JPH11135385A - Holder for chip electronic component and method of handling chip electronic component using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a holder for a chip electronic component, capable of efficiently aligning a plurality of chip electronic components and elastically holding each chip electronic component in a plurality of component holding holes provided in the holder for chip electronic component. SOLUTION: A plurality of component holding holes 23 and a plurality of component insertion holes 24 respectively through-connected to the same are set in a holder 21 for the chip electronic component. The component insertion holes 24 have cross-sectional form capable of receiving one by one in aligned state, the chip electronic component 22 inserted from the inlets desirably having taper 27. Each chip electronic component 22 inserted into the component insertion hole 24 is pushed into the component holding hole 23 by a pusher pin 32 and held by the holder 21 for the chip electronic component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped electronic component holder and a method for handling chip-shaped electronic components using the same, and more particularly, to a method for elastically receiving a plurality of chip-shaped electronic components one by one. The present invention relates to a chip-shaped electronic component holder having a plurality of component holding holes and a method for handling chip-shaped electronic components using the same.

[0002] In this specification, the term "chip-shaped electronic component" refers not only to a chip-shaped electronic component as a finished product but also to a so-called semi-finished product in which electrodes are not yet formed on the outer surface. Chip-type electronic components.

[0003]

2. Description of the Related Art FIGS. 8 to 10 are cross-sectional views of a conventional chip-shaped electronic component holder 1 which is of interest to the present invention. The holder 1 is a flat plate as a whole, and has a plurality of component holding holes 3 for receiving each of the plurality of chip-shaped electronic components 2 one by one. Holder 1
The main part is formed of an elastic body 4 such as an elastomer, for example. The elastic body 4 is reinforced by a reinforcing member 5 made of a rigid body passing around each of the component holding holes 3. In this manner, each component holding hole 3 has an inner peripheral surface formed of the elastic body 4. Further, as shown in FIG. 10, each component holding hole 3 is dimensioned to elastically hold each chip-shaped electronic component 2.

[0004] The chip-shaped electronic component 2 is, for example, a multilayer ceramic capacitor. An electrode such as an external electrode of a multilayer ceramic capacitor is connected to a plurality of chip-like electronic components 2.
The holder 1 is used for forming on each of the ends. As shown in FIG. 10, the holder 1 holds a plurality of chip-shaped electronic components 2 while elastically sandwiching them with the component holding holes 3, respectively. Steps 9 are sequentially performed.

First, as shown in FIG. 8, a transfer plate 6 is prepared, and the transfer plate 6 is stacked on the holder 1 in a state of being aligned. The transfer plate 6 has component transfer holes 7 at positions corresponding to the positions of the component holding holes 3, and a taper 8 is formed in an opening above each of the component transfer holes 7. Each of the component transfer holes 7 has a cross-sectional shape that receives the chip-shaped electronic components 2 in an aligned state.

A plurality of chip-like electronic components 2 are randomly arranged on the upper surface side of the transfer plate 6. For example, by applying vibration to the transfer plate 6, a chip located near the opening of each component transfer hole 7 is provided. One of the electronic components 2 is transferred into the component transfer hole 7 as shown by the imaginary line in FIG. 8, and then, when received in the component transfer hole 7 as shown by the solid line, the component transfer hole 7 are aligned.

Next, as shown in FIG. 9, a pusher pin 9 is inserted from above the transfer plate 6 into the component transfer hole 7 in a direction indicated by an arrow 10, whereby the component transfer hole 7 is inserted. Each chip-shaped electronic component 2 is pushed into the component holding hole 3 of the holder 1. At this time, each chip-shaped electronic component 2
Is protruded from the component holding hole 3.

Next, as shown in FIG. 10, the holder 1 is arranged above the applicator 12 on which the film of the conductive paste 11 for forming the external electrodes by baking is formed. In this state, the holder 1 and the applicator 12 are brought close to each other, so that one end of each of the plurality of chip-shaped electronic components 2 held by the holder 1 is made of a conductive paste as shown by an imaginary line in FIG. 11 is located.

