JP2019061954A - 照明モジュールおよびこれを備えた照明装置 - Google Patents
照明モジュールおよびこれを備えた照明装置 Download PDFInfo
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- JP2019061954A JP2019061954A JP2018175957A JP2018175957A JP2019061954A JP 2019061954 A JP2019061954 A JP 2019061954A JP 2018175957 A JP2018175957 A JP 2018175957A JP 2018175957 A JP2018175957 A JP 2018175957A JP 2019061954 A JP2019061954 A JP 2019061954A
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- layer
- diffusion layer
- resin layer
- light emitting
- light
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- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
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- F21—LIGHTING
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- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- H—ELECTRICITY
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
- F21S43/281—Materials thereof; Structures thereof; Properties thereof; Coatings thereof
- F21S43/28131—Structures comprising multiple layers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
- F21S43/281—Materials thereof; Structures thereof; Properties thereof; Coatings thereof
- F21S43/28135—Structures encapsulating the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- Electroluminescent Light Sources (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (20)
- 基板;
前記基板上にN列(Nは1以上の整数)に配置された複数の発光素子;
前記複数の発光素子を覆う第1レジン層;
前記第1レジン層上に配置されて前記第1レジン層から放出された光を拡散させる第1拡散層;および
前記第1拡散層上に配置され、前記第1拡散層から放出された光を拡散させる第2拡散層;を含み、
前記第1拡散層は、拡散剤を含み、
前記第2拡散層は、蛍光体を含み、
前記複数の発光素子の間の間隔は、前記第1レジン層の厚さと同じか、または大きく、
前記第2拡散層を介して外部に放出された光は、90%以上の光均一度を有する照明モジュール。 - 前記基板の下面と前記第2拡散層の上面との間の直線距離は、前記第1レジン層の厚さの220%以下であり、
前記第1拡散層の厚さは、前記第1レジン層の厚さの40%ないし80%の範囲であり、
前記第2拡散層の厚さは、前記第1拡散層の厚さの25%以下である、請求項1に記載の照明モジュール。 - 前記拡散剤のサイズは、前記発光素子から放出された光の波長より大きく、
前記拡散剤のサイズは、4μmないし6μmの範囲であり、
前記拡散剤の屈折率は、1.4ないし2の範囲である、請求項2に記載の照明モジュール。 - 前記蛍光体は、1μmないし100μmの範囲のサイズを有し、
前記蛍光体は、前記第2拡散層の樹脂材質に40wt%ないし60wt%の範囲を含む、請求項2または請求項3に記載の照明モジュール。 - 前記第1レジン層と前記第1拡散層は、同じ樹脂材質で形成され、
前記第2拡散層は、前記第1拡散層と異なる樹脂材質で形成される、請求項2ないし請求項4のうちいずれか一つの項に記載の照明モジュール。 - 前記第2拡散層の屈折率は、1.45ないし1.6の範囲であり、
前記発光素子は、青色光を発光し、
前記第2拡散層は、赤色光を放出し、
前記第2拡散層の表面カラーは、赤色系を含む、請求項5に記載の照明モジュール。 - 前記第2拡散層に添加された蛍光体の含有量は、前記第1拡散層に添加された拡散剤の含有量より5倍以上高く添加され、
前記第2拡散層は、前記第1拡散層の上面枠から前記基板の方向に延びた側面部を含む、請求項4ないし請求項6のうちいずれか一つの項に記載の照明モジュール。 - 基板;
前記基板上に複数の発光素子;
前記複数の発光素子をモールディングする第1レジン層;および
前記第1レジン層上にインク粒子を含む第2レジン層を含み、
