JPH09232113A - Formation of external electrode for electronic component and electronic component alignment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide formation of an external electrode for an electronic component which enables formation of an external electrode on a desired surface of a chip component having a rectangular parallelepiped shape. SOLUTION: A second component alignment plate 2 is stacked on a component holding plate 3, and a first component alignment plate 1 is stacked on the second component alignment plate 2. In this state, a chip P is dropped in a through alignment hole 1a of the first component alignment plate 1, with the largest plane Pa facing downward. Subsequently, the first component alignment plate 1 is slid, and the chip component P is dropped in a through alignment hole 2a of the second component alignment plate 2 and a bottomed holding hole 3a of the component holding plate 3, with the second largest plane Pb facing downward. Thus, the chip component P of rectangular parallelepiped shape is aligned and held in the bottomed holding hole 3a of the component holding plate 3, with the second largest plane Pb facing downward and with the chip component P and the bottomed holding hole 3a being in the same direction. Then, electrode paste is applied to an exposed portion of the chip P held by the component holding plate 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to chip parts such as chip capacitors, chip resistors and chip inductors,
In particular, an external electrode forming method of an electronic component suitable for forming an external electrode on a desired surface of a rectangular parallelepiped chip component, and an electronic component alignment for holding the rectangular parallelepiped chip component on a component holding plate in a predetermined posture. It relates to the device.

[0002]

2. Description of the Related Art FIG. 10 shows a conventional component aligning apparatus used for forming external electrodes. In the figure, P is a chip component,
Reference numeral 101 is a component alignment plate, and 102 is a component holding plate.

The chip part P has a rectangular parallelepiped shape having a predetermined length L1, a width L2 and a thickness L3.
It has the largest surface Pa defined by, the second largest surface Pb defined by L1 and L3, and the smallest surface Pc defined by L2 and L3.

The component alignment plate 101 is made of a plate material having a constant thickness such as hard rubber or plastic, and has a round hole-shaped through alignment hole 1
01a is provided in a predetermined arrangement. This through alignment hole 101
The inner diameter of a is slightly larger than the diagonal length of the surface Pc of the chip component P. In addition, a guide surface 101b for facilitating the dropping of the chip component P is provided by chamfering at the upper end opening of the through alignment hole 101a.

The component holding plate 102 is made of a plate material having a constant thickness such as hard rubber or plastic, and has bottomed holding holes 102a having the same inner diameter as the through alignment holes 101a of the component alignment plate 101 in the same arrangement as the through alignment holes 101a. ing.

A conventional external electrode forming method using the above-described component aligning device will be described below with reference to FIGS. 11 (a) (b) and 12.

First, as shown in FIG. 11 (a), the component alignment plate 101 is formed on the component holding plate 102 through the through alignment hole 1 thereof.
01a is superposed so that it is aligned with the component holding hole 102a. Then, the chip components P are separately supplied onto the component alignment plate 101, and vibration or rocking is applied to the entire stacked plates. Due to the addition of this vibration or swing, the chip component P on the component alignment plate 101 is dropped into the component alignment hole 101a with the smallest surface Pc facing downward, and the component holding plate 102 holds the component through the component alignment hole 101a. It is dropped into the hole 102a.

Next, as shown in FIG. 11B, the component aligning plate 101 is lifted right above and removed from the component holding plate 102. As a result, as shown in FIG. 12, in the chip component P, the smallest surface Pc faces downward, that is, one end in the longitudinal direction is inserted into the component holding hole 102a and the other part is exposed to the outside. Will be held at 102.

Next, an unillustrated paste application plate having the electrode paste Dp attached to one surface thereof is collectively pressed against the exposed end surface (smallest surface Pc) of the chip component P held by the component holding plate 102, The electrode paste Dp is attached to the exposed end surface and its peripheral portion. After the paste is attached, the chip component P together with the component holding plate 102 is put into a heating furnace (not shown) to dry the attached paste Dp.

[0010]

In the above-described conventional component aligning apparatus, since the through-hole aligning hole 101a of the component aligning plate 101 and the component holding hole 102a of the component holding plate 102 are both round holes, the chip component P is the smallest. Although the planes Pc can be aligned so as to face downward, it is impossible to align them in the same direction, that is, it is impossible to align all of the chip components P in the same posture. As shown in FIG. There is a problem in that the orientation of the chip component P with respect to is different. In order to solve this problem, it has been attempted to make the lower portions of the through-holes 101a into square holes so that their directions are aligned with each other.
There is a problem that the probability of being dropped to 01a is extremely reduced.

