effect that it is possible to prevent dust such as cutting powder generated during the processing of the substrate from being scattered and adhering to the substrate, so that a product with high accuracy and excellent quality can be processed.

In addition, the present invention is a substrate processing apparatus for scoring a substrate, including a scoring mechanism section for scoring a substrate, and a dust scattering prevention device according to claim 1; The outer cover of the dust scattering prevention device is formed so as to cover the scoring mechanism portion. At this time, it is also possible to set a cracking mechanism for cutting the substrate instead of the above-mentioned scoring mechanism, and it may also be set to a substrate processing apparatus having these two mechanisms.

In this substrate processing apparatus, the scoring mechanism portion or the breaking mechanism portion that is the processing portion is covered by a cover, and the internal space is decompressed by the gas vacuum mechanism at any time. Therefore, small foreign matters such as dust floating inside are sucked by the gas vacuum mechanism. Remove. Thereby, the inside of the outer cover can be kept clean, and dust can be prevented from being scattered and attached to the substrate during the processing of the substrate, so that products with high accuracy and excellent quality can be processed.

Preferably, the scoring mechanism includes a cutter wheel that rotates while pressing one surface of the substrate, and a support roller that opposes the cutter wheel and supports a surface on the opposite side of the substrate; In addition, the gas suction port of the gas vacuum mechanism is arranged near the moving path of the cutter wheel. Thereby, dust such as cutting powder generated by the rotation of the cutter wheel during the scoring process can be efficiently sucked, and contamination in the cover can be suppressed.

Hereinafter, one embodiment of the dust scattering prevention device and the substrate processing device of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic side view of the entire substrate processing apparatus A including the dust scattering prevention devices 14A, 15A, and 16A of the present invention, and FIG. 2 is a plan view thereof.

The substrate processing apparatus A includes: an upstream transfer unit B that linearly transfers the substrate W to be processed from upstream to downstream in a horizontal posture; and a scribe / break mechanism mechanism C as a substrate processing unit that is orthogonal to the transfer direction The back surface of the substrate W to be conveyed is processed with a scribe line in the direction, and the substrate W is divided along the scribe line; and the downstream conveying portion D conveys the divided substrate W to the downstream. Further, a substrate supply unit E is disposed on the upstream side of the upstream transfer unit B to supply the substrate W to be processed to the upstream transfer unit B of the substrate processing apparatus A. In the following description, the direction in which the substrate W is transported will be the X direction, and the direction orthogonal to it will be the Y direction.

The substrate W processed by the substrate processing device A is used as a mother substrate user in the manufacturing process of the OLED display. As shown in FIG. 5, an organic film for forming a flexible substrate is formed on the upper surface of the glass plate W2. The thin resin film W1. In addition, a region where the resin film W1 is not provided is formed in a band shape along the planned scribe line L. As the resin film W1, a polyimide film (PI film) was used.

The upstream transfer unit B of the substrate processing apparatus A includes a floating stage 1 that floats the substrate W in a horizontal posture by ejecting air pressure, and a jig 2 that holds the upstream edge portion of the substrate W that is floating and lifts the substrate. W is transported downstream. The jig 2 is supported by a beam member 2a extending in the Y direction, and the beam member 2a is mounted so as to be movable relative to left and right rails 2b and 2b arranged in parallel along the transport direction (X direction) of the substrate W. In this embodiment, as a floating mechanism (air-floating means) that ejects gas from the floating stage 1 to float the substrate W in order to float the substrate W, a plurality of small openings formed on the upper surface of the floating stage 1 are formed. The hole 1 a constitutes a nozzle for gas ejection, but a gas ejection nozzle may be separately provided along the floating stage 1. The floating platform 1 is provided on the base frame 10.

The scoring / breaking mechanism unit C includes a gate-type bridge 3 arranged so as to straddle the substrate W being transported. As shown in FIGS. 3 and 4, a pair of upper and lower guide rails 4 a and 4 b are arranged along the Y direction on the bridge 3 along the Y direction with the substrate W being transported from above and below. The upper scoring head 5a is mounted on the lower rail 4b so as to move upward and can be adjusted by the lifting mechanism (not shown) to move up and down, so that it can move in the Y direction and can be moved up and down by the lifting mechanism (not shown). The lower scoring head 5b is installed in the manner of movement adjustment.

