JP2004188451A - Device and method for laser beam machining - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for laser beam machining for suppressing the redeposits (debris) of machining-spatters, which is generated by the laser beam machining, onto the surface to be machined when irradiating the surface of a workpiece with a laser beam to machine the workpiece by abrasion or hot melt. <P>SOLUTION: The method for laser beam machining is a method for irradiating the surface 10 of a workpiece 9 with a laser beam 26 to machine the workpiece by abrasion or hot melt. In the method, the machining-spatters and debris 15, which are generated from the laser beam 26 applying area on the surface 10 of the workpiece 9, are positively deposited onto a adsorption plate 14 by using a magnetic field. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a laser processing method and apparatus for irradiating a surface of a processing target with a laser beam and performing processing by ablation or thermal melting.
[0002]
[Prior art]
In general, an excimer laser has a high photon energy capable of breaking a chemical bond, and uses a short-wavelength laser having a short wavelength by a photochemical decomposition or photothermal decomposition process called ablation. The object to be processed can be removed and finely processed while minimizing the influence. Laser processing technology by such ablation has attracted attention. By irradiating an object to be processed with an excimer laser beam whose energy density (fluence) is adjusted, various materials such as plastic (polymer material), metal, and ceramics can be finely processed by ablation.
[0003]
In ablation processing by excimer laser light irradiation, flying objects adhere to the periphery of the processing area from the surface of the processing target irradiated with the laser light. This scattered or attached matter is called debris. If debris is attached, desired processing quality and processing accuracy may not be obtained.
[0004]
As a method of reducing the debris, various methods are known, such as a method of suppressing generation of processing scattered matter itself, a method of reducing the accumulation of debris, and a method of removing debris after the accumulation.
[0005]
It is known that it is effective to blow an assist gas together with laser light irradiation on a processing target in order to reduce the generation amount of processing scattered matter (for example, see Patent Document 1).
[0006]
Further, as a method of controlling the generation itself of the processing splatter, a method of dispersing the processing splatter with a predetermined atmospheric gas or preventing re-adhesion is known. It is also known that processing under a reduced pressure of a predetermined degree of vacuum can significantly reduce the amount of deposition due to deposition.
[0007]
As a method of removing debris after deposition, there is known a method of irradiating ultraviolet laser light at a lower energy density than at the time of laser processing to remove generated debris. This method is considered to be effective when debris is easily removed (for example, see Patent Document 2).
[0008]
In addition, as a technique for preventing debris from adhering to the object to be processed, a liquid such as water is brought into contact with the surface of the object to be ablated, and a laser beam is irradiated onto the surface of the object through this liquid. In addition, there is known a method in which generated debris is suspended in a liquid, and the debris is washed away together with the liquid after processing is completed.
[0009]
[Patent Document 1]
JP-A-9-192870
JP-A-6-339784
[0010]
[Problems to be solved by the invention]
However, these methods described above are considered to be effective in reducing the accumulation of debris and in reducing the amount of processing scattered matter, but it is necessary to remove the debris after the deposition around the processing area. There was an inconvenience. Further, in ablation processing in a liquid, there is a possibility that floating debris may re-adhere to the surface of the processing object, and there is a disadvantage that the debris cannot be completely prevented from adhering to the surface of the processing object. Was.
[0011]
In view of such a point, the present invention provides a method of irradiating a laser beam onto a surface of an object to be processed and performing ablation or heat melting to reattach processing debris generated by laser processing to the processed surface (debris). ) Is proposed.
[0012]
[Means for Solving the Problems]
The laser processing method of the present invention is directed to a laser processing method of irradiating a surface of a processing object with laser light to perform processing by ablation or thermal melting. It is characterized in that objects and debris are positively deposited on the adsorption plate using a magnetic field.
[0013]
Further, the laser processing method of the present invention is directed to a laser processing method of irradiating a laser beam onto a surface of an object to be processed by ablation or heat melting. On the surface of the object to be processed, processing scattered matter and debris generated from a laser light irradiation region are positively deposited on the suction plate using a magnetic field. Alternatively, the laser processing under the reduced pressure atmosphere is performed using a partial vacuum mechanism.
[0014]
Further, the laser processing method of the present invention is such that, in a laser processing method of irradiating a laser beam to a surface of an object to be processed by ablation or thermal melting, the object to be processed is processed under an atmospheric gas. The present invention is characterized in that processing scattered matter and debris generated from a laser light irradiation area on a surface of a processing object are positively deposited on an attraction plate using a magnetic field.
[0015]
Further, the laser processing method of the present invention is a laser processing method of irradiating a laser beam onto the surface of a processing target, and performing processing by ablation or heat melting, and discharges or sends / discharges a fluid on the surface of the processing target, It is necessary to create a flow of air current on the surface of this processing object, put the processing scattered matter and debris generated from the laser beam irradiation area on this flow of air, and further actively deposit it on the adsorption plate using a magnetic field. It is a feature.
[0016]
Further, the laser processing method of the present invention is a laser processing method of irradiating a laser beam onto a surface of a processing object to perform processing by ablation or heat melting. The present invention is characterized in that the processing scattered matter and debris generated from the laser light irradiation area of the target are ionized and positively deposited on the attraction plate using a magnetic field.
[0017]
According to the present invention, the debris does not adhere to or accumulate on the processed surface by suppressing the diffusion of the scattered and released processed scattered materials and efficiently depositing the processed scattered materials on the suction plate. The step of removing the debris after the debris is deposited on the processed surface as described above can be eliminated.
[0018]
The laser processing apparatus of the present invention is directed to a laser processing apparatus that irradiates a laser beam onto a surface of an object to be processed by ablation or heat melting. It has an adhesion preventing mechanism for positively depositing objects and debris on an adsorption plate using a magnetic field.
[0019]
Further, the laser processing apparatus of the present invention is a laser processing apparatus that irradiates a laser beam to the surface of a processing target, and performs processing by ablation or heat melting. The surface of the object to be processed in the decompression processing container has an anti-adhesion mechanism for actively depositing processing debris and debris generated from a laser light irradiation area on an attraction plate using a magnetic field. It is a feature.
[0020]
Further, the laser processing apparatus of the present invention is a laser processing apparatus that irradiates a laser beam onto a surface of a processing target to perform processing by ablation or thermal melting, and a processing container that processes the processing target under an atmospheric gas. An anti-adhesion mechanism that positively deposits processing debris and debris generated from the laser irradiation area on the surface of the processing object in the processing container using a magnetic field on the suction plate. It is assumed that.
[0021]
In addition, the laser processing apparatus of the present invention is a laser processing apparatus that irradiates a laser beam onto a surface of a processing target to perform processing by ablation or heat melting, and discharges or sends / discharges a fluid on the surface of the processing target, An airflow control mechanism that creates a flow of airflow on the surface of the processing object, and puts processing scattered objects and debris generated from the laser beam irradiation area on this flow of airflow, and further actively uses the magnetic field to apply force to the adsorption plate. And an adhesion preventing mechanism for depositing.
[0022]
Further, the laser processing apparatus of the present invention is a laser processing apparatus that irradiates a laser beam onto a surface of a processing object to perform processing by ablation or heat melting. It is characterized by having an ion control mechanism that ionizes the scattered objects and debris generated from the laser light irradiation area of the target object, and an adhesion prevention mechanism that positively deposits on the adsorption plate using a magnetic field. is there.
[0023]
According to the present invention, the debris does not adhere to or accumulate on the processed surface by suppressing the diffusion of the scattered and released processed scattered materials and efficiently depositing the processed scattered materials on the suction plate. The step of removing the debris after the debris is deposited on the processed surface as described above can be eliminated.
[0024]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an example of an embodiment of the laser processing method and apparatus of the present invention will be described with reference to FIGS.
[0025]
FIG. 6 is a schematic configuration diagram illustrating an example of a laser light irradiation device applied to the laser processing device of the present example. The laser light irradiation device 11 includes a laser light source 1, mirrors 2, 3, and 4, a beam shaper 5, a mask 6, a projection lens 7, and a stage 8. Of course, the configuration of the laser beam irradiation device is not limited to this example.
[0026]
The processing surface 10 on the surface of the processing object 9 is ablated by a laser beam (laser light) 26 emitted from the laser light source 1. As the laser light source 1, for example, an excimer laser is used. There are a plurality of types of excimer lasers having different laser media. As the laser media, XeF (351 nm), XeCl (308 nm), KrF (248 nm), ArF (193 nm), and F2 (157 nm) are used in the order of wavelength. Exists.
[0027]
Excimer lasers are significantly different from YAG lasers (fundamental wave: 1.06 μm), CO2 lasers (10.6 μm), and the like used for laser processing using thermal energy, in that the oscillation wavelength of laser light is in the ultraviolet region. That is. In addition, the excimer laser is essentially a pulse oscillation, and has a short pulse (several ns to several tens ns or less).
[0028]
Excimer lasers use a short-pulse laser with a short wavelength to perform processing that is not easily affected by heat during the photochemical decomposition and photothermal decomposition processes called ablation. Become sharp. On the other hand, the YAG laser and the CO2 laser have a large thermal effect, and the peripheral portion of the processing becomes round due to the heat and does not become an end face.
[0029]
Furthermore, the excimer laser has an approximately 10 × 10 mm dimension in which the initial beam cross section is substantially rectangular, and this laser beam is reduced, or the area is increased or increased according to the processing purpose by a beam shaper. be able to. By increasing the area, a relatively large area can be processed collectively. Therefore, an excimer laser is suitable for processing a large area at the same time.