Further, there is a problem that the chip parts P can be aligned so that the smallest surface Pc faces downward, but the chip component P cannot be aligned so that the second largest surface Pb faces downward. In the rectangular parallelepiped chip component P, even if the size of the through alignment hole 101a is changed and the second largest surface Pb is directed downward and dropped into the through alignment hole 101a, the smaller surface Pc is formed first. Since it cannot be prevented from entering inside, the second largest surface Pb cannot be aligned so as to face downward.

Therefore, the attachment of the electrode paste Dp to the chip component P is limited to the smallest surface Pc of the chip component P and its peripheral portion, and the electrode paste Dp is attached to the other surface to form the external electrode. In addition, there is a problem that the electrode paste Dp cannot be attached to a part of the surface to form the external electrode.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an external electrode forming method for an electronic component capable of forming an external electrode on a desired surface of a chip component having a rectangular parallelepiped shape, and a rectangular parallelepiped shape. It is an object of the present invention to provide an electronic component aligning device capable of aligning and holding the chip components forming the above in a component holding plate in a predetermined posture.

[0014]

In order to achieve the above object, in the method of forming an external electrode of an electronic component according to the present invention, a second component alignment plate is formed on a component holding plate, and the through alignment hole has a component holding hole. In a state in which the first component aligning plate is placed on the second component aligning plate so that the lower end opening of the through aligning hole is closed by the second component aligning plate. , The chip part is dropped into the through alignment hole of the first component alignment plate with the largest surface facing downward, and then the through alignment hole of the first component alignment plate matches the through alignment hole of the second component alignment plate. Slide the first component alignment plate,
By dropping the chip component into the through alignment hole of the second component alignment plate and the bottomed holding hole of the component holding plate with the surface adjacent to the largest surface facing downward, the rectangular parallelepiped chip component is bottomed of the component holding plate. The feature is that they are aligned and held in a holding hole in a predetermined posture, and an electrode paste is attached to an exposed portion of the chip component held by the component holding plate.

In the method of forming the external electrodes of the electronic component according to the present invention, the chip component having a rectangular parallelepiped shape is aligned and held in the bottomed holding hole of the component holding plate in a predetermined posture, and the electrode paste is exposed on the exposed portion of the chip component. The external electrodes can be formed on the desired surface of the chip component by attaching the.

The electronic component aligning apparatus according to the present invention comprises a first component aligning plate having a through-hole aligning hole in the shape of a square hole corresponding to the largest surface of the chip component and a surface adjacent to the largest surface of the chip component. And a component holding plate having a bottomed holding hole of the same shape as the through alignment hole of the second component alignment plate. It has a feature.

In the component aligning apparatus according to the present invention, the second component aligning plate is superposed on the component retaining plate so that the through alignment holes thereof coincide with the component retaining holes, and the second component aligning plate is placed on the second component aligning plate. With the first component aligning plate superposed so that the lower end opening of the through aligning hole is closed by the second component aligning plate, the chip component is placed on the first component aligning plate with the largest surface facing downward. Into the through alignment hole of the first component alignment plate, and then slide the first component alignment plate so that the through alignment hole of the first component alignment plate matches the through alignment hole of the second component alignment plate, By dropping the chip parts into the through alignment holes of the second component alignment plate and the bottomed holding holes of the component holding plate with the adjacent surfaces facing downward, the rectangular parallelepiped chip parts are formed into the bottomed holding holes of the component holding plate. Can be aligned and held in a predetermined posture

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment of the present invention, specifically, a parts aligning apparatus used for forming external electrodes, in which P is a chip part, 1 is a first part aligning plate, Two
Is a second component alignment plate, and 3 is a component holding plate.

The chip component P has a rectangular parallelepiped shape having a predetermined length L1, width L2 and thickness L3.
It has the largest surface Pa defined by, the second largest surface Pb defined by L1 and L3, and the smallest surface Pc defined by L2 and L3.

As shown in FIG. 2, the first component aligning plate 1 is made of a plate material having a constant thickness such as hard rubber or plastic, and has square hole-shaped through aligning holes 1a arranged in a predetermined array (one in the drawing for convenience). (Only displayed). The shape of this through-alignment hole 1a corresponds to the largest surface Pa of the chip component P, and has a size that can be inserted with a margin with the surface Pa facing downward. In addition, a guide surface 1b for facilitating the dropping of the chip component P is provided by chamfering at the upper end opening of the through alignment hole 1a. Further, the depth of the through alignment hole 1a including the guide surface 1b, that is, the thickness of the first component alignment plate 1 is the thickness L3 of the chip component P.
Slightly larger than or equal to the thickness L3.

