JP2019072925A - Workpiece holding tool, electronic component processing device, and manufacturing method of electronic component - Google Patents

Abstract

To provide a workpiece holding tool, an electronic component processing device, and a manufacturing method of an electronic component by which continuous processing of a plurality of surfaces to be processed of a workpiece can be carried out with high precision.SOLUTION: A workpiece holding tool 1 includes a workpiece holding mechanism 10 for holding a workpiece 50. The workpiece holding mechanism 10 includes a workpiece housing part 13 having a first abutting surface 131, a second abutting surface 132, and a third abutting surface 133 on which three surfaces of the workpiece 50 abut. An opposite side to the first abutting surface 131 and an opposite side of the second abutting surface 132 of the workpiece housing part 13 are opened so as to expose at least the two surfaces to be processed (an end surface 52a3 of a flange part 52a, and upper surfaces 52a1, 52a2 of flange parts 52a, 52b) of the workpiece 50 housed in the workpiece housing part 13.SELECTED DRAWING: Figure 1B

Description

  The present invention relates to a workpiece holding jig having a workpiece holding mechanism for holding a workpiece, an electronic component processing apparatus having the workpiece holding jig, and a method of manufacturing an electronic component using the workpiece holding jig.

  At the time of manufacturing an electronic component, a plurality of workpieces are held by a workpiece holding jig as described in FIG. 7 and the like of Patent Document 1, and an electrode film (terminal Electrode) may be formed.

  In an electronic component having a plurality of processing planned surfaces, in order to form an electrode film on each processing planned surface, each time an electrode film is formed on the processing planned surface, the workpiece is removed from the workpiece holding jig to form an electrode film. It is necessary to change the direction so that the not-to-be-treated surface faces the printing screen or the like.

  However, once the work is removed from the work holding jig, it is not easy to accurately reposition the work in its original position. If the electrode film is formed in a misaligned state, the electrode film can not be formed at a desired position, or an electrode film having a desired shape can not be obtained, or a defect occurs in part of the electrode film, etc. , There is a risk of problems.

Japanese Patent Application Laid-Open No. 7-201653

  The present invention has been made in view of such circumstances, and an object thereof is to manufacture a workpiece holding jig, an electronic component processing apparatus, and an electronic component capable of performing processing continuously on a plurality of processing planned surfaces of the workpiece with high accuracy. It is to provide a method.

In order to achieve the above object, a work holding jig according to the present invention is:
A workpiece holding jig having a workpiece holding mechanism for holding a workpiece, wherein
The workpiece holding mechanism has a workpiece storage portion having a first contact surface on which the three surfaces of the workpiece contact, a second contact surface, and a third contact surface.
The work storage portion is at least opposite to the first contact surface and opposite to the second contact surface such that at least two planned processing surfaces of the workpiece stored in the work storage portion are exposed. Are open.

  The workpiece holding jig according to the present invention has a workpiece holding mechanism for holding a workpiece. The workpiece holding mechanism has a workpiece storage portion having a first contact surface, a second contact surface, and a third contact surface, and the workpiece storage portion is a portion of the workpiece stored in the workpiece storage portion. The opposite side of at least the first contact surface and the opposite side of the second contact surface are open so that the at least two planned treatment surfaces are exposed. Therefore, when the workpiece is accommodated in the workpiece accommodating portion, at least two planned processing surfaces of the workpiece are exposed at least from the opposite side of the first abutment surface of the workpiece accommodating portion and the opposite side of the second abutment surface.

  In the present invention, it is possible to form an electrode film on the processing scheduled surface by directing the processing scheduled surface of the workpiece exposed from the workpiece storage portion to a printing screen or the like. Then, after an electrode film is formed on one of the processing scheduled surfaces of the workpiece exposed from the workpiece storage portion (for example, the processing scheduled surface exposed from the opposite side of the first contact surface), the workpiece holding jig is at a predetermined angle By rotating only one of the other processing scheduled surfaces exposed from the workpiece storage unit (for example, the processing scheduled surface exposed from the opposite side of the second contact surface) to the printing screen etc. Can form an electrode film.

  That is, in the present invention, unlike the prior art, it is not necessary to remove the workpiece from the workpiece holding jig and change the orientation of the workpiece each time the electrode film is formed on the processing planned surface, and at least two processes exposed from the workpiece storage portion It is possible to form an electrode film continuously on a planned surface. Therefore, it is possible to prevent a defect such as a positional deviation or a defect of the electrode film which may occur due to the removal of the work, and to form the electrode film at a predetermined position of the work with high accuracy.

  Moreover, it is also possible to form not only an electrode film but other functional films (for example, an insulating film) on the processing planned surface of the workpiece by using the workpiece holding jig according to the present invention. Moreover, it is also possible to perform not only a film formation process but other processes (for example, surface treatment such as etching) on the surface to be treated. In any of the processes, the workpiece holding jig is rotated by a predetermined angle as described above, and the processing planned surface of the processing target is sequentially shifted, so that the processing continuous to a plurality of processing planned surfaces of the workpiece is highly accurate. Can be done with

  In addition, by positioning the work with the first contact surface, the second contact surface, and the third contact surface, displacement of the work is prevented, and processing continuous to a plurality of processing planned surfaces of the work is performed. Can be done with higher accuracy.

  Alternatively, a plurality of workpiece holding jigs (for example, two first and second holding jigs) may be arranged to simultaneously process different processing scheduled surfaces of the workpiece held by these. For example, the processing scheduled surface opposite to the first contact surface of the work of the first workpiece holding jig and the processing scheduled surface opposite to the second contact surface of the work of the second workpiece holding jig You may arrange | position so that it may become substantially flush. With such a configuration, processing such as electrode film formation processing can be performed simultaneously on the processing planned surfaces of two workpieces.

  Preferably, the two processing planned surfaces of the workpiece stored in the workpiece storage unit are exposed from the opposite side of the first contact surface and the opposite side of the second contact surface, respectively. The work is accommodated in the work accommodation portion. By adopting such a configuration, continuous processing is performed in the above-described manner on the planned treatment surface exposed from the opposite side of the first contact surface and the planned treatment surface exposed from the opposite side of the second contact surface. Can be done with higher accuracy.

  Preferably, the workpiece is accommodated in the workpiece accommodating portion such that the two processing planned surfaces project outside the workpiece accommodating portion. With such a configuration, each processing scheduled surface of the work protrudes to the outside of the workpiece accommodating portion, and processing such as electrode film forming processing can be easily performed on each processing scheduled surface by a squeegee or the like.

  Preferably, the amount of projection of the processing planned surface of the workpiece protruding from the opposite side of the first contact surface is substantially equal to the amount of projection of the processing planned surface of the workpiece protruding from the opposite side of the second contact surface. With such a configuration, when the work holding jig is rotated by a predetermined angle, even if any of the processing planned surfaces faces the printing screen etc. It becomes easy to adjust the distance between them so that it is always constant. Therefore, it is not necessary to adjust the above-mentioned distance each time the workpiece holding jig is rotated by a predetermined angle, and an electrode film can be easily formed on the processing scheduled surface of the workpiece by a squeegee or the like.

  Preferably, the work holding mechanism includes a plurality of work receiving portions. With such a configuration, each of a plurality of works can be disposed in each work storage portion, and terminal electrodes can be formed on a plurality of works with high accuracy at one time.

  Preferably, the second contact surface is formed with a recess which is recessed toward the side opposite to the workpiece accommodated in the workpiece accommodation portion. With such a configuration, after performing predetermined processing on the processing scheduled surface, a pin or the like is inserted into the recess, and the work fixed on the second contact surface is pushed out so as to scrape with this pin or the like Thus, the workpiece can be taken out of the workpiece storage unit.

  Preferably, the work holding mechanism includes a first work holding portion and a second work holding portion detachably attached to the first work holding portion, and the first contact surface and the third contact are provided. A surface is formed in the first work holding portion, and the second contact surface is formed in the second work holding portion. With such a configuration, processing can be performed in the following manner.

  That is, according to the size of the work to be processed, a plurality of first work holding parts having different sizes of the work storage parts (areas of the first contact surface and the third contact surface) are prepared in advance. A first workpiece holding unit having a desired size of workpiece holding unit is selected. If the first work holding unit is attached to the second work holding unit and processing is performed, the second work holding unit does not need to be changed, and therefore, the productivity of electronic components of other types can be improved.

  Preferably, the workpiece accommodated in the workpiece accommodation portion is disposed inside a corner formed by the second abutment surface and the third abutment surface. With such a configuration, the work is fixed inside the corner of the work storage portion, and the work can be easily positioned. Therefore, positional deviation of the workpiece can be prevented, and processing continuous to a plurality of processing planned surfaces of the workpiece can be performed with higher accuracy.

