JP6918673B2 - Surface treatment method and equipment, and glass substrate - Google Patents

Description

The present invention relates to a method and an apparatus for surface-treating a substrate to be treated such as a glass substrate, and an optical film such as a polarizing plate including a portion to be left and a portion to be peeled off, which is attached to the surface to be treated via a transparent adhesive. The present invention relates to a surface treatment method and apparatus suitable for the substrate to be treated, and a glass substrate.

For example, in a liquid crystal panel, a liquid crystal is enclosed between two laminated glasses. A polarizing plate is provided on the surface of each glass.
In the current manufacturing process, a mother cell is formed by applying a process such as circuit formation to each of the facing surfaces of two mother glass substrates and then bonding them together. The mother cell is divided into a plurality of liquid crystal panels by scribe break, washed, and then a film-shaped polarizing plate is attached (see Patent Document 1 and the like). An adhesive is applied to the surface to which the polarizing plate is attached, and the surface is covered with a release film. The release film is peeled off and a polarizing plate is adhered to the glass surface of the liquid crystal panel (see Patent Document 2 and the like).

In Patent Document 3, by irradiating the liquid crystal cell with UV light while supplying ozone, the wettability of the surface of the liquid crystal cell is enhanced and the adhesiveness of the polarizing plate is improved.

The polarizing plate is required to have not only adhesiveness but also reworkability (easiness of peeling and reusability) (Patent Documents 4 to 6).
In Patent Document 4, a polarizing plate is attached to a liquid crystal cell, a reworking film is attached thereto, and then the polarizing plate and the reworking film are peeled off at the same time to improve the reworkability.
In Patent Document 5, water is applied to a glass plate and a polarizing plate is laminated on the glass plate to improve reworkability.
In Patent Document 6, the reworkability is improved by using a polyvinyl acetal-containing composition as the pressure-sensitive adhesive for the polarizing plate.

JP-A-2017-142316 Japanese Unexamined Patent Publication No. 2003-131211 Japanese Unexamined Patent Publication No. 09-281472 Japanese Unexamined Patent Publication No. 2008-268255 Japanese Unexamined Patent Publication No. 2014-112232 Japanese Patent No. 442714

The inventors are working on improving the efficiency of the liquid crystal panel manufacturing process. As one of the ideas, we proposed the end cut process. That is, a mother polarizing plate having almost the same size as the mother cell is prepared, the mother polarizing plate is attached to the mother cell after the formation of the mother cell and before the scribe break, and then the unnecessary portion of the mother polarizing plate is laser-cut and peeled off. After that, perform a scribe break. By doing so, advantages such as a drastic reduction in the number of lines, a reduction in the number of workers, suppression of particles, and facilitation of support for various sizes can be obtained.
On the other hand, in such an end-cut process, it is required that the mother polarizing plate at the part to be the product part is firmly attached and the mother polarizing plate at the unnecessary part is easily peeled off. As described above, various techniques for improving adhesiveness (Patent Documents 3 and the like mentioned above) and techniques for improving reworkability (Patent Documents 4 to 6 mentioned above) have been proposed, but adhesiveness and reworkability (easiness of peeling) ) It is not easy to improve both.
In view of such circumstances, the present invention aims to achieve both adhesiveness and reworkability (easiness of peeling) when a film such as a polarizing plate including a portion to be left and a portion to be peeled off is attached to a substrate to be processed such as glass. With the goal.

In order to solve the above problems, the method of the present invention is a method of surface-treating a substrate to be treated, in which a film including a portion to be left and a portion to be peeled off is attached to a surface to be treated via an adhesive, before the attachment. ,
A plasma treatment step in which the process gas is converted into plasma and brought into contact with the surface to be treated,
During or before and after the plasma treatment step, a treatment step of performing a treatment for differentiating the surface energies of the remaining portion on the surface to be treated to which the remaining portion is attached and the peeling corresponding portion to which the peeling portion is attached. ,
It is characterized by being equipped with.
The apparatus of the present invention is an apparatus for surface-treating a substrate to be treated, in which a film including a portion to be left and a portion to be peeled off is attached to a surface to be treated via an adhesive, before the attachment.
A plasma processing unit that turns the process gas into plasma and brings it into contact with the surface to be processed,
During or before and after the treatment by the plasma processing unit, a treatment is performed to make the surface energies of the remaining portion on the surface to be treated to which the remaining portion is attached and the peeling compatible portion to which the peeling portion is attached different from each other. Department and
It is characterized by being equipped with.
This makes it possible to achieve both adhesiveness and ease of peeling.
Preferably, the surface energies of the corresponding portions are different, that is, contrasted so that the adhesiveness of the remaining portion is relatively high and the peelability of the peelable portion is relatively high. By doing so, it is possible to surely achieve both adhesiveness and ease of peeling.
The treatment step may be performed before the plasma treatment step, may be performed in parallel with the plasma treatment during the plasma treatment step, or may be performed after the plasma treatment step.
In the treatment step before the plasma treatment step, it is preferable to perform a treatment (for example, a mask) that gives contrast when the plasma treatment step is performed after the treatment step, instead of adding contrast in the treatment step.
When the treatment step is performed after the plasma treatment step, it is preferable that no contrast is added in the plasma treatment step and contrast is added in the subsequent treatment step.