[0030]
When the size is reduced, high-definition fine processing can be performed. By patterning the processing surface of the processing object by the step-and-repeat method, it is possible to process a relatively large area. The beam shaper 5 shapes the laser beam 26 from the laser light source 1 reflected by the mirrors 2 and 3, makes the beam intensity uniform, and outputs the beam toward the mirror 4.
[0031]
The mask 6 has a predetermined pattern for passing the laser beam 26 shaped by the beam shaper 5 and reflected by the mirror 4. As the mask 6, for example, a perforated mask formed of a metal material, a photomask formed of a transparent glass material or a metal thin film, a dielectric mask formed of a dielectric material, and the like are used.
[0032]
The projection lens 7 projects the laser beam 26 that has passed through the predetermined pattern of the mask 6 onto the processing surface 10 of the processing target 9 on the stage 8 at a predetermined magnification.
[0033]
The stage 8 is disposed on the projection lens 7 so that the laser beam 26 projected from the projection lens 7 is focused on the processing surface 10 of the processing object 9, and the processing object is placed on the stage using a known technique. It is fixed to. The stage 8 moves along a plane perpendicular to the optical axis of the laser beam 26 such as an XY stage so that the laser beam 26 can scan on the processing surface 10 of the processing object 9. It has a structure and function that allows positioning.
[0034]
In the laser irradiation device 11 having the above-described configuration, by using an excimer laser as the laser light source 1, the processing surface 10 of the processing target 9 is irradiated with a laser beam 26 having a predetermined pattern, and the processing surface 10 is subjected to ablation processing. The processing surface 10 generates processing debris (debris) of the material forming the processing surface 10 by the ablation processing. If the debris adheres to the processing surface 10, it may affect processing quality, processing accuracy, and the like, and it is necessary to prevent the debris from adhering.
[0035]
Therefore, an adhesion prevention mechanism described later provided near the processing surface of the processing target 9 or an adhesion prevention mechanism described later to a known technique is applied to prevent the adhesion of debris.
[0036]
Hereinafter, the configuration of the adhesion preventing mechanism for preventing the processing scattered object 9 from adhering to the processing surface 10 will be described. 1A, 1B, 1C, and 1D are a cross-sectional view and a top view, respectively, showing an example of the structure of an adhesion preventing mechanism of the laser processing apparatus of the present invention. In the drawing, the adhesion preventing mechanisms 12a, 12b, 12c, and 12d provided near the processing surface respectively include a portion 13 for generating a magnetic field (a hatched portion in a top view (a)) and a suction plate (a suction plate for sucking debris 15). Plate 14). Although not shown, these suction plates 14 are connected to a ground terminal.
[0037]
As shown in the top view (a), the adhesion preventing mechanism 12a in FIG. 1A has a so-called donut shape with a hole in the center, and the magnetic field generating portion 13 is attracted to the upper surface side of the donut shape and is attracted to the lower surface side. The plate 14 is disposed, and the debris 15 generated by irradiating the processing surface 10 of the processing object 9 with the laser beam 26 is adsorbed and deposited on the suction plate 14.
[0038]
As shown in FIG. 1B, the adhesion preventing mechanism 12b in FIG. 1B has a so-called donut shape with a hole in the center as shown in the top view (a). The suction plate 14 is disposed on the lower surface side, and the debris 15 generated by irradiating the processing surface 9 of the processing object 9 with the laser beam 26 is absorbed by the suction plate 14 and deposited. In this case, the adhesion preventing mechanism 12b causes the suction plate 14 to be inclined, and is arranged, for example, so as to be substantially perpendicular to the debris scattering direction, so that the suction area of the debris is increased and the suction is efficiently performed. I can do it.
[0039]
As shown in the top view (a) and the cross-sectional view (b), the adhesion preventing mechanism 12c in FIG. 1C has a U-shape when viewed from above, and the magnetic field generating portion is provided outside the U-shape. 13 and the inside of the suction plate 14 are arranged, and the diameter of the hole through which the laser light 26 passes is configured to be larger than the diameter of the irradiation area of the laser light 26 on the processing surface 10 of the processing object 9. Is attached to the inner wall 14a of the suction plate 14.
[0040]
As shown in the top view (a) and the cross-sectional view (b), the adhesion preventing mechanism 12d in FIG. 1D has a substantially cylindrical shape as a whole with a hole through which laser light passes when viewed from the top, and this cylindrical shape. The magnetic field generating portion 13 is arranged on the outer peripheral surface side of the shape, and the suction plate 14 is arranged on the inner peripheral surface side. , So that the debris 15 adheres to the inner wall 14 a of the inner peripheral surface of the suction plate 14.
[0041]
The shape of the suction plate 14 shown in FIG. 1 has an effect of suppressing the diffusion of the scattered and released debris and efficiently collecting (depositing the debris on the suction plate).
