JPH06251971A - Manufacture of laminated ceramic electronic component - Google Patents

Abstract

PURPOSE:To provide a method of manufacturing a laminated ceramic electronic part which is free from inner deformation and laminar deviation and wherein inner conductors are surely restrained from being disconnected. CONSTITUTION:A through-hole 4 200mum in diameter is die-cut in a ceramic green sheet 1 60mum thick and 100mm square through a die method by the use of a pin die, and then a U-shaped coil conductor pattern 3 is printed on the ceramic green sheet 1 so as to enable its one end overlap the through-hole 4. On the other hand, a blankout 2 of the same shape with the coil conductor pattern 3 is provided to another ceramic green sheet 1 20mum thick and of the same size with the former sheet 1 at a position correspondent to that of the coil conductor pattern 3 by a laser equipment. Then, these sheets 1 are laminated as shown in a figure to form a laminate. The laminate is bonded together by compression and cut into a laminate of prescribed size, the laminate is subjected to a debinder process by heating and then a burning process, and then an outer electrode is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a monolithic ceramic electronic component, and more specifically, even when manufactured using a thin ceramic sheet, internal strain, misalignment, disconnection of internal conductors, etc. The present invention relates to a method for manufacturing a monolithic ceramic electronic component that is less likely to generate.

[0002]

2. Description of the Related Art Conventionally, multilayer ceramic capacitors,
Multilayer ceramic inductor, multilayer noise elimination filter,
Alternatively, a laminated ceramic electronic component such as a multilayer printed circuit board has been manufactured by laminating ceramic green sheets having an internal conductor pattern in a predetermined configuration.

In recent years, miniaturization of such electronic components has progressed, and along with this, the thickness of the ceramic green sheet has become thinner, and the thickness of the ceramic green sheet can be as high as 10 μm after baking. On the other hand, the internal conductor pattern printed by the screen printing method on the ceramic green sheet has a limit in reducing the film thickness in consideration of electrical characteristics such as resistance value and allowable current. The film thickness was often maintained.

As described above, when the thickness of the ceramic green sheet constituting the laminated ceramic electronic component and the thickness of the internal conductor pattern printed on the sheet become substantially equal to each other, the laminate obtained by laminating these sheets is obtained. The body is laminated in such a manner that the green sheet adjacent to the internal conductor pattern is not in contact with the green sheet adjacent to the internal conductor pattern-unformed portion. When pressure is applied (pressed) from above and below to the laminated body of such an aspect,
Since the pressure is concentrated only on the internal conductor pattern forming portion, there is a problem that a portion where the internal conductor patterns are overlapped is deformed to cause internal strain, resulting in stacking deviation.

Therefore, according to the conventional technique, after the internal conductor pattern is printed on the ceramic green sheet, a ceramic paste having the same composition as that of the ceramic green sheet is screen-printed on a portion of the sheet on which the internal conductor pattern is not formed. By making the heights of the internal conductor pattern formation part and the internal conductor pattern non-formation part almost equal to reduce the step between both parts, the pressure applied during crimping is dispersed and internal distortion and stacking deviation occur. I was trying to prevent it.

[0006]

However, according to the above-mentioned conventional method, the ceramic paste is applied onto the green sheet by screen printing, and the stencil used in the screen printing is repeatedly used. However, there is a problem in that the printing accuracy is deteriorated due to the elongation. In other words, on the ceramic green sheet, generally several thousand electronic components are simultaneously formed, so several tens of patterns are formed on the screen printing stencil, but when this stencil stretches, There is a positional deviation between the pattern formed in the central portion of the stencil and the pattern formed in the peripheral portion.

As described above, when the ceramic paste is printed by the stencil in which the pattern arrangement position is displaced, the ceramic paste is printed even on the internal conductor pattern portion and the through hole portion, so that the through hole connection at the time of stacking is performed. There was a case where it was not performed sufficiently, and the overlap of the inner conductor was shifted.

Therefore, the present invention provides a method for manufacturing a monolithic ceramic electronic component which solves the above-mentioned problems of the conventional techniques and can surely suppress the occurrence of internal strain and lamination deviation and the disconnection of the internal conductor. With the goal.

[0009]

Means for Solving the Problems As a result of earnest studies for achieving the above-mentioned object, the inventors of the present invention have found that a punched portion having the same thickness as the internal conductor pattern and the same shape as the internal conductor pattern is formed. The inventors have found that the above-mentioned problems can be solved by laying the formed ceramic green sheet on a portion of the ceramic green sheet on which the internal conductor pattern is not formed, in which the internal conductor pattern is not formed, and arrived at the present invention.

That is, the present invention is a method of manufacturing a laminated ceramic electronic component in which a ceramic green sheet having an internal conductor pattern formed thereon is laminated and pressure-bonded and fired to form a laminated body. A ceramic green sheet having the same shape as this portion and having the same thickness as the internal conductor pattern is laid on the portion of the ceramic green sheet where the internal conductor pattern is not formed. It is a thing.

