JP3931631B2 - Electronic component chip handling method and electronic component chip alignment apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component chip handling method and an electronic component chip alignment apparatus, and more particularly to an electronic component chip handling method and an electronic component chip alignment apparatus using magnets.
[0002]
[Prior art]
FIG. 6 is a perspective view of an electronic component chip 1 that is of interest to the present invention. In this specification, the term “electronic component chip” refers to a semi-finished chip-shaped electronic component at a stage where no external electrode is formed on the outer surface of the electronic component main body, as shown in FIG. In addition, as shown in FIGS. 7 and 8 to be described later, it may indicate a chip-shaped electronic component as a finished product in which external electrodes are formed on the outer surface of the electronic component main body.
[0003]
Referring to FIG. 6, electronic component chip 1 has a rectangular parallelepiped shape having a length direction dimension L, a width direction dimension W, and a thickness direction dimension T, and has a length direction dimension L, a width direction dimension W, and a thickness direction. The dimension T is in a relationship of L> W and L> T, and is substantially in a relationship of W = T.
[0004]
The electronic component chip 1 shown in FIG. 6 is intended as an electronic component main body for a feedthrough capacitor, for example. Therefore, inside the electronic component chip 1, a plurality of penetrating internal electrodes 2 and a plurality of ground-side internal electrodes 3 are formed so that one of them is illustrated by a broken line. The penetrating internal electrode 2 and the ground-side internal electrode 3 are arranged in parallel to the LW surfaces 4 and 5 defined by the length direction dimension L and the width direction dimension W of the electronic component chip 1 and are opposed to each other. Are arranged alternately.
[0005]
The end edge of the through internal electrode 2 is exposed on each of the two WT surfaces 6 and 7 defined by the width direction dimension W and the thickness direction dimension T of the electronic component chip 1.
[0006]
The edge of the ground side internal electrode 3 is exposed to at least one of the LT surfaces 8 and 9 defined by the length direction dimension L and the thickness direction dimension T of the electronic component chip 1. In the electronic component chip 1 shown in FIG. 6, the edge of the ground-side internal electrode 3 is exposed on each of the two LT surfaces 8 and 9.
[0007]
FIG. 7 is a perspective view showing a chip-shaped electronic component 10 as a finished product constituted by using the electronic component chip 1 shown in FIG.
[0008]
The chip-shaped electronic component 10 includes three types of external electrodes 11, 12, and 13 formed on the outer surface of the electronic component chip 1.
[0009]
The external electrodes 11 and 12 are electrically connected to the edge of the penetrating internal electrode 2 and are formed on each of the WT surfaces 6 and 7 of the electronic component chip 1.
[0010]
On the other hand, the external electrode 13 is electrically connected to the edge of the ground-side internal electrode 3. In the chip-shaped electronic component 10 shown in FIG. 7, the external electrode 13 is formed not only on the LT surfaces 8 and 9 but also on the LW surfaces 4 and 5, and the LT surfaces 8 and 9 of the electronic component chip 1 and It is formed so as to go around LW surfaces 4 and 5.
[0011]
As described above, the external electrode 13 is provided so as to go around the electronic component chip 1 mainly for the following reason.
[0012]
In order to efficiently advance the formation of the external electrode 13, a process for forming the external electrode 13 is performed at once for the plurality of electronic component chips 1. In order to make this possible, it is necessary to align a plurality of electronic component chips 1 in the same posture.
[0013]
For the alignment described above, an alignment pallet is usually used. The alignment pallet has a volume capable of accommodating each electronic component chip 1 and a plurality of cavities each having an opening capable of receiving the electronic component chip 1 with each opening directed to the upper surface thereof. It is formed with. The plurality of electronic component chips 1 are placed on the alignment pallet in a random state, and in that state, the electronic pallet 1 is transferred one by one into each cavity by swinging and / or vibrating the alignment pallet. It is.
[0014]
The above-described cavity can accept the electronic component chip 1 only when the electronic component chip 1 is in a predetermined posture. Therefore, the electronic component chip 1 located in each cavity is an electronic component located in another cavity. The posture is the same as that of the chip 1.
