CN105826092B - Chip positioning device and chip positioning method - Google Patents
Chip positioning device and chip positioning method Download PDFInfo
- Publication number
- CN105826092B CN105826092B CN201610266812.XA CN201610266812A CN105826092B CN 105826092 B CN105826092 B CN 105826092B CN 201610266812 A CN201610266812 A CN 201610266812A CN 105826092 B CN105826092 B CN 105826092B
- Authority
- CN
- China
- Prior art keywords
- hole
- chip
- length
- guide plate
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Abstract
The invention discloses a kind of chip positioning device and chip positioning methods.Chip positioning device positions for the sealing end of the chip of flip chip type multilayer ceramic capacitor, including：It is provided with the first guide plate of multiple evenly distributed first through hole, the length and width of first through hole and the length of chip and thickness matches；The second guide plate of multiple the second evenly distributed through-holes, the quantity and distributing position of the second through-hole and the matching of first through hole are provided with, the width of the second through-hole is equal with the width of first through hole, and the depth of the second through-hole is more than the width of chip；The positioning plate of multiple evenly distributed third through-holes is provided with, the quantity and distributing position of third through-hole are matched with the second through-hole, and the width of third through-hole is equal with the width of the second through-hole.This chip positioning device and chip positioning method can guarantee that the chip of the flip chip type multilayer ceramic capacitor positioning orientating in sealing end is correct, can improve closed-end efficiency, and operate more convenient.
Description
Technical field
The present invention relates to field of electrical components, more particularly to a kind of chip for flip chip type multilayer ceramic capacitor
Block the chip positioning device of positioning and chip positioning method.
Background technology
Flip chip type multilayer ceramic capacitor is the multilayer ceramic capacitor of a kind of special designing, specification includes 0204,0306,
0508th, 0612 etc., difference lies in the length of electric capacity chip and wide reverse with conventional multilayer ceramic capacitor.For example, with routine
Corresponding flip chip type multilayer ceramic capacitor of 0402 specification (0.04 inch in length, 0.02 inch wide) of multilayer ceramic capacitor is
It is 0204 specification (0.02 inch long, 0.04 inch wide).Flip chip type multilayer ceramic capacitor has substantially to be reduced compared with conventional product
Length-width ratio, therefore significantly reduce equivalent series inductance, the application scenario particularly suitable for the decoupling of electronic equipment high speed.
As shown in Figure 1, for conventional multilayer ceramic capacitor, the surface that the length of chip and wide (L and W) are formed is known as leading
The surface of face, the length of chip and thick (L and T) formation is known as long side surface, and the surface that the width and thick (W and T) of chip are formed is referred to as short
Side.As shown in Fig. 2, for flip chip type multilayer ceramic capacitor, surface that the length of chip 200 and wide (L and W) are formed then based on
The surface of face, the length of chip 200 and thick (L and T) formation is then short sides, the width of chip 200 and the surface of thick (W and T) formation
It is then long side surface.The termination electrode of conventional multilayer ceramic capacitor is formed in opposite two short sides of chip, and flip chip type
The termination electrode of multilayer ceramic capacitor then needs to be formed on opposite two long side surface of chip 200.
However, when the chip of flip chip type multilayer ceramic capacitor is imported the plate hole of end-blocking plate, chip positioning easily occurs
The problem of misorentation, makes termination electrode accidentally be formed in opposite two short sides of chip, therefore flip chip type multi-layer ceramics
The closed-end efficiency of the chip of capacitor is relatively low.
Invention content
Based on this, it is necessary to which providing a kind of can improve closed-end efficiency, the chip for flip chip type multilayer ceramic capacitor
Sealing end positioning chip positioning device and chip positioning method.
A kind of chip positioning device, the sealing end for the chip of flip chip type multilayer ceramic capacitor position, including：
First guide plate is provided with multiple evenly distributed first through hole, the shape of the first through hole on first guide plate
Shape is rectangle, and the length of the length of the first through hole and the chip matches and the width of the first through hole and institute
The thickness for stating chip matches；
Second guide plate is provided with multiple the second evenly distributed through-holes, the shape of second through-hole on second guide plate
Shape is rectangle, and the quantity of second through-hole is identical with the quantity of the first through hole, the distributing position of second through-hole
It being corresponded with the distributing position of the first through hole, the width of second through-hole is equal with the width of the first through hole,
The depth of second through-hole is more than the width of the chip；And
Positioning plate is provided with multiple evenly distributed third through-holes on the positioning plate, and the shape of the third through-hole is
Rectangle, the quantity of the third through-hole is identical with the quantity of second through-hole, the distributing position of the third through-hole and institute
The distributing position for stating the second through-hole corresponds, and the width of the third through-hole is equal with the width of second through-hole, described
The depth of third through-hole is not more than described not less than the depth of 1/3rd and the third through-hole of the length of the chip
The half of the length of chip.