  The workpiece holding jig may have a substantially square cross-sectional shape perpendicular to the longitudinal direction. With such a configuration, when the workpiece holding jig is rotated by a predetermined angle, it is easy to always keep the distance between the printing screen or the like and the processing planned surface of the workpiece constant.

  Further, when a plurality of workpiece holding jigs are arranged adjacent to each other, when the workpiece holding jigs are rotated by a predetermined angle, the processing scheduled surface of the workpiece held between the adjacent workpiece holding jigs is displayed. It becomes easy to make it substantially flush and it becomes easy to perform processing such as screen printing.

  The workpiece accommodated in the workpiece accommodation portion may be disposed outside the corner formed by the second abutment surface and the third abutment surface. With such a configuration, the workpiece is fixed to the outside of the corner of the workpiece accommodating portion, and the workpiece can be positioned. Therefore, positional deviation of the workpiece can be prevented, and processing continuous to a plurality of processing planned surfaces of the workpiece can be performed with higher accuracy.

  In addition, when the work is placed in the work storage unit by the above-mentioned configuration, at least three planned processing surfaces of the work from the work storage unit are opposite to the first contact surface and two second contact surfaces. Exposed from the opposite side of the contact surface. Therefore, the workpiece holding jig is rotated by a predetermined angle as described above, and at least three processing target surfaces to be processed are sequentially shifted, whereby processing continuous to a plurality of processing target surfaces of the workpiece is performed with high accuracy. It can be carried out.

  In addition, a plurality of work holding jigs (for example, three first to third holding jigs) may be arranged to simultaneously process different processing planned surfaces of the work held by these. For example, the processing scheduled surface opposite to the first contact surface of the work of the first workpiece holding jig and the processing scheduled surface opposite to the second contact surface of the work of the second workpiece holding jig And the processing scheduled surface on the opposite side of the second contact surface of the workpiece of the third workpiece holding jig may be substantially flush with each other. With such a configuration, processing such as electrode film formation processing can be performed simultaneously on the processing planned surfaces of the three workpieces.

  Preferably, the apparatus further comprises pulling means for pulling the work stored in the work storage portion into contact with the second contact surface and the third contact surface. With such a configuration, it is possible to draw the workpiece stored in the workpiece storage portion into contact with the second contact surface and the third contact surface, and the positioning accuracy of the workpiece with respect to the workpiece holding jig Can be improved.

  The auxiliary member may be configured to be detachable from the workpiece holding mechanism. In this case, even if dust or the like (ferrite powder, chipping, or the like) accumulates inside the workpiece holding jig, the auxiliary member Can be removed from the workpiece holding mechanism to clean the inside of the workpiece holding jig and the like.

  A plurality of workpiece holding jigs may be provided in the electronic component processing apparatus. Examples of the electronic component processing apparatus include a printing apparatus, a sealing apparatus, and a coating apparatus.

  Preferably, in the method of manufacturing an electronic component according to the present invention, at least two processing planned surfaces are processed on any of the processing planned surfaces of the workpiece exposed from the workpiece storage unit using any of the above-described workpiece holding jigs. And rotating the workpiece holding jig by a predetermined angle to perform processing on any other planned surface of the workpiece. By manufacturing the electronic component by such a method, continuous processing can be performed with high accuracy on a plurality of processing planned surfaces of the workpiece.

Alternatively, in the method of manufacturing an electronic component according to the present invention, any one of the work holding jigs described above is held by the first contact surface of the work storage portion of one adjacent work holding jig and the other work holding adjacent thereto. Arranging them by rotating them by a predetermined angle so that the second contact surface of the workpiece accommodating portion of the jig faces in the same direction;
Processing of the work scheduled to be processed of the workpiece exposed from the opposite side of the first contact surface of the one work holding jig and the workpiece exposed from the opposite side of the second contact surface of the other work holding jig It may have a process which processes to a plan side.

  By manufacturing the electronic component by such a method, the processing scheduled surface exposed on the opposite side of the first contact surface of the workpiece accommodating portion of one adjacent workpiece holding jig by the squeegee etc. and the other adjacent The continuous processing can be performed collectively with high accuracy on the processing scheduled surface exposed on the opposite side of the second contact surface of the workpiece holding portion of the workpiece holding jig.

FIG. 1A is an overall perspective view of a workpiece holding jig according to a first embodiment of the present invention. FIG. 1B is a partially enlarged view of the workpiece holding jig shown in FIG. 1A. FIG. 1C is an enlarged view of the work shown in FIG. 1A. FIG. 1D is an enlarged view showing a modified example of the work shown in FIG. 1C. FIG. 2A is a side view showing a process of forming a terminal electrode on an electronic component using the workpiece holding jig shown in FIG. 1A. FIG. 2B is a side view showing the process following FIG. 2A. FIG. 2C is a side view showing the process following FIG. 2B. FIG. 2D is a side view showing the process continued from FIG. 2C. FIG. 2E is a side view showing a process of forming terminal electrodes of different modes on an electronic component using a workpiece holding jig according to a second embodiment of the present invention. FIG. 2F is a side view showing the process following FIG. 2E. FIG. 2G is a side view showing the process following FIG. 2F. FIG. 2H is a side view showing the process following FIG. 2G. FIG. 3 is an exploded perspective view of the workpiece holding jig shown in FIG. 1A. FIG. 4A is an overall perspective view showing a different arrangement of the workpiece holding jig shown in FIG. 1A. FIG. 4B is an overall perspective view when the workpiece holding jig shown in FIG. 4A is rotated. FIG. 5A is an overall perspective view of a work holding jig according to a third embodiment of the present invention. FIG. 5B is a partially enlarged view of the workpiece holding jig shown in FIG. 5A. FIG. 6A is a side view showing a process of forming a terminal electrode on an electronic component using the workpiece holding jig shown in FIG. 5A. FIG. 6B is a side view showing the process following FIG. 6A. FIG. 6C is a side view showing the process continued from FIG. 6B.

  Hereinafter, the present invention will be described based on embodiments shown in the drawings.

First Embodiment As shown in FIG. 1A, the workpiece holding jigs 1A and 1B according to the first embodiment of the present invention are a workpiece holding mechanism 10 and an auxiliary member 20 configured to be detachable from the workpiece holding mechanism 10. And. In the electronic component processing apparatus, a plurality of workpiece holding jigs 1A and 1B are provided in an arrayed state as shown in FIG. 1A. In the example shown in FIG. 1A, two work holding jigs 1A and 1B are arranged substantially in parallel, respectively, and one work holding jig 1A has a Y-axis relative to the other work holding jig 1B. It is rotated 90 ° clockwise as a central axis.

  The workpiece holding jigs 1A and 1B are jigs for aligning and holding element bodies (hereinafter, workpieces 50) of a plurality of electronic components in order to form terminal electrodes at the time of manufacturing the electronic components. The workpiece holding jigs 1A and 1B are used as auxiliary jigs for the electronic component processing apparatus (not shown), and a plurality of the workpiece holding jigs 1A and 1B are provided in the electronic component processing apparatus (not shown).

  Examples of the electronic component processing apparatus include a printing apparatus, a sealing apparatus, or a coating apparatus. At the time of manufacture of the electronic component, for example, the processing scheduled surfaces of the plurality of works 50 held by the work holding jigs 1A and 1B by a squeegee or the like provided in the printing apparatus (in the present embodiment, the ridges 52a and 52b shown in FIG. An electrode film (terminal electrode) formation process is performed on the surface).

  In the following, first, details of the electronic component formed by subjecting the workpiece 50 to the electrode film formation process will be described. In the following description, the direction parallel to the longitudinal direction of the workpiece holding jigs 1A and 1B is taken as the Y-axis direction, the direction perpendicular to the Y-axis as the X-axis direction, and the direction perpendicular to the Y-axis and the X-axis as the Z-axis direction. .

  As shown in FIG. 1B, the workpiece 50 (element body of the electronic component) held by one of the workpiece holding tools 1A comprises a drum core and a core 51 having a winding axis in the X-axis direction, and the core A pair of flanges 52a and 52b are provided at both ends of the 51 in the X-axis direction. The flanges 52a and 52b are arranged substantially parallel to each other at a predetermined interval in the X-axis direction. The winding core 51 is connected to the center of each of the faces facing each other in the pair of collars 52a and 52b, and connects the pair of collars 52a and 52b.