[0015]
For this reason, a plurality of electronic component chips 1 are aligned, and if the process of forming the external electrode 13 is performed while maintaining this aligned state, the plurality of electronic component chips 1 are collectively applied to the plurality of electronic component chips 1. The external electrode 13 can be formed.
[0016]
However, since the electronic component chip 1 shown in the drawing has the width direction dimension W and the thickness direction dimension T substantially equal to each other as described above, the LW surfaces 4 and 5 and the LT surface are in terms of shape from the appearance. 8 and 9 cannot be distinguished. For this reason, in the cavity of the alignment pallet, the electronic component chip 1 is accommodated in any of the postures with the LW surface 4 or 5 facing downward and the postures with the LT surface 8 or 9 facing downward. In the plurality of electronic component chips 1 formed, it is not known which of the LW surface 4 or 5 and the LT surfaces 8 and 9 is directed downward.
[0017]
In order to cope with such a situation, the external electrode 13 is formed on all of the LW surfaces 4 and 5 and the LT surfaces 8 and 9 of the electronic component chip 1 so as to ensure that the edge of the ground side internal electrode 3 is electrically connected. To be connected.
[0018]
[Problems to be solved by the invention]
However, portions of the external electrode 13 shown in FIG. 7 that are located on the LW surfaces 4 and 5 are originally electrically unnecessary portions. Therefore, if possible, it is desirable to form the external electrodes 13a and 13b separately on the LT surfaces 8 and 9 as in the chip-shaped electronic component 10a shown in FIG.
[0019]
This is because, if the external electrode 13 that circulates as shown in FIG. 7 is to be formed, a process for forming the external electrode 13 on the four surfaces of the LW surfaces 4 and 5 and the LT surfaces 8 and 9 must be performed. However, when the external electrodes 13a and 13b separated from each other are to be formed as shown in FIG. 8, a process for forming the external electrodes 13a and 13b only on the two surfaces of the LT surfaces 8 and 9 is performed. This is because the number of processes can be reduced.
[0020]
Further, the area of the entire external electrode 13 shown in FIG. 7 is larger than the total area of the external electrodes 13a and 13b shown in FIG. 8. Therefore, in order to form the external electrode 13 shown in FIG. More conductive material such as conductive paste is required, and the material cost is relatively high.
[0021]
In order to distinguish between the LW surface 4 or 5 and the LT surface 8 or 9 of the electronic component chip 1, for example, visual observation or image processing may be considered. In this case, a plurality of electronic component chips 1 may be used. It is necessary to view or image one by one and then insert one by one into the cavity of the alignment pallet. However, such operations are too cumbersome and inefficient.
[0022]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component chip handling method and an electronic component chip alignment device that can solve the above-described problems.
[0023]
[Means for Solving the Problems]
According to the present invention, a means capable of distinguishing the LW surface and the LT surface in the electronic component chip is provided, thereby solving the technical problem described above. In the present invention, attention is paid to the influence of the magnetic force from the magnet on the internal electrode, and the above-described effect of the magnetic force from the magnet is used to distinguish between the LW surface and the LT surface described above. .
[0024]
That is, the present invention has a rectangular parallelepiped shape having a length direction dimension L, a width direction dimension W, and a thickness direction dimension T, and the length direction dimension L, the width direction dimension W, and the thickness direction dimension T satisfy L> W. ≧ T, provided with an internal electrode arranged in parallel to the LW plane defined by the lengthwise dimension L and the widthwise dimension W, and the edge of the internal electrode has a lengthwise dimension L and a thickness The method is first directed to a method of handling an electronic component chip exposed on at least one of the LT surfaces defined by the directional dimension T, and is characterized by having the following configuration.
[0025]
In the electronic component chip handling method according to the present invention, a plurality of cavities each having a volume capable of accommodating one electronic component chip and having an opening capable of receiving the LT surface are formed on the upper surface thereof. An alignment pallet provided with each opening facing is prepared.
[0026]
A magnet is positioned below the cavity.
[0027]
A plurality of electronic component chips are placed on the alignment pallet. In this state, the alignment pallet is swung and / or vibrated, whereby one electronic component chip is transferred into each cavity.