The plasma-generated process gas is blown out from the processing head that can move relative to the substrate to be processed and brought into contact with the surface to be processed.
It is preferable that the degree of plasma processing when the processing head is directed to the remaining portion and when the processing head is directed to the peeling compatible portion is different from each other.
As a result, the treatment step can be performed during the plasma treatment step to add contrast to the surface energy of the surface to be treated. It is preferable to increase the surface energy of the portion corresponding to the residual by increasing the degree of plasma treatment. For the peel-corresponding portion, it is preferable to suppress the increase in surface energy by weakening the plasma treatment degree.
As the method for adjusting the plasma processing degree, the processing time for the remaining portion can be lengthened and the processing time for the peeling-compatible portion may be shortened.
For example, when the processing head is directed to the portion corresponding to the residue, the relative moving speed between the processing head and the substrate to be processed is slowed down, and when the processing head is directed to the portion corresponding to peeling, the processing head and the substrate to be processed are used. The relative movement speed of may be increased.
When the processing head is directed to the part corresponding to the residual, the process gas flow rate is increased, and when the processing head is directed to the part corresponding to peeling, the process gas flow rate is decreased or the process gas blowing is stopped. good.
The composition of the process gas may be different depending on whether the processing head is directed to the residue-compatible portion and the peeling-compatible portion.

The process gas preferably contains _{nitrogen (N 2} ) and oxygen (O _2). Thereby, the adhesiveness can be improved. Instead of nitrogen, a rare gas such as helium (He), neon (Ne), argon (Ar), or other inert gas may be used.
It is preferable to turn the process gas into plasma in a discharge space near atmospheric pressure. The plasma is preferably an atmospheric pressure plasma in the vicinity of the atmospheric pressure.
In the present specification, the vicinity of atmospheric pressure means ^{a range of 1.013 × 10 4 to} 50.663 × 10 ^{4 Pa, and 1.333 × 10 4 in} consideration of facilitation of pressure adjustment and simplification of device configuration. ~ 10.664 × 10 ⁴ Pa is preferable, and 9.331 × 10 ^{4 to} 10.397 × 10 ⁴ Pa is more preferable.

The plasma-generated process gas is blown out from the processing head that can move relative to the substrate to be processed and brought into contact with the surface to be processed.
The composition of the process gas when the processing head is directed to the residue-corresponding portion and when the processing head is directed to the peeling-corresponding portion may be different from each other.
For example, N ₂ and O _{2 are used as process gas components, and O 2} is supplied when processing the remaining portion _{to make the mixed gas of N 2} and O ₂ a process gas, and O when processing the peeling compatible portion. the process gas N ₂ only by stopping the supply of _2. As a result, it is possible to increase the surface energy of the portion corresponding to the residue and suppress the increase of the surface energy of the portion corresponding to the peeling.

It is preferable to perform the plasma treatment step after covering one of the peeling-corresponding portion and the residual-corresponding portion with a protective mask.
As a result, the portion with the protective mask is not plasma-treated, and only the portion without the protective mask is plasma-treated. Therefore, it is possible to add contrast to the surface energy of the surface to be treated.
The step of covering with the protective mask is a treatment step before the plasma treatment step.

The treatment step may be performed after the plasmaized process gas is evenly contacted over the entire surface to be treated. That is, by plasma-treating the remaining portion and the peeling-compatible portion evenly by the plasma treatment process, the surface energy of these corresponding portions is once made uniform, and then the surface energy of the residual-corresponding portion and the peeling-compatible portion is obtained by the treatment process. You may add contrast. As a result, even if the surface condition of the surface to be treated varies before treatment, the entire area corresponding to the residue can be made uniform and high surface energy, the entire area corresponding to peeling can be made uniform and low surface energy, and the adhesiveness can be obtained. And it is possible to prevent variations in ease of peeling.
Examples of the treatment step after the plasma treatment include plasma treatment using the processing head, plasma treatment using the protective mask, and air blowing only to the portion corresponding to the residue.