Further, in the method of the present invention, a portion corresponding to the internal conductor pattern is punched with a laser into the internal conductor pattern shape in a portion where the internal conductor pattern is not formed in all the ceramic green sheets on which the internal conductor pattern is formed, A mask having an opening with a shape similar to the internal conductor pattern was brought into contact with the ceramic green sheet, and high-pressure fluid was jetted from the mask side to punch the ceramic green sheet located under the mask opening into the internal conductor pattern shape. It is advisable to stack ceramic green sheets having the same shape as the portion where the internal conductor pattern is not formed.

[0012]

According to the method for producing a laminated ceramic electronic component of the present invention, among the ceramic green sheets forming the laminated body, this portion is formed in the portions where the internal conductor patterns are not formed in all the ceramic green sheets in which the internal conductor patterns are formed. Ceramic green sheets having the same shape and the same thickness as the internal conductor pattern are stacked.

In this way, by stacking the ceramic green sheet having the same thickness as the internal conductor pattern on the internal conductor pattern non-formed portion of the ceramic green sheet on which the internal conductor pattern is formed, Since the height is the same as that of the conductor pattern non-formed part, the pressure applied in the stacking direction during pressure bonding is dispersed (it will not be concentrated in the part where the internal conductor pattern is formed), and internal distortion and stacking deviation occur. Will be prevented.

Further, in the method of the present invention, a ceramic green sheet having the same shape as the portion where the internal conductor pattern is not formed is formed by punching the portion corresponding to the internal conductor pattern into the internal conductor pattern shape by laser processing. , Or by abutting a mask having an opening of the same shape as the internal conductor pattern on the ceramic green sheet and ejecting a high-pressure fluid from the mask side to punch the ceramic green sheet located under the mask opening into the internal conductor pattern shape. Is forming.

As described above, according to the method of the present invention, the sheet to be overlaid on the internal conductor pattern non-formed portion can be formed without using the stencil for screen printing as in the conventional method, and therefore there is no deterioration due to continuous use. As a result, disconnection of the internal conductor and stacking deviation due to this can be prevented.

Hereinafter, the present invention will be described in more detail with reference to Examples. However, the scope of the present invention is not limited by the following examples.

[0017]

Example 1 An example of a method for manufacturing a laminated inductor according to the present invention will be described below.

First, the thickness 60 cut into a 100 mm square size.
Two types of ceramic green sheets 1 having a thickness of 20 μm and a thickness of 20 μm were prepared. By the way, from the laminated body composed of sheets of the above size, for example, the baked size is 3.2 mm.
× It is possible to manufacture 820 1.6mm laminated inductors.

Then, by a die method using a pin die,
After punching a 200 μmφ through hole 4 at a predetermined position in the ceramic green sheet 1 having a thickness of 60 μm, a U-shaped coil conductor pattern 3 is printed so that one end of the through hole 4 is covered with the through hole 4. . on the other hand,
On the ceramic green sheet 1 having a thickness of 20 μm, a punched portion 2 having the same shape as the coil conductor pattern 3 was formed in a portion corresponding to the coil conductor pattern 3 by laser processing.

Next, using these sheets, a structure as shown in FIG. 1, that is, first, a ceramic green sheet 1 (dummy sheet) having a thickness of 60 μm in which the coil conductor pattern 3 and the punched portion 2 are not formed is formed. After laminating four layers on a laminating stand (not shown) of the laminating apparatus (constructing a cover sheet), laminating a ceramic green sheet 1 having a coil conductor pattern 3 formed thereon, The operation of stacking the ceramic green sheet 1 having the punched portion 2 of the same shape with the coil conductor pattern 3 protruding in the punched portion 2 is repeated a predetermined number of times, and five layers of dummy sheets are stacked thereon. (Constructing the cover sheet) and the laminated body. Note that FIG. 1 shows an exploded perspective view of a laminated body that constitutes one laminated inductor for easy understanding.

Next, the laminated body was pressure-bonded, cut into a predetermined size, subjected to a binder removal treatment by heating and a firing treatment, and then external terminal electrodes were formed to obtain a laminated ceramic inductor.

A plurality of monolithic ceramic inductors were manufactured as described above, 100 pieces were randomly picked from the pieces, and the pieces were cut to measure the lamination deviation of the internal conductor patterns. There was none.

[0023]

[Embodiment 2] Another example of the method for manufacturing a laminated inductor according to the present invention will be described below.

First, the thickness 60 cut into 100 mm square size
Two types of ceramic green sheets 1 having a thickness of 20 μm and a thickness of 20 μm were prepared. Then, a 200 μmφ through hole 4 is punched out at a predetermined position in the ceramic green sheet 1 having a thickness of 60 μm by a die method using a pin die, and then a U-shaped coil conductor pattern 3 is formed on one side of the through hole 4. The printing was performed so that the end portion was caught in the through hole 4.

On the other hand, a ceramic green sheet 1 having a thickness of 20 μm is provided with a vacuum device as shown in FIG. 2, that is, a top plate 7 having alignment pins 6 and openings 5 at predetermined positions.
Using the vacuum device that constitutes the vacuum chamber 8 in the box body 9 by suctioning from the bottom of the box body 9 by the vacuum pump 13, the punching section 2 was formed as follows.