[0028]
Then, in the above-described transfer process, among the electronic component chips transferred into the cavity, only those that are transferred in a posture in which the LT surface where the edge of the internal electrode is exposed faces the bottom surface of the cavity are placed on the alignment pallet. Regardless of the applied swing and / or vibration, the position in the cavity is maintained by the magnetic force exerted on the internal electrode from the magnet.
[0029]
Accordingly, for example, when the edge of the LW surface, the WT surface, or the internal electrode is exposed on only one of the LT surfaces, the LT surface where the edge of the internal electrode is not exposed faces the bottom surface of the cavity. When the electronic component chip is transferred, the magnetic force from the magnet is insufficient, and the electronic component chip is moved out of the cavity by the swing and / or vibration applied to the alignment pallet. The formed electronic component chip does not settle into the cavity until the LT surface where the edge of the internal electrode is exposed is swung toward the bottom surface of the cavity.
[0030]
According to the electronic component chip handling method according to the present invention, all the electronic component chips settled in the cavity of the alignment pallet have a posture in which the LT surface where the edge of the internal electrode is exposed faces the bottom surface of the cavity. Will be aligned.
[0031]
Therefore, preferably, the external electrode can be efficiently formed by utilizing this alignment state. That is, in the electronic component chip handling method according to the present invention, preferably, after the aforementioned transferring step, the electronic component chip is electrically connected to the internal electrode on the LT surface where the edge of the internal electrode of the electronic component chip is exposed. A step of forming an external electrode to be performed is further performed.
[0032]
In the step of forming the external electrode described above, it is preferable that the electronic component chip transferred into the cavity is transferred from the alignment pallet to the holding plate while maintaining its posture, and the electrons held in the holding plate Forming an external electrode on the component chip.
[0033]
In this invention, the electronic component chip may expose the edge of the internal electrode on both of the two LT surfaces. In this case, the electronic component chip settled in the cavity of the alignment pallet is in a posture in which one of the two LT surfaces faces the bottom surface of the cavity.
[0034]
The present invention is particularly advantageous because when the width direction dimension W and the thickness direction dimension T of the electronic component chip are substantially in a relationship of W = T, it is difficult to distinguish the LT surface from the LW surface in appearance. Applies to
[0035]
The internal electrode preferably includes a ferromagnetic material. The present invention is advantageously applied when the internal electrode includes, for example, nickel or a nickel alloy as a conductive component.
[0036]
Moreover, the electronic component chip handled by the handling method according to the present invention may have the following configuration. That is, when the above-described internal electrode is a ground side internal electrode, the electronic component chip further includes a through internal electrode facing the ground side internal electrode, and the edge of the through internal electrode has a width dimension W and a thickness. It is exposed on each of the two WT surfaces defined by the directional dimension T.
[0037]
The present invention also has a rectangular parallelepiped shape having a length direction dimension L, a width direction dimension W, and a thickness direction dimension T, and the length direction dimension L, the width direction dimension W, and the thickness direction dimension T satisfy L> W. ≧ T, provided with an internal electrode arranged in parallel to the LW plane defined by the lengthwise dimension L and the widthwise dimension W, and the edge of the internal electrode has a lengthwise dimension L and a thickness The present invention is also directed to an alignment device for aligning a plurality of electronic component chips exposed on at least one of the LT surfaces defined by the directional dimension T.
[0038]
The alignment apparatus according to the present invention has a plurality of cavities each having a volume capable of accommodating one electronic component chip and each having an opening capable of receiving an LT surface, and each opening is directed to the upper surface thereof. An alignment pallet provided in a state, a magnet provided below the cavity, and means for rocking and / or vibrating the alignment pallet.
[0039]
The magnetic force exerted on the internal electrode from the magnet is such that the edge of the internal electrode is exposed among the electronic component chips that are swung into the cavity by swinging and / or vibrating the alignment pallet. The posture in the cavity is maintained only for those that are transferred with the surface facing the bottom of the cavity. On the other hand, if the surface other than the LT surface is transferred in a posture toward the bottom surface of the cavity, the surface is moved out of the cavity by the above-described oscillation and / or vibration. Is set to
[0040]
DETAILED DESCRIPTION OF THE INVENTION
1 to 4 are for explaining one embodiment of the present invention. In this embodiment, an electronic component chip 1 as shown in FIG. 6 is handled. Accordingly, in FIGS. 1 to 4, elements corresponding to those shown in FIG. 6 are denoted by the same reference numerals, and redundant description is omitted, and FIG. 6 is also referred to in the following description.