前記第1レジン層および前記第2レジン層のうち少なくとも一つは、蛍光体を含む照明モジュール。 - 前記インク粒子の含有量は、前記蛍光体の含有量より小さい、請求項8に記載の照明モジュール。
- 前記蛍光体は、前記第2レジン層に配置され、
前記第2レジン層で前記蛍光体の含有量は、12wt%ないし23wt%の範囲であり、
前記第2レジン層で前記インク粒子の含有量は、3wt%ないし13wt%の範囲を含む、請求項9に記載の照明モジュール。 - 前記蛍光体は、前記第2レジン層に配置されて前記発光素子から離隔し、
前記第2レジン層の厚さは、前記第1レジン層の厚さより薄い、請求項9または請求項10に記載の照明モジュール。 - 前記蛍光体は、前記発光素子から放出された光の波長より長波長の光を発光し、
前記インク粒子は、前記蛍光体と同じカラー系を有する、請求項11に記載の照明モジュール。 - 前記蛍光体から発光された波長と前記インク粒子は、同じ赤色カラーを含み、
前記発光素子は、420nmないし470nmの範囲の波長を発光する、請求項11または請求項12に記載の照明モジュール。 - 前記基板の下面と前記第2レジン層の上面との間の直線距離は、前記第1レジン層の厚さの220%以下であり、
前記第2レジン層の厚さは、前記第1レジン層の厚さの40%ないし80%の範囲を含む、請求項11ないし請求項13のうちいずれか一つの項に記載の照明モジュール。 - 前記第2レジン層は、前記第1レジン層の側面に延びた側面部を含み、
前記第2レジン層の側面部は、前記基板に接触して前記蛍光体と前記インク粒子とを含む、請求項11ないし請求項14のうちいずれか一つの項に記載の照明モジュール。 - 前記第1レジン層は、拡散剤を含み、
前記拡散剤は、4μmないし6μmの範囲であり、
前記拡散剤は、屈折率が1.4ないし2の範囲である、請求項8ないし請求項15のうちいずれか一つの項に記載の照明モジュール。 - 前記第1および第2レジン層の間に前記発光素子と垂直方向に重なった遮光部を含む、請求項8ないし請求項16のうちいずれか一つの項に記載の照明モジュール。
- 前記第2レジン層の表面は、赤色であり、
前記第2レジン層の表面での彩度は、前記第2レジン層を介して放出された光の彩度より低い、請求項8ないし請求項17のうちいずれか一つの項に記載の照明モジュール。 - 前記発光素子は、
透光性基板;
前記透光性基板の下に第1導電型半導体層、活性層および第2導電型半導体層を有する発光構造物;
前記発光構造物の下に前記第1導電型半導体層と連結された第1電極;および
前記発光構造物の下に前記第2導電型半導体層と連結された第2電極;を含み、
前記発光素子の第1電極と第2電極は、前記基板と対面して前記基板と電気的に連結される、請求項8ないし請求項18のうちいずれか一つの項に記載の照明モジュール。 - 基板;
前記基板上にN列(Nは1以上の整数)で配置された複数の発光素子;
前記発光素子から放出された光を拡散させる第1拡散層;
前記発光素子から放出された光を拡散させる第2拡散層;および
前記発光素子から放出された光を拡散させる第3拡散層;を含み、
前記第1拡散層は、拡散剤を含み、
前記第2拡散層は、蛍光体を含み、
前記第3拡散層は、蛍光体およびインク粒子のうち少なくとも一つを含み、
前記発光素子の間の間隔は、前記第1拡散層、前記第2拡散層および前記第3拡散層の個別厚さより大きいか、または同じであり、
前記第1および第2拡散層の厚さは、前記第1拡散層の厚さより小さい照明モジュール。
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021009806A (ja) * | 2019-07-01 | 2021-01-28 | 大日本印刷株式会社 | バックライトモジュール、および表示装置 |
JP2021009807A (ja) * | 2019-07-01 | 2021-01-28 | 大日本印刷株式会社 | バックライトモジュール、および表示装置 |
JP2021034706A (ja) * | 2019-08-23 | 2021-03-01 | 聯京光電股▲ふん▼有限公司 | 発光素子パッケージ構造及びその製造方法 |
WO2021054709A1 (ko) * | 2019-09-20 | 2021-03-25 | 엘지이노텍 주식회사 | 조명 모듈, 조명 장치 및 램프 |
CN113024251A (zh) * | 2019-12-09 | 2021-06-25 | 上海航空电器有限公司 | 具有平凹形结构薄膜的高显色性激光照明用荧光陶瓷及其制备方法 |
WO2021182826A1 (ko) * | 2020-03-09 | 2021-09-16 | 엘지이노텍 주식회사 | 조명모듈 및 이를 구비한 조명장치 |
CN113883467A (zh) * | 2019-10-24 | 2022-01-04 | 现代摩比斯株式会社 | 用于汽车的灯及包括该灯的汽车 |
KR20220027077A (ko) | 2019-07-01 | 2022-03-07 | 다이니폰 인사츠 가부시키가이샤 | 확산 부재, 적층체, 확산 부재의 세트, led 백라이트 및 표시 장치 |
CN114419994A (zh) * | 2022-01-12 | 2022-04-29 | 友达光电(苏州)有限公司 | 背光模组 |
US11393965B2 (en) | 2019-08-02 | 2022-07-19 | Nichia Corporation | Light-emitting unit and surface-emission light source |
JP2022153365A (ja) * | 2019-07-01 | 2022-10-12 | 大日本印刷株式会社 | 拡散部材、積層体、拡散部材のセット、ledバックライトおよび表示装置 |
CN115234878A (zh) * | 2021-04-22 | 2022-10-25 | 现代摩比斯株式会社 | 车灯光学系统 |
US11506934B2 (en) | 2020-08-31 | 2022-11-22 | Nichia Corporation | Light-emitting device and planar light source |
WO2023127897A1 (ja) * | 2021-12-27 | 2023-07-06 | シチズン電子株式会社 | 発光装置及びその製造方法 |
US11817530B2 (en) | 2020-06-29 | 2023-11-14 | Citizen Electronics Co., Ltd. | Light emitting device |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210113883A (ko) * | 2020-03-09 | 2021-09-17 | 엘지이노텍 주식회사 | 조명모듈 및 이를 구비한 조명장치 |
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KR20240091646A (ko) | 2022-12-14 | 2024-06-21 | 에스엘 주식회사 | 조명 장치 |
KR20240091647A (ko) | 2022-12-14 | 2024-06-21 | 에스엘 주식회사 | 조명 장치 |
KR20240091650A (ko) | 2022-12-14 | 2024-06-21 | 에스엘 주식회사 | 조명 장치 |
KR20240091652A (ko) | 2022-12-14 | 2024-06-21 | 에스엘 주식회사 | 조명 장치 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011108889A (ja) * | 2009-11-18 | 2011-06-02 | Asahi Rubber Inc | 発光装置 |
JP2012134305A (ja) * | 2010-12-21 | 2012-07-12 | Panasonic Corp | 発光装置及びそれを用いた照明装置 |
US20130050979A1 (en) * | 2011-08-26 | 2013-02-28 | Antony P. Van de Ven | Reduced phosphor lighting devices |
JP2013077811A (ja) * | 2011-09-14 | 2013-04-25 | Nitto Denko Corp | 封止シート、その製造方法、発光ダイオード装置およびその製造方法 |
JP2014011159A (ja) * | 2012-06-27 | 2014-01-20 | Lg Innotek Co Ltd | 照明装置 |
JP2014026977A (ja) * | 2012-07-27 | 2014-02-06 | Lg Innotek Co Ltd | 照明装置 |
US20140367711A1 (en) * | 2013-06-18 | 2014-12-18 | LuxVue Technology Corporation | Led light pipe |
JP2015108677A (ja) * | 2013-12-03 | 2015-06-11 | 日本カーバイド工業株式会社 | 光拡散シート、光拡散シートを用いた照明装置、及び内部照明式表示装置 |
JP2016092401A (ja) * | 2014-10-31 | 2016-05-23 | 日亜化学工業株式会社 | 発光装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005298805A (ja) * | 2004-03-16 | 2005-10-27 | Mitsubishi Chemicals Corp | 発光装置及び照明装置 |
JP2006208938A (ja) * | 2005-01-31 | 2006-08-10 | Toyoda Gosei Co Ltd | ディスプレイ装置 |
JP2012049333A (ja) * | 2010-08-26 | 2012-03-08 | Panasonic Electric Works Co Ltd | 発光装置 |
JPWO2013011628A1 (ja) * | 2011-07-19 | 2015-02-23 | パナソニック株式会社 | 発光装置及びその製造方法 |
JP2013159003A (ja) | 2012-02-03 | 2013-08-19 | Shin-Etsu Chemical Co Ltd | 蛍光体含有層と蛍光体非含有層を有する熱硬化性シリコーン樹脂シート、それを使用する発光装置の製造方法及び封止発光半導体装置 |
KR102047833B1 (ko) * | 2012-12-17 | 2019-11-22 | 엘지이노텍 주식회사 | 조명장치 및 이를 포함하는 차량용 램프 |
JP2014125597A (ja) * | 2012-12-27 | 2014-07-07 | Mitsubishi Chemicals Corp | 熱可塑性樹脂組成物、波長変換部材、発光装置、及びled照明器具 |
JP6199568B2 (ja) * | 2013-01-30 | 2017-09-20 | 株式会社小糸製作所 | 発光モジュール |
KR20160066319A (ko) * | 2014-12-02 | 2016-06-10 | 엘지이노텍 주식회사 | 발광소자 패키지 |
-
2018
- 2018-08-17 KR KR1020180096012A patent/KR102469363B1/ko active IP Right Grant
- 2018-09-20 JP JP2018175957A patent/JP7407505B2/ja active Active
- 2018-09-25 EP EP24152381.0A patent/EP4343865A3/en active Pending
- 2018-09-25 CN CN202310923004.6A patent/CN117133763A/zh active Pending
-
2022
- 2022-11-16 KR KR1020220153927A patent/KR102638665B1/ko active Application Filing
-
2023
- 2023-12-19 JP JP2023213960A patent/JP2024029028A/ja active Pending
-
2024
- 2024-02-15 KR KR1020240021730A patent/KR20240024166A/ko active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011108889A (ja) * | 2009-11-18 | 2011-06-02 | Asahi Rubber Inc | 発光装置 |
JP2012134305A (ja) * | 2010-12-21 | 2012-07-12 | Panasonic Corp | 発光装置及びそれを用いた照明装置 |
US20130050979A1 (en) * | 2011-08-26 | 2013-02-28 | Antony P. Van de Ven | Reduced phosphor lighting devices |
JP2013077811A (ja) * | 2011-09-14 | 2013-04-25 | Nitto Denko Corp | 封止シート、その製造方法、発光ダイオード装置およびその製造方法 |
JP2014011159A (ja) * | 2012-06-27 | 2014-01-20 | Lg Innotek Co Ltd | 照明装置 |
JP2014026977A (ja) * | 2012-07-27 | 2014-02-06 | Lg Innotek Co Ltd | 照明装置 |
US20140367711A1 (en) * | 2013-06-18 | 2014-12-18 | LuxVue Technology Corporation | Led light pipe |
JP2015108677A (ja) * | 2013-12-03 | 2015-06-11 | 日本カーバイド工業株式会社 | 光拡散シート、光拡散シートを用いた照明装置、及び内部照明式表示装置 |
JP2016092401A (ja) * | 2014-10-31 | 2016-05-23 | 日亜化学工業株式会社 | 発光装置 |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7485189B2 (ja) | 2019-07-01 | 2024-05-16 | 大日本印刷株式会社 | バックライトモジュール、および表示装置 |
JP7443682B2 (ja) | 2019-07-01 | 2024-03-06 | 大日本印刷株式会社 | バックライトモジュール、および表示装置 |
JP7420168B2 (ja) | 2019-07-01 | 2024-01-23 | 大日本印刷株式会社 | 拡散部材、積層体、拡散部材のセット、ledバックライトおよび表示装置 |
KR20240023191A (ko) | 2019-07-01 | 2024-02-20 | 다이니폰 인사츠 가부시키가이샤 | 확산 부재, 적층체, 확산 부재의 세트, led 백라이트 및 표시 장치 |
JP2021009807A (ja) * | 2019-07-01 | 2021-01-28 | 大日本印刷株式会社 | バックライトモジュール、および表示装置 |
JP2022153365A (ja) * | 2019-07-01 | 2022-10-12 | 大日本印刷株式会社 | 拡散部材、積層体、拡散部材のセット、ledバックライトおよび表示装置 |
JP2021009806A (ja) * | 2019-07-01 | 2021-01-28 | 大日本印刷株式会社 | バックライトモジュール、および表示装置 |