A water-repellent mask may be provided on the peeling-compatible portion, and then the plasma treatment step may be performed with a process gas that increases the surface energy of the surface to be treated by plasma formation. It is preferable that the surface energy of the water-repellent mask is reduced by the interaction with the plasma-generated process gas.
Examples of the water-repellent mask include a black matrix and a bank. Examples of the process gas in this case include a mixed gas of a _{fluorine-containing compound and N 2.} Examples of fluorine-containing compounds include PFCs (perfluorocarbons) such _{as CF 4} , C ₂ F ₄ , C ₂ F ₆ , C ₃ F ₈ , and HFCs (hydrofluorocarbons) such as _{CHF 3} , CH ₂ F ₂ , and CH _{3 F.} Examples include SF ₆ , NF ₃ , and XeF ₂ . When the process gas is turned into plasma, fluorine-based active species and nitrogen-based active species are generated. The surface energy of the water-repellent mask decreases due to the interaction with the fluorine-based active species, and the surface energy of the remaining portion increases due to the contact with the nitrogen-based active species.
The step of providing the water-repellent mask is a treatment step before the plasma treatment step.

Further, the present invention is a glass substrate having a surface to be attached to which a film including a portion to be left and a portion to be peeled off is attached via an adhesive.
It is characterized in that the surface energies of the remaining portion on the surface to be attached to which the remaining portion is attached and the peeling compatible portion to which the peeled portion is attached are different from each other.
It is preferable that the surface energy of the remaining portion of the glass substrate is higher than the surface energy of the peeling-compatible portion.
As a result, the remaining portion has a relatively high hydrophilicity (the contact angle with water is small), and the adhesiveness with the water-based adhesive and the adhesiveness with the remaining portion of the film can be ensured. On the other hand, the peelable portion has a relatively low hydrophilicity (the contact angle with water is large), and the peelability of the peelable portion of the film can be ensured.

According to the present invention, it is possible to achieve both adhesiveness to the remaining portion of the film to be attached to the substrate to be processed and ease of peeling to the portion to be peeled off.

FIG. 1 is a front sectional view showing a schematic configuration of a surface treatment apparatus according to a first embodiment of the present invention. FIG. 2 is a perspective view of the surface treatment apparatus. FIG. 3A is a front sectional view showing a process of attaching the polarizing plate. FIG. 3B is a front view showing a laser cutting process. FIG. 3C is a front sectional view showing a peeling step. FIG. 4 is a perspective view schematically showing a surface treatment apparatus according to a second embodiment of the present invention. FIG. 5 is a side sectional view of the surface treatment apparatus according to the second embodiment. FIG. 6 is a perspective view schematically showing a surface treatment apparatus according to a third embodiment of the present invention. FIG. 7 is a front view of the surface treatment apparatus according to the third embodiment. FIG. 8 is a perspective view schematically showing a surface treatment apparatus according to a fourth embodiment of the present invention. FIG. 9 is a perspective view schematically showing a surface treatment apparatus according to a fifth embodiment of the present invention. FIG. 10 is a front view of the surface treatment apparatus according to the fifth embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 to 3 show the first embodiment of the present invention. The glass substrate 9 to be processed is a mother cell that should be a plurality of liquid crystal panels. As shown in FIG. 3A, a mother polarizing plate 7 (film) is attached to the surface to be processed 9s (attached surface) of the glass substrate 9 via an adhesive 8. The mother polarizing plate 7 is composed of, for example, an optical laminated resin film such as TAC (cellulose triacetate) / PVA (polyvinyl alcohol) / TAC, TAC / PVA / COP (cycloolefin polymer), and TAC / PVA / acrylic resin. ing. The adhesive 8 is composed of, for example, a water-soluble polyvinyl butyral (PVB) -containing composition. The materials of the polarizing plate and the adhesive of the present invention are not limited to these.

As shown in FIG. 3C, the mother polarizing plate 7 includes a portion 7a to be left and a portion 7b to be peeled off. On the surface to be processed 9s, a residual portion 9a to which the remaining portion 7a is attached and a peeling compatible portion 9b to which the peeling portion 7b is attached are set. Preferably, from the viewpoint of productivity, a plurality of remaining portion 9a are regularly arranged at equal intervals in the vertical and horizontal directions. The remaining portion on the surface to be processed 9s is a peeling-corresponding portion 9b.

The following surface treatment is applied to the glass substrate 9 before the mother polarizing plate 7 is attached.
Generally speaking, the surface to be treated 9s is subjected to plasma treatment for improving the adhesiveness of the polarizing plate 7 (plasma treatment step). During the plasma treatment step, a treatment for making the surface energies of the residual portion 9 and the peeling portion 9b different from each other by making the plasma treatment degree for the residual portion 9a and the plasma treatment degree for the peeling compatible portion 9b different from each other is performed. Apply (treatment process).

