JP5355349B2 - Laser scribing device - Google Patents

Description

  The present invention relates to a laser scribing apparatus used when forming a circuit pattern of a cell of a solar battery module.

  Laser scribing apparatuses that form grooves in a workpiece by irradiating laser light are used for forming divided grooves in a substrate and pattern processing of thin film solar cells. The laser scribing apparatus includes a stage on which a workpiece is placed, a laser light source that irradiates the workpiece with laser light, and a scanning mechanism that scans the irradiation position of the laser light irradiated on the workpiece.

  In such a laser scribing apparatus, there arises a problem that dust generated from the workpiece during processing adheres to the laser light optical system or adheres to the workpiece. Therefore, for example, Patent Document 1 discloses a technique for ejecting a gas toward a laser beam between an optical system that irradiates a laser beam and a workpiece in order to reduce adhesion of dusting materials.

  Further, for example, Patent Document 2 discloses a technique for removing dust by air blow or vacuum suction after laser scribing. Further, for example, Patent Document 3 discloses a technique in which dust is sucked in the vicinity of the irradiated portion and gas is blown to diffuse the dust in the suction direction.

JP 11-58050 A JP 2001-196610 A International Publication No. 2008/143042

  However, according to the above-described conventional technique, the dust generation material is blown off from the processing groove by the gas ejection, but the dust generation material blown off from the processing groove adheres to the substrate surface. In addition, when sucking dust generated from the workpiece, the dust generated in a region away from the suction portion may adhere to the substrate surface again.

  For example, in a solar cell module, a transparent electrode is formed on a glass substrate, and a circuit pattern is formed by laser scribing. A photoelectric conversion layer is formed thereon, and a circuit pattern of the photoelectric conversion layer is formed by laser scribing. Finally, a back electrode is formed on the photoelectric conversion layer, and the back electrode is patterned by laser scribing to complete a solar cell module.

  Here, when dust generation adheres to the substrate surface when laser scribing is performed on the transparent electrode, the photoelectric conversion layer on the foreign matter is generated on the transparent electrode layer during cleaning after the formation of the photoelectric conversion layer in the next step. And a part where the transparent electrode is partially exposed to the substrate surface is formed. In this exposed portion, when the back electrode is formed in the next process, the back electrode is directly formed on the transparent electrode, resulting in a short circuit. Therefore, there has been a problem that the yield of the product is lowered.

  The present invention has been made in view of the above, and a laser capable of reducing the adhesion of dust generated on the substrate surface generated during laser scribing to improve the yield in the manufacture of solar cell modules and the like. The purpose is to obtain a scribing device.

  In order to solve the above-described problems and achieve the object, the present invention provides a laser scribing apparatus that scans a laser beam from a laser light source and laser-scribes the workpiece. An airflow ejection nozzle that ejects an airflow from both sides in the scanning direction of the laser light toward the vicinity of the irradiation position, and a suction nozzle that sucks the airflow near the irradiation position of the laser light on the workpiece And

  According to the present invention, since the scattering of dust generation is suppressed by the laminar wall formed by the air flow ejected from the air flow ejection nozzle, and the dust generation object is sucked and removed by the suction nozzle, the dust generation substrate There is an effect that it is possible to reduce the adhesion to the surface and improve the yield in the manufacture of solar cell modules and the like.

FIG. 1 is a diagram showing a schematic configuration of a laser scribing apparatus according to Embodiment 1 of the present invention. FIG. 2 is a partially enlarged perspective view in which an airflow ejection nozzle portion is enlarged. FIG. 3 is a partially enlarged side view in which the airflow ejection nozzle portion is enlarged. FIG. 4 is a partially enlarged perspective view in which the suction nozzle portion is enlarged. FIG. 5 is a partially enlarged side view in which the suction nozzle portion is enlarged. FIG. 6 is a partial perspective view for explaining an airflow ejection nozzle and a suction nozzle of a laser scribing apparatus according to Embodiment 2 of the present invention. FIG. 7 is a plan view showing a tip portion of the airflow ejection nozzle.

  Embodiments of a laser scribing apparatus according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a diagram showing a schematic configuration of a laser scribing apparatus according to Embodiment 1 of the present invention. A laser scribing device 20 includes a stage 10 on which a glass substrate 1 of a thin-film solar cell, which is a workpiece, is placed, a laser light source 11 that irradiates the placed glass substrate 1 with laser light 2, and an irradiation position of the laser light 2. A scanning mechanism (not shown) for scanning is provided. The glass substrate 1 is held on the stage 10 with the film surface to be processed (processed surface) facing downward. The laser beam 2 is irradiated from the opposite side of the film surface.

