JPH07201653A - Production of multilayer electronic device - Google Patents

Abstract

PURPOSE:To provide a method for producing a multilayer electronic device in which the via part and the end face part of outer electrode can be formed collectively for a large number of bases of device. CONSTITUTION:The via electrode part 5a of an outer electrode 5 is formed on a laminate block 2 prior to formation of each base of device. Consequently, the via electrode pars 5a can be printed collectively for each base of device 3 by screen printing, for example.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component, for example, a laminated inductor, a laminated transformer, a laminated capacitor, an LC composite laminated electronic component having a laminated inductor and a capacitor, and an electronic component having external electrodes formed on the outer surface thereof. The present invention relates to a manufacturing method of.

[0002]

2. Description of the Related Art Conventionally, a manufacturing method shown in FIGS. 10 to 14 is known as a method of manufacturing a laminated electronic component of this type.

In this manufacturing method, as shown in FIG. 10, first, a large number of, for example, ceramic green sheets 1 on which a large number of conductive patterns for inductors, conductive patterns for capacitors, etc. are formed are laminated and fixed. The laminated block 2 having a square shape shown in FIG.

Next, the laminated body block 2 is cut into corresponding conductive patterns to form a plurality of component bases 3 as shown by the one-dot chain line arrow in FIG.
To bake.

External electrodes are formed on the component substrate 3 thus fired, for example, by the following two methods.

First, the method shown in FIG. 12 (Japanese Patent Application Laid-Open No. 2-33)
No. 908) uses an elastic transfer body 4 having a concave groove 4a and presses the end face of the component base 3 toward the electrode paste 4b filled in the groove 4a as shown by the solid arrow.
As a result, the electrode paste 4b is transferred to the component base 3, and as shown in FIG.
The wraparound electrode portion 5a of the external electrode 5 is formed on b, and the end surface electrode portion 5b of the external electrode 5 is formed on the end surface 3c of the component base 3.

On the other hand, the method shown in FIG. 13 (Japanese Patent Laid-Open No. 3-62)
No. 917) uses a pressurizing tank 6 having a through slit 6a and pressurizes the electrode paste 6b filled in the pressurizing tank 6 as shown by an outlined arrow. The electrode paste 6a is applied to the jet component base 3. As a result, as in the method described above,
The external electrode 5 shown in FIG. 4 is formed.

[0008]

However, the above-mentioned 2
In each of the various manufacturing methods, the component base 3 is manufactured in advance, and thereafter, one electrode paste is transferred or applied to each component base 3, so that the productivity is low.

In view of the conventional problems described above, an object of the present invention is to provide a method of manufacturing a laminated electronic component in which a wraparound electrode portion and an end face electrode portion of an external electrode can be collectively formed on a large number of component bases. .

[0010]

In order to solve the above-mentioned problems, the present invention provides a laminated body block in which a plurality of green sheets having a plurality of conductive patterns are laminated to form a laminated body block. In the method for manufacturing a laminated electronic component in which the laminate block is cut into corresponding component conductive patterns to form a plurality of component bases, at least one surface of the laminate block surrounds the external electrodes for the component bases. It is characterized in that an electrode portion is formed, and thereafter, the laminated body block is cut into corresponding conductive patterns.

According to a second aspect of the present invention, a plurality of green sheets having a plurality of conductive patterns are laminated to form a laminated body block, and thereafter the laminated body block is cut into corresponding conductive patterns to form a plurality of laminated sheets. In the method of manufacturing a laminated electronic component for forming individual component bases, the wrap-around electrode portion of the external electrode for each component base is formed on a predetermined green sheet, and then the green sheets are laminated. .

The invention of claim 3 is the same as claim 1 and claim 2.
In the method for manufacturing a laminated electronic component according to, the respective component bases on which the wraparound electrode portions of the external electrodes are formed are collectively aligned, and then the end face electrode portions of the external electrodes are formed on the end faces of the respective component bases. Characterize.