  As shown in FIG. 1C, the flanges 52a and 52b have a substantially rectangular shape (substantially hexahedron), and the upper surfaces 52a1 and 52b1 and the upper surfaces 52a1 and 52b1 are lower surfaces 52a2 and 52b2 opposite to each other in the Z-axis direction, The end faces 52a3 and 52b3, the first side faces 52a4 and 52b4, and the first side faces 52a4 and 52b4 are opposite to the second side faces 52a5 and 52b5 in the Y-axis direction, and the end faces 52a3 and 52b3 are on the opposite side in the X-axis direction And the inner side surfaces 52a6 and 52b6. Upper surface 52a1, 52b1 or lower surface 52a2, 52b2 is a part joined to a circuit board etc., for example.

  As shown in FIG. 1C, an electrode film 53 having a predetermined pattern is formed on the ridges 52a and 52b. The electrode portion 53 is formed of, for example, a metal paste baking film or a metal plating film. The electrode film 53 has an upper surface electrode portion 531, an end surface electrode portion 532 and a lower surface electrode portion 533, which are electrically and physically connected.

  The upper surface electrode portion 531 is formed of a surface parallel to the XY plane, and is formed on the upper surfaces 52a1 and 52b1. The end face electrode portion 532 is formed in a plane parallel to the YZ plane, and is formed on the end faces 52a3 and 52b3. The lower surface electrode portion 533 is a surface parallel to the XY plane, and is formed on the lower surface 52a2, 52b2.

  Next, details of the workpiece holding jigs 1A and 1B will be described. The workpiece holding jigs 1A and 1B have the same configuration, and therefore, in the following description, the workpiece holding jigs 1A and 1B will be described in detail with reference to the workpiece holding jig 1A.

  In the workpiece holding jig 1A, the X-axis direction corresponds to the lengthwise direction of the workpiece holding jig 1A, the Y-axis direction corresponds to the width direction of the workpiece holding jig 1A, and the Z-axis direction corresponds to the workpiece holding jig 1A. Corresponds to the height direction. Moreover, below, let the arrow direction side of Z-axis be upper direction, and let the opposite direction side to the arrow direction of Z-axis be downward.

  As shown in FIG. 1A, the workpiece holding jig 1A has a shape elongated in the Y-axis direction. When the workpiece holding mechanism 10 and the auxiliary member 20 are coupled, the cross-sectional shape perpendicular to the longitudinal direction of the combined body of the workpiece holding jig 1A is substantially square. More specifically, the length in the Y-axis direction of the workpiece holding jig 1A is, for example, 200 to 300 mm, the width in the X-axis direction is 10 to 30 mm, and the width in the Z-axis direction is 10 to 30 mm.

  The workpiece holding mechanism 10 has a plurality of workpiece accommodating parts 13. The work accommodating portion 13 is formed of a recess, and an open portion capable of receiving the work is formed on the upper side and the side. The workpiece 50 is accommodated in the workpiece accommodating portion 13 through the opening portion.

  As shown in FIG. 1B, the workpiece accommodating portion 13 has a first contact surface 131, a second contact surface 132, a third contact surface 133, and an opposing surface 134.

  The first contact surface 131 is formed of a surface (an XY plane in the illustrated example) parallel to the width direction and the length direction of the workpiece holding jig 1. The second contact surface 132 is formed of a surface (YZ plane in the illustrated example) parallel to the longitudinal direction and the height direction of the workpiece holding jig 1. The third contact surface 133 is formed of a surface (in the illustrated example, an XZ plane) parallel to the width direction and the height direction of the workpiece holding jig 1. The opposing surface 134 is composed of a surface (in the illustrated example, an XZ plane) parallel to the longitudinal direction and the height direction of the workpiece holding jig 1 and is disposed on the opposite side to the third contact surface in the Y axis direction. is there.

  The second contact surface 132 and the third contact surface 133 intersect each other substantially at right angles to form a corner. Similarly, the second abutment surface 132 and the opposing surface 134 intersect at substantially right angles with each other to form a corner.

  When the workpiece 50 is accommodated in the workpiece accommodating portion 13, the lower surfaces 52a2 and 52b2 of the flange portions 52a and 52b of the workpiece 50 shown in FIG. 1C abut on the first contact surface 131 of the workpiece accommodating portion 13. Further, an end face 52b3 of the flange 52b of the work 50 shown in FIG. 1C abuts on the second contact surface 132 of the work storage 13 shown in FIG. 1B. In addition, the second side surfaces 52a and 52b5 of the flanges 52a and 52b of the workpiece 50 shown in FIG. 1C abut on the third abutment surface 133 of the workpiece storage portion 13 shown in FIG. 1B. That is, three surfaces of the workpiece 50 abut on the first abutment surface 131, the second abutment surface 132, and the third abutment surface 133 shown in FIG. 1B.

  In the present embodiment, the width in the X-axis direction of the first contact surface 131 and the third contact surface 133 is slightly shorter than the width in the Y-axis direction between the end surfaces 52a3 and 52b3 of the flanges 52a and 52b shown in FIG. 1C. It is formed like. Further, the width in the Z-axis direction of the second contact surface 132, the third contact surface 133 and the opposing surface 134 shown in FIG. 1B is formed to be slightly smaller than the height in the Z-axis direction of the flanges 52a and 52b. It is

  Therefore, when the work 50 is stored in the work storage portion 13, the processing schedule of the work 50 stored in the work storage portion 13 from the opposite side of the first contact surface 131 and the opposite side of the second contact surface 132 The surface (the surface on which the electrode film 53 of a predetermined pattern is to be formed) protrudes to the outside of the workpiece storage portion 13.

  More specifically, the upper surfaces 52a1 and 52b1 of the flanges 52a and 52b shown in FIG. 1C protrude from the opposite side of the first contact surface 131 shown in FIG. 1B and are exposed to the outside of the workpiece accommodating portion 13. Further, the end face 52a3 of the flange 52a shown in FIG. 1C protrudes from the opposite side of the second contact surface 132 shown in FIG. 1B, and is exposed to the outside of the workpiece accommodating portion 13.

  When the workpiece 50 is accommodated inside the workpiece accommodation portion 13 with the workpiece 50 vertically inverted (Z-axis direction) and horizontally (Y-axis direction) inverted, the lower surface 52a2 of the flanges 52a and 52b shown in FIG. 1C. , 52b2 project from the opposite side of the first contact surface 131 shown in FIG. 1B, and are exposed to the outside of the workpiece storage portion 13. Further, the end face 52b3 of the flange 52b shown in FIG. 1C protrudes from the opposite side of the second contact surface 132 shown in FIG.

  In this embodiment, the amount of protrusion of the upper surfaces 52a1 and 52b1 of the flanges 52a and 52b protruding from the opposite side of the first abutment surface 131 and the end surface 52a3 of the flange 52a projecting from the opposite side of the second abutment surface 132 The amount of protrusion of the processing planned surface of is substantially equal.

  In the present embodiment, when the workpiece 50 is accommodated in the workpiece accommodating portion 13, the end face 52b3 of the flange portion 52b of the workpiece 50 is arranged along the second abutment surface 132 and the third abutment surface 133 of the workpiece accommodation portion 13 (see FIG. 1C) and the second side surfaces 52a, 52b5 (see FIG. 1C) of the flanges 52a, 52b. Therefore, as shown in FIG. 1B, the work 50 stored in the work storage portion 13 is disposed inside the corner formed by the second contact surface 132 and the third contact surface 133. .

  The workpiece 50 is disposed to be biased toward the third contact surface 133, and a gap is formed between the first side surface 52a4 of the workpiece 50 and the facing surface 134. The size of the gap may be appropriately set in accordance with the size of the workpiece 50 (in particular, the width in the Y-axis direction).

  The second abutment surface 132 has a recess recessed toward the opposite side (normal direction of the end surface 52b3 (see FIG. 1C) of the flange 52b of the workpiece 50) to the workpiece 50 contained in the workpiece housing 13. 132a is formed. The concave portion 132 a is formed to be biased toward the third contact surface 133 side of the second contact surface 132.

  The recess 132a has a long hole shape when viewed from above the workpiece holding jig 1A, but the shape of the recess 132a is not particularly limited, and may be changed as appropriate. Further, the depth in the Z-axis direction of the recess 132 a may be the same as the depth in the Z-axis direction of the workpiece accommodating portion 13, but may be different.

  The Y-axis direction width of the concave portion 132a is smaller than the Y-axis direction width of the flanges 52a and 52b. With such a configuration, when the workpiece 50 is accommodated in the workpiece accommodating portion 13, the workpiece 50 is prevented from being buried in the recess 132a.

  In the present embodiment, the work holding mechanism 10 includes the first work holding unit 11 and the second work holding unit 12 and is detachably attached to the work holding units 11 and 12. As shown in FIG. 2A, each of the first work holding portion 11 and the second work holding portion 12 has a stepped portion in the cross section, and each work holding portion 11 can be releasably engaged with each stepped portion. It is possible to combine twelve.