[0041]
1 and 2 show an alignment pallet 21.
[0042]
The alignment pallet 21 includes a plurality of cavities 22 each having a volume capable of accommodating the electronic component chips 1 shown in FIG. 6 one by one. The portion of the alignment pallet 21 in which one cavity 22 is provided is enlarged and shown in FIG.
[0043]
The cavity 22 has an opening 23 that can receive the LT surfaces 8 and 9 of the electronic component chip 1. A plurality of cavities 22 are provided with the openings 23 facing the upper surface of the alignment pallet 21.
[0044]
The planar shape of the cavity 22 is, for example, an ellipse as shown in FIG. Thus, by making the planar shape of the cavity 22 an ellipse, the length direction of the electronic component chip 1 located in the cavity 22 can be directed to a certain direction. In this case, the size of the cavity 22 is preferably selected so that the four corners of the LW surfaces 4 and 5 of the electronic component chip 1 are in light contact with the inner peripheral surface of the cavity 22 or form a slight gap. .
[0045]
Note that the planar shape of the cavity 22 may be changed to a shape similar to the LW surfaces 4 and 5 of the electronic component chip 1. Moreover, when it is not necessary to orient the longitudinal direction of the electronic component chip 1 located in the cavity 22 in a certain direction, the planar shape of the cavity 22 may be circular.
[0046]
A frame 24 is provided so as to surround the space above the alignment pallet 21.
[0047]
A magnet 25 is provided below the region of the alignment pallet 21 where the cavity 22 is provided. The magnet 25 is comprised from a permanent magnet, for example. Further, in FIG. 1, the magnet 25 has magnetic poles on the upper and lower surfaces thereof as shown by “S” and “N” poles. Therefore, the magnet 25 provides a magnetic flux substantially parallel to the depth direction of the cavity 22. Note that the S pole and the N pole may be reversed to those illustrated.
[0048]
A drive base 26 is provided so as to sandwich the magnet 25 and receive the alignment pallet 21 from below. The drive table 26 is for giving rocking and / or vibration to the alignment pallet 21. When the drive base 26 swings, the alignment pallet 21 swings as indicated by an arrow 27. In addition, this rocking | fluctuation is performed on the paper surface of FIG. 1 like the arrow 27 shown in FIG. 1, or is performed on the surface orthogonal to the paper surface of FIG.
[0049]
Further, when the alignment pallet 21 is vibrated by the drive base 26, vibration in the horizontal direction on the paper surface of FIG. 1 or vibration in a direction perpendicular to the paper surface of FIG.
[0050]
The plurality of electronic component chips 1 to be aligned are placed on the alignment pallet 21 in a random state. Then, swinging and / or vibration is applied to the alignment pallet 21 by the drive base 26. As a result, the plurality of electronic component chips 1 move on the alignment pallet 21 in various directions while changing their postures. For example, as indicated by an arrow 29 with respect to the electronic component chip 1 indicated by a broken line, Finally, one piece is transferred into each cavity 22.
[0051]
As described above, of the electronic component chip 1 that has been transferred into the cavity 22, one of the LT surfaces 8 and 9 from which the ground-side internal electrode 3 is exposed is transferred in a posture toward the bottom surface 28 of the cavity 22. Only, the posture in the cavity 22 is maintained by the magnetic force exerted on the internal electrode 3 from the magnet 25 regardless of the swing and / or vibration applied to the alignment pallet 21.
[0052]
FIG. 3 shows a state where the LT surface 8 of the electronic component chip 1 is transferred in a posture toward the bottom surface 28 of the cavity 22, but the reverse LT surface 9 is in a posture toward the bottom surface 28 of the cavity 22. Also about what was transferred, the attitude | position in the cavity 22 is maintained by the magnetic force from the magnet 25. FIG.
[0053]
On the other hand, the electronic component fed in such a posture that a surface other than the LT surface 8 or 9, that is, any one of the LW surfaces 4 and 5 and the WT surfaces 6 and 7 faces the bottom surface 28 of the cavity 22. For the chip 1, the magnetic force from the magnet 25 is insufficient to maintain it in the cavity 22, and it cannot remain in the cavity 22 due to rocking and / or vibration applied to the alignment pallet 21, It will not settle in the cavity 22 until it is swung out into the cavity 22 with the LT face 8 or 9 facing the bottom face 28 of the cavity 22.
[0054]
Therefore, when the electronic component chip 1 is accommodated in all the cavities 22 while the electronic component chip 1 is being transferred, and no electronic component chip 1 comes out of the cavity 22, the cavity All of the electronic component chips 1 in 22 are aligned in a desired direction.
[0055]
When the internal electrodes 2 and 3, particularly the ground-side internal electrode 3 include a ferromagnetic material, for example, when nickel or a nickel alloy is included as a conductive component, it is more easily affected by the magnetic force from the magnet 25 as described above. Therefore, it is preferable. However, as long as the ground side internal electrode 3 is affected by the magnetic force from the magnet 25, the ground side internal electrode 3 may not include a ferromagnetic material.
[0056]
Next, in order to form the external electrodes 13a and 13b as shown in FIG. 8 on the electronic component chip 1, a process as shown in FIG. 4 is performed.
[0057]
First, the alignment pallet 21 is taken out from the structure shown in FIG. At this time, if the excess electronic component chips 1 that have not been transferred into the cavity 22 remain on the alignment pallet 21, these excess electronic component chips 1 are removed.
[0058]
Next, as shown in FIG. 4A, the cover plate 31 is placed on the alignment pallet 21 so as to close the opening 23 of the cavity 22.
[0059]
Next, as shown in FIG. 4 (2), the alignment pallet 21 is inverted together with the cover plate 31 and then placed on the holding plate 32.
[0060]
The holding plate 32 is provided with a plurality of holding holes 33 for holding the electronic component chips 1 one by one corresponding to each position of the cavity 22 of the alignment pallet 21. The holding plate 32 includes, for example, a core material 34 made of a rigid body such as metal, and an elastic body 35 made of rubber or the like so as to cover it. The holding hole 33 described above is formed in the elastic body 35 portion. Provided. Further, the size of the holding hole 33 is slightly smaller than the size of the electronic component chip 1. Therefore, the electronic component chip 1 can be elastically held in the holding hole 33.
[0061]
Next, the cover plate 31 is extracted while maintaining the state shown in FIG. Thereafter, the alignment pallet 21 is separated from the holding plate 32.
[0062]
As a result, as shown in FIG. 4 (3), the electronic component chip 1 closes one opening 36 of the holding hole 33 of the holding plate 32 while maintaining the posture when it is located in the cavity 22. Located in.
[0063]
Next, as shown in FIG. 4 (3), the electronic component chip 1 is pushed into the holding hole 33 by operating the pusher pin 37 in the direction of the arrow 38.
[0064]
As a result, as shown in FIG. 4 (4), a state is obtained in which each electronic component chip 1 is sandwiched by each holding hole 33. At this stage, it is preferable that the LT surface 8 or 9 of the electronic component chip 1 slightly protrudes from the one main surface 39 of the holding plate 32. Note that the electronic component chip 1 illustrated in FIG. 3 described above is in a posture in which the LT surface 8 faces the bottom surface 28 of the cavity 22, and therefore in FIG. 4, the posture shown in FIG. 3 is maintained. 1 shows an electronic component chip 1. Therefore, in FIG. 4 (4), the LT surface 8 of the electronic component chip 1 is shown protruding from the main surface 39 of the holding plate 32.
[0065]
Next, in order to form the external electrode 13a as shown in FIG. 8 on the LT surface 8 of the electronic component chip 1 held by the holding plate 32, a plurality of slits 41 are formed as shown in FIG. The provided slit plate 42 is prepared. The slit plate 42 is for supplying the conductive paste 43 from the slit 41.
[0066]
The LT surface 8 of the electronic component chip 1 held by the holding plate 32 is brought into contact with or close to the slit plate 42, and the conductive paste 43 is supplied through the slit 41, whereby the external electrode 13a. A conductive paste 43 to be formed is applied on the LT surface 8 of the electronic component chip 1.