<Surface treatment equipment>
FIG. 1 shows a surface treatment apparatus 1 that performs the plasma treatment step and the treatment step. The surface treatment device 1 includes a substrate support means 2, a local treatment head 10, and a moving means 20.
The glass substrate 9 is horizontally supported by the substrate supporting means 2 with the surface to be processed 9s facing upward. The substrate supporting means 2 may be a stage on which the glass substrate 9 is placed, or may be a holder that grips the edge of the glass substrate 9.

As shown in FIGS. 1 and 2, the local processing head 10 is arranged above the glass substrate 9 supported by the substrate supporting means 2. The local processing head 10 has a spot nozzle shape.
As shown in FIG. 1, double cylindrical electrodes 11H and 11E are provided inside the local processing head 10. The center electrode 11H is connected to, for example, a high-frequency power supply 12 that supplies high-frequency power in the form of a pulse wave. The cylindrical outer electrode 11E surrounding the center electrode 11H is electrically grounded. A solid dielectric is provided on the facing surface of at least one of the electrodes (for example, the inner peripheral surface of the outer electrode 11E). A cylindrical inter-electrode space 15 (discharge space) is formed between the outer peripheral surface of the center electrode 11H and the inner peripheral surface of the outer electrode 11E.

The process gas supply unit 13 is connected to the upstream end of the space between the electrodes 15. The process gas supply unit 13 supplies the process gas to the space between the electrodes 15. As the process gas, a mixed gas in which a trace amount of oxygen (O _{2 ) is added to nitrogen (N 2) is used.} The amount of oxygen added to nitrogen is, for example, on the order of ppm (1 ppm or more and less than 1%), preferably about 250 ppm.

A spot-shaped outlet 14 is connected to the downstream end of the space between electrodes 15. The air outlet 14 is arranged at the lower end of the local processing head 10 and is in close proximity to the glass substrate 9 supported by the substrate supporting means 2.
Further, a suction port (not shown) may be provided at the lower end of the local processing head 10.

The local processing head 10 is relatively moved with respect to the glass substrate 9 in the x direction and the y direction (two directions orthogonal to the surface to be processed 9s) by the moving means 20 simplified and illustrated in FIG.
The glass substrate 9 may be fixed and the local processing head 10 may be moved, or the local processing head 10 may be fixed and the glass substrate 9 may be moved.
The moving means 20 may be an XY stage that also serves as a substrate supporting means 2, or may be an articulated arm robot that also serves as a supporting means for the local processing head 10.

The surface treatment device 1 operates as follows.
<Plasma processing process>
The power supply 12 supplies electric power to the electrodes 11, and the process gas supply unit 13 supplies process gas to the processing head 10. By the power supply, an atmospheric pressure glow discharge is generated between the pair of electrodes 11, and the space between the electrodes 15 becomes a discharge space near the atmospheric pressure. The process gas from the process gas supply unit 13 is introduced into the discharge space 15, and the process gas is turned into plasma (including excitation, activation, radicalization, and ionization) in the discharge space 15.
The plasma-generated process gas (hereinafter, appropriately referred to as “plasma gas”) flows from the discharge space 15 to the outlet 14, and is blown out from the outlet 14. When the plasma gas comes into contact with the surface to be treated 9s of the glass substrate 9, the surface to be treated 9s is treated with plasma.

<Treatment process>
At the same time, the plasma processing degree is adjusted so that the plasma processing degree for the residual portion 9a is relatively strong and the plasma processing degree for the peeling corresponding portion 9b is relatively weak.
Specifically, the moving means 20 directs the processing head 10 in the blowout mainly to the remaining portion 9a of the remaining portion 9a and the peeling compatible portion 9b of the surface to be processed 9s. Then, for example, as shown by the white arrow a in FIG. 2, the processing head 10 is moved relative to each other in an annular shape along the inner portion of the contour of each remaining portion 9a. As a result, the plasma gas is brought into contact with the residual portion 9a, so that the residual portion 9a is surface-treated with plasma. Specifically, the surface energy is increased by the hydrophilic treatment. Therefore, the wettability is enhanced and the contact angle with water is reduced.
On the other hand, when the processing head 10 is on the peeling-corresponding portion 9b or when the processing head 10 passes over the peeling-corresponding portion 9b in order to move to the adjacent residual-retaining portion 9a, the plasma gas spray flow rate is limited. do. That is, the spraying flow rate is made smaller than that in the case of the remaining portion 9a, or the spraying is stopped. As a result, the hydrophilization treatment of the peeling-corresponding portion 9b is suppressed, and the increase in surface energy is suppressed.
As a result, the surface energies of the residue-corresponding portion 9 and the peeling-corresponding portion 9b are different from each other to provide contrast.

