CN112743469A - Positioning fixture for chip capacitor and positioning method thereof - Google Patents
Positioning fixture for chip capacitor and positioning method thereof Download PDFInfo
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- CN112743469A CN112743469A CN202110021718.9A CN202110021718A CN112743469A CN 112743469 A CN112743469 A CN 112743469A CN 202110021718 A CN202110021718 A CN 202110021718A CN 112743469 A CN112743469 A CN 112743469A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 190
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000004080 punching Methods 0.000 claims description 9
- 238000012797 qualification Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000004512 die casting Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
本发明涉及定位夹具技术领域，公开了一种用于片式电容器的定位夹具及其定位方法，其定位夹具包括：第一定位块和第二定位块，第一定位块设有能够容置片式电容器的定位槽，定位槽的长度和宽度分别与片式电容器的宽度和厚度相匹配，定位槽的槽底设置有贯穿第一定位块的通孔；第二定位块设有能够容置片式电容器的腔道，腔道贯穿第二定位块，腔道的长度和宽度分别与片式电容器的宽度和厚度相匹配，腔道与定位槽相对应，使得第一定位块和第二定位块合拢时，片式电容器能够自定位槽移动至腔道中。本发明对自身宽度大于长度的片式电容器能够正确定位，制备的外电极能够与片式电容器的内电极形成正确的电连接，确保片式电容器能发挥其电路功能。
The invention relates to the technical field of positioning fixtures, and discloses a positioning fixture for a chip capacitor and a positioning method thereof. The positioning fixture comprises: a first positioning block and a second positioning block, and the first positioning block is provided with a The length and width of the positioning groove are matched with the width and thickness of the chip capacitor respectively, and the bottom of the positioning groove is provided with a through hole that penetrates through the first positioning block; The cavity of the chip capacitor, the cavity runs through the second positioning block, the length and width of the cavity are respectively matched with the width and thickness of the chip capacitor, and the cavity corresponds to the positioning groove, so that the first positioning block and the second positioning block are When folded, the chip capacitor can move from the positioning slot into the channel. The invention can correctly locate the chip capacitor whose width is greater than its length, and the prepared outer electrode can form correct electrical connection with the inner electrode of the chip capacitor, so as to ensure that the chip capacitor can exert its circuit function.
Description
Technical Field
The invention relates to the technical field of positioning fixtures, in particular to a positioning fixture for a chip capacitor and a positioning method thereof.
Background
For the chip capacitor, external electrodes are prepared by dipping, and the external electrodes are disposed on both side surfaces of the chip capacitor where the width and thickness are simultaneously present, and the two opposite side surfaces are denoted as end surfaces. For the chip capacitor with the width larger than the length, the positioning device in the prior art can not obtain correct positioning, so that the outer electrode is formed on other surfaces of the non-inner electrode leading-out surface of the chip capacitor, and can not form correct electric connection with the inner electrode of the chip capacitor, and the chip capacitor can not play the circuit function. If the chip ceramic capacitor which is positioned by mistake is corrected manually, the efficiency of preparing the outer electrode is very low, and the current production requirement cannot be met.
Disclosure of Invention
The purpose of the invention is: the positioning fixture and the positioning method for the chip capacitor can be used for correctly positioning the chip capacitor with the width larger than the length, and the qualification rate of preparing the outer electrode is improved.
In order to achieve the above object, the present invention provides a positioning jig for a chip capacitor, comprising: the first positioning block is provided with a positioning groove capable of containing a chip capacitor, the length and the width of the positioning groove are respectively matched with the width and the thickness of the chip capacitor, and a through hole penetrating through the first positioning block is formed in the bottom of the positioning groove; the second positioning block is provided with a cavity channel capable of containing the chip capacitor, the cavity channel penetrates through the second positioning block, the length and the width of the cavity channel are respectively matched with the width and the thickness of the chip capacitor, and the cavity channel corresponds to the positioning groove, so that the chip capacitor can move into the cavity channel from the positioning groove when the first positioning block and the second positioning block are folded.
Optionally, the depth value of the positioning groove is greater than 0.9 times the length value of the chip capacitor.
Optionally, the depth value of the positioning groove is less than 1.2 times of the length value of the chip capacitor.
Optionally, the number of through-holes is 2, and 2 the through-holes set up along the length direction of constant head tank.