[0067]
Next, in order to apply the conductive paste 43 on the other LT surface 9 of the electronic component chip 1, the electronic component chip 1 is transferred to another holding plate, and the LT surface 9 protrudes from the main surface of this holding plate. The conductive paste 43 to be the external electrode 13b as shown in FIG. 8 is applied on the LT surface 9 as shown in FIG.
[0068]
In order to apply the conductive paste 43 on the LT surface 9 of the electronic component chip 1, instead of the above-described method, the electronic component chip 1 is moved in the holding hole 33 in the same holding plate 32, and the holding plate 32. The LT surface 9 may be protruded to the other main surface 40 side, and the process shown in FIG. 4 (5) may be performed again in this state.
[0069]
Further, the holding plate 32 is thinner than the illustrated one, and the electronic component chip 1 can be held in the holding hole 33 with the two LT surfaces 8 and 9 protruding from the main surfaces 39 and 40, respectively. Such a thing may be used. In this case, the electronic component chip 1 is held by the single holding plate 32 without being transferred to another holding plate or moved in the holding hole 33. The conductive paste 43 can be applied to each of the LT surfaces 8 and 9.
[0070]
Moreover, regarding the method for applying the conductive paste 43, in place of the method using the slit plate 42 as described above, for example, intaglio printing, letterpress printing, or screen printing may be applied.
[0071]
Thus, after applying the conductive paste 43 to be the external electrodes 13a and 13b on each of the LT surfaces 8 and 9 to the electronic component chip 1, each of the WT surfaces 6 and 7 of the electronic component chip 1 is provided. On top, the conductive paste to be the external electrodes 11 and 12 shown in FIG. 8 is applied. Since the application of the conductive paste for forming the external electrodes 11 and 12 is irrelevant to the essence of the present invention, the detailed description thereof is omitted.
[0072]
Thus, after the conductive paste to be the external electrodes 13a and 13b and 11 and 12 is applied, these conductive pastes are baked to form a chip shape in which the external electrodes 13a and 13b and 11 and 12 are formed. The electronic component 10a is completed.
[0073]
FIG. 5 is for explaining another embodiment of the present invention. In FIG. 5, elements corresponding to those shown in any of FIGS. 1 to 4 are denoted by the same reference numerals, and redundant description is omitted.
[0074]
FIG. 5 is an enlarged cross-sectional view of a portion of the alignment pallet 21a provided with the cavity 22, and an enlarged cross-sectional view of the portion of the holding plate 32 shown in FIG. Shown in the figure.
[0075]
The feature of this embodiment is that, for example, two small-diameter through holes 51 are provided so as to communicate with the bottom surface 28 of the cavity 22 of the alignment pallet 21a. The through hole 51 is used when the electronic component chip 1 transferred into the cavity 22 is transferred to the holding plate 32.
[0076]
That is, as shown in FIG. 5, the holding plate 32 is disposed on the alignment pallet 21 a while aligning the cavity 22 and the holding hole 33.
[0077]
Next, the pusher pin 52 is inserted into the through-hole 51 as indicated by an arrow 53, whereby the electronic component chip 1 is pushed up.
[0078]
As a result, the electronic component chip 1 is inserted into the holding hole 33 and is elastically held by the holding hole 33.
[0079]
While the present invention has been described with reference to the illustrated embodiment, various other modifications are possible within the scope of the present invention.
[0080]
For example, with respect to the position of the magnet 25, the magnet 25 may be positioned on the lower surface side of the driving table 26 while the driving table 26 is in contact with the entire lower surface of the alignment pallet 21.
[0081]
Similarly, the position of the magnet 25 may be embedded in the alignment pallet 21. In this case, when the magnetic force of the magnet 25 is too strong, the electronic component chip 1 may not fall on the cover plate 31 in the process shown in FIG. It is preferable to use an electromagnet that can be controlled off.
[0082]
Further, regarding the width direction dimension W and the thickness direction dimension T of the electronic component chip 1, in the illustrated embodiment, the relationship of W = T is substantially satisfied, but the relationship of W> T is satisfied. May be.
[0083]
Further, the electronic component chip 1 constitutes a feedthrough capacitor, but may be replaced with an electronic component chip for a chip-shaped electronic component having other functions.
