JPH05144668A - Manufacture of multilayer ceramic electronic component - Google Patents

Abstract

PURPOSE:To prevent the generation of deformation and break of a green sheet independently of the thickness of the green sheet to be laminated when the green sheet is stuck on a frame, prevent the deterioration of precision due to sheet attack at the time of electrode printing, and improve lamination preci sion without position deviation of the green sheet. CONSTITUTION:A green sheet 1 formed on a carrier sheet 2 is cut together with the carrier sheet; the carrier sheet side is stuck on a metal frame; an electrode is printed on the green sheet; the green sheet is puched in a specified shape together with the carrier sheet; at the same time, a positioning hole 5 is punched at a position capable of engaging with the positioning pin 7 of a compression metal mold 6; the green sheet is positioned by using a hole and a pin. The carrier sheet is laminated on a ceramic sheet 8 for a cover use so as to make the green sheet face downward; the peeling of the upper side carrier sheet is repeated and the green sheet is laminated; thereon another sheet for a cover use is laminated and a laminate is formed by compression bonding.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a laminated ceramic capacitor,
The present invention relates to a method for manufacturing a laminated ceramic electronic component such as a laminated inductor and a laminated LC.

[0002]

2. Description of the Related Art Conventionally, there has been a method of manufacturing a monolithic ceramic electronic component such as a monolithic ceramic capacitor by a frame tension method. This frame-clad manufacturing method means that a ceramic green sheet made by applying and forming a slurry on a carrier sheet is peeled from the carrier sheet, cut into a predetermined size, and attached to a metal frame such as stainless steel. The method was a method of stacking the obtained green sheets by punching after printing the electrodes.

[0003]

However, according to the above-mentioned conventional frame tensioning method, since the green sheet attached to the frame is thin, the green sheet causes some distortion such as sag and wrinkles. For this reason, precision deviation is likely to occur during electrode printing, and the green sheet itself may sometimes break. Further, in recent years, the green sheets have been made even thinner as the multilayer ceramic electronic components such as multilayer ceramic capacitors have become smaller and have larger capacities. Since the thinner the green sheet is, the more likely it is that distortion will occur, handling has become extremely difficult in recent years, and the yield has decreased. Further, in the electrode printing, the thinner the green sheet is, the stronger the sheet attack by the electrode paste is, which causes a problem such as a decrease in pattern stacking accuracy.

The present invention solves the above-mentioned problems of the prior art, and regardless of the thickness of the green sheet, the green sheet attached to the frame can be easily handled without causing distortion and tear, and at the time of electrode printing. It is an object of the present invention to provide a method for manufacturing a monolithic ceramic electronic component such as a monolithic ceramic capacitor, which can prevent the precision from being deteriorated due to the sheet attack.

[0005]

Means for Solving the Problems The above-mentioned problems are from the step of cutting a ceramic green sheet formed on a carrier sheet into a predetermined size to the step of punching into a predetermined shape through a step of sticking to a frame and an electrode printing step. This has been solved by the development of the manufacturing method of the present invention, which is carried out without peeling the ceramic green sheet from the carrier sheet.

That is, in the present invention, first, the ceramic green sheet formed on the carrier sheet is cut out together with the carrier sheet into a predetermined size, and the carrier sheet side is attached to a metal frame with an appropriate adhesive. An electrode is printed on the ceramic green sheet located on the upper surface by sticking the carrier sheet side, and this is dried. Next, this green sheet is punched together with the carrier sheet into a predetermined shape, and at the same time, a positioning hole is punched at a position where it can be fitted into the positioning pin of the crimping die. On the other hand, a ceramic sheet for a cover is formed of a single or a plurality of green sheets so as to have a predetermined thickness, punched into a predetermined shape having the above-mentioned positioning hole, and a pin is inserted into the positioning hole. Is placed in the crimping die as the bottom layer. Similarly, the punched sheet body consisting of the green sheet and the carrier sheet is placed on the cover sheet already placed in the crimping die so that the pins are inserted into the positioning holes, with the carrier sheet side facing upward. Place them and crimp them. After pressure bonding, the carrier sheet is peeled off from the pressure-bonded sheet body. On the electrode-mounted green sheet that is peeled off the carrier sheet and appears on the surface, a sheet body manufactured in the same manner as above is laminated with the carrier sheet side as the upper surface so that the positioning holes enter the pins in the same manner. After pressure bonding, the carrier sheet is peeled off from the sheet body. This operation is repeated as many times as the number of laminated layers so that the layers are laminated in a desired structure, and then the cover green sheet is laminated as the uppermost layer to manufacture a laminated ceramic capacitor element body. In all the above-mentioned sheet arrangements, the positioning holes are accurately positioned by fitting the positioning holes into the positioning pins of the crimping die.

[0007]

In the manufacturing method of the present invention, the carrier green sheet formed on the carrier sheet is peeled off after the pressure bonding after lamination is completed. Therefore, no matter how thin the ceramic green sheet is, it is reinforced by the thick carrier sheet, and when it is attached to the frame, distortion such as sagging and wrinkles does not occur, and handling becomes easy. Further, at the time of electrode printing, the carrier sheet and the green sheet are in close contact with each other, so that the sheet attack is prevented. Furthermore, the deformation of the green sheet is suppressed by the reinforcement of the carrier sheet when pressure-bonded after lamination, and the positioning holes of the punched green sheet together with the carrier sheet are fitted to the positioning pins provided in the crimping die, Since the carrier sheet is peeled off after pressure bonding, there is no positional deviation of the sheet and the stacking accuracy is improved.

Since the positioning holes formed in the green sheet are used during the lamination and pressure bonding process of the green sheets, the positional deviation and the dimension deviation of the laminated body do not occur during the pressure bonding, and the positioning holes remain in the laminated body. ..

Hereinafter, the present invention will be described in more detail with reference to examples. However, the scope of the present invention is not limited by the following examples.

[0010]

Example 1 An example of a method for manufacturing a laminated ceramic capacitor of the laminated ceramic electronic components according to the present invention will be described with reference to FIGS. 1, 2, 3, 4 and Table 1.

FIG. 1 is an enlarged view of the vicinity of the positioning pin 7 of the crimping die 6 in the manufacturing process of the present invention. The ceramic green sheet 1 having internal electrodes printed on the cover ceramic green sheet 8 is shown in FIG. When laminating four layers, the lamination is performed by inserting the positioning holes 5 provided in the green sheet into the positioning pins 7 and peeling the carrier sheet 2 of the fourth green sheet. Is shown.

2 and 3 are perspective views showing stepwise a method of manufacturing a laminated ceramic capacitor according to the present invention.
(A) shows the state of a united sheet obtained by cutting the carrier sheet 2 coated with the ceramic green sheet 1 into a predetermined size, and (b) shows the frame 3 made of stainless steel. FIG. 3C shows a state in which the united sheet of FIG. 3A is attached to the frame 3 of FIG. 2B, and FIG.
The electrode 4 is printed on the surface of the green sheet 1 in (c). FIG. 3E shows a state in which the printed sheet body shown in FIG. 3D is punched out into a predetermined shape, and at the same time, the positioning hole 5 is punched out. FIG. 3F shows a state in which the cover ceramic green sheet arranged under the sheet body shown in FIG.

FIG. 4 is a side sectional view showing a laminated mode (A pattern) of the laminated ceramic capacitor manufactured in this embodiment.

In this embodiment, first, a ceramic green sheet 1 having a thickness of 10 to 11 μm is coated on a carrier sheet 2 having a thickness of 50 μm and cut into a size of 10 cm × 15 cm (see FIG. 2 ( a)). The sheet body consisting of the cut carrier sheet and the ceramic green sheet (Fig. 2 (a)) has an outer dimension of 14 cm x 20 cm and an inner dimension of 8 cm x 1.
The carrier sheet side was attached with an adhesive to a stainless steel frame 3 (Fig. 2 (b)) cut out to a size of 2 cm and a thickness of 1 mm (Fig. 2 (c)). Next, on the green sheet 1, 2 mm × 4 mm rectangular internal electrodes 4 were screen-printed using Pd paste at intervals of 1 mm in each length and width (FIG. 3D). After the printed internal electrodes 4 were dried, the sheet body attached to the frame was punched out together with the carrier sheet into a size of 7 cm × 10 cm (FIG. 3 (e)). At the same time, at the four corners 5 mm apart from each edge of the punched sheet,
A 3 mmφ positioning hole 5 was punched out. On the other hand, as a cover green sheet, a ceramic green sheet having a thickness of about 100 μm was manufactured in the same manner as above except that the electrode printing step was removed, and the 3 mmφ positioning pin 7 of the crimping die 6 was manufactured.
Positioning holes were integrated and arranged in (FIG. 3 (f)).
On this ceramic green sheet 8 for the cover sheet, the sheet body is placed with the positioning hole 5 provided on the sheet body with the carrier sheet side up, and the 3 mmφ positioning pin 7 of the crimping die 6 is fitted into the hole. Placed and lightly crimped. After pressure bonding, the uppermost carrier sheet 2 was peeled from the ceramic green sheet 1. On the ceramic green sheet 1 exposed on the surface by peeling the carrier sheet, a sheet body manufactured in the same manner as above is arranged and pressure-bonded in the same manner,
The carrier sheet on the top layer was peeled off. This was repeated to laminate 30 layers of electrode-mounted ceramic green sheets, and then another cover sheet similar to the above was placed as the uppermost layer and pressure-bonded to manufacture a laminated ceramic capacitor element body. In this example, a large number of laminated ceramic capacitor element bodies of pattern A shown in FIG. 4 were manufactured, and randomly selected 50 points out of them to measure the lamination accuracy of the pressure-bonded body before firing, and the most deviation ( The larger w) is shown in the column of Example 1 in Table 1.

As can be seen from Table 1, the method of the present invention significantly improved the stacking accuracy as compared with the method manufactured by the conventional method.

[0016]

Second Embodiment Another example of the method for manufacturing the laminated ceramic capacitor of the present invention will be described with reference to FIG. 5 and Table 1.

FIG. 5 is a side sectional view showing a laminated mode (Pattern B) of the laminated ceramic capacitor manufactured in this embodiment.

In this embodiment, when the sheet body and the positioning holes are punched by a punching machine, the internal electrodes formed on the adjacent sheets when stacked are punched so that they are displaced in one direction alternately. Was carried out in the same manner as in Example 1 except that the laminated ceramic capacitor having the B pattern shown in FIG. 5 was manufactured. In this example, a large number of B-patterned laminated ceramic capacitor element bodies were manufactured, and randomly selected 50 points out of them to measure the lamination accuracy of the pressure-bonded body before firing,
The one having the largest deviation (w) in one chip is shown in the column of Example 2 in Table 1.

As can be seen from Table 1, the method of the present invention significantly improved the stacking accuracy as compared with the method manufactured by the conventional method.

[0020]

Comparative Example 1 Table 1 shows a comparative example for comparison with the method for manufacturing a laminated ceramic capacitor of the present invention.

In this comparative example, a large number of laminated ceramic capacitor element bodies having the same pattern A as in Example 1 were manufactured by the conventional frame-stamping method, and 50 points were randomly selected from the laminated ceramic capacitor element bodies before firing. The stacking accuracy was measured, and the one with the largest deviation (w) in one chip is shown in the column of Comparative Example 1 in Table 1.

As can be seen from Table 1, in comparison with the method of the present invention, it was confirmed that the A-pattern laminated ceramic capacitor manufactured by the conventional method has a large lamination deviation of 10 μm or more.

[0023]

COMPARATIVE EXAMPLE 2 Another comparative example for comparison with the method for manufacturing a laminated ceramic capacitor of the present invention is shown in Table 1.

In this comparative example, a large number of laminated ceramic capacitor element bodies having the same B pattern as in Example 2 were manufactured by the conventional frame tensioning method, and 50 randomly selected points were selected from the crimped body before firing. The stacking accuracy was measured, and the one with the largest deviation (w) in one chip is shown in the column of Comparative Example 2 in Table 1.

As can be seen from Table 1, in comparison with the method of the present invention, it was confirmed that the B-patterned laminated ceramic capacitor manufactured by the conventional method has a lamination deviation about twice as large.

Although the multilayer capacitors have been described in the above embodiments, the present invention is not limited to this, and various multilayer ceramic electronic components such as multilayer inductors, multilayer LC filters, multilayer chip beads, multilayer piezoelectric elements, etc. Needless to say that it is widely available.

[0027]

[Table 1]

[0028]

As a result of the development of the method for manufacturing a laminated ceramic capacitor of the present invention, no matter how thin the ceramic green sheet is, when it is attached to the frame, distortion such as sagging and wrinkles does not occur, and handling becomes easy. Also, sheet attack at the time of printing electrodes is prevented. Furthermore, since the positioning of each sheet is performed by the holes provided in each sheet and the pins on the pressure bonding die, the accuracy of printing is improved, and in addition, the deformation of the green sheet due to pressure bonding can be suppressed, The stacking accuracy is improved.

[Brief description of drawings]

FIG. 1 is an enlarged perspective view of the vicinity of a positioning pin of a crimping die in a manufacturing process in the method of the present invention.

FIG. 2 is a first half (a) to (a) of the method for manufacturing a laminated ceramic capacitor according to the present invention, which is shown in six stages (a) to (f).
It is a perspective view showing the stage of (c).

FIG. 3 is a second half (d) to (f) of the above (a) to (f).
It is a perspective view showing the stage.

FIG. 4 is a side sectional view showing a laminated mode (A pattern) of the laminated ceramic capacitor manufactured in this example.

FIG. 5 is a side sectional view showing a stacking mode (B pattern) of the multilayer ceramic capacitor manufactured in this example.

[Explanation of symbols]

 1 Ceramic Green Sheet 2 Carrier Sheet 3 Stainless Steel Frame 4 Internal Electrodes 5 Positioning Holes 6 Crimping Mold 7 Positioning Pins 8 Ceramic Green Sheets for Cover w 1 Misalignment in Chip

[Figure 1]

[Fig. 2]

[Figure 3]

[Figure 4]

[Figure 5]

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[Procedure amendment]

[Submission date] February 4, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Brief description of the drawing

[Correction method] Change

[Correction content]

[Brief description of drawings]

FIG. 1 is an enlarged perspective view of the vicinity of a positioning pin of a crimping die in a manufacturing process in the method of the present invention.

FIG. 2 is a first half (a) to (a) of the method for manufacturing a laminated ceramic capacitor according to the present invention, which is shown in six stages (a) to (f).
It is a perspective view showing the stage of (c).

FIG. 3 is a second half (d) to (f) of the above (a) to (f).
It is a perspective view showing the stage.

FIG. 4 is a side sectional view showing a laminated mode (A pattern) of the laminated ceramic capacitor manufactured in this example.

FIG. 5 is a side sectional view showing a stacking mode (B pattern) of the multilayer ceramic capacitor manufactured in this example.

[Description of symbols] 1 ceramic green sheet 2 carrier sheet 3 stainless steel frame 4 internal electrode 5 positioning hole 6 crimping die 7 positioning pin 8 ceramic green sheet for cover w 1 misalignment within a chip

Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location H01G 4/40 321 9174-5E

Claims (5)

[Claims] 1. A lamination including a step of cutting a ceramic green sheet formed on a carrier sheet into a predetermined size, adhering it to a frame to print electrodes, punching it into a predetermined shape, and sequentially laminating the green sheets. In the method of manufacturing a ceramic electronic component, a ceramic green sheet formed on a carrier sheet is cut into a predetermined size together with the carrier sheet, the carrier sheet side is attached to a frame, an electrode is printed on the green sheet side, and the electrode is printed. A multilayer ceramic electronic component characterized in that the green sheet is punched together with the carrier sheet into a predetermined shape, laminated and pressure-bonded with the carrier sheet side as the upper surface, and the carrier sheet on the upper surface is repeatedly peeled to form a laminated body. Manufacturing method. 2. The method according to claim 1, wherein the monolithic ceramic electronic component is a monolithic ceramic capacitor. 3. A lamination including a step of cutting a ceramic green sheet formed on a carrier sheet into a predetermined size, adhering it to a frame to print electrodes, punching it into a predetermined shape and sequentially laminating the green sheets. In the method of manufacturing a ceramic electronic component, a ceramic green sheet formed on a carrier sheet is cut into a predetermined size together with the carrier sheet, the carrier sheet side is attached to a frame, an electrode is printed on the green sheet side, and the electrode is printed. And the green sheet is punched together with the carrier sheet into a predetermined shape, and at the time of punching, at least two or more positioning holes are simultaneously formed while the ceramic green sheet supported by the carrier sheet and the carrier sheet are integrally formed. Place these holes on the positioning pins on the mold. Laminated ceramics characterized in that a green sheet is laminated together with a carrier sheet, and at that time, the carrier sheet side is made an upper surface, laminated and pressure-bonded, and then the upper surface carrier sheet is repeatedly peeled to form a laminated body. Manufacturing method of electronic parts. 4. The method according to claim 3, wherein the positioning holes are provided at four corners of the green sheet, and the green holes are laminated to form positioning holes in the laminate. 5. The method according to claim 3, wherein the monolithic ceramic electronic component is a monolithic capacitor.