  As shown in FIG. 1A, a screw hole 60 is formed in the second work holding portion 12, and the first work holding portion 11 and the second work holding portion 12 are inserted by inserting a screw 70 into the screw hole 60. It is possible to firmly fix the

  In the present embodiment, the workpiece storage unit 13 is formed by combining the first workpiece holding unit 11 and the second workpiece holding unit 12. That is, the workpiece storage unit 13 is configured to be separable. Hereinafter, the detailed structure of the workpiece storage unit 13 will be described.

  The first work holding portion 11 has a first partition end 111, a second partition end 112, a plurality of partitions 113, and a plurality of recesses 114. The plurality of partition portions 113 have a predetermined thickness along the Y-axis direction, and are arranged along the longitudinal direction of the first work holding portion 11 at a predetermined interval. In addition, the thickness along the Y-axis direction of the partition part 113 is not specifically limited, You may change suitably.

  The first partition end 111 is formed at one end in the longitudinal direction of the first workpiece holder 11, and the second partition end 112 is formed at the other end in the longitudinal direction of the first workpiece holder 11.

  Each of the plurality of recesses 114 is between the first partition end 111 and the partition 113 adjacent to it, between the second partition end 112 and the partition 113 adjacent to it, and a plurality of partitions It is formed between each of 113. The upper side of the recess 114 is open. Further, in the state in which the first holding portion 11 and the second holding portion 12 are separated, the lateral sides (both ends in the width direction) of the concave portion 114 are open.

  The second work holding portion 12 has an end face portion 121. The end face portion 121 constitutes one end of the first work holding portion 12 in the width direction, and the end face portion 121 is provided with the recess 132 a of the work storage portion 13 described above. In addition, although it is preferable that the upper surface of the 2nd workpiece | work holding part 12 and the upper surface of the partition part 113 become flush | level, a level | step difference may be formed.

  In the workpiece holding jig 1A, when the second holding portion 12 is combined with the first holding portion 11, the end surface portion 121 (shown in FIG. 1B) of the second holding portion 12 is shown on the side (one end in the X-axis direction) of the recess 114. The portion corresponding to the second contact surface 132 of the workpiece accommodating portion 13 abuts. As a result, one end of the recess 114 in the width direction is closed, and the other end of the width direction is opened to form the workpiece storage portion 13.

  That is, as shown in FIG. 1B, the upper surfaces 52a1 and 52b1 (see FIG. 1C) of the flanges 52a and 52b of the workpiece 50 accommodated in the workpiece accommodation unit 13 and the end surface 52a3 (see FIG. 1C) of the flange 52a are exposed. As a result, the workpiece accommodating portion 13 in which the opposite side of the first abutment surface 131 and the opposite side of the second abutment surface 132 are opened is formed.

  In the example shown in FIG. 1B, the first contact surface 131 and the third contact surface 133 are formed in the first workpiece holder 11, and the second contact surface 132 is in the second workpiece holder 12. It is formed. However, as an aspect of the work storage unit 13, it is not necessary to configure the first work holding unit 11 and the second work holding unit 12 in combination as in the example shown in the drawings. It may be formed only on the first work holding portion 11.

  As shown in FIG. 3, the auxiliary member 20 combined with the workpiece holding mechanism 10 has a main body portion 21, a plurality of magnets 22, a magnet holding portion 23, and a positioning protrusion 24. In the illustrated example, the main body portion 21 has substantially the same length, width and height as the first work holding portion 11. In the illustrated example, two positioning protrusions 24 are formed on both ends of the main body 21 in the longitudinal direction. The positioning projection 24 engages with a positioning recess (not shown) of the first work holding portion 11 when the work holding mechanism 10 and the auxiliary member 20 are mounted.

  The magnet holding portion 23 is formed along the longitudinal direction of the main body portion 21 and is disposed at one end in the width direction of the main body portion 21. The magnet holding portion 23 has a plurality of housing concave portions 220 for housing a plurality of (same as the number of the workpiece housing portions 13) magnets 22. Each of the plurality of housing recesses 220 is disposed along the longitudinal direction of the magnet holding portion 23 at a predetermined interval.

  The magnet 22 has a substantially cylindrical shape and is housed inside the housing recess 220. The magnet 22 serves as a drawing means for drawing the workpiece 50 stored in the workpiece storage portion 13 into contact with the first contact surface 131, the second contact surface 132 and the third contact surface 133. . One end of the magnet 22 is exposed from the upper end of the accommodation recess 220 and faces the first contact surface 131 of the workpiece accommodation unit 13 of the first holding unit 11.

  The magnet 22 is disposed below the recess 114 of the first workpiece holder 11 shown in FIG. 1B, that is, below the workpiece holder 13. More specifically, the magnet 22 shown in FIG. 3 has a workpiece 50 by magnetic force at an angle portion formed by the second contact surface 132 and the third contact surface 113 in the workpiece accommodating portion 13 shown in FIG. 1B. Play a role in attracting.

  In the manufacture of the electronic component, first, as shown in FIG. 2A, a plurality of workpiece holding jigs 1A and 1B and, for example, a drum-type workpiece 50 are prepared (work preparation step). In the work 50, a winding core 51 and collars 52a and 52b shown in FIG. 1B are integrally formed. In the present embodiment, the upper surfaces 52a1 and 52b1, the lower surfaces 52a2 and 52b2, and the end surfaces 52a3 and 52b3 of the flanges 52a and 52b of the workpiece 50 are to be processed.

  Next, as shown in FIG. 2A, each of the plurality of works 50 is accommodated inside each of the work accommodating portions 13 of the work holding jigs 1A and 1B (work accommodation step). In the workpiece accommodation step, each workpiece 50 is accommodated so that the end surface 52b3 of the collar 52b abuts on the second abutment surface 132 and the second side surface 52b5 of the collar 52b abuts on the third abutment surface 133. It arranges inside the part 13.

  In this manner, each work 50 stored in the interior of each work storage unit 13 has the first contact surface 131 shown in FIG. 1B and the first contact surface 131 shown in FIG. 1B by the magnetic force of each magnet 22 of the second work holding unit 12 shown in FIG. It is drawn to the corner formed by the two abutment surfaces 132 and positioned inside the corner.

  Next, as shown in FIG. 1B, each of the workpiece holding jigs 1A and 1B is held by the first contact surface 131 of the workpiece accommodating portion 13 of one adjacent workpiece holding jig 1A and the other workpiece holding adjacent thereto. The second contact surface 132 of the workpiece accommodating portion 13 of the jig 1B is rotated by a predetermined angle (90 degrees) so as to face the same direction (Z-axis upper direction) (a workpiece arranging step).

  As a result, as shown in FIG. 2A, in the work 50 stored in the work storage portion 13 of the work holding jig 1B, the end face 52a3 of the collar portion 52a faces upward, and the second contact surface of the work storage portion 13 Exposed from the opposite side of 132. Further, in the workpiece 50 accommodated in the workpiece accommodation portion 13 of the workpiece holding jig 1A, the upper surfaces 52a1 and 52b1 of the flanges 52a and 52b face upward, and the opposite side of the first contact surface 131 of the workpiece accommodation portion 13 Exposed from

  Next, an electrode film formation process is performed by screen printing or the like on the processing planned surface (upper surfaces 52a1 and 52b1 and end surface 52a3) of the workpiece 50 exposed from the workpiece storage portion 13 to form the electrode portions 53 shown in FIG. (1st treatment process).

  More specifically, as shown in FIG. 2A, the end surface of the flange portion 52a exposed from the opposite side of the second contact surface 132 for the workpiece 50 stored in the workpiece storage portion 13 of the workpiece holding jig 1B. An electrode film forming process is performed on 52 a 3 to form an end face electrode portion 532 of the electrode portion 53.

  In addition, for the work 50 stored in the work storage unit 13 of the work holding jig 1A, the electrode film forming process is performed on the upper surfaces 52a1 and 52b1 of the flanges 52a and 52b exposed from the opposite side of the first contact surface 131 To form upper surface electrode portions 531 and 531 of the electrode portion 53.

  The electrode film forming process is performed by applying a metal paste (for example, Ag paste) through a screen to the processing planned surface of each work 50 held by the work holding jig 1 using a squeegee or the like. .

  Next, the workpiece holding jigs 1A and 1B are rotated by a predetermined angle. More specifically, as shown in FIG. 2B, the workpiece holding jig 1B is rotated 90 degrees clockwise about the Y axis such that the first contact surface 131 is directed upward. In addition, the workpiece holding jig 1A is rotated 90 degrees clockwise about the Y axis such that the second contact surface 132 faces upward. Thus, when the workpiece holding jigs 1A and 1B are rotated by 90 degrees, the left and right positions of the workpiece holding jigs 1A and 1B are switched.