In addition, a scoring head 5a is mounted on the upper portion, and a support roller 6 having a flat outer peripheral surface is mounted so that it can be adjusted up and down by a lifting mechanism (not shown), and a scoring head 5b is provided on the lower portion so that the lifting mechanism can be used (Not shown) A cutter wheel 7 for cutting and scoring and a roller 8 for cutting are mounted in a manner of moving up and down. The breaking roller 8 is provided with a V-shaped groove 8 a on the outer peripheral surface (see FIG. 9). Further, a cleaner 9 is provided on the upper rail 4a so as to be able to move in the Y direction via the head 9a to remove minute foreign matter after the scribe line is formed. As shown in FIG. 6, the cleaner 9 includes an elongated gas suction port 9 b having a length direction in the X direction, and a plurality of gas blow-out ports 9 c for blowing gas around the gas suction port 9 b. 9 moves along the scribe line above the scribe line of the substrate W, sucks small foreign matter such as dust with the gas suction port 9b, and prevents the lower surface of the substrate W and the cleaner 9 by the blown gas from the gas blow-out port 9c Close contact. This prevents dust from flowing into the outer cover, which can reduce the internal scattering of small foreign matter such as dust and prevent dust from adhering to the substrate, so that products with high accuracy and excellent quality can be obtained.

The downstream transfer unit D of the substrate processing apparatus A is provided with a floating stage 11 that floats the substrate W in a horizontal posture by the ejection air pressure from the small hole 11a in the same manner as the upstream transfer unit B described above, and a clamp 12 that holds The floating-side end of the substrate W transports the substrate W to the downstream side. The jig 12 is supported by a beam member 12a extending in the Y direction, and the beam member 12a is mounted so as to be able to move relative to the left and right rails 12b and 12b arranged in parallel along the X direction. A discharge conveyor 13 is provided on the downstream side of the floating stage 11 to send the separated substrates Wa and Wb to the outside of the substrate processing apparatus A.

Further, in the substrate processing apparatus A, dust scattering prevention devices 14A, 15A, and 16A are provided at the upstream transfer section B, the scribe / break mechanism section C, and the downstream transfer section D to prevent the scattering of minute foreign matter such as dust. . The dust scattering prevention devices 14A, 15A, and 16A are provided with outer covers 14, 15, 16 that cover the upstream transfer section B, the scoring / breaking mechanism section C, and the downstream transfer section D, respectively, and are provided at the respective covers 14, 15, 16 The entrances 14a, 15a, and 16a of the substrate W are taken out. In addition, shutters 14b, 15b, and 16b that can be opened and closed are attached to each of the entrances and exits.

The dust scattering prevention devices 14A and 16A in the upstream conveying section B and the downstream conveying section D are provided with pressure means for pressurizing the internal space of the outer covers 14 and 16 at any time. As the pressurizing means, in this embodiment, it is configured in such a manner that pressure gas inlets 17 and 18 for injecting a pressure gas are provided on the tops of the outer covers 14 and 16, and from the pressure gas inlets 17 and 18 The pressurized pressurized gas is injected into the outer covers 14 and 16. In addition, in order to allow the gas to be continuously supplied, small slit-like openings (not shown) are formed in the side walls of the covers 14, 16 to discharge a part of the gas. Thereby, the inflow of dust from the scribe / break mechanism part C or the outside is prevented, internal scattering of minute foreign matter such as dust is reduced, and dust and the like are prevented from adhering to the substrate W. Further, in the dust scattering prevention device 15A of the scoring / breaking mechanism section C, the internal space of the outer cover 15 is decompressed at any time by a pressure reducing means. As this decompression means, in this embodiment, a gas vacuum mechanism 19 is arranged in the internal space, and the inside of the outer cover 15 is decompressed by the gas suction performed by the gas vacuum mechanism 19. Thereby, minute foreign matter such as dust generated during the processing of the scribe line and the cutting step is sucked and removed to prevent contamination inside the cover 15. In particular, the generation of dust often occurs when the scribing process is performed by the cutter wheel 7, so it is preferable to arrange the gas of the gas vacuum mechanism 19 near the movement path of the cutter wheel 7 as shown in Figs. 2 and 4. Suction port. With such a design, dust such as cutting powder generated during the scribe process can be efficiently sucked, and contamination in the cover 15 can be reduced.