[0042]
Although not shown, the surface shape of the suction plate (plate) 14 has irregularities with a surface roughness of about 25S to 100S [μm] larger than the fine particle diameter of the processing scattered object, and the processing scatter once absorbed. Processing and treatment are performed so that objects and deposits such as debris do not peel or detach due to a difference in linear expansion coefficient or the like.
[0043]
Next, FIGS. 2A, 2B, 2C, and 2D are cross-sectional views showing states of magnetic fields generated by the adhesion preventing mechanism of the laser processing method and apparatus of the present invention. 2, the same reference numerals are given to portions corresponding to FIG. 1, and detailed description thereof will be omitted. In the drawing, each of the adhesion preventing mechanisms has a portion 13 and / or 16 for generating a magnetic field and a substantially cylindrical suction plate (plate) 14 for sucking debris. Although not shown, these suction plates 14 are connected to a ground terminal.
[0044]
The adhesion preventing mechanism of FIG. 2A has the same structure as the above-described adhesion preventing mechanism 12d of FIG. 1D, and the magnetic field generating unit 13 is provided on the outer peripheral surface of the substantially cylindrical adhesion preventing mechanism provided above the processing surface 10. ing. As for the magnetic force lines 17 generated by the magnetic field generating unit 13, magnetic force lines having a high density spread from the central hole of the suction plate 14 of the cylindrical anti-adhesion mechanism over the entire processing surface 9 and distributed.
[0045]
2B is different from the above-described adhesion preventing mechanism in FIG. 2A in that a magnetic field generator 16 is additionally provided near the outer periphery of the edge of the processing surface 10 of the processing target 9. With such a configuration, the magnetic force lines 17 generated by the magnetic field generating units 13 and 16 spread from the central hole of the suction plate 14 of the cylindrical anti-adhesion mechanism over the entire processing surface 9.
[0046]
2C and FIG. 2D, for example, the diameter of the suction plate 14 and the magnetic field generating unit 13 that are formed in a substantially cylindrical shape is larger than the size of the workpiece 9 in comparison with the adhesion prevention mechanism shown in FIG. As a result, a strong diverging magnetic field is generated from the processing surface 10 toward the suction plate 14. Here, the adhesion preventing mechanism of FIG. 2C includes a magnetic field generating unit 13 on the outer peripheral surface of the suction plate 14 having a substantially cylindrical shape and a magnetic field generating unit 16 near the outer periphery of the edge of the processing surface 10 of the workpiece 9. On the other hand, the adhesion preventing mechanism in FIG. 2D has a structure in which the magnetic field generating unit 13 is not provided on the outer peripheral surface of the suction plate 14 having a substantially cylindrical shape.
[0047]
2A, 2B, 2C, and 2D, when a magnetic field is generated and the laser beam 26 is applied to the processing surface 10 of the processing object 9, the surface of the processing object 9 is decomposed.・ Evaporated substances are scattered and released as fine particles. By generating a magnetic field, a magnetic field is generated between the workpiece 9 and the adhesion preventing mechanism, as represented by magnetic force lines 17 in the drawing. In such a magnetic field, the electrons 18 in the plasma move in the direction of the magnetic force lines so as to be entangled with the magnetic force lines 17.
[0048]
The ions also move along the lines of magnetic force 17 due to the internal electric field generated by the electrons 18, and the processing scattered matter is deposited on the adsorption plate (plate) 14. As described above, by actively sucking and accumulating the processing scattered matter on the suction plate (plate) 14, it is possible to prevent the debris 15 from re-adhering to the processing surface 10.
[0049]
In addition, since there is also a cleaning effect on the processing surface 10 due to the high activity in the plasma, there is a synergistic effect with prevention of debris adhesion.
[0050]
The magnetic field uses an electromagnetic coil, an electromagnet, a permanent magnet or the like (preferably 600 gauss or more), and the attraction plate (plate) 14 is preferably a metal having rust prevention and corrosion resistance such as SUS304 or SUS316. When an electromagnetic coil or the like is used, in order to suppress the influence of heat generation, it is desirable to provide, for example, a cooling mechanism 29 using circulating water as shown in FIG. 2C inside the suction plate 14 near the magnetic field generating unit 13. .
[0051]
Next, an example of an embodiment of the laser processing method and apparatus of the present invention will be described with reference to FIG. 3, parts corresponding to those in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0052]
As described in the related art, a reduced-pressure atmosphere (for example, a degree of vacuum of 10 [Pa] (10 ^-2 [Torr])), it is said that the generation of debris can be reduced depending on the material of the object to be processed. On the other hand, it has been reported that the generation of debris is thinly generated in a wide range depending on the material of the object to be processed. As a laser processing technique for reducing the problem of debris, a technique for irradiating a laser beam having an energy density lower than the energy density at which laser processing is performed to remove debris is disclosed in, for example, JP-A-6-339784. I have.