In one embodiment, the depth of the first through hole is more than the width of the chip.
In one embodiment, the length of the first through hole and the length of the chip match and described first leads to
The width in hole and the thickness of the chip match, so that formed when the chip with the length of the chip and thickness
When short sides enter the first through hole for front end, the first through hole can just accommodate the chip.
In one embodiment, the one end open of the first through hole is horn-like.
In one embodiment, the thickness of the chip is no more than the 75% of the length of the chip.
In one embodiment, the length of the third through-hole be equal to length and the chip of the chip width it
With.
In one embodiment, length of the length of second through-hole not less than the third through-hole and the chip
The sum of 1/3rd of length, and the length of second through-hole is no more than the length of the third through-hole and the length of the chip
The sum of half of degree.
A kind of chip positioning method completes the chip of flip chip type multilayer ceramic capacitor using above-mentioned chip positioning device
Sealing end positioning, include the following steps：
By applying adhesive tape on a surface of the positioning plate；
Second guide plate is layered on another surface of the positioning plate, is then layered in first guide plate
On second guide plate；
Multiple chips are led to using the short sides that the length of the chip and thickness are formed as front end into described first
Hole simultaneously causes the chip to be fixed by the applying adhesive tape；And
First guide plate and second guide plate are removed, completes the sealing end positioning of the chip.
In one embodiment, the one end open of the first through hole is horn-like；
The one side of the flare openings far from the first through hole of first guide plate is separate with second guide plate
The surface contact of the positioning plate.
In one embodiment, when second guide plate is layered on another surface of the positioning plate, the third
One end of through-hole is concordant with one end of second through-hole；
When first guide plate is layered on second guide plate, one end and the first through hole of second through-hole
One end is concordant.
This chip positioning device and chip positioning method can guarantee that the chip of flip chip type multilayer ceramic capacitor is blocking
When positioning orientating it is correct, closed-end efficiency can be improved, and operate more convenient.
Description of the drawings
Fig. 1 is the structure diagram of the chip of the conventional multilayer ceramic capacitor of an embodiment；
Fig. 2 is the structure diagram of the chip of the flip chip type multilayer ceramic capacitor of an embodiment；
Fig. 3 is the structure diagram of the first guide plate of the chip positioning device of an embodiment；
Fig. 4 is the structure diagram of the second guide plate of the chip positioning device of an embodiment；
Fig. 5 is the structure diagram of the positioning plate of the chip positioning device of an embodiment；
Fig. 6 is the flow chart of the chip positioning method of an embodiment；
Fig. 7 is the operation chart of S10~S30 of chip positioning method as shown in Figure 6；
Fig. 8 is the operation chart of the S30 of chip positioning method as shown in Figure 6；
Fig. 9 is the operation chart of the S30 of chip positioning method as shown in Figure 6；
Figure 10 is that the S40 of chip positioning method as shown in Figure 6 completes the schematic diagram after sealing end positioning.
Specific embodiment
The sealing end for being used for the chip of flip chip type multilayer ceramic capacitor is determined mainly in combination with drawings and the specific embodiments below
The chip positioning device and chip positioning method of position are described in further detail.
With reference to Fig. 2, the surface of the length (L) of the chip 200 of flip chip type multilayer ceramic capacitor and wide (W) formation is interarea,
The surface that the length (L) of chip 200 and thick (T) are formed is short sides, and the surface that the width (W) of chip 200 and thick (T) are formed is long side
Face.The termination electrode of flip chip type multilayer ceramic capacitor is formed on opposite two long side surface of chip 200.
With reference to Fig. 3~Fig. 4, for an implementation of the sealing end positioning of the chip 200 of above-mentioned flip chip type multilayer ceramic capacitor
The chip positioning device of mode, including：First guide plate 10, the second guide plate 20 and positioning plate 30.
Preferably, the thickness T of chip 200 is no more than the 75% of the length L of chip 200, so as to chip during sealing end
200 are properly positioned as possible.
With reference to Fig. 3, multiple evenly distributed first through hole 12 are provided on the first guide plate 10.The shape of first through hole 12 is
Rectangle, the length of first through hole 12 are denoted as L1, and the width of first through hole 12 is denoted as W1, and the depth of first through hole 12 is denoted as D1.