As a method of limiting or releasing the blowing flow rate of the plasma gas in order to add the contrast, in addition to the method of adjusting the process gas supply flow rate from the supply unit 13, the process gas supply flow rate is made constant. Examples thereof include a method of mechanically changing the flow of the process gas (plasma gas) after being converted into plasma while holding the process, and a method of changing the relative speed of the processing head 10 with respect to the glass substrate 9. From the viewpoint of avoiding a temperature rise of the electrodes 11H and 11E, it is preferable to keep the process gas supply flow rate constant.
As a method of mechanically changing the flow of plasma gas, a shielding plate is provided below the air outlet 14 so that it can move forward and backward, and the shielding plate is retracted from the air outlet 14 on the remaining portion 9a, so that the plasma gas remains as it is. The plasma gas is blocked by the shielding plate and deviates from the glass substrate 9 by being sprayed onto the glass substrate 9 and the shielding plate is interposed between the air outlet 14 and the glass substrate 9 on the peeling-corresponding portion 9b. It may flow in the direction. Alternatively, a valve may be used to mechanically change the flow path of the plasma gas.
When changing the relative speed of the processing head 10 with respect to the glass substrate 9, the plasma gas is blown out at a constant flow rate, and when the processing head 10 is on the residual portion 9a, it is moved at a low speed and is moved on the peeling compatible portion 9b. It is good to move at high speed when you are in.
According to the first embodiment, by changing the control program of the device 1, various layouts of the residual portion 9a and the peeling compatible portion 9b can be supported. Further, according to the first embodiment, the masks 5 and 6 described later are unnecessary.
A plurality of processing heads 10 may be provided, and the plurality of processing heads 10 may be operated at the same time to simultaneously surface-treat a plurality of locations on the surface to be processed 9s.

<Glass substrate after processing 9>
In the glass substrate 9 after the treatment, the surface energies of the remaining portion 9a and the peeling compatible portion 9b on the surface to be treated 9s (attached surface) are different from each other, and the surface energy of the residual corresponding portion 9a is the peeling compatible portion 9b. Higher than surface energy. Therefore, it is possible to increase the hydrophilicity (wetting property) of the residual portion 9a and suppress the increase in hydrophilicity (wetting property) of the peeling-compatible portion 9b. Therefore, the water contact angle of the residual portion 9a is smaller than the water contact angle of the peeling compatible portion 9b. There is a correlation between the water contact angle and the adhesiveness of the water-soluble adhesive 8.

<Pasting process>
As shown in FIG. 3A, after the treatment step with the degree of treatment adjustment, the mother polarizing plate 7 is attached to the entire surface of the surface to be treated 9s of the glass substrate 9. Of the surface to be treated 9s, the portion 9a corresponding to the residue is sufficiently hydrophilized, so that the adhesive 8 on the back surface of the mother polarizing plate 7 is firmly adhered.

<Laser cutting process>
As shown in FIG. 3B, the laser cutting machine 4 then irradiates the laser 4a along the boundary between the remaining portion 7a and the peeling portion 7b in the mother polarizing plate 7 to make a cut 7c.

<Peeling process>
As shown in FIG. 3C, the peeling portion 7b of the mother polarizing plate 7 is then peeled off. Since the peelable portion 9b is hardly hydrophilized, it can be easily peeled off.
As a result, it is possible to achieve both good adhesiveness to the remaining portion 7a and ease of peeling (reworkability) to the peeling portion 7b.

<Scribe break process>
Although not shown, a scribe line is subsequently inserted into the peeling-corresponding portion 9b after peeling by a scribe device. Subsequently, the break device breaks the glass substrate 9 along the scribe line. As a result, the glass substrate 9 (mother cell) is divided into a plurality of liquid crystal panels. Since a polarizing plate is already attached to each liquid crystal panel, the number of lines after that can be drastically reduced, the manufacturing efficiency of the liquid crystal panel can be improved, the number of workers can be reduced, particles can be suppressed, and various sizes can be easily supported. You can get the benefits of.
Since the remaining portion 9a is regularly arranged vertically and horizontally at equal intervals on the glass substrate 9 (mother cell), it is easy to cut out the liquid crystal panel. This can improve productivity.

Next, other embodiments of the present invention will be described. In the following embodiments, the same reference numerals are given to the drawings for configurations that overlap with the above-described embodiments, and the description thereof will be omitted.
<Second Embodiment>
4 and 5 show a second embodiment of the present invention. In the surface treatment apparatus 1B of the second embodiment, the treatment head 10B has a width of about a fraction of the width of the glass substrate 9. A pair of electrodes 11 having a parallel plate electrode structure are provided in the processing head 10B. The downstream end of the inter-electrode space 15 is connected to the air outlet 14B at the lower end of the processing head 10B. The air outlet 14B has a slit shape extending in the width direction of the processing head 10B (the direction orthogonal to the paper surface in FIG. 5). The width dimension of the air outlet 14B is substantially equal to _{the width dimension W 9a of the remaining portion 9a.}

The process gas supply source 13 of the surface treatment apparatus 1B has a nitrogen supply unit 13a and an oxygen supply unit 13b separately. The supply line from the oxygen supply unit 13b joins the supply line from the nitrogen supply unit 13a via the on-off valve 13v and is connected to the inter-electrode space 15 of the processing head 10B.