[0053]
However, in the above method, debris cannot be completely removed due to the substance of the object to be processed. Further, when the processing target has a multilayer structure, the energy density at the time of debris removal may damage the lower layer film.
[0054]
Therefore, the anti-adhesion mechanism according to the present invention is provided under a reduced-pressure atmosphere using a reduced-pressure processing vessel (for example, a ^-2 [Pa] (10 ^-2 -10 ^-4 [Torr])) to solve this problem. Specifically, for example, a hole through which the laser beam 26 from the laser beam irradiation device 11 shown in FIG. The anti-adhesion mechanism in which the magnetic field generator 16 is installed near the outer periphery of the edge of the processing surface 10 of the object 9 and the object 9 to be processed are housed in a reduced-pressure processing container 19, and the suction plate 14 is connected to the ground terminal 27. Note that the adhesion preventing mechanism applied to the example of FIG. 3 is not limited to the above example.
[0055]
The decompression processing vessel 19 is provided with a transmission window member 20 through which a laser beam 26 is incident, and a supply pipe 21 for supplying an atmosphere into the vessel and an exhaust pipe 22 for exhausting the atmosphere in the vessel.
[0056]
The transmission window member 20 is formed of a material that transmits the laser beam 26 incident from the opening side of the decompression processing container 19. Specifically, for example, when a KrF excimer laser having a wavelength of 248 nm is used as a laser light source, a synthetic quartz glass having a high transmittance with respect to the KrF excimer laser and an ArF excimer laser having a wavelength of 193 nm are used. Used is made of calcium fluoride or the like. It is well known that a material resistant to each wavelength (laser type), a processed mirror, a lens, and the like are used for each optical system.
[0057]
In the above configuration, by using the debris adhesion prevention mechanism of the present example in a reduced pressure atmosphere using a reduced pressure processing container, the scattering of the scattered and released processing scattered materials is suppressed, and the adsorption is efficiently performed. By depositing the processing scattered matter on the plate 14, debris does not adhere to or accumulate on the processing surface 10, so that it is not necessary to remove debris after deposition on the processing surface as in the related art, and good processing quality and processing accuracy are obtained. be able to.
[0058]
Next, another embodiment of the laser processing method and apparatus of the present invention will be described with reference to FIG. FIG. 4A is a sectional view of an example of the laser processing apparatus of the present invention, and FIG. 4B is a bottom view of the laser processing apparatus of FIG. 4A. 4A and 4B, parts corresponding to those in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0059]
FIG. 3 shows an embodiment in which the debris adhesion preventing mechanism according to the present invention is used in a reduced-pressure atmosphere using the reduced-pressure processing container 19. However, when the object to be processed is enlarged (large substrate), the reduced-pressure processing is performed. As the size of the container increases, the problem of throughput arises, which has been a problem when adopting it for mass production.
[0060]
Therefore, for example, the debris adhesion preventing mechanism of the present example is used in a reduced pressure atmosphere to which a partial vacuum mechanism is applied as described in Japanese Patent Application No. 2002-318870 filed by the present applicant.
[0061]
As shown in FIG. 4A, a magnetic field generating unit 16 is installed near the outer periphery of the edge of the processing surface 10 of the processing object 9, and for example, a laser beam 26 from the laser light irradiation device 11 as shown in FIG. On the laser beam path immediately before the object 9 is irradiated, a suction member having a substantially cylindrical partial vacuum mechanism made of aluminum, stainless steel, or the like, having a transmission window member 20 through which the laser beam 26 passes is provided in proximity to the processing surface 10. The plate 14 (hatched portion in the figure) is arranged.
[0062]
The suction plate 14 provided with the partial vacuum mechanism has a substantially cylindrical shape provided with a center hole 32 along the irradiation direction axis of the laser beam 26, and as shown in FIG. Several exhaust holes 31 are formed on a concentric circle around the outer peripheral portion of the center hole 32 through which the laser beam 26 passing through the transmission window member 20 is disposed at the center, and a partial vacuum mechanism is formed through the exhaust holes 31. The suction plate 14 is evacuated by an external roughing pump 30 to evacuate the atmosphere around the surface of the processing surface 10. The suction plate 14 is connected to the ground terminal 27.
[0063]
With the suction plate 14 having a partial vacuum mechanism, the vicinity of the processing surface 10 is made into a decompressed atmosphere with a simple configuration, and laser light is irradiated in this depressurized atmosphere, so that debris generated by ablation is suctioned from the exhaust hole 31 of the bottom 14a. Then, it is taken into the suction plate 14 and further taken into the roughing pump 30.