The length L1 of the first through hole 12 and length L of chip 200 matches and the width W1 and chip of first through hole 12
200 thickness T-phase matching.Here, the length L1 of first through hole 12 and the length L of chip 200 match and first through hole 12
The thickness T-phase of width W1 and chip 200 matched mean：It is formed when chip 200 with the length L of chip 200 and thickness T
When short sides enter first through hole 12 for front end, first through hole 12 can just accommodate chip 200.
Preferably, the depth D1 of first through hole 12 is more than the width W of chip 200.
Preferably, the one end open of first through hole 12 is horn-like.
With reference to Fig. 4, the shape size of the second guide plate 20 matches with the first guide plate 10.It is provided on second guide plate 20 multiple
The second evenly distributed through-hole 22.The shape of second through-hole 22 is rectangle.
The quantity of second through-hole 22 is equal with the quantity of first through hole 12, the distributing position and first through hole of the second through-hole 22
12 distributing position corresponds.
The width of second through-hole 22 is W2, W2=W1.The depth of second through-hole 22 is D2, D2 ＞ W.Preferably, second is logical
The length in hole 22 is L2, L3+ (1/3) L≤L2≤L3+ (1/2) L.
With reference to Fig. 5, the shape size of positioning plate 30 matches with the second guide plate 20.It is provided on positioning plate 30 multiple uniform
The third through-hole 32 of arrangement.The shape of third through-hole 32 is rectangle.
The quantity of third through-hole 32 is equal with the quantity of the second through-hole 22 and distributing position corresponds.Third through-hole 32
Width be W3, W3=W2.The depth of third through-hole 32 is D3, L/3≤D3≤L/2, and the chip 200 after positioning can be made to have foot
Enough length protrudes from the surface of positioning plate 3 in order to block, and makes the thickness of positioning plate 30 larger so as to enough strong
Degree and flexing resistance.
The length of third through-hole 32 is L3, and L3 is equal to the sum of the length L of chip 200 and the width W of chip 200, i.e. L3=L
+W。
The chip positioning method of an embodiment as shown in Figure 6 completes flip chip type using above-mentioned chip positioning device
The sealing end positioning of the chip 200 of multilayer ceramic capacitor, includes the following steps：
S10, adhesive tape 40 is pasted onto on a surface of positioning plate 30.
Adhesive tape 40 can select conventional adhesive tape.
As shown in fig. 7, adhesive tape 40, which is tightened, makes its straight non-wrinkled, and is pasted onto on a surface of positioning plate 30,
Adhesive tape 40 is made to be fitted closely with positioning plate 30, chip 200 will be efficiently located in the step of in this way below, and is made each
A chip 200 it is highly consistent so as to ensure sealing end formed termination electrode size it is consistent.
S20, the second guide plate 20 is layered on another surface of positioning plate 30, the first guide plate 10 is then layered in
On two guide plates 20.
It is not pasted on the surface of adhesive tape 40 as shown in fig. 7, the second guide plate 20 is layered in positioning plate 30, makes shape big
Small the second guide plate 20 being mutually matched and positioning plate 30 overlap.At this moment the quantity of third through-hole 32 and the quantity phase of the second through-hole 22
Deng and distributing position correspond, one end of third through-hole 32 is concordant with one end of the second through-hole 22.Due to W2=W3 and
L2 is more than L3, thus from the second through-hole 22 to third through-hole 32 be not completely through, positioning plate 30 has partly blocked second
Through-hole 22.
Preferably, the one end open of first through hole 12 is horn-like.
By the one side of 12 flare openings of separate first through hole of the first guide plate 10 and the remotely located plate of the second guide plate 20
30 one side contact, the first guide plate 10 is layered on the second guide plate 20,10 He of the first guide plate for being mutually matched shape size
Second guide plate 20 overlaps.At this moment the quantity of the second through-hole 22 is equal with the quantity of first through hole 12 and distributing position one is a pair of
Should, and one end of the second through-hole 22 is concordant with one end of first through hole 12.Since W2=W1 and L2 are more than L1, so from the
One the 12 to the second through-hole of through-hole 22 be completely through.
S30, multiple chips 200 are entered into first through hole using the short sides that the length of chip 200 and thickness are formed as front end
12 and cause 200 adhesive band 40 of chip paste fix.
Preferably, the thickness T of chip 200 is no more than the 75% of the length L of chip 200, so as to chip during sealing end
200 are properly positioned as possible.