Further, a charging prevention device (Ionizer, static electricity remover) 20 is provided inside the outer covers 14 and 16 of the upstream transfer unit B and the downstream transfer unit D to prevent the substrate W or the scattered dust from being charged. The antistatic device 20 is preferably a photo-ionizer using a soft X-ray that does not generate ozone, and a plurality of antistatic devices 20 are provided on the top and bottom surfaces of the outer covers 14 and 16 along the transport direction of the substrate W. Each. By providing the static electricity prevention device 20 in the sealed outer covers 14 and 16, it is possible to improve the efficiency of static elimination and prevent external leakage of soft X-rays.

In addition, a plurality of sensors 21 for detecting a floating substrate W and the floating tables 1 and 11, that is, a floating amount, are provided in the substrate transfer areas of the upstream transfer section B and the downstream transfer section D at regular intervals. If an abnormality in the floating amount is detected, the gas discharge pressure is increased or decreased, so that the floating posture can be maintained at any time. In addition, if the floating platforms 1 and 11 are divided into a plurality of blocks, a sensor 21 and a plurality of small holes 1a, 11a are formed in each block, and the amount of gas to be ejected can be adjusted for each block, and the floating can be adjusted more finely. posture.

In this embodiment, the substrate supply section E that supplies the substrate W to the floating stage 1 of the upstream conveying section B uses a lifter having a claw 22 that can be moved up and down and back and forth by a driving mechanism (not shown). Moreover, the contact surface with the substrate W is small. Alternatively, the substrate W may be fed in, for example, by a conveyor belt, a crank claw, or the like.

The small holes 1a, 11a for the gas ejection on the floating tables 1, 11 in the substrate processing apparatus A, the gas suction port 9b and the gas blow-out port 9c of the cleaner 9, the upstream transfer section B, and the downstream transfer section D cover The pressure gas inflow ports 17, 18 of 14, 16 and the gas vacuum mechanism 19 of the cover 15 are connected to a gas source (not shown) through piping, respectively.

Next, the operation of the substrate processing apparatus A will be described in order based on FIGS. 2, 8 to 17. FIG. 2 shows the state where the substrate W is about to be fed into the substrate processing apparatus A. The substrate W is placed on the substrate with the glass plate W2 (see FIG. 5) of the substrate W in a posture in which the scribe line L is oriented in the Y direction. Supply part E 的 爪 22. Then, the baffle 14b of the upstream inlet / outlet 14a of the upstream transfer section B is opened, the hook 22 is extended, and the substrate W is transferred to the floating stage 1 of the upstream transfer section B. Thereafter, the hook claw 22 is returned to the original position, the shutter 14 b is closed, the substrate W is floated, and the upstream end portion thereof is held by the jig 2 (see FIG. 11).

Next, open the baffles on the downstream inlet and outlet 14a of the upstream conveying section B, the inlets 15a and 15a on both sides of the scoring / splitting mechanism section C, and the upstream inlet and outlet 16a of the downstream conveying section D, so that the clamp 2 moves downstream The movement is carried out while the substrate W is floating, and the conveyance is performed until the scribe line L of the substrate W reaches a position directly above the cutter wheel 7 of the scribe / break mechanism unit C. At this position, the downstream end of the substrate W is held by the clamp 12 on the downstream side, and the substrate W is held in a horizontally floating posture on the upstream and downstream sides with good stability (see FIGS. 12 and 7). .

Next, as shown in FIG. 8, the cutter wheel 7 and the supporting roller 6 of the scoring / breaking mechanism part C are brought into contact with the surface of the substrate W in the floating state, and the upper and lower scribe heads 5 a, 5 are pressed while pressing the cutter wheel 7 5b moves along the guide rails 4a and 4b, thereby processing the scribe line L1 along the Y direction (see FIG. 13).

Next, as shown in FIG. 9, the scoring heads 5 a and 5 b and the upper support roller 6 are moved to the original position while the cutter wheel 7 is moved backward and the cutting roller 8 is pressed against the scribe line L1. Thereby, the board | substrate W is bent, and it is divided along the score line L1 (refer FIG. 14). In this way, by one round trip of the scoring heads 5a, 5b, the processing of the moving scribe line L1 and the breaking along the scribe line L1 can be performed.