First, the positioning pin 6 provided on the top plate 7 in the above vacuum apparatus has a recess having the shape of the ceramic green sheet 1, and the coil conductor pattern 3 is provided in this recess.
The metal foil B11 (FIG. 3) in which the opening 5 having the same shape as the above was formed was inserted. Next, the ceramic green sheet 1 having a thickness of 20 μm is placed in the concave portion of the metal foil B11, and then the alignment pin 6 is provided with the opening 5 similar to the metal foil B11 (FIG. 3). Was inserted and fixed. Next, as shown in FIG. 2, high-pressure compressed air is jetted from the metal foil A10 side by the nozzle 12, and the ceramic green sheet 1 located between the openings 5 of both metal foils is blown away to remove the punched portion 2. Formed (forming a punched portion on a green sheet by this method is extremely inexpensive and easy).

In forming the punched portion on the ceramic green sheet, a flat plate having a smooth surface is used in place of the metal foil B, and a ceramic formed on the base film between the flat plate and the metal foil A. It can also be formed by sandwiching the green sheet together with the base film (the green sheet and the metal foil A, and the base film and the flat plate) and then ejecting a fluid onto the metal foil A (this method is used). , Especially effective when forming a punched part in a thin green sheet). Also, as the above fluid, there is no problem even if other than air is used,
For example, gas, water, organic solvent, oil or the like can be used.

Next, using these sheets, a laminated body was constructed in the same manner as in Example 1, and after the laminated body was pressure-bonded,
Cut into a predetermined size, debinding by heating,
Firing treatment and external terminal electrode formation were performed to obtain a monolithic ceramic inductor.

A plurality of monolithic ceramic inductors were manufactured as described above (in the manufacturing, a metal foil after 10,000 times of use was used), and 100 pieces were randomly extracted from them and cut to form an internal conductor. As a result of measuring the layer displacement of the pattern, none of the layer displacement exceeded 10 μm.

[0030]

[Comparative Example] As a comparative example of the method of the present invention, an example of a conventional method for producing a monolithic ceramic inductor is shown below. A plurality of laminated ceramic electronic components were manufactured in the same manner as in Example 1 except that a ceramic paste having the same composition as the ceramic green sheet was screen-printed instead of the green sheet.
(A stencil was used after 10,000 times of use), and 100 pieces were randomly picked from the pieces and cut to measure the stacking deviation of the internal conductor pattern. As a result, there were 5 pieces showing a stacking deviation of more than 10 μm.

[0031]

As a result of the development of the method for producing a monolithic ceramic electronic component of the present invention, even when a ceramic sheet having a small thickness is used, the occurrence of internal strain, lamination deviation, disconnection of internal conductors, etc. is ensured. It came to be able to suppress it. Further, according to the method of the present invention, even when the ceramic green sheet is repeatedly processed, the processing accuracy does not deteriorate, so that it is effective in improving productivity and reliability.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a laminated body that constitutes a laminated inductor manufactured by an example of the method of the present invention.

FIG. 2 is a schematic cross-sectional view showing an example (using a vacuum device) of a method for forming a punched portion having a coil conductor pattern shape on a ceramic green sheet according to the method of the present invention.

FIG. 3 is a perspective view in which a metal foil A and a metal foil B in the vacuum device of FIG. 2 are extracted and enlarged.

[Explanation of symbols]

 1 Green sheet 2 Punched part 3 Coil conductor pattern 4 Through hole 5 Opening 6 Alignment pin 7 Top plate 8 Vacuum room 9 ... Box 10 ... Metal foil A 11 ... Metal foil B 12 ... Nozzle 13 ... Vacuum pump

Claims (3)

[Claims] 1. A method of manufacturing a laminated ceramic electronic component in which a ceramic green sheet having an internal conductor pattern formed thereon is laminated and pressure-bonded to form a laminated body, and all the ceramic green sheets having an internal conductor pattern are formed. A method for manufacturing a laminated ceramic electronic component, comprising: stacking a ceramic green sheet having a shape similar to that of the internal conductor pattern and having a thickness equal to that of the internal conductor pattern, on the portion where the internal conductor pattern is not formed. 2. An inner conductor pattern formed by punching a portion corresponding to the inner conductor pattern into a shape of the inner conductor pattern with a laser in a portion where the inner conductor pattern is not formed in all the ceramic green sheets on which the inner conductor pattern is formed. 2. The method for manufacturing a monolithic ceramic electronic component according to claim 1, wherein ceramic green sheets having the same shape as the forming portion are stacked. 3. A mask having an opening having a shape similar to that of the internal conductor pattern is brought into contact with the ceramic green sheet at a portion where the internal conductor pattern is not formed in all the ceramic green sheets on which the internal conductor pattern is formed,
The ceramic green sheet having the same shape as the internal conductor pattern-unformed portion formed by jetting a high-pressure fluid from the mask side to punch out the ceramic green sheet located under the mask opening into the internal conductor pattern shape. Manufacturing method of multilayer ceramic electronic component.