  Then, with respect to the workpiece 50 stored in the workpiece storage portion 13 of the workpiece holding jig 1A, an electrode film forming process is performed on the end surface 52a3 of the ridge portion 52a exposed from the opposite side of the second contact surface 132. The end face electrode portion 532 is formed.

  In addition, for the work 50 stored in the work storage portion 13 of the work holding jig 1B, the electrode film forming process is performed on the upper surfaces 52a1 and 52b1 of the flanges 52a and 52b exposed from the opposite side of the first contact surface 131 To form the upper surface electrode portions 531 and 531.

  In the series of electrode film formation processes before and after rotation of the workpiece holding jigs 1A and 1B, the electrode film formation process after rotation is performed before the electrode film 53 formed in the electrode film formation process before rotation is dried. May be After completion of the series of electrode film formation processes, the electrode film 53 may be dried (drying process).

  Next, as shown in FIG. 2C, the workpiece 50 is taken out of the workpiece holding portion 13 of the workpiece holding jigs 1A and 1B, the upper and lower sides and the left and right of the workpiece 50 are reversed, and the above-mentioned workpiece housing process is performed. As a result, as shown in FIG. 2C, the end face electrode portion 532 formed on the end face 52a3 of the flange portion 52a shown in FIG. 2B abuts on the second contact surface 132 of the workpiece storage portion 13. Further, the second side surfaces 52a 5 52b 5 of the flanges 52a 52b shown in FIG. 1C abut on the third contact surface 133 shown in FIG. 1B. Further, as shown in FIG. 2C, upper surface electrode portions 531 and 531 formed on the upper surfaces 52a1 and 52b1 of the flange portions 52a and 52b shown in FIG. 2B abut on the first contact surface 131.

  As a result, as shown in FIG. 2C, in the work 50 stored in the work storage portion 13 of the work holding jig 1A, the end face 52b3 of the collar portion 52b faces upward, and the second contact surface of the work storage portion 13 Exposed from the opposite side of 132. Further, in the workpiece 50 stored in the workpiece storage portion 13 of the workpiece holding jig 1B, the lower surfaces 52a2 and 52b2 of the flange portions 52a and 52b face upward, and the opposite side of the first contact surface 131 of the workpiece storage portion 13 Exposed from

  Next, an electrode film forming process is performed again on the processing planned surfaces (the lower surfaces 52a2 and 52b2 and the end surface 52b3) of the workpiece 50 exposed from the workpiece storage portion 13 (second processing step).

  In the second processing step, the lower surface 52a2 and the lower surface 52b2 of the flanges 52a and 52b exposed from the opposite side of the first contact surface 131 for the workpiece 50 stored in the workpiece storage unit 13 of the workpiece holding jig 1B. An electrode film formation process is performed to form lower surface electrode portions 533 and 533.

  In addition, with respect to the workpiece 50 stored in the workpiece storage portion 13 of the workpiece holding jig 1A, an electrode film forming process is performed on the end surface 52b3 of the flange 52b exposed from the opposite side of the second contact surface 132 An electrode portion 532 is formed.

  Next, the workpiece holding jigs 1A and 1B are rotated by a predetermined angle. More specifically, the workpiece holding jig 1B is rotated 90 degrees clockwise about the Y axis such that the second contact surface 132 faces upward. In addition, the workpiece holding jig 1A is rotated 90 degrees clockwise about the Y axis such that the first contact surface 131 faces upward. Thus, when the workpiece holding jigs 1A and 1B are rotated by 90 degrees, as shown in FIG. 2D, the left and right positions of the workpiece holding jigs 1A and 1B are switched.

  Then, with respect to the workpiece 50 accommodated in the workpiece accommodation portion 13 of the workpiece holding jig 1B, an electrode film forming process is performed on the end surface 52b3 of the flange 52b exposed from the opposite side of the second contact surface 132. The end face electrode portion 532 is formed.

  Further, for the workpiece 50 stored in the workpiece storage portion 13 of the workpiece holding jig 1A, the electrode film forming process is performed on the lower surfaces 52a2 and 52b2 of the flanges 52a and 52b exposed from the opposite side of the first contact surface 131 To form lower surface electrode portions 533 and 533.

  A drying process may be performed after completion of a series of electrode film formation processes. After the second treatment process, the workpiece 50 is baked at a predetermined temperature, and then the surface to be treated is subjected to, for example, electrolytic plating or electroless plating, as needed, to form a plating film.

  In the present embodiment, when the workpiece 50 is accommodated in the workpiece accommodating portion 13, the two processing planned surfaces (upper surface 52 a 1, 52 b 1 and end surface 52 a 3 or lower surface 52 a 2, 52 b 2 and end surface 52 b 3) of the workpiece 50 are the first of the workpiece accommodating portion 13. It is exposed from the opposite side of the contact surface 131 and the opposite side of the second contact surface 132.

  In the present embodiment, the electrode film 53 of a predetermined pattern can be formed on the processing scheduled surface by directing the processing scheduled surface of the workpiece 50 exposed from the workpiece storage unit 13 to a printing screen or the like. Then, after the upper surface electrode portion 531 is formed on any of the processing planned surfaces (for example, the upper surfaces 51a1 and 51b1) of the workpiece 50 exposed from the workpiece accommodation portion 13, the workpiece holding jig 1 is rotated by 90 degrees to By directing any other processing planned surface (for example, the end surface 51a3) exposed from the storage section 13 to the printing screen etc., the end surface electrode section 532 is continuously displaced to the upper surface electrode section 531 on the processing planned surface. It can form in a predetermined pattern, without doing.

  That is, in the present embodiment, unlike in the prior art, it is not necessary to remove the work from the work holding jig and change the direction of the work each time the electrode film is formed on the processing planned surface. The electrode film 53 can be continuously formed on the processing target surface (for example, the upper surfaces 52a1 and 52b1 and the end surface 52a3). Therefore, it is possible to prevent a defect such as a positional deviation or a defect of the electrode film 53 which may occur due to the removal of the work 50, and to form the electrode film 53 at a predetermined position of the work 50 with high accuracy.

  Moreover, not only the electrode film 53 but also other functional films (for example, insulating films) can be formed on the processing planned surface of the work 50 by using the work holding jigs 1A and 1B according to the present embodiment. It is. Moreover, it is also possible to perform not only a film formation process but other processes (for example, surface treatment such as etching) on the surface to be treated. In any of the processes, the workpiece holding jigs 1A and 1B are rotated by 90 degrees as described above, and the processing scheduled surfaces of the processing targets are sequentially shifted, whereby the plurality of processing scheduled surfaces of the workpiece 50 are continuous. Processing can be performed with high accuracy.

  Further, by positioning the work 50 with the first contact surface 131, the second contact surface 132, and the third contact surface 133, positional deviation of the work 50 can be prevented, and a plurality of processes of the work 50 can be performed. It is possible to perform continuous processing on the planned surface with higher accuracy.

  Further, in the present embodiment, the plurality of workpiece holding jigs 1A and 1B are to be processed on the side opposite to the first contact surface 131 of the workpiece 50 held by the workpiece holding jig 1A (the ridge portions 52a and 52b So that the upper surface 52a1, 52b1) and the second processing surface (the end surface 53a3 of the flange portion 52a) opposite to the second contact surface 132 of the workpiece 50 held by the workpiece holding jig 1B are substantially flush with each other Arrange in Then, processing is simultaneously performed on different processing scheduled surfaces of the work 50 held by these. Therefore, processing such as electrode film formation can be performed simultaneously on the processing planned surfaces of the two workpieces 50.

  Further, in the present embodiment, the two processing planned surfaces (the upper surfaces 52a1 and 52b1 and the end surface 52a3) of the workpiece 50 stored in the workpiece storage portion 13 are respectively opposite to the first contact surface 131 and the second The workpiece 50 is accommodated in the workpiece accommodating portion 13 so as to be exposed from the opposite side of the abutment surface 132. Therefore, in the above-described manner, continuous processing is performed with higher accuracy on the upper surfaces 52a1 and 52b1 exposed from the opposite side of the first abutment surface 131 and the end surface 52a3 exposed from the opposite side of the second abutment surface 132. It can be carried out.