[0084]
Further, in the illustrated embodiment, the alignment of the plurality of electronic component chips 1 by the alignment pallet 21 is performed as a previous step for forming the external electrodes 13a and 13b. It may be applied to the alignment of the electronic component chip 1 as a pre-stage of processes such as characteristic measurement, mounting, and taping.
[0085]
【The invention's effect】
As described above, according to the present invention, the edge of the internal electrode is aligned with at least one of the LT surfaces defined by the lengthwise dimension L and the thicknesswise dimension T, and the electronic component chips are aligned. When using the alignment pallet provided with a plurality of cavities for receiving electronic component chips one by one, a magnet is positioned below the cavity of the alignment pallet, and a plurality of The electronic components are placed in the cavities in this step of placing one electronic component chip and swinging and / or vibrating the alignment pallet so that one electronic component chip is placed in each cavity. Only chips that have been transferred in a posture in which the LT surface where the edge of the internal electrode is exposed faces the bottom surface of the cavity Rocking and / or regardless of vibration given to the alignment pallet, by the magnetic force exerted to the internal electrodes from the magnet, it is maintained posture within the cavity On the other hand, if the surface other than the LT surface is transferred in a posture toward the bottom surface of the cavity, the surface is moved out of the cavity by the above-described oscillation and / or vibration. Therefore, if the electronic component chips once transferred into the cavities do not go out after a predetermined time, the internal electrodes of all the electronic component chips accommodated in the cavities It is possible to obtain an aligned state in which the LT surface with the exposed edge is oriented toward the bottom surface of the cavity.
[0086]
Therefore, after being transferred as described above, a step of forming an external electrode electrically connected to the internal electrode on the LT surface where the edge of the internal electrode of the electronic component chip is exposed is performed. Then, since each electronic component chip is in the same posture, such external electrodes can be formed efficiently.
[0087]
In particular, when forming the external electrode, the electronic component chip transferred from the alignment pallet into the cavity is transferred to the holding plate while maintaining the posture, and the external electrode is attached to the electronic component chip held by the holding plate. If formed, the external electrode can be formed while reliably maintaining the posture of the electronic component chip.
[0088]
For this reason, when forming the external electrode electrically connected to the internal electrode, it is not necessary to form the electronic component chip in a state of being circulated, thereby reducing the number of steps for forming the external electrode. In addition, it is possible to save the conductive material used for forming the external electrode.
[0089]
The present invention is particularly advantageously applied when the widthwise dimension W and the thicknesswise dimension T of the electronic component chip are substantially in a relationship of W = T. This is because in this case, it is difficult to distinguish the LW surface and the LT surface from the appearance.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an alignment pallet 21, a magnet 25, and a drive base 26 for explaining an embodiment of the present invention.
FIG. 2 is a plan view showing the alignment pallet 21 shown in FIG.
3 is an enlarged cross-sectional view of a portion of the alignment pallet 21 shown in FIG. 1 where a cavity 22 is provided.
4 is a cross-sectional view sequentially showing steps for forming external electrodes for a plurality of electronic component chips 1 aligned by an alignment pallet 21. FIG.
FIG. 5 is an enlarged cross-sectional view illustrating a portion of the alignment pallet 21a provided with the cavity 22 and a portion of the holding plate 32 provided with the holding hole 33 for explaining another embodiment of the present invention. It is.
FIG. 6 is a perspective view showing an electronic component chip 1 of interest to the present invention.
7 is a diagram for explaining problems of the prior art, and a chip-like electronic component 10 obtained by forming external electrodes 11, 12 and 13 on the outer surface of the electronic component chip 1 shown in FIG. FIG.
FIG. 8 is a diagram for explaining a desire to be achieved by the present invention, in which a chip shape in which external electrodes 11, 12, 13a and 13b are formed on the outer surface of the electronic component chip 1 shown in FIG. 6; It is a perspective view which shows the electronic component 10a.