Optionally, the 2 through holes are also symmetrically arranged about the center line of the groove bottom of the positioning groove.
Optionally, a protrusion is arranged on the inner wall of the cavity in the length direction, and the protrusion is used for abutting against the outer wall of the chip capacitor.
The invention also provides a positioning method of the positioning fixture for the chip capacitor, which comprises the following steps:
the method comprises the following steps: placing a chip capacitor in a positioning groove of a first positioning block, wherein any end face of the chip capacitor is opposite to the bottom of the positioning groove;
step two: the first positioning block and the second positioning block are folded, and a punching needle penetrates through a through hole communicated with the positioning groove to push a part of the chip capacitor into a cavity channel;
step three: separating the first positioning block and the second positioning block, and preparing a first outer electrode on the end face of the chip capacitor outside the cavity;
step four: and the punching needle pushes the chip capacitor, so that the end face of the chip capacitor, which is positioned in the cavity, is pushed out of the cavity and a second external electrode is prepared on the end face.
Optionally, the first step further includes: and after the chip capacitor is arranged in the positioning groove, correcting the position of the chip capacitor to ensure that any end surface of the chip capacitor is over against the bottom of the positioning groove.
Optionally, the third step further includes: and after leveling the end surfaces of the chip capacitors positioned outside the cavity, preparing first external electrodes on the end surfaces of the chip capacitors positioned outside the cavity.
Optionally, the fourth step further includes: and leveling the end surfaces of the chip capacitors pushed out of the cavity, and then preparing second external electrodes on the end surfaces of the chip capacitors pushed out of the cavity.
The invention provides a positioning fixture for a chip capacitor and a positioning method thereof, compared with the prior art, the positioning fixture has the advantages that:
the invention relates to a positioning fixture for a chip capacitor, which comprises: the positioning device comprises a first positioning block and a second positioning block, wherein the first positioning block is provided with a positioning groove capable of containing a chip capacitor, the length and the width of the positioning groove are respectively matched with the width and the thickness of the chip capacitor, and the bottom of the positioning groove is provided with a through hole penetrating through the first positioning block; the second positioning block is provided with a cavity capable of containing the chip capacitor, the cavity penetrates through the second positioning block, the length and the width of the cavity are respectively matched with the width and the thickness of the chip capacitor, and the cavity corresponds to the positioning groove, so that the chip capacitor can move into the cavity from the positioning groove when the first positioning block and the second positioning block are folded. By moving the chip capacitor from the positioning groove into the cavity, when the external electrode is prepared, two end faces of the chip capacitor respectively extend out of two openings of the cavity to prepare the external electrode. Through the structure, the chip capacitor with the width larger than the length can be correctly positioned, the prepared outer electrode can form correct electric connection with the inner electrode of the chip capacitor, the chip capacitor can be ensured to play the circuit function, and the qualification rate of the prepared outer electrode is improved.
The invention also provides a positioning method of the positioning clamp for the chip capacitor, which can correctly position the chip capacitor with the width larger than the length, and the prepared outer electrode can form correct electric connection with the inner electrode of the chip capacitor, thereby ensuring the chip capacitor to play the circuit function and further improving the qualification rate of the prepared outer electrode.
Drawings
Fig. 1 is a schematic structural diagram of a chip capacitor according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a first positioning block according to an embodiment of the present invention.
Fig. 3 is a sectional view of a first positioning block according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a second positioning block according to an embodiment of the present invention.
Fig. 5 is a schematic view of a chip capacitor in a positioning groove according to an embodiment of the invention.
Fig. 6 is a schematic diagram of a chip capacitor in a cavity according to an embodiment of the invention.
FIG. 7 shows another exemplary detent structure according to the present invention.
In the figure, 1, a first positioning block; 2. positioning a groove; 3. a through hole; 4. a second positioning block; 5. a lumen; 6. a protrusion; 7. a chip capacitor; 8. end face of chip capacitor.
L, length of the chip capacitor; w, width of the chip capacitor; t, the thickness of the chip capacitor; A. the length of the positioning groove; D. the groove depth of the positioning groove.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 2 and 4, a positioning fixture for a chip capacitor 7 according to a preferred embodiment of the present invention includes a first positioning block 1 and a second positioning block 4.