KR20220027077A (ko) | 2019-07-01 | 2022-03-07 | 다이니폰 인사츠 가부시키가이샤 | 확산 부재, 적층체, 확산 부재의 세트, led 백라이트 및 표시 장치 |
US12104784B2 (en) | 2019-07-01 | 2024-10-01 | Dai Nippon Printing Co., Ltd. | Diffusion member, stacked body, diffusion member set, LED backlight, and displaying apparatus |
US11393965B2 (en) | 2019-08-02 | 2022-07-19 | Nichia Corporation | Light-emitting unit and surface-emission light source |
US11799064B2 (en) | 2019-08-02 | 2023-10-24 | Nichia Corporation | Light-emitting unit and surface-emission light source |
JP2021034706A (ja) * | 2019-08-23 | 2021-03-01 | 聯京光電股▲ふん▼有限公司 | 発光素子パッケージ構造及びその製造方法 |
US12044398B2 (en) | 2019-09-20 | 2024-07-23 | Lg Innotek Co., Ltd. | Lighting module, lighting device and lamp |
CN114423987B (zh) * | 2019-09-20 | 2024-04-16 | Lg伊诺特有限公司 | 照明装置 |
CN114423987A (zh) * | 2019-09-20 | 2022-04-29 | Lg伊诺特有限公司 | 照明模块、照明设备及灯 |
WO2021054709A1 (ko) * | 2019-09-20 | 2021-03-25 | 엘지이노텍 주식회사 | 조명 모듈, 조명 장치 및 램프 |
US11796154B2 (en) | 2019-09-20 | 2023-10-24 | Lg Innotek Co., Ltd. | Lighting module, lighting device and lamp |
CN113883467A (zh) * | 2019-10-24 | 2022-01-04 | 现代摩比斯株式会社 | 用于汽车的灯及包括该灯的汽车 |
CN113024251A (zh) * | 2019-12-09 | 2021-06-25 | 上海航空电器有限公司 | 具有平凹形结构薄膜的高显色性激光照明用荧光陶瓷及其制备方法 |
WO2021182826A1 (ko) * | 2020-03-09 | 2021-09-16 | 엘지이노텍 주식회사 | 조명모듈 및 이를 구비한 조명장치 |
US11817530B2 (en) | 2020-06-29 | 2023-11-14 | Citizen Electronics Co., Ltd. | Light emitting device |
US11506934B2 (en) | 2020-08-31 | 2022-11-22 | Nichia Corporation | Light-emitting device and planar light source |
US12117691B2 (en) | 2020-08-31 | 2024-10-15 | Nichia Corporation | Method of producing light-emitting device and planar light source |
CN115234878A (zh) * | 2021-04-22 | 2022-10-25 | 现代摩比斯株式会社 | 车灯光学系统 |
WO2023127897A1 (ja) * | 2021-12-27 | 2023-07-06 | シチズン電子株式会社 | 発光装置及びその製造方法 |
CN114419994A (zh) * | 2022-01-12 | 2022-04-29 | 友达光电(苏州)有限公司 | 背光模组 |
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CN117133763A (zh) | 2023-11-28 |
KR102638665B1 (ko) | 2024-02-21 |
KR20190035491A (ko) | 2019-04-03 |
EP4343865A2 (en) | 2024-03-27 |
KR20240024166A (ko) | 2024-02-23 |
JP7407505B2 (ja) | 2024-01-04 |
JP2024029028A (ja) | 2024-03-05 |
KR20220159325A (ko) | 2022-12-02 |
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KR102469363B1 (ko) | 2022-11-23 |
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