As shown in FIG. 3, the second component aligning plate 2 is made of a plate material having a constant thickness such as hard rubber or plastic, and has square hole-shaped through aligning holes 2a formed in the first component aligning plate 1. The through alignment holes 1a are provided in the same arrangement (only one is shown in the figure for convenience). The shape of this through-alignment hole 2a corresponds to the second largest surface Pb of the chip component P.
It has a size such that it can be inserted with a margin with b facing downward. In addition, at the upper end opening of the through alignment hole 2a,
A guide surface 2b for facilitating the dropping of the chip component P is provided by chamfering. In the illustrated example, the opening contour of the guide surface 2b is the lower end opening shape of the through alignment hole 1a of the first component alignment plate 1. It is matched with. further,
The depth of the through alignment hole 2a including the guide surface 2b, that is, the second
The thickness of the component alignment plate 2 is slightly larger than or equal to the width L2 of the chip component P.

As shown in FIG. 4, the component holding plate 3 is made of a plate material having a constant thickness such as hard rubber or plastic, and the square-shaped bottomed holding holes 3a are arranged through the second component arranging plate 2. The holes 2a are provided in the same arrangement (only one is shown in the figure for convenience). The shape of the component holding hole 3a is 2 of that of the chip component P.
It corresponds to the second largest surface Pb and has a size such that it can be inserted with a margin with the surface Pb facing downward. Further, the depth of the component holding hole 3a is about 1/2 of the width L2 so that the chip component P can be held in an exposed state.

An external electrode forming method using the above component aligning device will be described below with reference to FIGS. 5 (a) to 5 (f), 6 (a) (b), 7 (a) and 7 (b). To do.

First, as shown in FIG. 5A, the second component alignment plate 2 is superposed on the component holding plate 3 so that the through alignment holes 2a and the component holding holes 3a are aligned with each other. Two
The first component aligning plate 1 is placed on the component aligning plate 2 of FIG. 1 so that the lower end opening of the through aligning hole 1a is orthogonal to the position near the hole of the second component aligning plate 2, specifically, the center of the through aligning hole 2a in the longitudinal direction. Stack them so that they will be blocked at the part you want. In the same state, the through-hole aligning holes 1a of the first component aligning plate 1 and the through-hole aligning holes 2a of the second component aligning plate 2 are parallel to each other when viewed from above, and their longitudinal centers coincide with each other. There is.

Then, the chip parts P are supplied in a separated state onto the first part alignment plate 1, and vibration or rocking is applied to the whole stacked plates. By the addition of this vibration or swing, the chip component P on the first component alignment plate 1 is dropped into the component alignment hole 1a with the largest surface Pa facing downward.

Here, since the shape of the component alignment hole 1a is matched with the largest surface Pa of the chip component P, and the lower end opening is closed to make the hole depth shallower in accordance with the thickness L3 of the chip component P. Even when the chip component P is inserted with the other surface facing downward, it can be largely projected from the upper end opening of the component alignment hole 1a and can be repelled by the moving other chip component P, and thereby into the through alignment hole 1a. It is possible to efficiently drop the chip component P of 1 with high probability.

Next, as shown in FIGS. 5B and 5C, the first component alignment plate 1 is slowly slid in the lateral direction of the through alignment hole 1a (width direction of the chip component P), The chip component P is carried on the through-alignment hole 2a of the second component alignment plate 2. By this slide operation, the chip component P
When the barycentric point of is approaching the inside of the edge of the through-alignment hole 2a (the edge of the guide surface) (see FIG. 5B), the chip component P gradually begins to tilt clockwise in the figure, and thereafter The inclination increases with the slide amount (see FIG. 5C),
Eventually, the chip component P is dropped into the component alignment hole 2a with the second largest surface Pb facing downward.

As shown in FIG. 5 (d), when the through alignment hole 1a of the first component alignment plate 1 is aligned with the through alignment hole 2a of the second component alignment plate 2 by the above sliding operation, the chip With the second largest surface Pb of the component P facing downward, the component holding plate 3 is passed through the component aligning hole 2a.
Is dropped into the component holding hole 3a. That is, the chip component P that was in the component alignment hole 1a of the first component alignment plate 1 is dropped into the component holding hole 3a with its orientation changed by 90 degrees.