As shown in Figure 7, Figure 8 and Figure 9, multiple chips 200 are placed on the first guide plate 10 because L1 and L match and
W1 is matched with T-phase, by rocking, vibrating or apply magnetic force, chip 200 can be made to fall into first as front end using short sides and led to
Hole 12.The flare openings of first through hole 12 help to import chip 200.At this moment due to from the 12 to the second through-hole of first through hole 22
Be completely through, therefore chip 200 can continue to fall into the second through-hole 22.At this moment due to from the second through-hole 22 to third through-hole 32
Be not completely through, chip 200 cannot be fallen directly into third through-hole 32, but the short sides of chip 200 are with partly hiding
The positioning plate 30 for having kept off the second through-hole 22 touches.Due to L3+ (1/3) L≤L2≤L3+ (1/2) L, so chip 200 and positioning plate
30 is largely hanging when touching, so as to roll side to overturn to hanging.Due to the width W2 of the second through-hole 22 and third through-hole 32
Width W3 is equal and is matched with the thickness T-phase of chip 200, therefore the second through-hole 22 and third through-hole 32 can limit chip
Along the length direction of third through-hole 32 during 200 overturning.200 side flipping side of chip is fallen in third through-hole 32, with long side surface
It contacts adhesive tape 40 and adhesive band 40 is pasted and fixed.At this moment, have in each third through-hole 32 and only there are one chip 200 with gluing
Adhesive tape 40 contacts.The length L3=L+W of third through-hole 32 can both ensure that third through-hole 32 had sufficient space to fall after accommodating overturning
The chip 200 entered, and space can be saved, improve production capacity.In addition, if L2 is too big, chip 200 is touched with positioning plate 30
Shi Buneng is overturn, and L2 is too small, and the switching process of chip 200 is because center of gravity problem can be interrupted, so should make L3+ (1/3) L≤L2
≤ L3+ (1/2) L, can smoothly complete the entire switching process of chip 200.
S40, the first guide plate 10 and the second guide plate 20 are removed, completes the sealing end positioning of chip 200.
As shown in Figure 10, the first guide plate 10 and the second guide plate 20 are removed, be left positioning plate 30, adhesive tape 40 and is pasted onto viscous
The extra chip 200 that not adhesive band 40 on multiple chips 200 of adhesive tape 40 and positioning plate 30 is pasted.Due to L3=L
+ W, so third through-hole 32 cannot accommodate extra chip 200, do not occur in a third through-hole 32 there are two or more
200 adhesive band 40 of chip situation about clinging.
It for extra chip 200, can directly shake off, permanent magnet or electromagnet can also be used by extra core
Piece 200 is sucked out.
At this moment, the entire long side surface for being pasted onto the chip 200 of adhesive tape 40 protrudes from a side surface of positioning plate 30, chip
200 positioning has been completed, and can easily be blocked.
This chip positioning device and chip positioning method can guarantee that the chip 200 of flip chip type multilayer ceramic capacitor exists
Positioning orientating is correct during sealing end, can improve closed-end efficiency, and operates more convenient.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of chip positioning device, for the sealing end positioning of the chip of flip chip type multilayer ceramic capacitor, which is characterized in that packet
It includes：
First guide plate is provided with multiple evenly distributed first through hole on first guide plate, and the shape of the first through hole is
Rectangle, the length of the length of the first through hole and the chip matches and the width of the first through hole and the core
The thickness of piece matches；
Second guide plate is provided with multiple the second evenly distributed through-holes on second guide plate, and the shape of second through-hole is
Rectangle, the quantity of second through-hole is identical with the quantity of the first through hole, the distributing position of second through-hole and institute
The distributing position for stating first through hole corresponds, and the width of second through-hole is equal with the width of the first through hole, described
The depth of second through-hole is more than the width of the chip；And
Positioning plate is provided with multiple evenly distributed third through-holes on the positioning plate, and the shape of the third through-hole is rectangular
Shape, the quantity of the third through-hole is identical with the quantity of second through-hole, the distributing position of the third through-hole and described the
The distributing position of two through-holes corresponds, and the width of the third through-hole is equal with the width of second through-hole, the third
The depth of through-hole is not more than the chip not less than the depth of 1/3rd and the third through-hole of the length of the chip
Length half.
2. chip positioning device according to claim 1, which is characterized in that the depth of the first through hole is more than the core
The width of piece.
3. chip positioning device according to claim 1, which is characterized in that when the chip with the length of the chip and
When the short sides that thickness is formed enter the first through hole for front end, the first through hole can just accommodate the chip.
4. chip positioning device according to claim 1, which is characterized in that the one end open of the first through hole is loudspeaker
Shape.
5. chip positioning device according to claim 1, which is characterized in that the thickness of the chip is no more than the chip
Length 75%.
