JP2019047065A - 量子カスケードレーザ光源の製造方法 - Google Patents
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Abstract
【解決手段】量子カスケードレーザ光源の製造方法は、半導体積層体を準備する工程と、一対の第1掘り込み部と、該一対の第1掘り込み部に挟まれるように形成されたリッジ部とを形成する工程と、チャネル構造と、リッジ部との間にチャネル構造を挟むように形成された周縁部とを形成する工程と、第1領域に接するように電極パターン81を形成すると共に、第2領域に接するように電極パターン82を形成する工程と、結晶成長面側を支持基板91に固定する工程と、Feドープ(半絶縁)InP単結晶基板21を除去する工程と、Si基板93を固定する工程と、支持基板91を剥離する工程と、を備える。
【選択図】図4
Description
Claims (4)
- リン化インジウム基板上に、下部コンタクト層、下部クラッド層、下部ガイド層、活性層、及び上部ガイド層が順次積層された半導体積層体を準備する工程と、
前記半導体積層体において、部分的にエッチングを行い、該エッチングにより前記下部クラッド層が露出した一対の第1掘り込み部と、該一対の第1掘り込み部に挟まれるように形成されたリッジ部とを形成する工程と、
前記第1掘り込み部においてドープ層が成長し、更に、前記第1掘り込み部及び前記リッジ部において上部クラッド層及び上部コンタクト層が成長した後に、前記一対の第1掘り込み部それぞれにおいて、部分的にエッチングを行い、該エッチングにより前記下部コンタクト層が露出した第2掘り込み部と、前記リッジ部との間に前記第2掘り込み部を挟むように形成された周縁部とを形成する工程と、
前記リッジ部における前記上部コンタクト層の一部の領域である第1領域、及び、前記第2掘り込み部における前記下部コンタクト層の一部の領域である第2領域を除いて絶縁膜を形成した後に、前記第1領域に接するように第1電極を形成すると共に、前記第2領域に接するように第2電極を形成し、半導体素子を形成する工程と、
前記半導体素子における前記第1電極及び前記第2電極が形成された側である結晶成長面側を支持基板に固定する工程と、
前記支持基板に固定された前記半導体素子の前記リン化インジウム基板を除去する工程と、
前記半導体素子における前記リン化インジウム基板が除去された面にシリコン基板を固定する工程と、
前記シリコン基板が固定された後に前記半導体素子から前記支持基板を剥離する工程と、を備える量子カスケードレーザ光源の製造方法。 - 前記支持基板を剥離する工程後において、所定の切断ラインに沿ってステルスダイシングを行うことにより、前記半導体素子をチップ化する工程を更に備える、請求項1記載の量子カスケードレーザ光源の製造方法。
- 前記半導体素子を形成する工程では、前記第2領域に接する前記第2電極を、前記周縁部を覆う前記絶縁膜に沿って前記周縁部の表面まで形成し、
第3電極と、該第3電極の両側に設けられた第4電極とが設けられたサブマウントを準備する工程と、
前記チップ化する工程後において、前記サブマウントの前記第3電極及び前記第4電極が形成された面と、前記半導体素子の前記第1電極及び前記第2電極が形成された面とを対向させ、前記第3電極に前記第1電極が接触し、前記第4電極に前記第2電極が接触するように、エピサイドダウン組立により前記サブマウントに前記半導体素子を接続する工程と、を更に備える、請求項2記載の量子カスケードレーザ光源の製造方法。 - 前記第2掘り込み部と前記周縁部とを形成する工程では、前記一対の第1掘り込み部それぞれに対応する前記第2掘り込み部を、前記リッジ部を挟んで対称となる位置に形成する、請求項1〜3のいずれか一項記載の量子カスケードレーザ光源の製造方法。
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WO2021200670A1 (ja) * | 2020-04-02 | 2021-10-07 | 浜松ホトニクス株式会社 | 量子カスケードレーザ素子及び量子カスケードレーザ装置 |
WO2021200582A1 (ja) * | 2020-04-02 | 2021-10-07 | 浜松ホトニクス株式会社 | 量子カスケードレーザ素子の製造方法 |
DE112021002106T5 (de) | 2020-04-02 | 2023-02-09 | Hamamatsu Photonics K.K. | Quantenkaskadenlaserelement und Quantenkaskadenlasergerät |
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JP7411483B2 (ja) | 2020-04-02 | 2024-01-11 | 浜松ホトニクス株式会社 | 量子カスケードレーザ素子の製造方法 |
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US20190074664A1 (en) | 2019-03-07 |
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