  Further, in the present embodiment, from the opposite side of the first contact surface 131 and the opposite side of the second contact surface 132, the two processing planned surfaces (for example, the upper surfaces 52a1 and 52b1 and the end surface 52a3) The workpiece 50 is accommodated in the workpiece accommodating portion 13 so as to protrude to the outside of the portion 13. Therefore, each processing scheduled surface of the workpiece 50 protrudes outside the workpiece accommodating portion 13, and the processing such as electrode film forming processing can be easily performed on each processing scheduled surface by a squeegee or the like.

  Further, in the present embodiment, the amount of projection of the end surface 52a3 of the work 50 that protrudes from the opposite side of the first contact surface 131 and the amount of upper surface 52a1, 52b1 of the work 50 that protrudes from the opposite side of the second contact surface. Are approximately equal. Therefore, when the workpiece holding jigs 1A and 1B are rotated by 90 degrees, the distance between the printing screen or the like and the processing planned surface of the workpiece 50 can be easily adjusted to be always constant. Therefore, it is not necessary to adjust the above-mentioned distance each time the work holding jig 1 is rotated by 90 degrees, and the electrode film can be easily formed on the processing planned surface of the work 50 by a squeegee or the like.

  Further, in the present embodiment, the workpiece holding mechanism 10 includes a plurality of workpiece accommodating portions 13. Therefore, it becomes possible to arrange each of a plurality of works 50 in each work storage part 13, and a terminal electrode can be formed on a plurality of works 50 at once with high accuracy.

  Further, in the present embodiment, the second contact surface 132 is formed with a recess 132 a that is recessed toward the opposite side to the workpiece 50 accommodated in the workpiece accommodation portion 13. Therefore, after performing predetermined processing on the processing scheduled surface, a pin or the like is inserted into the recess 132a, and the workpiece 50 fixed to the second contact surface 132 is pushed out so as to scrape with the pin or the like. The workpiece 50 can be taken out of the housing portion 13.

  Further, in the present embodiment, the workpiece holding mechanism 10 includes the first workpiece holding portion 11 and the second workpiece holding portion 12 removably attached to the first workpiece holding portion 11, and the first contact surface 131 And the third contact surface 132 are formed on the first workpiece holder 11, and the second contact surface 132 is formed on the second workpiece holder 12. Therefore, processing can be performed in the following manner.

  That is, a plurality of first work holding portions 11 having different sizes (areas of the first contact surface 131 and the third contact surface 133) of the work storage portion 13 are prepared in advance, and the work 50 is processed In accordance with the size, the first workpiece holding unit 11 having the desired size of the workpiece storage unit 13 is selected. By mounting the first work holding unit 11 on the second work holding unit 12 and performing processing, the second work holding unit 12 does not need to be changed, and thus the productivity of the electronic components 50 of other types can be improved. it can.

  Further, in the present embodiment, the workpiece 50 accommodated in the workpiece accommodation portion 13 is disposed inside the corner formed by the second abutment surface 132 and the third abutment surface 133. Therefore, it becomes possible to easily position the work 50 inside the corner of the work accommodating portion 13. Therefore, positional deviation of the work 50 can be prevented, and processing continuous to a plurality of planned processing surfaces of the work 50 can be performed with higher accuracy.

  Further, in the present embodiment, the cross-sectional shape perpendicular to the longitudinal direction of the workpiece holding jigs 1A and 1B is substantially square. Therefore, when the workpiece holding jigs 1A and 1B are rotated by 90 degrees, it is easy to always keep the distance between the printing screen or the like and the processing planned surface of the workpiece 50 constant.

  Further, in the case where the plurality of work holding jigs 1A and 1B are arranged adjacent to each other, when the work holding jigs 1A and 1B are rotated by a predetermined angle, between the adjacent work holding jigs 1A and 1B. It becomes easy to make the processing scheduled surface of the workpiece 50 to be held substantially flush, and it becomes easy to carry out processing such as screen printing.

  Further, in the present embodiment, the magnet 22 is provided to draw the work 50 stored in the work storage portion 13 into contact with the first contact surface 131, the second contact surface 132, and the third contact surface 133. . Therefore, it becomes possible to draw the work 50 stored in the work storage portion 13 into contact with the second contact surface 132 and the third contact surface 133, and positioning of the work 50 with respect to the work holding jigs 1A and 1B. Accuracy can be improved.

  Further, in the present embodiment, the auxiliary member 12 is configured to be attachable to and detachable from the work holding mechanism 11, so that dust etc. (ferrite powder, chipping etc.) is accumulated inside the work holding jigs 1A and 1B. Even if it is, the auxiliary member 12 can be removed from the workpiece holding mechanism 11, and the inside of the workpiece holding jigs 1A and 1B can be cleaned.

Second Embodiment The workpiece holding jigs 1A and 1B according to the present embodiment are the same as the workpiece holding jigs 1A and 1B according to the first embodiment except that the form of the electrode film forming process is different. Hereinafter, portions different from the first embodiment will be described in detail, and description of the common portions will be omitted. Further, in the members shown in the drawings, the common members are denoted by the same reference numerals, and the description thereof is partially omitted.

  As shown in FIG. 1D, the electronic component obtained by subjecting the work 50A to the electrode film forming process in the present embodiment does not have a configuration in which the electrode film 53A corresponds to the lower surface electrode portion, and an end surface electrode portion 532A. It differs from the electronic component in the first embodiment in that the width in the Z-axis direction is shorter than the width in the Z-axis direction of the end face electrode portion 532 in the first embodiment. The end surface electrode portion 532A is formed only on substantially the upper half of the end surfaces 52a3 and 52b3 of the flange portions 52a and 52b of the work 50A.

  In the present embodiment, in the first processing step (the step before rotating the workpiece holding jigs 1A and 1B), the second contact surface of the workpiece 50A accommodated in the workpiece accommodating portion 13 of the workpiece holding jig 1B. An electrode film forming process is performed only on the substantially upper half of the end face 52a3 of the flange 52a exposed from the opposite side of 132 to form the end face electrode portion 532A.

  The electrode film forming process is performed only on the upper surface 52a1 of the ridge portion 52a exposed from the opposite side of the first contact surface 131 for the workpiece 50A stored in the workpiece storage portion 13 of the workpiece holding jig 1A. An upper surface electrode portion 531 is formed. The upper surface 52b1 of the ridge portion 52b is preferably masked so that the electrode film formation process is not performed.

  Further, as shown in FIG. 2F, even after rotating the workpiece holding jigs 1A and 1B by 90 degrees, the first contact of the workpiece 50A stored in the workpiece storage portion 13 of the workpiece holding jig 1B is continued. An electrode film forming process is performed only on the upper surface 52a1 of the ridge portion 52a exposed from the opposite side of the contact surface 131 to form the upper surface electrode portion 531. The upper surface 52b1 of the ridge portion 52b is preferably masked so that the electrode film formation process is not performed.

  In addition, with regard to the work 50A accommodated in the workpiece accommodation portion 13 of the workpiece holding jig 1A, the electrode film is formed only on the substantially upper half of the end face 52a3 of the flange 52a exposed from the opposite side of the second contact surface 132 A process is performed to form the end face electrode portion 532A.

  In the present embodiment, after completion of the first processing step, the workpiece 50A is taken out from the workpiece storage portion 13 of the workpiece holding jig 1A, 1B, and only the left and right are reversed without inverting the top and bottom of the workpiece 50A. Housed inside of 13.

  Also in the second treatment process (the process after rotating the work holding jigs 1A and 1B), the electrode film formation process is performed in the manner described above. That is, as shown in FIG. 2G, in the workpiece 50A accommodated in the workpiece accommodation portion 13 of the workpiece holding jig 1A, substantially the end surface 52b3 of the flange 52b exposed from the opposite side of the second contact surface 132 An electrode film forming process is performed only on the upper half to form an end face electrode portion 532A.

  The electrode film forming process is performed only on the upper surface 52b1 of the ridge portion 52b exposed from the opposite side of the first contact surface 131 for the workpiece 50A stored in the workpiece storage portion 13 of the workpiece holding jig 1B. An upper surface electrode portion 531 is formed. The upper surface 52a1 of the ridge portion 52a is preferably masked so that the electrode film formation process is not performed.

  Further, as shown in FIG. 2H, even after rotating the workpiece holding jigs 1A and 1B by 90 degrees, the second contact for the workpiece 50A stored in the workpiece storage portion 13 of the workpiece holding jig 1B is continued. An electrode film forming process is performed only on the substantially upper half of the end face 52b3 of the ridge 52b exposed from the opposite side of the contact surface 132, to form an end face electrode 532A.

  The electrode film forming process is performed only on the upper surface 52b1 of the ridge portion 52b exposed from the opposite side of the first contact surface 131 for the workpiece 50A stored in the workpiece storage portion 13 of the workpiece holding jig 1A. An upper surface electrode portion 531 is formed. The upper surface 52a1 of the ridge portion 52a is preferably masked so that the electrode film formation process is not performed.

  According to the present embodiment, by using the workpiece holding jigs 1A and 1B according to the first embodiment, it is possible to form an electrode portion 53A not having a configuration equivalent to the lower surface electrode portion, for example, and an electronic component Various electrode parts can be formed according to the application etc.

Third Embodiment As shown in FIGS. 5A and 5B, in the workpiece holding jig 201 according to the present embodiment, the workpiece holding jig 1A or 1B according to the first embodiment except the configuration of the workpiece holding mechanism 210 is different. Is the same as Hereinafter, portions different from the first embodiment will be described in detail, and description of the common portions will be omitted. Further, in the members shown in the drawings, the common members are denoted by the same reference numerals, and the description thereof is partially omitted.

  As shown in FIG. 5A, a plurality of work accommodating parts 213 are provided along the Y-axis direction at the upper part in the Z-axis direction of the work holding mechanism 210 in the present embodiment.

  The work storage portion 213 is constituted by the recess 114, and unlike the work storage portion 13 in the first embodiment, both sides in the X axis direction of the recess 114 are open to the outside.

  As shown in FIG. 5B, the workpiece storage portion 213 differs from the workpiece storage portion 13 in the first embodiment in that the workpiece storage portion 213 has a second contact surface 232 instead of the second contact surface 132 shown in FIG. 1B. .

  The second contact surface 232 is a surface (YZ plane in the illustrated example) parallel to the longitudinal direction and the height direction of the workpiece holding jig 201, and both sides in the width direction (X-axis direction) of the partition portion 113 Correspond to the face. In the present embodiment, two second contact surfaces 232 are provided for one work accommodating portion 213.

  In the workpiece storage portion 213, the second contact surface 232 and the third contact surface 133 intersect each other at substantially right angles to form a corner. Similarly, the opposing surface 134 and the second abutment surface 132 intersect each other at substantially right angles to form a corner.

  When the workpiece 50 is housed in the workpiece housing portion 213, the outer circumferential surface of the core portion 51 of the workpiece 50 is in contact with the first contact surface 131 and the third contact surface 133 of the workpiece housing portion 213. In addition, one of the inner side surfaces 52a6 and 52b6 of the flanges 52a and 52b of the workpiece 50 abuts on one of the second contact surfaces 232 of the workpiece accommodating portion 213.

  That is, in the present embodiment, when the workpiece 50 is accommodated in the workpiece accommodating portion 213, the outer periphery of the winding core portion 51 of the workpiece 50 is arranged along the second abutment surface 232 and the third abutment surface 133 of the workpiece accommodating portion 213. The faces and the inner side surfaces 52a6, 52b6 of the ridges 52a, 52b are arranged. Therefore, the work 50 stored in the work storage portion 213 is disposed outside the corner formed by the second contact surface 232 and the third contact surface 133.

  The work 50 is disposed biased toward the third contact surface 133, and although a detailed illustration is omitted, there is a slight gap between the outer peripheral surface of the winding core 51 of the work 50 and the facing surface 134. It is formed.

  The gap is formed by drawing the work 50 to the magnet 22 (see FIG. 3) of the auxiliary member 20 shown in FIG. 5A, and varies appropriately according to the size of the work 50 (in particular, the width in the Y-axis direction). . In the present embodiment, the magnet 22 draws the workpiece 50 stored in the workpiece storage portion 213 so as to abut on the first contact surface 131 and the third contact surface 133.

  In the manufacture of an electronic component using the workpiece holding jig 201, first, as shown in FIGS. 6A to 6C, a plurality of (three in the illustrated example) workpiece holding jigs 201A, 201B, and 201C are prepared. The configurations of the workpiece holding jigs 201A, 201B and 201C are the same as the configuration of the workpiece holding jig 201 shown in FIG. 5A.

  Then, in a mode as shown in FIG. 5B, each of the plurality of works 50 is accommodated inside each of the work accommodating portions 13 of the work holding jigs 201A to 201C (work accommodation step). As shown in FIG. 5B, in the workpiece accommodation step, a part of the outer peripheral surface of the winding core 51 abuts on the third contact surface 133, and the inner side surfaces 52a6 and 52b6 of the flanges 52a and 52b are the second contact surfaces. Each work 50 is disposed inside each work accommodating portion 213 so as to be in contact with 232 and 232.

  Next, as shown to FIG. 6A, each of workpiece holding jigs 201A-201C is arranged (work arrangement process). In the workpiece arranging step, one adjacent workpiece holding jig 201A to 201C and the other adjacent workpiece holding jig 201A to 201C are rotated and arranged by a predetermined angle (90 degrees) with the Y axis as a central axis. . In the illustrated example, the workpiece holding jig 201B is disposed at the center, and the workpiece holding jigs 201A and 201C are rotated by 90 degrees around the Y axis, respectively, to the left and right of the workpiece holding jig 201B. It is arranged.

  As a result, in the workpiece 50 accommodated in the workpiece accommodating portion 213 of the workpiece holding jig 201A, the end surface 52a3 of the flange portion 52a faces upward, and the opposite of the second contact surface 232 (not shown) of the workpiece accommodating portion 213 Exposed from the side. Further, in the workpiece 50 stored in the workpiece storage portion 213 of the workpiece holding jig 201B, the upper surfaces 52a1 and 52b1 of the collar portions 52a and 52b face upward, and the opposite side of the first contact surface 131 of the workpiece storage portion 213 Exposed from Further, in the workpiece 50 accommodated in the workpiece accommodating portion 213 of the workpiece holding jig 201C, the end surface 52b3 of the flange portion 52b faces upward, and the opposite side of the second contact surface 232 (not shown) of the workpiece accommodating portion 213. Exposed from

  Next, an electrode film forming process is performed on the processing planned surfaces (the upper surfaces 52a1 and 52b1 and the end surfaces 52a3 and 52b3) of the workpiece 50 exposed from the workpiece accommodation portion 213. (First processing step).

  More specifically, as shown in FIG. 6A, the workpiece 50 stored in the workpiece storage portion 213 of the workpiece holding jig 201A is exposed from the side opposite to the second contact surface 232 (not shown). An electrode film forming process is performed on the end surface 52a3 of the portion 52a to form an end surface electrode portion 532.

  Further, for the workpiece 50 stored in the workpiece storage portion 213 of the workpiece holding jig 201B, the electrode film forming process is performed on the upper surfaces 52a1 and 52b1 of the flanges 52a and 52b exposed from the opposite side of the first contact surface 131 To form the upper surface electrode portions 531 and 531.

  In addition, for the work 50 stored in the work storage portion 213 of the work holding jig 201C, an electrode film forming process is performed on the end face 52b3 of the flange portion 52b exposed from the opposite side of the second contact surface 232 (not shown). To form the end face electrode portion 532.

  Next, as shown in FIG. 6B, the workpiece holding jigs 201A to 201C are rotated by a predetermined angle. More specifically, the workpiece holding jig 201A is rotated 90 degrees counterclockwise about the Y axis such that the first contact surface 131 faces upward. In addition, the workpiece holding jig 201B is rotated 90 degrees counterclockwise about the Y axis such that the second contact surface 232 (not shown) faces upward. The workpiece holding jig 201C is rotated 180 degrees counterclockwise about the Y axis so that the second contact surface 232 (not shown) faces upward.

  Thus, when the workpiece holding jigs 201A to 201C are rotated by a predetermined angle, the workpiece holding jig 201C is disposed at the position where the workpiece holding jig 201A was disposed in FIG. 6A, and the workpiece holding jig 201B is disposed. The workpiece holding jig 201A is disposed at the position where the workpiece holding jig 201A is disposed, and the workpiece holding jig 201B is disposed at the position where the workpiece holding jig 201C is disposed.

  Then, with respect to the workpiece 50 stored in the workpiece storage portion 213 of the workpiece holding jig 201A, the electrode films are formed on the upper surfaces 52a1 and 52b1 of the ridges 52a and 52b exposed from the opposite side of the first contact surface 131. The formation processing is performed to form the upper surface electrode portions 531 and 531.

  In addition, for the work 50 stored in the work storage portion 213 of the work holding jig 201B, an electrode film forming process is performed on the end face 52b3 of the flange 52b exposed from the opposite side of the second contact surface 232 (not shown). To form the end face electrode portion 532.

  Further, with regard to the work 50 stored in the work storage portion 213 of the work holding jig 201C, an electrode film forming process is performed on the end face 52a3 of the ridge portion 52a exposed from the opposite side of the second contact surface 232 (not shown). To form the end face electrode portion 532.

  Next, as shown in FIG. 6C, the workpiece holding jigs 201A to 201C are rotated by a predetermined angle. More specifically, the workpiece holding jig 201C is rotated 90 degrees counterclockwise about the Y axis such that the first contact surface 131 faces upward. The workpiece holding jig 201A is rotated 90 degrees counterclockwise about the Y axis so that the second contact surface 232 faces upward. In addition, the workpiece holding jig 201B is rotated 180 degrees counterclockwise about the Y axis such that the second contact surface 232 faces upward.

  Thus, when the workpiece holding jigs 201A to 201C are rotated by a predetermined angle, the workpiece holding jig 201C is disposed at the position where the workpiece holding jig 201A was disposed in FIG. 6B, and the workpiece holding jig 201B is disposed. The workpiece holding jig 201A is disposed at the position where the workpiece holding jig 201A is disposed, and the workpiece holding jig 201B is disposed at the position where the workpiece holding jig 201C is disposed.

  Subsequently, with respect to the workpiece 50 stored in the workpiece storage portion 213 of the workpiece holding jig 201A, an electrode film forming process is performed on the end surface 52b3 of the ridge portion 52b exposed from the opposite side of the second contact surface 232. The end face electrode portion 532 is formed.

  In addition, with respect to the workpiece 50 stored in the workpiece storage portion 213 of the workpiece holding jig 201B, an electrode film forming process is performed on the end surface 52a3 of the ridge portion 52a exposed from the opposite side of the second contact surface 232. An electrode portion 532 is formed.

  Further, for the workpiece 50 stored in the workpiece storage portion 213 of the workpiece holding jig 201C, an electrode film forming process is performed on the upper surfaces 52a1 and 52b1 of the flanges 52a and 52b exposed from the opposite side of the first contact surface 131 To form the upper surface electrode portions 531 and 531.

  In the present embodiment, the workpiece 50 accommodated in the workpiece accommodation portion 213 is disposed outside the corner formed by the second abutment surface 232 and the third abutment surface 133. Therefore, the work 50 is fixed to the outside of the corner of the work storage portion 213, and the work 50 can be positioned. Therefore, positional deviation of the work 50 can be prevented, and processing continuous to a plurality of planned processing surfaces of the work 50 can be performed with higher accuracy.

  In addition, when the workpiece 50 is disposed in the workpiece storage portion 213, the three processing planned surfaces (the upper surfaces 52a1 and 52b1 and the end surfaces 52a3 and 52b3 of the ridges 52a and 52b) of the workpiece 50 from the workpiece storage portion 213 are the first contact surfaces. It is exposed from the opposite side of 131 and the opposite side of the two second contact surfaces 232. Therefore, the workpiece holding jig 201 is rotated by 90 degrees as described above, and the three processing target surfaces to be processed are sequentially shifted, so that the processing continuous to a plurality of processing target surfaces of the workpiece 50 is highly accurate. Can be done with

  Further, in the present embodiment, the plurality of workpiece holding jigs 201A, 201B, and 201C are to be treated holding surfaces opposite to the first contact surface 131 of the workpiece 50 held by the workpiece holding jig 201A, and the workpiece holding The processing scheduled surface opposite to the second contact surface 132 of the workpiece 50 held by the jig 201B, and the processing opposite to the second contact surface 132 of the workpiece 50 held by the workpiece holding jig 201C Arrange so as to be approximately flush with the planned surface. Then, processing is simultaneously performed on different processing scheduled surfaces of the work 50 held by these. Therefore, processing such as electrode film formation can be performed simultaneously on the processing planned surfaces of the three workpieces.

  The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention. For example, in the example shown in FIG. 1A, the work holding jigs 1A and 1B are arranged in an inverted state by 90 degrees, but may be arranged without being inverted as shown in FIGS. 4A and 4B. .

  In each of the above embodiments, the cross-sectional shape of the winding core 12 is rectangular, but the cross-sectional shape is not particularly limited, and may be circular, substantially octagonal, or other polygonal shapes.

  Further, in the above embodiment, the cross sectional shapes of the flanges 52a and 52b are rectangular in this embodiment, but the cross sectional shape is not particularly limited, and may be circular, substantially octagonal, or other It may be a polygon.

1A, 1B, 201, 201A, 201B, 201C ··· Work holding jig 10, 210 ··· Work holding mechanism 11 ··· First holding portion 111 ··· First partition end portion 112 ··· Second Partition end portion 113: Partition portion 114: Recess 12: Second holding portion 121: End surface portion 13, 213: Work storage portion 131: First contact surface 132, 232 ... second contact surface 132a ... recess 133 ... third abutment surface 134 ... facing surface 20 ... auxiliary member 21 ... main body 22 ... magnet 220 ... housing recess 23: Magnet holding portion 24: Positioning projection 50, 50A: Work (electronic parts)
51: Winding core portion 52a, 52b: Collar portion 52a1, 52b1: Upper surface 52a2, 52b2: Lower surface 52a3, 52b3: End surface 52a4, 52b4: First side surface 52a5, 52b5. · Second side face 52a6, 52b6 · · · inner side face 53, 53 A · · · electrode portion 531 · · · upper surface electrode portion 532, 532 A · · · end surface electrode portion 533 · · · lower surface electrode portion 60 · · · screw hole 70 · · · ·screw

Claims (14)

A workpiece holding jig having a workpiece holding mechanism for holding a workpiece, wherein
The workpiece holding mechanism has a workpiece storage portion having a first contact surface on which the three surfaces of the workpiece contact, a second contact surface, and a third contact surface.
The work storage portion is at least opposite to the first contact surface and opposite to the second contact surface such that at least two planned processing surfaces of the workpiece stored in the work storage portion are exposed. A work holding jig characterized by being open.   The workpiece is so exposed that the two processing planned surfaces of the workpiece stored in the workpiece storage portion are respectively exposed from the opposite side of the first contact surface and the opposite side of the second contact surface. The workpiece holding jig according to claim 1, wherein the workpiece holding portion is housed in the workpiece housing portion.   The workpiece holding jig according to claim 2, wherein the workpiece is accommodated in the workpiece accommodating portion such that the two processing planned surfaces project outside the workpiece accommodating portion.   The protrusion amount of the processing planned surface of the workpiece protruding from the opposite side of the first contact surface and the protrusion amount of the processing planned surface of the workpiece protruding from the opposite side of the second contact surface are substantially equal. The workpiece holding jig according to claim 3.   The workpiece holding jig according to any one of claims 1 to 4, wherein the workpiece holding mechanism comprises a plurality of the workpiece accommodating portions.   The workpiece holding device according to any one of claims 1 to 5, wherein the second contact surface is formed with a concave portion which is recessed toward the opposite side to the workpiece accommodated in the workpiece accommodation portion. jig. The work holding mechanism has a first work holding portion, and a second work holding portion detachably attached to the first work holding portion.
The first contact surface and the third contact surface are formed in the first work holding portion,
The workpiece holding jig according to any one of claims 1 to 6, wherein the second contact surface is formed on the second workpiece holding portion.   The workpiece accommodated in the said workpiece accommodation part is arrange | positioned inside the angle part which the said 2nd contact surface and the said 3rd contact surface make | forms, The any one of the Claims 1-7 characterized by the above-mentioned. The work holding jig described in.   9. The workpiece holding jig according to claim 8, wherein a cross-sectional shape perpendicular to the longitudinal direction is substantially square.   The workpiece accommodated in the said workpiece accommodation part is arrange | positioned on the outer side of the corner | angular part which the said 2nd contact surface and the said 3rd contact surface make, either of the Claims 1-7 characterized by the above-mentioned. Work holding jig described in.   11. The apparatus according to any one of claims 1 to 10, further comprising a pulling means for pulling the work stored in the work storage portion into contact with the second contact surface and the third contact surface. Work holding jig as described.   The electronic component processing apparatus which has multiple work holding jigs in any one of Claims 1-11. A step of processing any one processing planned surface of a work exposed by at least two processing planned surfaces from a workpiece storage unit using the workpiece holding jig according to any one of claims 1 to 11. When,
And D. rotating the workpiece holding jig by a predetermined angle to perform processing on any other planned surface of the workpiece. A plurality of work holding jigs according to any one of claims 1 to 11, a first contact surface of a work accommodating portion of one adjacent work holding jig, and the other adjacent to each other. Arranging them by rotating them by a predetermined angle so that the second contact surface of the workpiece accommodating portion of the workpiece holding jig faces the same direction;
Processing of the work scheduled to be processed of the workpiece exposed from the opposite side of the first contact surface of the one work holding jig and the workpiece exposed from the opposite side of the second contact surface of the other work holding jig And a step of performing processing on the planned surface.

Images