[0064]
As described above, under the reduced pressure atmosphere by the partial vacuum mechanism, by using the debris adhesion preventing mechanism of this example, it is possible to solve the problem of throughput in increasing the size of the processing object, and also to prevent the re-adhesion of debris, Good processing quality and processing accuracy can be obtained.
[0065]
Next, another embodiment of the laser processing method and apparatus according to the present invention will be described with reference to FIG.
[0066]
In general, in laser processing in an atmosphere, for example, in processing in a helium atmosphere, it is said that debris itself can be reduced depending on a substance to be processed. Also, depending on the material of the processing object, the spouting speed at which the material decomposed and evaporated during laser irradiation becomes fine particles and scatters and emits is faster than the speed in the air, so that the processing scattered material is dispersed far away and apparently It is said that the upper debris seems to have been reduced. However, since the processing scattered matter is re-attached to the processing surface, it is necessary to remove debris after depositing on the processing surface.
[0067]
Therefore, in this embodiment, when laser processing in an atmosphere is necessary, the adhesion preventing mechanism of this embodiment is used, and the configuration shown in FIG. 3 can be used as the configuration of the apparatus.
[0068]
The laser beam irradiation apparatus is used not for the decompression purpose but for supplying the atmospheric gas from the supply pipe 21 using the decompression processing container 19 as a chamber for sealing the gas, and at the timing when the surface near the surface of the processing surface 10 is filled with the atmospheric gas. The processing surface 10 is irradiated with a laser beam 26 from 11 to perform laser processing.
[0069]
As described above, when laser processing in an atmosphere is required due to the substance of the processing target, the debris is deposited on the suction plate 14 by using the adhesion prevention mechanism of the present example, so that debris is generated around the processing area 11. Since there is no deposition, there is no need for a step of removing after deposition, and good processing quality and processing accuracy can be obtained.
[0070]
Helium (He), argon (Ar), neon (Ne), or the like is used as the atmosphere gas in this example.
[0071]
Next, another example of the embodiment of the laser processing method and apparatus of the present invention will be described with reference to FIG. 5, parts corresponding to those in FIGS. 1 to 4 are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0072]
As an airflow control mechanism, there is a means for exhausting (suctioning) or sending / exhausting a fluid, and as a laser processing method for preventing the accumulation of debris on a processing surface of a processing target by ablation processing, see, for example, These are disclosed in JP-A-192870, JP-A-10-20509, JP-A-10-99978, and the like. However, since the processing scattered matter is re-attached to the processing surface, it is necessary to remove debris after depositing on the processing surface.
[0073]
Therefore, a laser processing method that has means for exhausting (suctioning) or sending and exhausting a fluid and for preventing debris from accumulating on a processing surface of a processing target by ablation processing is provided with a debris adhesion preventing mechanism according to the present invention. And its configuration is shown in FIG.
[0074]
In FIG. 5, reference numeral 39 denotes a processing vessel (chamber), and a processing object 9 is arranged at the center of the inside. On the upper surface of the processing container 39, there is provided a transmission window member 20 for irradiating the processing surface 9 of the processing object 10 and transmitting the laser beam 26 from the laser light irradiation device 11.
[0075]
Further, in the example described above, the adhesion preventing mechanism causes the magnetic force lines 17 to be distributed substantially along the axis of the laser beam 26 applied to the processing surface 10 as shown in FIG. 2 when a magnetic field is generated. However, in this example, as shown in FIG. 5, the adhesion preventing mechanism is disposed at a position where the direction of the magnetic force lines 17 when the magnetic field is generated by the magnetic field generating unit 13 is substantially orthogonal to the laser beam 26. I do. In other words, for example, the anti-adhesion mechanism shown in FIG. 2A is turned 90 ° clockwise in FIG. The atmosphere in the processing vessel 39 is exhausted to the outside through the center hole of the substantially cylindrical suction plate 14 of the adhesion preventing mechanism and the exhaust means 28.
[0076]
An airflow control unit 23 for sending out gas such as oxygen is provided on the left side surface of the processing container 39, and gas such as oxygen is sent out from the lateral direction of the processing target 9 along the surface of the processing surface 10. The gas such as oxygen that has passed through the surface of the processing surface 10 is exhausted from the opening 28a of the substantially cylindrical adsorption plate 14 via the exhaust means 28.
[0077]
The exhaust means 28 has a predetermined radius of curvature (R) so that debris carried on the magnetic lines of force 17 passing through the center hole of the suction plate 14 may be sucked by hitting the suction plate 25 provided on the curved portion. It has been made. The suction plates 14 and 25 are connected to the ground terminals 27, respectively.
[0078]
In the above configuration, when the processing surface 10 of the processing object 9 is irradiated with the laser beam 26 through the transmission window member 20, the processing scattered object scattered from the processing area irradiated with the laser beam 26 by laser ablation. 15 occurs. At this time, a gas such as oxygen is sent from the airflow control unit 23, and generates an airflow 24, and the processing scattered matter 15 is put on the flow and guided to the opening 28a of the suction plate 14.