[0013]

According to the invention of claim 1, since the wrap-around electrode portion of the external electrode is formed in the laminated body block before forming each component base, the wrap-around electrode portion is collectively printed on each component base by screen printing or the like. Then you can print.

According to the second aspect of the present invention, since the wraparound electrode portion of the external electrode is formed at the stage of the green sheet before forming the laminated body block, the wraparound electrode portion is also formed on each component base by screen printing or the like. You can print all at once.

According to the third aspect of the present invention, the end faces of the respective component bases can be arranged flush with each other by collectively aligning the respective component bases. Therefore, the end face electrode portions of the external electrodes are formed on the respective component bases by screen printing or the like. You can print all at once.

[0016]

1 to 6 show a first embodiment of a method for manufacturing a laminated electronic component according to the present invention. FIG. 1 is a perspective view showing a printing process of a wraparound electrode portion of an external electrode, and FIG. FIG. 3 is a perspective view showing a cutting process of the printed laminated body block, FIG. 3 is a perspective view showing a collective alignment process of each component base, FIG. 4 is a perspective view showing a printing process of an end face electrode portion of an external electrode, and FIG. FIG. 6 is a perspective view showing a state in which an end face electrode portion of an electrode is printed on a component base, and FIG. 6 is a perspective view showing a laminated electronic component on which external electrodes are printed. The same components as those of the conventional example are represented by the same reference numerals.

In manufacturing this laminated electronic component, FIG.
Similarly to the conventional example shown in FIG. 1, first, a large number of, for example, ceramic green sheets 1 on which a large number of conductive patterns for inductors and conductive patterns for capacitors are formed are laminated and adhered to each other. Form the body block 2. The conductive pattern (not shown) printed on each green sheet 1 is a well-known one, and the conductive pattern of each layer is formed by each through hole (not shown) formed in each sheet 1 described later. They are connected in the upper and lower sides to form an inductor and the like.

After the laminated body block 2 is formed, the laminated body block 2 is subjected to thick film printing, for example, screen printing.
The wraparound electrode portion 5a of the external electrode 5 is printed on the front surface and the back surface of the. For this screen printing, for example, a mask screen 7 having a large number of square holes 7a as shown in FIG. 1 is prepared. The square holes 7a of the mask screen 7 are arranged so as to correspond to the extraction electrode portions (electrodes (not shown) connected to the external electrodes 5) of the conductive patterns, and the electrode paste is printed through the square holes 7a of the mask screen 7. . In this embodiment, as shown in FIG. 2, the wraparound electrode portion 5a of the external electrode 5 is printed over the adjacent conductive patterns, and the wraparound electrode portion 5a at two locations is formed by one square hole 7a. Is forming.

When the printing process of the wraparound electrode portion 5a is completed, the cutting process shown in FIG. 2 is started. In this cutting step, each conductive pattern is cut lengthwise and breadthwise as shown by the one-dot chain line arrow to form a rectangular component base 3. In this cutting step, since the wraparound electrode portion 5a of the external electrode 5 is printed across the adjacent conductive pattern, when cutting the wraparound electrode portion 5a so as to cross the wraparound electrode portion 5a, the surface 3a and the back surface of the component base 3 are cut. Electrode part 5 wraps around 3b
The component base 3 on which a is printed is formed.

The component base 3 formed in this cutting step is a raw chip that has not been fired yet and is easily deformed. Therefore, this is fired in, for example, a belt furnace to solidify the component base 3.

When this firing process is completed, as shown in FIG. 3, the respective component bases 3 are collectively arranged on a mounting plate frame 8 having a rectangular shape, for example, in which a predetermined number of component bases 3 are inserted. When the component base 3 is aligned, the component base 3 is erected so that the front surface 3a and the back surface 3b of the component base 3 are vertical, and further, the wraparound electrode portions 5a of the external electrodes 5 formed on the component base 3 are positioned vertically. To arrange. As a result, the edges of the wraparound electrode portions 5a extending to the end faces of the component bases 3 are linearly arranged between the component bases 3 adjacent to each other in the thickness direction.