The processing head 10B is aligned with each row of the remaining portion 9a and then moved relative to the glass substrate 9 in a moving direction orthogonal to the width direction (direction along the white arrow b in FIG. 4). .. As a result, the processing head 10B alternately crosses the residue-corresponding portion 9a and the peeling-corresponding portion 9b. In parallel, the process gas is turned into plasma in the space 15 between the electrodes, blown out from the outlet 14B, and brought into contact with the surface to be treated 9s (plasma treatment step). Further, the composition of the process gas is adjusted so as to be different between when the processing head 10B is on the residual portion 9a and when the processing head 10B is on the peeling compatible portion 9b (treatment step). _{That is, the supply of O 2} gas is controlled on and off according to the relative position of the processing head 10B with respect to the glass substrate 9. Specifically, when it is on the remaining portion 9a, the process gas is made into a mixed gas _{of N 2} and O _{2 by opening the on-off valve 13v.} On the other hand, when it is on the peeling corresponding portion 9b, the process gas is limited to N ₂ by closing the opening / closing valve 13v. As a result, the surface energy of the residual portion 9a can be made lower, the surface energy of the peeling-corresponding portion 9b can be suppressed from being lowered, and the surface energy can be contrasted with the surface to be treated 9s.
Since the remaining portion 9a is regularly arranged at equal intervals, the on-on-off control is easy.
After moving the processing head 10B along one row of the remaining portion 9a, the processing head 10B is shifted to another adjacent row to perform the same processing. By reciprocating the processing head 10B a number of times corresponding to the number of rows of the remaining portion 9a, the entire area of the surface to be processed 9s can be processed, and the tact can be shortened as compared with the first embodiment (FIGS. 1 and 2).
In the second embodiment, as in the first embodiment, the treatment step of adding the contrast is performed during the plasma treatment step.

<Third Embodiment>
6 and 7 show a third embodiment of the present invention. In the third embodiment, a treatment step for contrasting the surface energy is performed before the plasma treatment step. That is, before the plasma treatment step, a protective mask 5 is provided on the peeling-corresponding portion 9b of the glass substrate 9 as a treatment step. The remaining portion 9a is not masked.
The material of the protective mask 5 may be metal, resin, or ceramic.
The protective mask 5 may be placed on the glass substrate 9 and brought into contact with the surface to be processed 9s, or may be slightly lifted from the glass substrate 9. It is not necessary to bond the protective mask 5 to the glass substrate 9.

After the mask, a plasma treatment step is performed by the surface treatment device 1C. The processing head 10C and thus the electrode 11 and the slit-shaped outlet 14C of the surface treatment apparatus 1C have a width equivalent to the width of the glass substrate 9. As the process gas, a mixed gas _{of N 2} and O _{2 can be used as in the first embodiment.} It is not necessary to adjust the composition as in the second embodiment. The plasma gas formed by plasmaizing the process gas is evenly blown out from the entire width direction of the processing head 10C.

In parallel with the blowout, the processing head 10C is relatively moved in the moving direction b orthogonal to the width direction with respect to the glass substrate 9 by the moving means 20 schematically shown in FIG. As a result, the plasma gas comes into contact with the residual corresponding portion 9a, and the residual corresponding portion 9a is subjected to plasma hydrophilic treatment. The peel-corresponding portion 9b is not hydrophilized because the mask 5 prevents the plasma gas from coming into contact with the portion 9b. As a result, in the plasma treatment step after the treatment step (after mask formation), the surface energy contrast is added to the surface to be treated 9s. As a result, it is possible to achieve both good adhesiveness to the remaining portion 7a and ease of peeling (reworkability) to the peeling portion 7b.
In the third embodiment, the wide processing head 10C can process the remaining portion 9a of the entire width direction of the glass substrate 9 at a time. By moving the processing head 10C one way in the length direction of the glass substrate 9, the remaining portion 9a of the entire glass substrate 9 can be processed. Therefore, the time (tact) required for the plasma processing step can be shortened.

After the plasma treatment step, the mask 5 is removed. The procedure after the subsequent step of attaching the mother polarizing plate 7 is the same as that of the first embodiment.

<Fourth Embodiment>
FIG. 8 shows a fourth embodiment of the present invention. In the fourth embodiment, after the plasma treatment step, a treatment step for contrasting the surface energy is performed.
The surface treatment apparatus 1D of the fourth embodiment has the same wide treatment head 10D as that of the third embodiment. While the processing head 10D is relatively moved in the moving direction b along the longitudinal direction of the glass substrate 9, _{a process gas composed of a mixed gas of N 2} and O ₂ is supplied to the processing head 10D to be turned into plasma and blown out, and the surface to be processed is processed. Contact with 9s (plasma processing step). As a result, the surface energy of the surface to be treated 9s is increased. Moreover, the plasma gas is evenly contacted over the entire surface of the surface to be treated 9s, so that the entire area of the surface to be treated 9s is in a substantially uniform surface energy state. Therefore, even if the hydrophilicity (contact angle with water) of the surface to be treated 9s before the plasma treatment step varies depending on the location, the variation can be eliminated. The plasma processing step of the fourth embodiment is also a homogenization step.
Preferably, the plasma treatment degree in the plasma treatment step (uniformization step) is weaker than the plasma treatment degree as the treatment step described later. For example, the plasma processing degree can be weakened by increasing the moving speed of the processing head 10D with respect to the glass substrate 9.
Alternatively, in the plasma treatment step (homogenization step), as the process gas component contained the fluorine-containing compound such as CF _4, even with a lower surface energy by the entire area of the treated surface 9a to water repellent treatment good.

After the plasma treatment step (uniformization step), a treatment step is performed. In the treatment step, the same treatment as the plasma treatment of the first to third embodiments may be performed. For example, using the spot nozzle-shaped processing head 10 of the first embodiment (FIGS. 1 and 2), only the residual portion 9a is plasma-treated. As a result, the surface energy of the residual portion 9a becomes higher than that at the end of the plasma processing step (uniformization step). The surface energy of the peeling-corresponding portion 9b remains at the magnitude at the end of the plasma treatment step (uniformization step). Therefore, it is possible to add contrast to the surface energy of the surface to be treated 9s.

Alternatively, as the treatment step of the fourth embodiment, as in the second embodiment (FIGS. 4 and 5), a short-width processing head 10B is used, and _{the supply of O 2} gas is controlled on and off to be processed. Contrast may be added to the surface energy of the surface 9s.
Alternatively, as the treatment step of the fourth embodiment, as in the third embodiment (FIGS. 6 and 7), the protective mask 5 is put on the surface to be processed 9s, and then plasma gas is blown from the wide processing head 10C. Therefore, the surface energy of the surface to be processed 9s may be contrasted.

Further, the treatment step of the fourth embodiment is not necessarily limited to plasma treatment, and may be non-plasma treatment. For example, although not shown, a spot-shaped nozzle may be used to blow a non-plasma-ized gas such as air only on the remaining portion 9a. A component such as oxygen in the non-plasma gas interacts with the surface component of the residue-corresponding portion 9a activated in the plasma treatment step (homogenization step) to contrast the surface energy of the surface to be treated 9s. Can be attached.

As a result, the adhesiveness to the remaining portion 7a can be improved, and the ease of peeling (reworkability) to the peeling portion 7b can be ensured. Moreover, since the surface condition of the peelable portion 9b is uniform, the peelable portion 7b can be peeled off without bias depending on the location.

<Fifth Embodiment>
9 and 10 show a fifth embodiment of the present invention. In the fifth embodiment, a treatment step for contrasting the surface energy is performed before the plasma treatment step.
Specifically, the water-repellent mask 6 is coated on the peelable portion 9b (treatment step). Examples of the water-repellent mask 6 include resin masks such as a black matrix and a bank.

Next, the plasma treatment step is performed by the surface treatment device 1E. The surface treatment apparatus 1E has a wide treatment head 10E similar to that of the third embodiment (FIG. 6). As the process gas, a mixed gas of _{CF 4} and N _{2 is used.} The process gas is supplied from the process gas supply source 13E to the processing head 10E and turned into plasma, so that a plasma gas containing a fluorine-based active species and a nitrogen-active species is generated.
Instead of CF _{4 , C 2} F ₄ , C ₂ F ₆ , C ₃ F _{8 and} other fluorine-containing compounds may be used.

While the processing head 10E is relatively moved in the moving direction b along the longitudinal direction of the glass substrate 9, the plasma gas is blown out and brought into contact with the entire surface of the surface to be processed 9s (plasma processing step). As a result, the unmasked residual portion 9a is made hydrophilic by increasing the surface energy mainly by the interaction with the nitrogen-based active species in the plasma gas. On the other hand, the surface of the mask 6 is made water-repellent due to a decrease in surface energy mainly due to interaction with fluorine-based active species in the plasma gas. The peelable portion 9b under the mask 6 maintains the initial surface state.

After that, the polarizing plate 7 is attached to the entire area of the surface to be processed 9s without removing the mask 6. Subsequent procedures are the same as in the first embodiment.
The portion 7b of the polarizing plate 7 that covers the mask 6 can be easily peeled off by making the mask 6 water repellent, and the portion 7a that covers the unmasked residual portion 9a is a hydrophilic portion 9a that corresponds to the residual. Can be firmly attached to.

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, by making the process gas composition of the residue-compatible portion 9a during plasma treatment and the process gas composition of the peeling-compatible portion 9b during plasma treatment different from each other, the residue-compatible portion 9a is hydrophilized while being peeled. The corresponding portion 9b may be treated to be water repellent.
Depending on the material of the adhesive, the composition of the process gas, etc., the plasma treatment degree of the peeling-compatible portion 9b may be larger than the plasma treatment degree of the residual portion 9a, and the residual portion 9a is the peeling-compatible portion without plasma treatment. Only 9b may be plasma treated. A protective mask 5 may be provided on the remaining portion 9a.
The film attached to the glass substrate 9 is not limited to the polarizing plate 7, and may be a retardation film or other optical film, and may be a protective film, a decorative film, or various other films.
The glass substrate 9 to be processed or to which the film is attached is not limited to the mother cell for the liquid crystal panel, and may be a glass substrate of the liquid crystal panel itself, another optical glass substrate, or a general-purpose glass substrate.
The substrate to be processed is not limited to the mother cell of the liquid crystal panel or other glass substrate, and may be an optical film, a wafer, or the like.

The present invention can be applied to, for example, a liquid crystal panel production line.

1,1B ~ 1E Surface treatment device 2 Substrate support means 4 Laser cutting machine 5 Mask 7 Polarizing plate (film)
7a Remaining part 7b Peeling part 8 Adhesive 9 Glass substrate (processed substrate)
9a Remaining part 9b Peeling part 9c Cut 9s Surface to be treated (Attachment surface)
10,10B-10E Processing heads 11, 11H, 11E Electrodes 12 Power supply 13 Process gas supply source 14, 14B, 14C Outlet 20 Transportation means

Claims (9)

A method of surface-treating a substrate to be treated, in which a film including a portion to be left and a portion to be peeled off is attached to a surface to be treated via an adhesive, before the attachment.
A plasma treatment step in which the process gas is converted into plasma and brought into contact with the surface to be treated,
During or before and after the plasma treatment step, a treatment step of performing a treatment for differentiating the surface energies of the remaining portion on the surface to be treated to which the remaining portion is attached and the peeling corresponding portion to which the peeling portion is attached. ,
A surface treatment method characterized by being provided with. The plasma-generated process gas is blown out from the processing head that can move relative to the substrate to be processed and brought into contact with the surface to be processed.
The surface treatment method according to claim 1, wherein the degree of plasma treatment when the treatment head is directed to the residue-corresponding portion and when the treatment head is directed to the peeling-corresponding portion is different from each other. The plasma-generated process gas is blown out from the processing head that can move relative to the substrate to be processed and brought into contact with the surface to be processed.
The surface treatment method according to claim 1, wherein the composition of the process gas when the treatment head is directed to the residue-corresponding portion and when the treatment head is directed to the peeling-corresponding portion is different from each other. The surface treatment method according to claim 1, wherein one of the peel-corresponding portion and the residual-corresponding portion is covered with a protective mask, and then the plasma treatment step is performed. The surface treatment method according to any one of claims 1 to 4, wherein the treatment step is performed after the plasmaized process gas is evenly contacted over the entire surface to be treated. After providing a water-repellent mask on the peelable part,
The plasma treatment step is performed by a process gas that increases the surface energy of the surface to be treated by plasma formation.
The surface treatment method according to claim 1, wherein the water-repellent mask has a surface energy reduced by interaction with the plasma-generated process gas. A device for surface-treating a substrate to be treated, in which a film including a portion to be left and a portion to be peeled off is attached to a surface to be treated via an adhesive, before the attachment.
A plasma processing unit that turns the process gas into plasma and brings it into contact with the surface to be processed,
During or before and after the treatment by the plasma processing unit, a treatment is performed to make the surface energies of the remaining portion on the surface to be treated to which the remaining portion is attached and the peeling compatible portion to which the peeling portion is attached different from each other. Department and
A surface treatment device characterized by being equipped with. A glass substrate having a surface to be attached to which a film including a portion to be left and a portion to be peeled off is attached via an adhesive.
A glass substrate on the surface to be attached, wherein the surface energies of the remaining portion to which the remaining portion is attached and the peeling compatible portion to which the peeled portion is attached are different from each other. The glass substrate according to claim 8 , wherein the surface energy of the remaining portion is higher than the surface energy of the peeling-corresponding portion.

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