Thereafter, as shown in FIG. 10 and FIG. 15, the cleaner 9 is moved along the scribe line L1 of the substrate W in the Y direction so as not to contact the substrate W, thereby scoring using the gas suction port 9 b. The foreign matter such as dust generated during thread processing or cutting is sucked and removed. At this time, the substrate W is prevented from coming into close contact with the lower surface of the cleaner 9 by the blowing gas from the gas blowing port 9c.

After being cut, the substrate Wa on the downstream side is kept in a floating posture, and is transported downstream by the clamp 12, and then discharged by the discharge conveyor 13 from the downstream inlet 16 b (see FIG. 16). The separated upstream substrate Wb is also taken over by the returned downstream-side clamp 12 and is discharged by the discharge conveyor 13 like the preceding downstream-side substrate Wa (see FIG. 17).

As described above, in the upstream conveying section B and the downstream conveying section D, the substrates to be conveyed are floated by a floating mechanism (air-floating means), that is, a pressurized gas ejected from the plurality of small holes 1a, 11a. It can minimize the damage caused by the contact on the back surface of the glass plate before the organic film is formed, or the adhesion of tiny foreign objects.

In addition, in the upstream conveying section B and the downstream conveying section D, dust scattering preventing devices 14A and 16A are provided, and the inside of the covers 14 and 16 is pressurized by a pressurized gas at any time, so that the floating dust self-scribing / breaking mechanism can be prevented The inflow of the part C or the outside can prevent tiny foreign matters from adhering to the surface of the substrate during transportation.

Further, in the scoring / breaking mechanism section C, a dust scattering prevention device 15A is provided, and the inside of the cover 15 is decompressed by the gas vacuum mechanism 19 at any time. Therefore, the gas vacuum mechanism 19 can be used to float the dust and the like floating inside. The small foreign matter is sucked and removed to keep the inside of the outer cover 15 clean. In particular, in this embodiment, the gas suction port of the gas vacuum mechanism 19 is disposed near the moving path of the dust-prone cutter wheel 7 such as cutting powder, so that it can efficiently suction the scoring process. The generated dust suppresses contamination in the cover 15. Thereby, in addition to the operation of sucking and removing the dust directly along the scribe line L1 by the cleaner 9 described above, it is possible to prevent tiny foreign matter from adhering to the surface of the substrate.

As mentioned above, although the typical embodiment of this invention was described, this invention is not limited to the said embodiment. For example, in the above embodiment, the cleaner 9 is disposed on the upper side of the substrate W, but it may be on the lower side. Regarding the scoring / breaking mechanism section C, the cutter wheel 7 and the cutting roller 8 are arranged on the upper side of the substrate W and the support roller 6 is arranged on the lower side, in contrast to the above-mentioned embodiment, and the scoring and cutting are performed. Breaking is also possible.

In the above-mentioned embodiment, the scribe line L1 is processed by the scribe / break mechanism unit C, and the cutting along the scribe line L1 is performed. However, the substrate is only processed after the scribe line is processed. It can also be sent out, and then the substrate can be divided along the scribe line by another breaking device. On the contrary, only the breaking mechanism is provided, and the scoring mechanism is omitted. In this case, the scribe line may be processed by another scoring device. In the above-mentioned embodiment, a processing example of an OLED mother substrate in which a resin film (PI film) W1 serving as a flexible substrate is formed on the upper surface of the glass substrate W2 has been described. Processing of glass substrates for other purposes. In addition, in the present invention, modifications and changes can be appropriately made within a range that can achieve the object without departing from the scope of patent application. [Industrial availability]

The dust scattering prevention device of the present invention is mainly used for a substrate processing device for processing a scribe line on a brittle material substrate such as glass, or cutting a substrate on a brittle material such as glass along the scribe line.