When the work of arranging the component bases 3 is completed, the end face electrode portions 5b of the external electrodes 5 are formed on the upper and lower end faces 3c of the component bases 3 by the thin film printing method. As the thin film printing method, for example, a vacuum sputtering method is used. For this sputtering, the mask 9 shown in FIG.
To use. The mask 9 has elongated holes 9a formed in the same width dimension as the wrap-around electrode portions 5a of the external electrodes 5 aligned in the assembly and alignment step so as to correspond to each component arrangement. To form a Cr thin film and a Ni thin film. Thereby, as shown in FIG. 5, the end face electrode portion 5b of the external electrode 5 is collectively formed on the end face 3c of the component base 3.

When the film forming process of the end face electrode portion 5b is completed, each component base 3 is removed from the mounting plate frame 8 and the external electrode 5 is sequentially plated with a Ni film and a solder film. As a result, the laminated electronic component 10 shown in FIG. 6 is manufactured.

As described above, according to this embodiment, since the wrap-around electrode portion 5a of the external electrode 5 is screen-printed on the laminated body block 2 before being separated into the component base material 3, it is formed thereafter. The wraparound electrode part 5 in the component base 3
a is printed collectively.

Further, when forming the end face electrode portion 5b of the external electrode 5, since the respective component bases 3 are collectively aligned and subjected to vacuum sputtering or the like, the end face electrode portion 5b is formed by the respective end face electrode portions 3b.
Are collectively formed.

As described above, since the wrap-around electrode portion 5a and the end face electrode portion 5b of the external electrode 5 of the laminated electronic component 10 are collectively formed, the productivity of the laminated electronic component 10 is improved.

7 and 8 show a second embodiment of the method for manufacturing a laminated electronic component according to the present invention. FIG. 7 shows a component base placed on a mounting plate frame according to the second embodiment. FIG. 8 is a sectional view showing a state, and FIG. 8 is an enlarged sectional view showing an essential part of the second embodiment.

In the first embodiment, the end face electrode portions 5b of the external electrodes 5 are collectively formed on a large number of component bases 3. The end face electrode portions 5b extend over the entire front and rear component bases 3. Therefore, after that, it is necessary to separate each of the component materials 3 one by one to separate them. In this separation work, there is no problem when the separation position of the end face electrode portion 5b is in the center between the adjacent component bases 3, but it is expected that the separation position will be closer to one end face electrode portion 5b side. In such a case, a defective laminated electronic component 10 may be manufactured.

The second embodiment focuses on such a problem,
The point is that the mounting plate frame 8 is improved so that the end face electrode portions 5b are formed separately from each other between the component bases 3.

That is, the mounting plate frame 8'according to the second embodiment is provided with the projections 8a on the bottom surface thereof, and the adjacent component bases 3 are arranged separately. As a result, as shown in FIG. 8, the end face electrode portion 5b formed on each component base 3 is formed separately, and the separation work after the film formation is not necessary.
A good end face electrode portion 5b is formed on each component base 3. The other configurations and operations are similar to those of the first embodiment.

FIG. 9 shows a third embodiment of the method for manufacturing a laminated electronic component according to the present invention. In the first embodiment, the wraparound electrode portion 5a of the external electrode 5 is screen-printed on the front surface and the back surface of the laminate block 2, but in the third embodiment, the wraparound electrode portion 5 is formed before the green sheet 1 is laminated.
a is formed.

That is, the wrap-around electrode portions 5a are printed by screen printing or the like on the green sheets 1a located above and below the laminated green sheets 1, and then the green sheets 1 are laminated. In this third embodiment as well, similar to the first embodiment, the wrap-around electrode portions 5a can be collectively formed. Other configurations and operations are similar to those of the first embodiment.