Next, as shown in FIG. 5E, the first component aligning plate 1 and the second component aligning plate 2 are lifted together directly above and removed from the component holding plate 3. As a result, FIG.
As shown in (f), the chip component P is a component with the second largest surface Pb facing downward, that is, with one end in the width direction inserted into the component holding hole 3a and the other part exposed to the outside. It will be held by the holding plate 3.

Next, as shown in FIG. 6A, an electrode paste Dp is attached to one surface of the exposed end surface (second largest surface Pb) of the chip component P held by the component holding plate 3. The coating plate 4 is pressed together, and the electrode paste Dp is attached to the exposed end surface and its peripheral portion. Of course, as shown in FIG. 6B, the exposed end surface of the chip component P held by the component holding plate 3 (the second largest surface Pb).
The electrode paste Dp may be attached to the exposed end face and its peripheral portion by continuously moving the electrode paste Dp while contacting the paste applying roller 5 attached to the peripheral face thereof. After the paste is attached, the chip component P together with the component holding plate is put into a heating furnace (not shown) to dry the attached paste Dp.

When the electrode paste Dp is attached to one surface of the paste application plate 4 or the peripheral surface of the paste application roller 5 in a larger area than the exposed end surface of the chip component P, the case shown in FIG.
As shown in (a), the electrode paste Dp is a chip component P.
Will be attached to the second largest surface Pb and its peripheral portion, but when the electrode paste Dp is attached to these surfaces in an area smaller than the exposed end surface of the chip component P, or from the exposed end surface of the chip component P. When a paste applying roller having a small width is used, as shown in FIG. 7B, the electrode paste D is partially formed on the exposed end surface of the chip part P.
It is also possible to attach p.

As described above, according to the above-described embodiment, the chip components P having a rectangular parallelepiped shape are held on the component holding plate 1 with the second largest surface Pb facing downward and aligned so that their directions are the same. This makes it possible to control the attitude, which has heretofore been impossible, and makes the subsequent handling of the chip component P extremely easy.

Further, two of the chip parts P having a rectangular parallelepiped shape are provided.
Since the external electrode can be formed on the second largest surface Pb and the chip component P can be held on the component holding plate 3 in the same posture, it is extremely useful even when the external electrode is partially formed on the same surface Pb. .

Furthermore, since the desired parts can be aligned by adding vibrations or swings as in the conventional case, there is no trouble of arranging one chip part individually by using a robot or the like, and 100 or 1000 pieces can be arranged. The chip components can be collectively arranged and paste can be attached in units, which can contribute to cost reduction and work efficiency.

In the above embodiment, the guide alignment surface is provided by chamfering at the upper end openings of the through alignment holes of the first component alignment plate and the through alignment holes of the second component alignment plate. The guide surface 1b 'may be provided by R as shown in FIG.

In the above embodiment, the chip component P has the length L1, the width L2, and the thickness L3 having the relationship of L1>L2> L3. However, the width L2 and the thickness L3 are L2 = L3. The present invention can also be applied to related chip components.

Further, in the above embodiment, the case where the rectangular parallelepiped chip parts are aligned with the second largest surface facing downward has been exemplified, but the structure shown in FIGS. 9A to 9C, that is, The first component alignment plate 11 having the through hole aligning holes 11a in the shape of square holes corresponding to the largest surface Pa of the chip component P, and the through hole aligning holes 12a in the shape of square holes corresponding to the smallest surface Pc of the chip component P are provided. By using the second component alignment plate 12 and the component holding plate 13 having the bottomed holding holes 13a having the same shape as the through alignment holes 12a of the second component alignment plate 12, the first component alignment plate 11 slides. By only setting the direction to be the longitudinal direction of the through-alignment hole 11a, the chip components P are aligned with the smallest surface Pc facing downward and in the same direction as shown in FIG. Hold it on plate 13 It is possible.

[0038]

As described above in detail, according to the method of forming an external electrode of an electronic component of the present invention, it becomes possible to form an external electrode on a desired surface of a chip component having a rectangular parallelepiped shape, and the chip component is formed. Since it can be held on the component holding plate in the same posture, it is extremely useful when the external electrodes are partially formed on the same surface.

According to the electronic component aligning apparatus of the present invention,
With the chip surface forming a rectangular parallelepiped, turn the desired surface downward,
In addition, they can be aligned and held by the component holding plate so that their orientations are the same, and it is possible to control the attitude, which has heretofore been impossible, and extremely easily handle the chip components thereafter.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of essential parts of a component alignment device showing an embodiment of the present invention.

FIG. 2 is a top view of essential parts of a first component alignment plate and a cross-sectional view taken along line bb thereof.