6. chip positioning device according to claim 1, which is characterized in that the length of the third through-hole is equal to the core
The sum of the length of piece and the width of the chip.
7. chip positioning device according to claim 1, which is characterized in that the length of second through-hole is not less than described
The sum of 1/3rd of the length of the length of third through-hole and the chip, and the length of second through-hole is no more than described the
The sum of the length of three through-holes and the half of length of the chip.
A kind of 8. chip positioning method, which is characterized in that using the chip positioning device as described in any one of claim 1 ~ 7
The sealing end positioning of the chip of flip chip type multilayer ceramic capacitor is completed, is included the following steps：
By applying adhesive tape on a surface of the positioning plate；
Second guide plate is layered on another surface of the positioning plate, is then layered in first guide plate described
On second guide plate；
Multiple chips are entered into the first through hole simultaneously using the short sides that the length of the chip and thickness are formed as front end
So that the chip is fixed by the applying adhesive tape；And
First guide plate and second guide plate are removed, completes the sealing end positioning of the chip.
9. chip positioning method according to claim 8, which is characterized in that the one end open of the first through hole is loudspeaker
Shape；
The one side of the flare openings far from the first through hole of first guide plate is with second guide plate far from described
The surface contact of positioning plate.
10. chip positioning method according to claim 8, which is characterized in that second guide plate is layered in the positioning
When on another surface of plate, one end of the third through-hole is concordant with one end of second through-hole；
When first guide plate is layered on second guide plate, one end of second through-hole and one end of the first through hole
Concordantly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610266812.XA CN105826092B (en) | 2016-04-26 | 2016-04-26 | Chip positioning device and chip positioning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610266812.XA CN105826092B (en) | 2016-04-26 | 2016-04-26 | Chip positioning device and chip positioning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105826092A CN105826092A (en) | 2016-08-03 |
| CN105826092B true CN105826092B (en) | 2018-06-26 |
Family
ID=56527517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610266812.XA Active CN105826092B (en) | 2016-04-26 | 2016-04-26 | Chip positioning device and chip positioning method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105826092B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102428532A (en) * | 2009-05-27 | 2012-04-25 | 株式会社村田制作所 | Component alignment device and method for producing electronic components |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09232113A (en) * | 1996-02-21 | 1997-09-05 | Taiyo Yuden Co Ltd | Formation of external electrode for electronic component and electronic component alignment device |
| JP3931631B2 (en) * | 2001-11-06 | 2007-06-20 | 株式会社村田製作所 | Electronic component chip handling method and electronic component chip alignment apparatus |
-
2016
- 2016-04-26 CN CN201610266812.XA patent/CN105826092B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102428532A (en) * | 2009-05-27 | 2012-04-25 | 株式会社村田制作所 | Component alignment device and method for producing electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105826092A (en) | 2016-08-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2016145779A1 (en) | Alignment mark, circuit board and display device | |
| CN105975135A (en) | Display device, electronic equipment and manufacturing method of display device | |
| EP2568367A3 (en) | Touch screen, transparent circuit board for touch screen and method for fabricating touch screen | |
| CN202269097U (en) | Printed circuit board and electronic device | |
| CN105807992A (en) | Touch display panel and touch display apparatus | |
| CN105826093B (en) | Chip positioning device and chip positioning method | |
| CN203746444U (en) | Anisotropic conductive film and display panel | |
| CN108807213A (en) | The transfer method and micro component transfer device of micro component | |
| CN105826092B (en) | Chip positioning device and chip positioning method | |
| US20150077946A1 (en) | Touch screen panel and method for manufacturing same | |
| EP2750189A1 (en) | Package on package device | |
| CN105428256B (en) | A kind of semiconductor devices and its manufacturing method and electronic device | |
| CN106455315A (en) | 0201 element bonding pad design method and PCB (printed circuit board) | |
| CN105845465B (en) | Chip positioning device and chip positioning method | |
| US20160345435A1 (en) | Print circuit board | |
| TW201301964A (en) | PWB connecting assembly | |
| CN103172271B (en) | A kind of coating process | |
| TWI686107B (en) | Package device and manufacturing method thereof | |
| CN205176821U (en) | OGS capacitive touch screen and touch -sensitive display device | |
| CN105931836B (en) | Chip positioning device and chip positioning method | |
| CN203407084U (en) | Dustproof type PCB | |
| US20070226993A1 (en) | Apparatus for adhering electronic device and a method for adhering electronic device | |
| CN204291577U (en) | A kind of printed circuit board pads structure | |
| CN204031604U (en) | Objective table and hot-press equipment | |
| WO2021114498A1 (en) | Method for manufacturing magnetic circuit system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |