JPH10149938A - Electronic circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To protect an electronic circuit device from thermal and mechanical stresses by providing holding fixtures for mounting a surface-mount ceramic capacitor on both sides of the terminals of the ceramic capacitor on an insulating board and mounting the large-sized layered capacitor by holding the capacitor between the holding fixtures. SOLUTION: Each metallic piece 4 is constructed in such a structure that can absorb stresses associated with the temperature fluctuation by absorbing forces applied to a pair of fixtures from the top, bottom, left, right, front, and rear sides by using the fixtures. The metallic pieces 4 are provided on an insulating board 1 separately from the electronic part and connected to the substrate 1 by soldering. In addition, the vertical and horizontal sizes of a surface-mount ceramic capacitor are set at >=3.2mm. Therefore, the ceramic capacitor does not crack nor comes off the board 1 even when the distance between the fixtures 4 varies, because the fixtures 4 absorb thermal stresses. In addition, all the flux can be removed completely.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an electronic circuit device and, more particularly, to a mounting structure of a large surface mount type ceramic capacitor.

[0002]

2. Description of the Related Art FIG. 2 shows a conventional electronic circuit device. Generally, in order to manufacture such an electronic circuit device, a creamy solder (usually called a solder paste) is supplied by printing to a position corresponding to a mounted component on an insulating substrate, and the component is placed thereon. After being mounted, it is put into a soldering furnace and soldered all together. Thereafter, the flux is removed with a cleaning agent to complete the device.

However, this method has the following problems. 1. When taken out of the solder furnace and returned to room temperature, the difference in the thermal shrinkage ratio between the insulating substrate and the surface mount type ceramic capacitor sometimes made it easy to remove the surface mount type ceramic capacitor. (2) 2 After soldering, remove from the furnace and remove the flux with a cleaning agent. However, since the distance between the surface mount type ceramic capacitor and the insulating substrate is usually as small as 0.1 mm, the cleaning agent hardly enters this part. The flux remained and the problem of migration occurred. (3) In some cases, the insulating substrate was divided after soldering, but the surface mount type ceramic capacitor was sometimes removed during the division. In particular, the surface mount type ceramic capacitor has a problem because the inner insulating dielectric layer is usually as thin as 0.1 mm and the material is ceramic and is easily broken.

[0004]

SUMMARY OF THE INVENTION The present invention is to solve the above three problems.

[0005]

Means for Solving the Problems Holding metal fittings for mounting a surface mount type ceramic capacitor are provided on both sides of a ceramic capacitor terminal on an insulating substrate, and a large multilayer capacitor is mounted between both holding metal fittings.

[0006]

[Action] The first problem is that even if the distance between the holding brackets changes,
Since the thermal stress is absorbed by the holding metal, the stress is not transmitted to the ceramic capacitor, and the ceramic capacitor is not broken or removed. The second problem is that if the height of the holding bracket is increased, the air gap becomes large and the distance between the surface mount type ceramic capacitor and the insulating substrate can be increased, so that the flux can be dropped cleanly and that problem can be solved. The third problem can also be solved because the stress is absorbed by changing the distance between the holding fittings. (3)

[0007]

1 and 3 show one embodiment of the present invention, in which 1 is an insulating substrate, 2 is a surface mount type ceramic capacitor, 4 is a metal piece, 5 is a projection, 6 is an electronic component, and 7 is an electrode. The metal piece has a structure in which a pair of metal fittings is used, and the metal fittings absorb the force applied in the up, down, left, right, front and rear directions, and absorb the stress accompanying the temperature change. In this case, a metal piece must be provided on the substrate in addition to a normal electronic component, but there is still a sufficient merit considering that the electronic circuit will break down later. The shape of the metal fittings is not limited to this, but various shapes can be considered, but it is important that the metal fittings have a structure that cannot be easily removed by thermal or mechanical stress. The connection between the metal piece and the insulating substrate was made by soldering.

Although the present invention allows electrical connection without using solder, it is also possible to partially connect solder to increase the connection strength. However, when the ceramic capacitor is electrically connected without using solder, it can be easily replaced when the life of the ceramic capacitor is deteriorated or defective, which is convenient. In particular, in the case of a power supply circuit and the like, among various electronic components, a ceramic capacitor has a short life, so that it is highly effective that it can be easily replaced.

In this embodiment, the height is 3.2 mm and the width is 4.5.
I experimented with a ceramic capacitor of millimeter size, but as the ceramic capacitor became larger,
This is because the effect of the present invention increases because the thermal or mechanical stress increases.

Further, the present invention can be practiced other than the ceramic capacitor as long as it is a surface mount type capacitor. However, the effect of the invention is particularly large since ceramic is easily broken. (4)

As described above, the present invention protects a surface mount type ceramic capacitor from thermal and mechanical stress, and solves the problem of flux remaining, thereby increasing industrial applicability. .

[Brief description of the drawings]

FIG. 1 is a perspective view of an embodiment of an electronic circuit device of the present invention.

FIG. 2 is a perspective view of one embodiment of a conventional electronic circuit device.

FIG. 3 shows an example in which the surface mount type ceramic capacitor of the present invention is mounted on an insulating substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating board 2 Surface mount type ceramic capacitor 3 Solder 4 Metal piece 5 Projection 6 Electronic component 7 Electrode 8 Air gap

Claims (2)

[Claims] 1. An electronic circuit device having a surface-mounted ceramic capacitor mounted on an insulating substrate, wherein connection between the surface-mounted ceramic capacitor and the circuit is established by connecting two electrodes of the surface-mounted ceramic capacitor from the insulating substrate. An electronic circuit device characterized in that a force applied to the surface mount type ceramic capacitor is absorbed by the metal pieces sandwiched between the metal pieces that are set up. 2. The electronic circuit device according to claim 1, wherein the size of the surface mount type ceramic capacitor is 3.2 mm or more in both the vertical and horizontal directions.