FIG. 3 is a top view of a main part of a second component alignment plate and a sectional view taken along the line bb thereof.

FIG. 4 is a top view of a main part of a component holding plate and a sectional view taken along the line bb thereof.

FIG. 5 is a diagram showing a method of aligning parts.

FIG. 6 is a diagram showing a paste attaching method.

FIG. 7 is a diagram showing a paste adhesion state.

FIG. 8 is a diagram showing another example of the shape of the guide surface.

FIG. 9 is a top view of a main part of a parts aligning device showing another embodiment of the present invention and a perspective view showing a part holding state.

FIG. 10 is an exploded perspective view of essential parts of a component aligning device showing a conventional example.

FIG. 11 is a diagram showing a component alignment method.

FIG. 12 is a perspective view showing a component holding state and a paste adhering state.

[Explanation of symbols]

P ... Chip component, Pa ... Largest surface, Pb ... Second largest surface, Pc ... Smallest surface, 1 ... First component alignment plate, 1a ... Through alignment hole, 1b, 1b '... Guide surface, 2 ...
Second component alignment plate, 2a ... Through alignment hole, 2b ... Guide surface, 3 ... Component holding plate, 3a ... Bottom holding hole, Dp ... Electrode paste.

Claims (4)

[Claims] 1. An electronic device in which a rectangular parallelepiped chip component is aligned and held on a component holding plate in a predetermined posture, and an electrode paste is attached to an exposed portion of the chip component held by the component holding plate to form an external electrode. In the method of forming an external electrode of a component, a first component alignment plate having a through-hole alignment hole having a square hole shape corresponding to the largest surface of the chip component, and a square hole shape corresponding to a surface adjacent to the largest surface of the chip component. And a component holding plate having a bottomed holding hole having the same shape as the through alignment hole of the second component alignment plate, and the second component alignment plate having the through alignment hole of The component alignment plates are overlapped so that the through alignment holes are aligned with the component holding holes, and the first component alignment plate is placed on the second component alignment plate so that the lower end opening of the through alignment holes is the second component alignment. In a state where they are stacked so that they are blocked by a board, The chip part into the through alignment hole of the first component aligning plate with the large surface facing downward, and then the through aligning hole of the first component aligning plate matches the through aligning hole of the second component aligning plate. As described above, by sliding the first component aligning plate and placing the chip component into the through alignment hole of the second component aligning plate and the bottomed holding hole of the component holding plate with the surface adjacent to the largest surface facing downward, A rectangular parallelepiped chip component is aligned and held in a bottomed holding hole of a component holding plate in a predetermined posture, and an electrode paste is attached to an exposed portion of the chip component held by the component holding plate. Method for forming external electrode of electronic component. 2. An electronic component aligning device for aligning and holding a rectangular parallelepiped chip component on a component holding plate in a predetermined posture, comprising an angular hole-shaped through alignment hole corresponding to the largest surface of the chip component. No. 1 component alignment plate, a second component alignment plate having a square hole-shaped through alignment hole corresponding to the surface adjacent to the largest surface of the chip component, and the same shape as the through alignment hole of the second component alignment plate. A component holding plate having a bottomed holding hole, and a second component aligning plate is superposed on the component holding plate so that the penetrating aligning hole is aligned with the component holding hole. The first component aligning plate on the top of the first component aligning plate so that the lower end opening of the through aligning hole is closed by the second component aligning plate, and the chip component is the first component with the largest surface facing downward. Drop it into the through-alignment hole of the alignment plate, then the first part The first component alignment plate is slid so that the through alignment holes of the row plate match the through alignment holes of the second component alignment plate, and the surface adjacent to the largest surface faces downward, so that the chip component becomes the second component. An electronic device characterized in that a rectangular parallelepiped chip component is aligned and held in a bottomed holding hole of the component holding plate in a predetermined posture by being dropped into the through-hole alignment hole of the alignment plate and the bottomed holding hole of the component holding plate. Parts alignment device. 3. The depth of the through alignment hole of the first component alignment plate is made to match the dimension between the largest surfaces of the chip component, and the depth of the through alignment hole of the second component alignment plate is adjusted to the depth of the chip component. 3. The electronic component aligning device according to claim 2, wherein the dimension between the faces adjacent to the largest face is matched. 4. A guide surface for facilitating dropping of chip components is provided at upper end openings of the through alignment holes of the first component alignment plate and the through alignment holes of the second component alignment plate. The electronic component aligning device according to claim 2 or 3, which is characterized in that.