  In order to process a photoelectric conversion film containing silicon as a main component in a thin film solar cell, a visible laser such as a YAG second harmonic pulse laser is preferably used as the laser light source 11. By scanning while irradiating the laser beam 2 with a pulse, a continuous groove is formed in the transparent electrode film 5 or the like on the glass substrate 1.

  An airflow ejection nozzle 3 and a suction nozzle 4 are provided below the stage 10 on the processing surface side of the glass substrate 1. At the same time as the laser beam 2 is irradiated, gas is blown from the airflow jet nozzle 3 to the glass substrate 1 and suction is performed from the suction nozzle 4. A gas is supplied from a gas supply source 13 to the airflow ejection nozzle 3. The gas supply source 13 is, for example, a gas cylinder that supplies nitrogen gas or the like, or a compressor that supplies compressed air.

  An exhaust pump 15 is connected to the suction nozzle 4. Between the suction nozzle 4 and the exhaust pump 15, you may provide the filter which supplements the particle of a dust generation thing. As described above, the laser scribing apparatus 20 includes an airflow control structure including an airflow generation device such as the gas supply source 13 and the exhaust pump 15 and the nozzles 3 and 4 connected thereto.

  FIG. 2 is a partially enlarged perspective view in which the airflow ejection nozzle 3 is enlarged. FIG. 3 is a partial enlarged side view in which the airflow ejection nozzle 3 is enlarged.

  The airflow ejection nozzle 3 is structured to blow airflow from both sides in the scanning direction so as to concentrate toward the vicinity of the irradiation position of the laser light 2. Specifically, the airflow jet nozzle 3 is provided so that the jet direction of the airflow from the airflow jet nozzle 3 is inclined to the irradiation position side of the laser light 2 with respect to the direction parallel to the laser light 2. It has been. The jet outlet 3 a of the airflow jet nozzle 3 has a shape extending in parallel with the scanning direction 6. A rectified air current is ejected from the ejection port 3a. The airflow ejection nozzle 3 moves along with the scanning of the laser light 2 and can blow an airflow near the irradiation position of the laser light 2. In addition, the center of the airflow ejected from each airflow ejection nozzle 3 is set slightly toward the near side from the center of the irradiation position of the laser beam 2. Thereby, it adjusts so that an airflow may hit the groove edge part formed. Further, the suction nozzle 4 is arranged on the near side in the scanning direction 6 with respect to the irradiation position of the laser beam 2. Further, the suction nozzle 4 moves together with the scanning of the laser light 2 and can perform suction near the irradiation position of the laser light 2.

  As shown in FIG. 3, the airflow from both sides in the scanning direction 6 collides in the vicinity of the irradiation position of the laser beam 2, the components parallel to the substrate cancel each other, and the glass substrate 1 near the irradiation position of the laser beam 2. An air flow away from the glass substrate 1 is generated in a direction perpendicular to the surface of the glass substrate 1. The dust generation 8 generated at the irradiation position of the laser beam 2 by laser scribing is separated from the surface of the glass substrate 1 together with this air flow. Then, the air flow and the dust generation material 8 that are separated from the glass substrate 1 are sucked by the suction nozzle 4 arranged on the near side in the scanning direction 6.

  In the first embodiment, the laser beam 2 passes through the transparent glass substrate 1 and processes the surface on the side from which the laser beam 2 is emitted. The dust 8 generated at the processing location is separated from the surface of the glass substrate 1 by the air flow away from the glass substrate 1 and sucked by the suction nozzle 4, so that the dust 8 is attached to the optical system of the laser beam 2. Can be suppressed. Further, since the suction nozzle 4 is disposed on the emission surface side of the laser light 2 from the glass substrate 1, the suction nozzle 4 does not block the laser light 2 before processing the glass substrate 1. Therefore, the freedom degree of the position which arrange | positions the suction nozzle 4 can be raised.

  In the first embodiment, the angle of the airflow ejection nozzle 3 can be changed. Thereby, angle (theta) which the ejection direction of the airflow from the airflow ejection nozzle 3 makes can be changed. By adjusting the angle θ, for example, even when the width of the groove formed by laser scribing is changed, the air flow can be more reliably applied to the groove edge portion, and the dust generation object 8 can be efficiently sucked. Can be realized. The angle θ is preferably about 60 to 120 degrees.

  As shown in FIG. 3, the position where the center line of the airflow from the airflow ejection nozzle 3 intersects the surface of the glass substrate 1 is preferably slightly outside the edge of the groove to be formed. For example, when a groove having a width of about 0.03 to 0.1 mm is formed, it is preferable that the groove is positioned about 0.1 to 0.3 mm away from the edge of the groove. In addition, the distance between the tip of the airflow ejection nozzle 3 and the surface of the glass substrate 1 is desirably close enough so that the airflow does not diffuse so much, for example, about 3 to 10 mm is preferable.

  FIG. 4 is a partially enlarged perspective view in which the suction nozzle 4 portion is enlarged. FIG. 5 is a partially enlarged side view in which the suction nozzle 4 portion is enlarged. The suction force of the suction nozzle 4 is adjusted by the suction amount adjustment valve 14 so that most of the airflow ejected from the airflow ejection nozzle 3 can be sucked. If the suction force from the suction nozzle 4 is too strong, dust other than the dust generation material 8 is attracted from the surroundings, and there is a risk of causing dust to adhere to the surface of the glass substrate 1. Therefore, the suction force from the suction nozzle 4 is preferably adjusted to a suction force that is slightly stronger than the suction force that can suck all the airflows ejected from the airflow ejection nozzle 3.

  With such a configuration, a laminar flow wall surrounding the irradiation position of the laser beam 2 from both sides is formed by the air flow toward the glass substrate 1 out of the rectified air flow ejected from the air flow ejection nozzle 3. Can do. This laminar wall can confine the dust 8 generated by laser scribing within the laminar wall and prevent it from being scattered on the surface of the glass substrate 1. Further, as described above, among the airflows ejected from the airflow ejection nozzle 3, the dusting substance 8 confined in the laminar flow wall is separated from the glass substrate 1 by the airflow away from the glass substrate 1, and reliably It can be removed by suction with the suction nozzle 4. In this way, by suppressing the adhesion of the dust generation material 8 to the surface of the glass substrate 1, it is possible to greatly reduce the peeling of the photoelectric conversion layer during substrate cleaning, and thus it is possible to suppress a decrease in yield due to a short circuit. Note that if the airflow is ejected from only one side instead of from both sides in the scanning direction 6, it is difficult to suppress the dusting material 8 from being scattered. 8 easily adheres to the surface of the glass substrate 1.

  Moreover, although not shown in figure, in order to stabilize the flow of the airflow from the airflow ejection nozzle 3, you may use the nozzle which combined the baffle plate with the airflow ejection nozzle 3. FIG. Furthermore, in order to prevent electrification due to the friction of the airflow, it is better to perform an antistatic treatment on the gas introduced into the airflow ejection nozzle 3. Further, in the first embodiment, the configuration in which the suction nozzle 4 is disposed on the front side with respect to the scanning direction 6 of the laser beam 2 with respect to the airflow ejection nozzle 3 is shown. It may be arranged on the back side.

Embodiment 2. FIG.
FIG. 6 is a partial perspective view for explaining the airflow ejection nozzle 23 and the suction nozzle 24 of the laser scribing apparatus 21 according to Embodiment 2 of the present invention. FIG. 7 is a plan view showing a tip portion of the airflow ejection nozzle 23. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. Further, in FIG. 6, illustration of a stage, a gas supply source, and the like is omitted. In the second embodiment, as shown in FIG. 7, the jet outlet 23a, which is the tip of the airflow jet nozzle 23, includes a parallel slit portion (first jet outlet) 23b and an arc portion (second jet outlet) 23c. The parallel slit portion 23 b has a shape extending in parallel with the scanning direction 6 on both sides of the scanning direction 6 of the laser light 2. The arc portion 23c has a semicircular arc shape and is provided between the parallel slit portions 23b. The parallel slit part 23b and the circular arc part 23c are integrally connected, and the jet outlet 23a is one jet outlet. Due to the parallel slit portion 23b and the circular arc portion 23c, the ejection port 23a has a U-shape as a whole in plan view.

  The parallel slit portion 23b ejects a rectified airflow toward the surface of the glass substrate 1 as in the first embodiment. Since the parallel slit portion 23b is connected to the circular arc portion 23c and it is difficult to adjust the angle, the ejection direction and the installation angle are set in advance so that the air flow easily hits the edge portion of the workpiece machining groove. Further, an air flow is ejected from the arc portion 23 c toward the vicinity of the irradiation position of the laser beam 2 from the back side in the scanning direction 6 with respect to the irradiation position of the laser beam 2. More specifically, an airflow directed toward the center of the arc is ejected from the arc portion 23c. Moreover, in order to apply an airflow appropriately to the edge part of a process groove, the gap of the head part of the airflow ejection nozzle 3 and a workpiece | work can be adjusted now.