[Explanation of symbols]
1 Electronic component chip
A few internal electrodes
4,5 LW surface
6,7 WT surface
8,9 LT surface
10, 10a Chip-shaped electronic component
11, 12, 13, 13a, 13b External electrode
21,21a Alignment palette
22 cavities
23, 36 opening
25 Magnet
26 Drive stand
28 Bottom
32 holding plate
33 Holding hole
37, 52 Pusher pin
42 Slit plate
43 Conductive paste

Claims (9)

It has a rectangular parallelepiped shape having a length direction dimension L, a width direction dimension W, and a thickness direction dimension T. The length direction dimension L, the width direction dimension W, and the thickness direction dimension T satisfy L> W ≧ T. An internal electrode arranged in parallel to an LW plane defined by the lengthwise dimension L and the widthwise dimension W, and an edge of the internal electrode has the lengthwise dimension L and the A method of handling an electronic component chip exposed on at least one of LT surfaces defined by a thickness direction dimension T,
A plurality of cavities each having a volume capable of accommodating the electronic component chips one by one and each having an opening capable of receiving the LT surface are provided with the openings facing the upper surface. Preparing an alignment pallet;
Positioning a magnet below the cavity;
Placing a plurality of the electronic component chips on the alignment pallet;
Swinging and / or vibrating the alignment pallet to swing the electronic component chips one by one into each of the cavities,
In the transferring step, among the electronic component chips transferred into the cavity, only those transferred in such a manner that the LT surface where the edge of the internal electrode is exposed faces the bottom surface of the cavity. Regardless of the swing and / or vibration applied to the alignment pallet, the magnetic force exerted on the internal electrode from the magnet maintains the posture in the cavity , while the surface other than the LT surface is the surface of the cavity. A method of handling an electronic component chip, characterized in that a component that is transferred in a posture facing the bottom surface is moved out of the cavity by the swing and / or vibration . The method further comprises forming an external electrode electrically connected to the internal electrode on the LT surface where an edge of the internal electrode of the electronic component chip is exposed after the transferring step. The electronic component chip handling method according to 1. The step of forming the external electrode includes the step of transferring the electronic component chip that has been transferred into the cavity from the alignment pallet to a holding plate while maintaining the posture thereof, and the step of holding the holding plate on the holding plate. The method of handling an electronic component chip according to claim 2, further comprising: forming the external electrode on the electronic component chip. The electronic component chip handling method according to claim 1, wherein an edge of the internal electrode is exposed on both of the two LT surfaces. 5. The electronic component chip handling method according to claim 1, wherein the width-direction dimension W and the thickness-direction dimension T of the electronic component chip are substantially in a relationship of W = T. 6. 6. The method of handling an electronic component chip according to claim 1, wherein the internal electrode includes a ferromagnetic material. The method for handling an electronic component chip according to claim 1, wherein the internal electrode includes nickel or a nickel alloy as a conductive component. When the internal electrode is a ground side internal electrode, the electronic component chip further includes a through internal electrode facing the ground side internal electrode, and an edge of the through internal electrode has the width direction dimension W and the thickness. The method for handling an electronic component chip according to claim 1, wherein the electronic component chip is exposed on each of two WT surfaces defined by a vertical dimension T. It has a rectangular parallelepiped shape having a length direction dimension L, a width direction dimension W, and a thickness direction dimension T. The length direction dimension L, the width direction dimension W, and the thickness direction dimension T satisfy L> W ≧ T. An internal electrode arranged in parallel to an LW plane defined by the lengthwise dimension L and the widthwise dimension W, and an edge of the internal electrode has the lengthwise dimension L and the An alignment apparatus for aligning a plurality of electronic component chips exposed on at least one of LT surfaces defined by a thickness direction dimension T,
A plurality of cavities each having a volume capable of accommodating the electronic component chips one by one and each having an opening capable of receiving the LT surface are provided with the openings facing the upper surface. , With alignment palette,
A magnet provided below the cavity;
Means for rocking and / or vibrating the alignment pallet,
The magnetic force exerted on the internal electrode from the magnet is such that the edge of the internal electrode is exposed among the electronic component chips transferred into the cavity by swinging and / or vibrating the alignment pallet. Only in the case where the LT surface is transferred in a posture toward the bottom surface of the cavity, the posture in the cavity is maintained, and on the other hand, the surface other than the LT surface is transferred in a posture toward the bottom surface of the cavity. The electronic component chip aligning apparatus according to claim 1, wherein the electronic component chip aligning device is set to be moved out of the cavity by the oscillation and / or vibration .

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