Referring to fig. 2 and 3, a first positioning block 1 is provided with a positioning groove 2 capable of accommodating a chip capacitor 7, a length a and a width of the positioning groove 2 are respectively matched with a width and a thickness of the chip capacitor 7, and a through hole 3 penetrating through the first positioning block 1 is formed at a bottom of the positioning groove 2. The positioning groove 2 is used to place the chip capacitor 7 in the positioning groove 2. When the positioning groove 2 is arranged specifically, the positioning groove 2 is rectangular, the length of the positioning groove 2 is slightly larger than the width of the chip capacitor 7, and the width of the positioning groove 2 is slightly larger than the thickness of the chip capacitor 7. So set up, can let chip capacitor 7 place in constant head tank 2. In terms of material selection, the first positioning block 1 may be made of epoxy resin. The through hole 3 is arranged to allow a punch pin to penetrate through the through hole 3 to push the chip capacitor 7 in the positioning groove 2. Of course, it is not necessary to use a punch pin, and other objects capable of pushing the chip capacitor 7 through the through-hole 3 may be used.
And the second positioning block 4 is provided with a cavity channel 5 capable of containing the chip capacitor 7, the cavity channel 5 penetrates through the second positioning block 4, the length and the width of the cavity channel 5 are respectively matched with the width and the thickness of the chip capacitor 7, and the cavity channel 5 corresponds to the positioning groove 2, so that when the first positioning block 1 and the second positioning block 4 are folded, the chip capacitor 7 can move into the cavity channel 5 from the positioning groove 2. In specific setting, the length of the cavity channel 5 is slightly larger than the width of the chip capacitor 7, and the width of the cavity channel 5 is slightly larger than the thickness of the chip capacitor 7. So arranged, the chip capacitor 7 can be let into the cavity 5. The second positioning block 4 can be made of aluminum alloy, and the die-casting rubber is arranged on the inner wall of the cavity 5, so that friction on the chip capacitor 7 is reduced.
In the positioning fixture of the chip capacitor 7 of the embodiment, the chip capacitor 7 is placed in the positioning groove 2, the first positioning block 1 and the second positioning block 4 are folded, the chip capacitor 7 is moved from the positioning groove 2 to the cavity 5, and when an external electrode is prepared, two end surfaces 8 of the chip capacitor 7 respectively extend out of two openings of the cavity 5 to prepare the external electrode. By the structure, the chip capacitor 7 with the width larger than the length can be correctly positioned, the prepared outer electrode can form correct electric connection with the inner electrode of the chip capacitor 7, the chip capacitor 7 can be ensured to play the circuit function, and the qualification rate of preparing the outer electrode is improved.
For the shape of the chip capacitor 7 and its length L, width W, and thickness T, please refer to fig. 1.
In this embodiment, the positioning slot 2 may also be configured in other shapes, please refer to fig. 7, or may also be configured as a kidney-shaped slot with two ends being arc-shaped.
In the present embodiment, the depth D of the positioning groove 2 has a value greater than 0.9 times the value of the length of the chip capacitor 7. The depth D of the positioning groove 2 is smaller than 1.2 times of the length value of the chip capacitor 7. If the depth D of the positioning slot 2 is outside this range, it is not favorable for correct positioning. Hereinafter, specific reasons for these will be explained in detail.
The quantity of through-hole 3 is 2, and 2 through-holes 3 set up along the length direction of constant head tank 2. The 2 through holes 3 are also arranged symmetrically with respect to the center line of the groove bottom of the positioning groove 2. With the arrangement, when the punch pin passes through the through hole 3, uniform thrust can be generated on the chip capacitor 7, and the chip capacitor 7 can be correctly positioned.
The inner wall of the cavity 5 in the length direction is provided with a bulge 6, and the bulge 6 is used for abutting against the outer wall of the chip capacitor 7. Referring to fig. 6, the protrusion 6 contacts the chip capacitor 7, so that the contact area between the chip capacitor 7 and the inner wall of the cavity 5 is reduced, and friction is reduced, so that the chip capacitor 7 is easy to move in the cavity 5 when pushed. The die-casting rubber is arranged on the protrusion 6, so that the chip capacitor 7 can be clamped and fixed, and an external electrode can be conveniently prepared on the end face 8.
Referring to fig. 5 to 6, the present embodiment further provides a positioning method for a positioning fixture of a chip capacitor 7, including the following steps:
the method comprises the following steps: the chip capacitor 7 is arranged in the positioning groove 2 of the first positioning block 1, and any end surface 8 of the chip capacitor 7 is opposite to the bottom of the positioning groove 2.