In the first to third embodiments, the wraparound electrode portion 5a of the external electrode 5 is formed on the front surface and the back surface of the laminated body block 2 or both of the upper and lower green sheets 1a. There is this laminated electronic component 1
0 on one side or one green sheet 1a in relation to a conductive pattern of a printed circuit board (not shown)
It may be printed on.

[0034]

As described above, according to the first aspect of the invention, since the wraparound electrode portion of the external electrode is formed in the laminated body block before forming each component base, the wraparound electrode portion is formed on the screen. Printing can be performed on each component substrate in a lump and the productivity of laminated electronic components is improved.

According to the second aspect of the invention, since the wraparound electrode portion of the external electrode is formed at the stage of the green sheet before forming the laminated body block, the wraparound electrode portion is also formed on each component base by screen printing or the like. It is possible to print all at once, improving the productivity of laminated electronic components.

According to the third aspect of the present invention, since the end faces of the respective component bases can be arranged flush with each other by collectively aligning the respective component bases, the wrap-around electrode portions of the external electrodes as well as the end face electrode portions are screen-printed or the like. With this, it is possible to collectively print on each component base, which improves the productivity of laminated electronic components.

[Brief description of drawings]

FIG. 1 is a perspective view showing a printing process of a wraparound electrode portion of an external electrode according to a first embodiment.

FIG. 2 is a perspective view showing a step of cutting the laminated body block according to the first embodiment.

FIG. 3 is a perspective view showing a step of assembling and arranging respective component bases according to the first embodiment.

FIG. 4 is a perspective view showing a printing process of an end face electrode portion of the external electrode according to the first embodiment.

FIG. 5 is a perspective view showing a component base on which end face electrode portions of external electrodes according to the first embodiment are printed.

FIG. 6 is a perspective view showing a laminated electronic component having external electrodes printed thereon according to the first embodiment.

FIG. 7 is a sectional view showing a mounting plate frame on which a component base according to a second embodiment is mounted.

FIG. 8 is an enlarged cross-sectional view showing the main parts of the second embodiment.

FIG. 9 is a perspective view showing a printed state of a wraparound electrode portion of an external electrode according to a third embodiment.

FIG. 10 is a perspective view showing a stacking process of green sheets.

FIG. 11 is a perspective view showing a cutting process of the laminated body block.

FIG. 12 is a front view showing an example of a conventional external electrode forming process.

FIG. 13 is a cross-sectional view showing another example of a conventional external electrode forming step.

FIG. 14 is a perspective view of a component base on which external electrodes are formed.

[Explanation of symbols]

1, 1a ... Green sheet, 2 ... Laminated block, 3 ...
Component base, 5 ... External electrode, 5a ... Wound electrode part, 5b
... end face electrode part, 10 ... laminated electronic component.

Claims (3)

[Claims] 1. A laminated body block is formed by laminating a plurality of green sheets having a plurality of conductive patterns formed thereon, and then the laminated body block is cut into corresponding conductive patterns to form a plurality of component bases. In the method for manufacturing a laminated electronic component to be formed, at least one surface of the laminated body block, a wrap-around electrode portion of the external electrode for each component base is formed, and then the laminated body block is cut into corresponding conductive patterns. A method of manufacturing a laminated electronic component, comprising: 2. A plurality of green sheets on which a plurality of conductive patterns are formed are laminated to form a laminated body block, and then the laminated body block is cut into corresponding conductive patterns to form a plurality of component bases. In the method for manufacturing a laminated electronic component to be formed, the wrap-around electrode portion of the external electrode for each component base is formed on a predetermined green sheet, and then the green sheets are laminated to produce a laminated electronic component. Method. 3. The component bases on which the wrap-around electrode portions of the external electrodes are formed are collectively aligned, and then the end face electrode portions of the external electrodes are formed on the end faces of the component bases. Item 1. A method for manufacturing a laminated electronic component according to claim 1 or 2.