  Since the parallel slit portions 23b extend in parallel to the scanning direction 6 on both sides of the scanning direction 6 of the laser light 2, the dust generating material 8 is confined in the laminar flow wall as in the first embodiment, and the glass substrate 1 It can suppress adhering to the surface. A laminar wall is also formed by the air flow ejected from the arc portion 23c. The laminar flow wall formed by the airflow from the arc portion 23c prevents dust from being scattered from between the laminar flow walls formed by the airflow from the parallel slit portion 23b, thereby ensuring more reliable layering. Dust can be trapped in the flow wall. Further, the suction nozzle 24 is disposed on the front side in the scanning direction 6 of the laser beam 2 with respect to the irradiation position of the laser beam 2, that is, on the opposite side of the laminar flow wall formed by the airflow from the arc portion 23c. The dust generated from the portion not surrounded by the laminar flow wall can be reliably sucked and removed by the suction nozzle 24.

  In this way, dust generated by laser scribing is trapped and removed within the laminar wall, so that dust can be prevented from adhering to the surface of the workpiece such as a glass substrate. In addition, since the separation of the photoelectric conversion layer at the time of cleaning the substrate due to dust generation can be greatly reduced, yield reduction due to a short circuit can be suppressed.

  In the second embodiment, the shape of the jet port 23a of the airflow jet nozzle 23 is U-shaped, but the portion corresponding to the arc portion 23c is a straight shape, and the shape of the jet port 23a is a U-shape as a whole. It does not matter. Moreover, although the parallel slit part 23b and the circular arc part 23c are integrally formed, you may form each separately.

  Further, the arc portion 23 c may be arranged on the near side with respect to the scanning direction 6. In this case, by providing the suction nozzle 24 on the back side with respect to the scanning direction, dust particles scattered from a portion not surrounded by the laminar flow wall can be reliably sucked and removed by the suction nozzle 24. .

  As described above, the laser scribing apparatus according to the present invention is useful for laser scribing of a workpiece, and is particularly suitable for laser scribing while removing dust.

1 Glass substrate (workpiece)
DESCRIPTION OF SYMBOLS 2 Laser beam 3 Airflow ejection nozzle 3a Ejection port 4 Suction nozzle 5 Transparent electrode film 6 Scanning direction 8 Dust generation 10 Stage 11 Laser light source 13 Gas supply source 14 Suction amount adjustment valve 15 Exhaust pump 20, 21 Laser scribing device 23 Air current ejection Nozzle 23a Spout 23b Parallel slit (first spout)
23c Arc part (second outlet)
24 Suction nozzle

Claims (6)

A laser scribing device that scans a laser beam from a laser light source to laser scribe a workpiece,
On the opposite side of the surface to which the laser beam of the workpiece is irradiated,
Towards the vicinity irradiation position of the laser beam, and the air jet nozzle for ejecting a stream from both sides in the scanning direction of the laser beam,
A suction nozzle that is provided in the vicinity of the irradiation position of the laser beam to the workpiece and sucks an airflow between the airflows ejected from both sides in the scanning direction ;
Wherein the air jet nozzle and the suction nozzle, the the workpiece, the laser scribing apparatus characterized that you move with the scanning of the laser beam.   2. The laser scriber according to claim 1, wherein the airflow ejection nozzle is provided such that an airflow ejection direction is inclined toward the irradiation position side of the laser beam with respect to a direction parallel to the laser beam. apparatus.   The laser scribing apparatus according to claim 1, wherein a jet direction of an air flow from the air jet nozzle is changeable. The airflow ejection nozzle is
A first jet nozzle for jetting an airflow from both sides of the laser beam scanning direction toward the vicinity of the irradiation position of the laser beam;
A second jet nozzle for jetting an air stream toward at least one of the laser beam scanning position and the near side in the scanning direction of the laser beam toward the vicinity of the laser beam irradiation position. The laser scribing apparatus according to claim 1.   The laser scribing apparatus according to claim 4, wherein the first jet port and the second jet port are connected to form one jet port.   The laser scribing apparatus according to claim 5, wherein the second ejection port has an arc shape.

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