[0079]
A part of the processing scattered matter 15 guided to the opening of the suction plate 14 is adsorbed by the suction plate 14 here, and the remaining processing scattered matter 15 is further bent by the exhaust means 28 into a curved portion of the exhaust means 28. Suction is efficiently performed by the provided suction plate 25.
[0080]
As described above, by using the debris adhesion preventing mechanism according to the present embodiment, the processing scattered matter 15 decomposed and evaporated from the processing surface 10 of the processing target 9 is positively deposited on the suction plates 14 and 25 by the ablation processing. Thereby, the reattachment (debris) of the processing scattered matter 15 can be prevented, and good processing quality and processing accuracy can be obtained.
[0081]
In this example, as the gas to be delivered, for example, oxygen (O2), helium (He), neon (Ne), argon (Ar), or the like is used.
[0082]
Further, the airflow control unit 23 of the above-described example is used as an ion source, and an ion control mechanism using a well-known ion gun (ion gun) for ionization is configured. The processing scattered object 15 scattered from the laser light irradiation region of the processing surface 10 is ionized by the ion atmosphere by the ion source 23, and the adsorption and deposition on the adsorption plate 14 by the magnetic force lines 17 can be more efficiently and positively performed. Reattachment (debris) of the processing scattered matter 15 can be prevented, and good processing quality and processing accuracy can be obtained.
[0083]
As described above, according to this example, it is possible to reduce the thermal effect during laser processing by ablation or thermal melting by laser light and to prevent debris from adhering to the processed surface.
As a result, it is possible to provide an excellent effect that precise laser processing can be realized and debris can be prevented from being adhered. It can be formed at cost.
[0084]
In the description of the example of the embodiment described above, the object to be processed is shown horizontally and the laser irradiation direction is shown vertically, but the object to be processed can be made vertically and the laser irradiation direction can be made horizontal. It is not limited.
[0085]
It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that various other configurations can be adopted without departing from the gist of the present invention.
[0086]
【The invention's effect】
According to the present invention, it is possible to reduce the thermal effect at the time of laser processing by ablation or thermal melting by laser light, and to prevent debris from adhering to the processed surface.
As a result, according to the present invention, it is possible to provide an excellent effect that accurate laser processing can be realized and debris can be prevented from being adhered. There is an advantage that it can be formed at low cost while having high accuracy.
[Brief description of the drawings]
1A and 1B are a cross-sectional view and a top view, respectively, showing an example of the structure of an adhesion preventing mechanism of a laser processing apparatus according to the present invention.
FIG. 2 is a cross-sectional view showing a state of a magnetic field generated by an adhesion preventing mechanism of the laser processing apparatus of the present invention.
FIG. 3 is a diagram showing an example of an embodiment of the laser processing apparatus of the present invention.
FIG. 4 is a diagram showing another example of the embodiment of the laser processing apparatus of the present invention.
FIG. 5 is a diagram showing another example of the embodiment of the laser processing apparatus of the present invention.
FIG. 6 is a schematic configuration diagram illustrating an example of a laser light irradiation device.
[Explanation of symbols]
1 laser light source 9 processing object 10 processing surface 11 laser beam irradiation device 12a, 12b, 12c, 12d adhesion prevention mechanism 13 ... magnetic field generating part, 14 ... suction plate (plate), 15 ... processing scattered matter (debris), 16 ... magnetic field generating part, 17 ... magnetic field lines, 18 ... ... Electronic, 19 ... Vacuum processing container, 20 ° transmission window member, 21 ... Supply pipe, 22 ... Exhaust pipe, 23 ... Air flow control unit (ion source), 25 ... adsorption plate (plate), 26 ... laser beam (laser light), 28 ... exhaust means, 30 ‥‥ roughing pump, 31 ... exhaust hole, 32 ‥‥ center Hole

Claims (20)

In the laser processing method of irradiating a laser beam on the surface of the object to be processed and performing processing by ablation or thermal melting,
A laser processing method characterized by actively depositing processing debris and debris generated from a laser light irradiation area on a surface of a processing object on a suction plate using a magnetic field. The laser processing method according to claim 1,
Laser processing method to prevent re-adhesion of processing scattered matter and debris in the atmosphere. In the laser processing method of irradiating a laser beam on the surface of the object to be processed and performing processing by ablation or thermal melting,
The processing object is processed in a reduced pressure atmosphere using a reduced pressure processing container,
A laser processing method, wherein processing scattered matter and debris generated from a laser light irradiation area on the surface of the processing object are positively deposited on an attraction plate using a magnetic field. The laser processing method according to claim 3,
A laser processing method, wherein the laser processing under the reduced pressure atmosphere is performed using a partial vacuum mechanism. In the laser processing method of irradiating a laser beam on the surface of the object to be processed and performing processing by ablation or thermal melting,
The object to be processed is processed under an atmosphere gas,