1‧‧‧floating platform

2‧‧‧ Fixture

2a‧‧‧ beam member

3‧‧‧bridge

5a‧‧‧Scratch head

5b‧‧‧ Lower scribed head

6‧‧‧ support roller

7‧‧‧ knife wheel

8‧‧‧ breaking roller

9‧‧‧ Cleaner

9b‧‧‧Gas suction port

9c‧‧‧Gas blowing outlet

10‧‧‧ base frame

11‧‧‧ floating platform

12‧‧‧ Fixture

13‧‧‧Discharge conveyor

14‧‧‧ Outer cover of upstream transfer department

14A‧‧‧Dust scattering prevention device for upstream transfer department

14a‧‧‧Entrance

14b‧‧‧ bezel

15‧‧‧ Scoring / splitting mechanism cover

15A‧‧‧Dust scattering prevention device for scoring / split mechanism

15a‧‧‧Entrance

15b‧‧‧ bezel

16‧‧‧ Outer cover of downstream conveying department

16A‧‧‧Dust scattering prevention device for downstream conveying department

16a‧‧‧Entrance

16b‧‧‧ bezel

17‧‧‧Pressure gas inlet

18‧‧‧Pressure gas inlet

19‧‧‧Gas vacuum mechanism

20‧‧‧Charge prevention device

21‧‧‧Sensor

22‧‧‧ Hook

A‧‧‧ substrate processing equipment

B‧‧‧ Upstream Transport Department

C‧‧‧Scribing / Splitting Mechanism Department

D‧‧‧ Downstream Transport Department

W‧‧‧ substrate

FIG. 1 is a schematic side view of a substrate processing apparatus including the dust scattering prevention apparatus of the present invention. FIG. 2 is a schematic plan view of the substrate processing apparatus in FIG. 1. FIG. 3 is an enlarged front view of the scoring / breaking mechanism portion of the substrate processing apparatus in FIG. 1. FIG. 4 is an enlarged side view similar to FIG. 3. Fig. 5 is a perspective view showing a substrate to be processed according to the present invention. Fig. 6 is a sectional view and a bottom view of the cleaner in the present invention. FIG. 7 is a perspective view showing a state where the substrate is held by the upstream-side clamp and the downstream-side clamp. FIG. 8 is a cross-sectional view showing the scribe process of the scribe / break mechanism section. FIG. 9 is a cross-sectional view showing the breaking operation of the scribe / break mechanism mechanism. Fig. 10 is a sectional view showing the operation of the cleaner. FIG. 11 is a plan view showing a first step of the operation of the substrate processing apparatus. FIG. 12 is a plan view showing a second step of the operation of the substrate processing apparatus. 13 is a plan view showing a third step of the operation of the substrate processing apparatus. 14 is a plan view showing a fourth step of the operation of the substrate processing apparatus. FIG. 15 is a plan view showing a fifth step of the operation of the substrate processing apparatus. FIG. 16 is a plan view showing a sixth step of the operation of the substrate processing apparatus. FIG. 17 is a plan view showing a seventh step of the operation of the substrate processing apparatus.

Claims (7)

A dust scattering prevention device is used for preventing dust scattering generated at a processing part of a substrate processing device, and is provided with: a space for covering an outer cover of a processing portion of a processing substrate; and a reduction in pressure of the space inside the cover at any time. The pressure reducing means; wherein the pressure reducing means is configured to reduce the pressure by a gas vacuum mechanism that sucks a gas in the cover. A substrate processing device is used to scribe and scribe a substrate, and includes: a scoring mechanism unit that scribes and scribes a substrate; and a dust scattering prevention device according to claim 1; wherein the dust is scattered The prevention device cover is formed so as to cover the scoring mechanism section. A substrate processing device is used for breaking a substrate, and includes: a breaking mechanism section for breaking the substrate along a scribe line formed on the substrate; and a dust scattering prevention device according to claim 1 Wherein, the outer cover of the dust scattering prevention device is formed so as to cover the fracture mechanism section. A substrate processing device is used to divide a substrate, and is provided with: a scribe mechanism section for processing a scribe line on the substrate; and dividing the substrate along the scribe line processed by the scribe section. And the dust scattering prevention device according to claim 1, wherein the outer cover of the dust scattering prevention device is formed to cover the scoring mechanism portion and the fracture mechanism portion. The substrate processing apparatus according to claim 2 or 4, wherein the scoring mechanism includes: a cutter wheel that rotates while pressing one surface of the substrate; and a support roller that opposes the cutter wheel and supports the substrate. The surface on the opposite side; and the gas suction port of the gas vacuum mechanism is arranged near the moving path of the cutter wheel. The substrate processing apparatus according to any one of claims 2 to 4, wherein the substrate is a mother substrate for an OLED display having a surface area layer above a glass plate with a resin film for forming an organic film. The substrate processing apparatus according to claim 5, wherein the substrate is a mother substrate for an OLED display having a surface area layer above a glass plate and a resin film for forming an organic film.