Next, when the holder 1 and the applicator 12 are separated, the chip-shaped electronic component 2 having the conductive paste 11 applied on one end thereof is obtained. After the conductive paste 11 on one end is dried, the conductive paste is applied to the other end of the chip-shaped electronic component 2 in the same manner, and then dried. At this time, a second holder having substantially the same form as the holder 1 is prepared in order to obtain a state in which the plurality of chip-shaped electronic components 2 are held by the holder while projecting the other end from the component holding hole. Then, a plurality of chip-shaped electronic components 2 are transferred to the second holder, or the chip-shaped electronic components 2 are moved in the axial direction in the component holding holes 3 of the same holder 1. Is performed.

After the conductive paste 11 has been applied to both ends in this way, the paste is fired, thereby obtaining a finished product having external electrodes formed thereon.

[0011]

However, the chip-like electronic component holder 1 as described above inserts the chip-like electronic components 2 in the component holding holes 3 in an aligned state. Need. That is, both the holder 1 and the transfer plate 6 must be prepared.

Therefore, the chip-shaped electronic component 2 to be held
If a plurality of types of holders 1 are prepared according to the standard such as the size of the transfer plate, a plurality of types of transfer plates 6 must be prepared similarly. This means
For example, when you want to change the process,
This means that the holder 1 suitable for the process must be selected, and the transfer plate 6 suitable for the holder 1 must be selected without fail. Therefore, complicated management is required for both the holder 1 and the transfer plate 6, and a mistake in selecting the holder 1 and the transfer plate 6 is likely to occur.

Further, when the transfer step is to be performed, the transfer plate 6 must be positioned with high precision with respect to the holder 1, so that the work for positioning is complicated. For this reason, the setup requires a relatively long time, and the workability is deteriorated.

An object of the present invention is to provide a holder for a chip-shaped electronic component and a method for handling the chip-shaped electronic component using the same, which can solve the above-mentioned problems.

[0015]

According to the present invention, there are provided a plurality of component holding holes for receiving a plurality of chip-shaped electronic components one by one, and each component holding hole has at least one inner peripheral surface thereof. The portion is formed of an elastic body, and is sized to elastically sandwich each chip-shaped electronic component, is directed to such a chip-shaped electronic component holder,
In order to solve the above-mentioned technical problem, simply, a portion corresponding to a conventional transfer plate is incorporated in this chip-shaped electronic component holder.

More specifically, the chip-like electronic component holder according to the present invention is further provided with a plurality of component transfer holes so as to communicate with the component holding holes, respectively. It has an opening on one surface side of the electronic component holder, and has a cross-sectional shape for receiving chip-shaped electronic components transferred from the opening in an aligned state one by one.

In the present invention, preferably, a taper is formed in the opening of the component transfer hole. In addition, the present invention
The present invention is also directed to a method for handling chip-shaped electronic components using the holder for chip-shaped electronic components described above. In the method of handling a chip-shaped electronic component according to the present invention, the step of preparing the above-described chip-shaped electronic component holder includes turning one surface of the chip-shaped electronic component holder upward, and forming a plurality of chips on the one surface. A step of disposing the chip-shaped electronic components, a step of transferring the chip-shaped electronic components into the respective component transfer holes, and a step of aligning the chip-shaped electronic components one by one in each of the component transfer holes;
In addition, each chip-shaped electronic component in each component transfer hole is pushed into each component holding hole, thereby holding each chip-shaped electronic component elastically by each component holding hole, while holding the chip-shaped electronic component. Is carried out.