In the first step, the chip capacitor 7 is placed on the first positioning block 1, and a vibration force is applied to move the chip capacitor 7 into the positioning groove 2. Since the length and width in the positioning groove 2 have been defined to match the width and thickness of the chip capacitor 7, the chip capacitor 7 is placed in the positioning groove 2 in a state where the end surface 8 faces the bottom of the groove, or in the positioning groove 2 in a state where the side surface where both the thickness and length of the chip capacitor 7 exist faces the bottom of the groove. The former is a correct position state of the chip capacitor 7, and the latter is an incorrect position state.
If an error location status occurs, the first step further comprises: after the chip capacitor 7 is placed in the positioning groove 2, the position of the chip capacitor 7 is corrected, so that any end surface 8 of the chip capacitor 7 is opposite to the bottom of the positioning groove 2. Some embodiments are provided herein to correct an erroneous location state to a correct location state.
For example, the vibration force may be directly applied to rotate the chip capacitor 7 in the wrong position state so that the end face 8 faces the bottom of the groove, thereby uniformly positioning the chip capacitors 7 in the correct position state.
For another example, the first positioning block 1 may be tilted by a certain angle, the chip capacitor 7 slides to a lower end under the action of gravity, and then a brush is disposed from one side of the chip capacitor 7 close to the inner wall of the positioning groove 2 to push the chip capacitor 7 to rotate so that the end surface 8 faces the bottom of the groove, thereby uniformly positioning the chip capacitors 7 in a correct position state. When the chip capacitor 7 is in the wrong position, the chip capacitor 7 will protrude from the surface of the first positioning block 1, so the brush can push the chip capacitor 7 more easily. The depth value of the positioning groove 2 is greater than 0.9 times of the length value of the chip capacitor 7. If the depth of the positioning slot 2 is less than 0.9 times of the length of the chip capacitor 7, the chip capacitor 7 in the correct position protrudes from the surface of the first positioning block 1 by a greater distance, which is likely to be pushed by the brush, and is not favorable for the accurate alignment of the chip capacitor 7 and the cavity 5.
Step two: the first positioning block 1 and the second positioning block 4 are folded, and the punch pin penetrates through the through hole 3 communicated with the positioning groove 2 to push a part of the chip capacitor 7 into the cavity 5.
When the first positioning block 1 and the second positioning block 4 are folded, the positioning groove 2 corresponds to the cavity 5, so that the chip capacitor 7 can be pushed into the cavity 5 when the punching needle pushes the chip capacitor 7. In this embodiment, after the first positioning block 1 and the second positioning block 4 are folded, the first positioning block 1 and the second positioning block 4 are turned over together, the punch pin vertically passes through the through hole 3 from the upper side to the lower side, and the chip capacitor 7 is pushed into the cavity channel 5 at the lower side. Therefore, the end face 8 positioned outside the second positioning block 4 is above the second positioning block 4, and the preparation of the outer electrode is convenient.
Of course, after the first positioning block 1 and the second positioning block 4 are folded, the punch pin vertically penetrates through the through hole 3 from the lower part upwards, and the chip capacitor 7 is pushed into the cavity 5 from the positioning groove 2. It should be noted here that the movement of the punch pin in the vertical direction is only for convenience of mass production, and the movement direction of the punch pin is not limited.
Since the depth value of the positioning groove 2 is less than 1.2 times the length value of the chip capacitor 7. The chip capacitor 7 can protrude from the surface of the first positioning block 1, and also can not protrude from the surface of the first positioning block 1, so that the alignment accuracy of the chip capacitor 7 is not affected in both cases, and the chip capacitor 7 can be ensured to be pushed into the cavity 5. If the depth value of the positioning groove 2 is greater than 1.2 times of the length value of the chip capacitor 7, the chip capacitor 7 is turned over after the first positioning block 1 and the second positioning block 4 are folded, and the distance from the chip capacitor 7 to the surface of the second positioning block 4 is large, which is not favorable for the accurate alignment of the chip capacitor 7 and the cavity 5.
When the positioning groove 2 is multiple, the punching needles can move together to push the chip capacitors 7 into the cavity 5 in order and uniformly.