A laser processing method, characterized in that a processing scattered object and debris generated from a laser light irradiation area on a surface of the processing object are positively deposited on an attraction plate using a magnetic field. In the laser processing method of irradiating a laser beam on the surface of the object to be processed and performing processing by ablation or thermal melting,
The fluid on the surface of the processing object is discharged or sent / discharged to form an airflow on the surface of the processing object, and processing scattered objects and debris generated from a laser light irradiation area are put on the flow of the airflow. And a laser processing method characterized by positively depositing on an attraction plate using a magnetic field. In the laser processing method of irradiating a laser beam on the surface of the object to be processed and performing processing by ablation or thermal melting,
Sends and discharges ions to the surface of the processing object, ionizes processing scattered matter and debris generated from the laser light irradiation area of the processing object,
A laser processing method characterized by actively depositing on an attraction plate using a magnetic field. The laser processing method according to claim 6 or 7,
If some of the processing scattered matter and debris do not adhere to the suction plate, the processing scattered matter and debris are newly provided on the path after passing through the suction plate,
The laser processing method, wherein the unattached processing scattered matter and debris are positively deposited on the newly provided suction plate. The laser processing method according to claim 1, 3, 5, 6, or 7,
A laser processing method, wherein the attracting plate generates a magnetic field by an electromagnet or a permanent magnet, and efficiently deposits processing debris and debris in a shape that prevents scattering. The laser processing method according to claim 1, 3, 5, 6, or 7,
The surface shape of the suction plate has irregularities of a predetermined surface roughness, and has been subjected to processing and treatment for preventing separation and detachment of the adsorbed scattered work and debris deposits. Laser processing method. In a laser processing apparatus that irradiates a laser beam onto the surface of a processing target and performs processing by ablation or thermal melting,
A laser processing apparatus having an adhesion preventing mechanism for positively depositing processing scattered matter and debris generated from a laser light irradiation area on a surface of a processing object on a suction plate using a magnetic field. The laser processing apparatus according to claim 11,
A laser processing apparatus characterized by preventing re-adherence of processing scattered matter and debris in the atmosphere. In a laser processing apparatus that irradiates a laser beam onto the surface of a processing target and performs processing by ablation or thermal melting,
A reduced pressure processing container for processing the processing object in a reduced pressure atmosphere,
On the surface of the object to be processed in the decompression processing container, having an adhesion preventing mechanism for positively depositing processing scattered matter and debris generated from a laser light irradiation region on an attraction plate using a magnetic field. Characteristic laser processing equipment. The laser processing apparatus according to claim 13,
A laser processing apparatus wherein the laser processing under the reduced pressure atmosphere is performed using a partial vacuum mechanism. In a laser processing apparatus that irradiates a laser beam onto the surface of a processing target and performs processing by ablation or thermal melting,
A processing container for processing the processing object under an atmospheric gas,
An adhesion preventing mechanism for positively depositing processing scattered matter and debris generated from a laser light irradiation region on a surface of the processing object in the processing container using a magnetic field. Laser processing equipment. In a laser processing apparatus that irradiates a laser beam onto the surface of a processing target and performs processing by ablation or thermal melting,
The fluid on the surface of the processing object is discharged or sent / discharged to form an airflow on the surface of the processing object, and the processing scattered matter and debris generated from the laser light irradiation area are put on the flow of the airflow. Airflow control mechanism,
A laser processing apparatus, further comprising an adhesion preventing mechanism for positively depositing on the suction plate using a magnetic field. In a laser processing apparatus that irradiates a laser beam onto the surface of a processing target and performs processing by ablation or thermal melting,
An ion control mechanism that sends and discharges ions to the surface of the processing target, and ionizes processing scattered objects and debris generated from the laser light irradiation region of the processing target,
A laser processing apparatus comprising: an adhesion preventing mechanism that positively deposits on an attraction plate using a magnetic field. The laser processing apparatus according to claim 16 or 17,
If some of the processing scattered matter and debris do not adhere to the suction plate, the processing scattered matter and debris are newly provided on the path after passing through the suction plate,
A laser processing apparatus, wherein the non-adhered processing scattered matter and debris are positively deposited on the newly provided suction plate. The laser processing apparatus according to claim 11, 13, 15, 16, or 17,
A laser processing apparatus, wherein the attracting plate generates a magnetic field by an electromagnet or a permanent magnet, and efficiently deposits scattered objects and debris in a shape that prevents scattering. The laser processing apparatus according to claim 11, 13, 15, 16, or 17,
The surface shape of the suction plate has irregularities of a predetermined surface roughness, and has been subjected to processing and treatment for preventing separation and detachment of the adsorbed scattered work and debris deposits. Laser processing equipment.

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