[0018] In the above-mentioned step of bringing the chip-shaped electronic component into each component transfer hole and aligning the chip-shaped electronic component included in the method of handling the chip-shaped electronic component according to the present invention,
Preferably, a bottom-forming projection is inserted into each component holding hole to provide a bottom surface for each component transfer hole. In addition, the method for handling chip-shaped electronic components according to the present invention typically includes
This is performed when an electrode is to be formed at the end of each chip-shaped electronic component. In this case, when each chip-shaped electronic component is pushed into each component holding hole, one end of each chip-shaped electronic component is made to protrude from each component holding hole, and each chip held in the chip-shaped electronic component holder is held. An electrode is formed on one protruding end of the electronic component.

[0019]

1 to 7 illustrate a chip-like electronic component holder 21 and a method of handling a chip-like electronic component 22 using the same according to an embodiment of the present invention. The chip-shaped electronic component holder 21 includes:
As is well shown in FIG. 3, it is flat as a whole. The holder 21 includes a plurality of chip-shaped electronic components 2.
For example, as shown in FIG. 6, there are provided a plurality of component holding holes 23 for receiving each of the two. Also,
The holder 21 is further provided with a plurality of component transfer holes 24 so as to communicate with the respective component holding holes 23 while being located on the same axis as the respective component holding holes 23.

The holder 21 has a portion made of a rigid body 25 such as a metal and a portion made of an elastic body 26 such as an elastomer, for example, as shown in FIG. The rigid body 25 acts to reinforce the elastic body 26. The portion of the rigid body 25 can be obtained by, for example, machining a metal. In particular, the step on the surface in contact with the elastic body 26 can be formed by half-etching the step. Also, the portion of the elastic body 26
For example, it can be formed by casting an elastomer.

In the holder 21 having such a cross-sectional structure, the above-mentioned component holding hole 23 is located at the portion of the elastic body 26, and the component transfer hole 24 is located at the portion of the rigid body 25. Therefore, the inner peripheral surface of each component holding hole 23 is provided by the elastic body 26. Also, each component holding hole 23
As shown in FIG. 6, each has a dimension for elastically holding each of the chip-shaped electronic components 22. In this embodiment, as shown in FIG. 2, each component holding hole 23 has a circular cross section.

On the other hand, the component transfer hole 24 has an opening on the upper surface side of the holder 21, and a taper 27 is formed in this opening. The slope of the taper 27 is designed to be, for example, 60 degrees at an angle A (see FIG. 1) with respect to the upper surface of the holder 21. Each component transfer hole 24
Has a cross-sectional shape that receives the chip-shaped electronic components 22 in an aligned state. In this embodiment,
Each component transfer hole 24 has a cross-sectional shape similar to the cross-sectional shape of the chip-shaped electronic component 22, and has a rectangular cross-section as shown in FIG. The portion of the taper 27 has a conical surface shape.

The chip-like electronic component 22 is, for example, a multilayer ceramic capacitor. In this embodiment, a holder 21 is used to form electrodes such as external electrodes of a multilayer ceramic capacitor on each end of a plurality of chip-shaped electronic components 22. For example, as shown in FIG. 6, the holder 21 holds a plurality of chip-shaped electronic components 22 while elastically holding them by the component holding holes 23. In order to obtain such a state, FIG. Each step shown in FIG. 5 is sequentially performed.

First, as shown in FIG. 4, the surface of the holder 21 on which the component transfer hole 24 is located faces upward, and a plurality of chip-shaped electronic components 22 are randomly arranged on this upper surface. Is done. In this state, for example, the holder 21
, One of the chip-shaped electronic components 22 located near the opening of each component transfer hole 24 is inserted into the component transfer hole 24 along the taper 27 as shown by an imaginary line in FIG. Transfer, and then, as shown by the solid line,
When received in the component transfer hole 24, the component transfer hole 2
4 are aligned.

In this state, the chip-shaped electronic component 22
Is engaged with a part of the upper surface of the elastic body 26 that defines the opening surface of the component holding hole 23, so that the chip-shaped electronic component 22 does not enter the component holding hole 23. In the step of transferring the chip-shaped electronic components 22 into the component transfer holes 24 and aligning them, in this embodiment, as shown in FIG. Bottom forming projection 2 in component holding hole 23
8 is inserted from below.

As shown in FIG.
Are provided on the upper surface of the flat base member 29. Each of the bottom surface forming projections 28 is distributed corresponding to the position of the component holding hole 23, and the base member 29 is positioned in the component holding hole 23 as described above by overlapping the base member 29 on the lower surface side of the holder 21. Is done. In order to facilitate alignment between the holder 21 and the base member 29 for obtaining this state, preferably, the holder 21 includes
For example, the alignment holes 30 are provided at two positions separated from each other.
On the other hand, the base member 29 is provided with an alignment pin 31 received in the alignment hole 30.

It is preferable that the bottom surface forming projection 28 forms a flat surface at its upper end. Since the bottom surface of each component holding hole 24 is formed by positioning the bottom surface forming projection 28 in each component holding hole 23 as described above, the chip-shaped electronic component 22 transferred into each component transfer hole 24 is formed. Can be reliably prevented from inadvertently fitting the chip-shaped electronic component 22 by, for example, fitting the corner portion into the component holding hole 23 undesirably.

Next, the bottom surface forming projection 28 is inserted into the component holding hole 2.
3 so that the base member 29 can escape from the holder 21.
5, the pusher pins 32 are inserted into the component transfer holes 24 from above the holder 21 in the direction indicated by the arrow 33, as shown in FIG. Each of the illustrated chip-shaped electronic components 22 is pushed into the component holding hole 23 as shown by a solid line. At this time, one end of each chip-shaped electronic component 22 projects from the component holding hole 23.

Next, as shown in FIG. 6, the holder 21 is arranged above the applicator 35 on which the film of the conductive paste 34 for forming the external electrodes by baking is formed. In this state, the holder 21 and the applicator 35 are brought close to each other, so that one end of each of the plurality of chip-shaped electronic components 22 held by the holder 21 is made of a conductive paste as indicated by an imaginary line in FIG. 34.

Next, as shown in FIG. 7, when the holder 21 and the applicator 35 are separated from each other, a chip-shaped electronic component 22 having a conductive paste 34 applied to one end thereof is obtained. After the conductive paste 34 on one end is dried, the conductive paste is also applied to the other end of the chip-shaped electronic component 2 (not shown), and then dried.

More specifically, a second holder for holding a plurality of chip-shaped electronic components 2 with the other end protruding from the component holding hole is prepared. As the second holder, for example, a holder having substantially the same form as the holder 1 shown in FIGS. 8 to 10 can be used. Then, the second holder is arranged so that the conductive paste 34 as shown in FIG. 7 faces the holder 21 holding the chip-shaped electronic component 22 provided at one end, and the second holder In a state where each of the component holding holes is aligned with each of the component holding holes 23 of the holder 21, for example, a pusher pin is applied to each of the chip-shaped electronic components 22 so that a plurality of component holding holes are formed in the component holding holes of the second holder. The transfer of the chip-shaped electronic components 22 is performed. In this transfer operation, a plurality of chip-shaped electronic components 2
Since the second holder 2 is held in an aligned state by the holder 21 in advance, the second holder does not require a portion having an action corresponding to the component transfer hole 24.

In this manner, the plurality of chip-shaped electronic components 22 are held by the second holder with the other end protruding. Then, steps substantially similar to the steps shown in FIGS.
2 is sequentially performed on the other end, and the chip-shaped electronic component 22 having the conductive paste 34 applied to both ends is obtained. Then, it is fired to obtain a finished product on which external electrodes are formed.

Although the present invention has been described with reference to the illustrated embodiment, other than the above, within the scope of the present invention,
Various embodiments are possible. For example, in the illustrated embodiment, the component holding hole 23 has a circular cross-section, and the component transfer hole 24 has a rectangular cross-section. However, these cross-sectional shapes may be arbitrarily set according to the form of the chip-like electronic component to be handled. Can be changed.

In the illustrated embodiment, the chip electronic component 22 to be handled is a multilayer ceramic capacitor, but other chip electronic components may be used. Also,
In the illustrated embodiment, the opening of the component transfer hole 24 has a taper 2.
7 are formed, but those without such a taper also fall within the scope of the present invention. In the illustrated embodiment, the inner peripheral surface of the component holding hole 23 is entirely formed of the elastic body 26.
However, as long as the chip-shaped electronic component can be elastically sandwiched, only a part of the inner peripheral surface may be provided by an elastic body.

In the illustrated embodiment, the bottom surface forming projections 28 are used at the time of transfer of the chip-shaped electronic component 22, but an embodiment in which such bottom surface forming projections are not used is also possible. In the illustrated embodiment, since the electrodes are formed at the ends of the chip-shaped electronic component 22, the conductive paste 34 is formed.
However, the electrodes may be formed by, for example, dry plating.

In the illustrated embodiment, the method for handling the chip-shaped electronic component according to the present invention has been described in relation to the method for forming an electrode at the end of the chip-shaped electronic component 22. The method for handling chip-shaped electronic components according to the present invention can be applied, for example, when manufacturing a series of taping electronic components in a form in which chip-shaped electronic components are housed in cavities distributed in a housing tape. .

[0037]

As described above, according to the chip-shaped electronic component holder according to the present invention, the holder is in communication with the plurality of component holding holes for receiving the respective chip-shaped electronic components one by one. A plurality of component transfer holes are provided, each of the component transfer holes has an opening on one surface side of the chip-shaped electronic component holder, and the chip-shaped electronic components transferred from the opening are aligned one by one. Since it has a cross-sectional shape to be received in a state, the function of the conventional transfer plate can also be performed by the chip-shaped electronic component holder.

Therefore, it is not necessary to prepare both the chip-shaped electronic component holder and the transfer plate as in the prior art. Therefore, in addition to preparing a plurality of types of holders in accordance with the standards such as dimensions of the chip-shaped electronic components to be held, and preparing a plurality of types of transfer plates in the same manner, for example, when performing a setup change of a process. When selecting a holder suitable for the process, there is no need for complicated management, such as selecting the transfer plate that matches the holder without fail, and there is still room for mistakes in selecting the holder and transfer plate. Absent.

Further, when the transfer step is to be performed, a complicated step of positioning the transfer plate with respect to the holder with high accuracy is not required. As a result, efficient setup becomes possible. In the chip-shaped electronic component holder according to the present invention, if the opening of the component transfer hole is formed with a taper, the chip-shaped electronic component can be advantageously guided by the taper and transferred into the component transfer hole. In addition, the transfer process to the component transfer holes can be smoothly performed.

Further, according to the method of handling a chip-shaped electronic component according to the present invention, since the above-described chip-shaped electronic component holder is used, the above-described effects can be obtained.
In the method of handling chip-shaped electronic components according to the present invention, in the above-described step of transferring the chip-shaped electronic components into the component transfer holes and in a state where they are aligned, in order to provide a bottom surface of each component transfer hole, When the bottom-forming projections are inserted into the component holding holes, the corners of the chip-shaped electronic components transferred into the respective component transfer holes are undesirably fitted into the component holding holes. A situation that hinders proper alignment of the electronic components can be reliably prevented.

Further, when the method of handling a chip-shaped electronic component according to the present invention is carried out so as to form an electrode at an end portion of each chip-shaped electronic component, the chip-shaped electronic component is converted to a chip-shaped electronic component. A series of steps of holding by the application holder and then forming an electrode on the end of the chip-shaped electronic component can efficiently proceed.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a part of a chip-shaped electronic component holder 21 according to an embodiment of the present invention.

FIG. 2 is a plan view showing a portion of the chip-shaped electronic component holder 21 shown in FIG. 1;

FIG. 3 is a perspective view showing the chip-shaped electronic component holder 21 and the base member 29 used in combination therewith shown in FIG. 1 separately from each other.

4 shows a state in which the chip-shaped electronic component holder 21 and the base member 29 shown in FIG. 3 are aligned with each other, and shows a process of transferring the chip-shaped electronic component 22 into the component transfer hole 24. FIG. It is a corresponding sectional view.

FIG. 5 is a cross-sectional view corresponding to FIG. 1, illustrating a step of pushing the chip-shaped electronic component 22 into the component holding hole 23.

FIG. 6 is a cross-sectional view corresponding to FIG. 1, illustrating a process of applying a conductive paste 34 to an end of the chip-shaped electronic component 22.

7 is a cross-sectional view corresponding to FIG. 1, showing a state in which a conductive paste 34 is applied to an end of the chip-shaped electronic component 22.

FIG. 8 is a cross-sectional view showing a conventional chip-shaped electronic component holder 1 of interest to the present invention together with a transfer plate 6.
3 shows a step of transferring the chip-shaped electronic component 2 into the component transfer hole 7.

9 is a cross-sectional view corresponding to FIG. 8, showing a step of pushing the chip-shaped electronic component 2 into the component holding hole 3. FIG.

FIG. 10 is a cross-sectional view corresponding to FIG. 8, showing a process of applying a conductive paste 11 to an end of the chip-shaped electronic component 2.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 21 Chip-shaped electronic component holder 22 Chip-shaped electronic component 23 Component holding hole 24 Component transfer hole 26 Elastic body 27 Taper 28 Bottom forming projection 32 Pusher pin 34 Conductive paste

Claims (5)

[Claims] 1. A plurality of component holding holes for receiving each of a plurality of chip-like electronic components one by one, and at least a part of an inner peripheral surface of each of the component holding holes is formed of an elastic body. In the chip-like electronic component holder, which is dimensioned to elastically hold each of the chip-like electronic components, a plurality of component transfer holes are further provided so as to communicate with the component holding holes, respectively. The component transfer hole has an opening on one surface side of the chip-shaped electronic component holder, and has a cross-sectional shape that receives the chip-shaped electronic components transferred from the opening in an aligned state one by one. A chip-shaped electronic component holder. 2. The chip-shaped electronic component holder according to claim 1, wherein the opening of the component transfer hole is tapered. 3. A plurality of component holding holes for receiving each of the plurality of chip-shaped electronic components one by one, and at least a part of an inner peripheral surface of each of the component holding holes is formed of an elastic body. And, each chip-shaped electronic component is dimensioned to elastically sandwich it, and further, a plurality of component transfer holes are provided so as to communicate with each of the component holding holes, and each of the component transfer holes is formed by the chip-shaped electronic component. A chip-shaped electronic component holder having an opening on one surface side of the electronic component holder and having a cross-sectional shape for receiving chip-shaped electronic components transferred from the opening in an aligned state one by one. Preparing, the one side of the chip-shaped electronic component holder is directed upward, a plurality of chip-shaped electronic components are arranged on the one surface, and the chip-shaped electronic components are transferred into each of the component transfer holes, and Each of the above The chip-shaped electronic components are aligned one by one in the product transfer hole, and each of the chip-shaped electronic components in each of the component transfer holes is pushed into each of the component holding holes. A method for handling a chip-shaped electronic component, comprising: a step of holding an electronic component by a holder for the chip-shaped electronic component while elastically holding the electronic component by the component holding holes. 4. A bottom-forming projection in each of the component holding holes to provide a bottom surface of each of the component transfer holes in the step of transferring and aligning the chip-shaped electronic component into each of the component transfer holes. 4. The method for handling a chip-shaped electronic component according to claim 3, wherein a chip is inserted. 5. The step of pushing each of the chip-shaped electronic components into each of the component holding holes includes a step of projecting one end of each of the chip-shaped electronic components from each of the component holding holes. The method for handling a chip-shaped electronic component according to claim 3, further comprising a step of forming an electrode on one protruding end of each of the chip-shaped electronic components held by the holder.