The punching pin pushes a part of the chip capacitor 7 into the cavity 5 instead of pushing the chip capacitor 7 into the cavity 5 completely, and the end face 8 of the chip capacitor 7 is positioned outside the cavity 5, so that an external electrode can be prepared on the end face 8 conveniently.
In the embodiment, two symmetrical through holes 3 are arranged, two punching pins respectively penetrate through the two through holes 3, the stress is uniform, the chip capacitor 7 cannot rotate, the position of the chip capacitor 7 is prevented from being inclined when the chip capacitor 7 is pushed into the cavity channel 5, and the consistency of the size of the outer electrode of each chip capacitor 7 is ensured.
Step three: and separating the first positioning block 1 and the second positioning block 4, and preparing a first external electrode on an end surface 8 of the chip capacitor 7 outside the cavity 5.
After the first positioning block 1 and the second positioning block 4 are separated, the end surface 8 of each chip capacitor 7 outside the cavity 5 can be flattened, and then a first external electrode is prepared on the end surface 8 of each chip capacitor 7 outside the cavity 5. The end surfaces 8 of the chip capacitors 7 positioned outside the second positioning block 4 can be leveled by a roller, so that the distances of the end surfaces 8 protruding out of the outer surface of the second positioning block 4 are consistent, and the size consistency of the first external electrodes is improved.
Step four: the punch pin pushes the chip capacitor 7 so that an end face 8 of the chip capacitor 7 located inside the cavity 5 is pushed out of the cavity 5 and a second external electrode is prepared on the end face 8.
Similarly, after the punching pin pushes the chip capacitors 7, the end surfaces 8 of the chip capacitors 7 pushed out of the cavities 5 are leveled, and second external electrodes are formed on the end surfaces 8 of the chip capacitors 7 pushed out of the cavities 5. Similarly, the size uniformity of the second external electrode is also improved.
To sum up, the embodiment of the present invention provides a positioning fixture for a chip capacitor 7 and a positioning method thereof, which can correctly position the chip capacitor 7 having a width larger than a length thereof, and the prepared external electrodes can form correct electrical connection with the internal electrodes of the chip capacitor 7, so as to ensure that the chip capacitor 7 can perform its circuit function, thereby improving the qualification rate of the prepared external electrodes.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110021718.9A CN112743469A (en) | 2021-01-08 | 2021-01-08 | Positioning fixture for chip capacitor and positioning method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110021718.9A CN112743469A (en) | 2021-01-08 | 2021-01-08 | Positioning fixture for chip capacitor and positioning method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN112743469A true CN112743469A (en) | 2021-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110021718.9A Pending CN112743469A (en) | 2021-01-08 | 2021-01-08 | Positioning fixture for chip capacitor and positioning method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142352A (en) * | 2001-11-06 | 2003-05-16 | Murata Mfg Co Ltd | Method for handling electronic component chip, and apparatus for aligning the electronic component chip |
| CN102428532A (en) * | 2009-05-27 | 2012-04-25 | 株式会社村田制作所 | Component alignment device and method for producing electronic components |
| CN105845465A (en) * | 2016-04-26 | 2016-08-10 | 广东风华高新科技股份有限公司 | Chip positioning device and method |
| CN212303359U (en) * | 2020-06-05 | 2021-01-05 | 东莞顺络电子有限公司 | An inductive baking curing fixture |
| CN214603898U (en) * | 2021-01-08 | 2021-11-05 | 广东风华高新科技股份有限公司 | Positioning fixture for chip capacitor |
-
2021
- 2021-01-08 CN CN202110021718.9A patent/CN112743469A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142352A (en) * | 2001-11-06 | 2003-05-16 | Murata Mfg Co Ltd | Method for handling electronic component chip, and apparatus for aligning the electronic component chip |
| CN102428532A (en) * | 2009-05-27 | 2012-04-25 | 株式会社村田制作所 | Component alignment device and method for producing electronic components |
| CN105845465A (en) * | 2016-04-26 | 2016-08-10 | 广东风华高新科技股份有限公司 | Chip positioning device and method |
| CN212303359U (en) * | 2020-06-05 | 2021-01-05 | 东莞顺络电子有限公司 | An inductive baking curing fixture |
| CN214603898U (en) * | 2021-01-08 | 2021-11-05 | 广东风华高新科技股份有限公司 | Positioning fixture for chip capacitor |
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Application publication date: 20210504 |
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