JP2019046986A - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP2019046986A
JP2019046986A JP2017169195A JP2017169195A JP2019046986A JP 2019046986 A JP2019046986 A JP 2019046986A JP 2017169195 A JP2017169195 A JP 2017169195A JP 2017169195 A JP2017169195 A JP 2017169195A JP 2019046986 A JP2019046986 A JP 2019046986A
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JP
Japan
Prior art keywords
substrate
cooling gas
cooling
discharge port
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017169195A
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English (en)
Japanese (ja)
Inventor
上田　大
Masaru Ueda
大 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2017169195A priority Critical patent/JP2019046986A/ja
Priority to PCT/JP2018/023470 priority patent/WO2019044129A1/ja
Priority to TW107125730A priority patent/TWI700740B/zh
Publication of JP2019046986A publication Critical patent/JP2019046986A/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2017169195A 2017-09-04 2017-09-04 基板処理装置および基板処理方法 Pending JP2019046986A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017169195A JP2019046986A (ja) 2017-09-04 2017-09-04 基板処理装置および基板処理方法
PCT/JP2018/023470 WO2019044129A1 (ja) 2017-09-04 2018-06-20 基板処理装置および基板処理方法
TW107125730A TWI700740B (zh) 2017-09-04 2018-07-25 基板處理裝置以及基板處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017169195A JP2019046986A (ja) 2017-09-04 2017-09-04 基板処理装置および基板処理方法

Publications (1)

Publication Number Publication Date
JP2019046986A true JP2019046986A (ja) 2019-03-22

Family

ID=65525137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017169195A Pending JP2019046986A (ja) 2017-09-04 2017-09-04 基板処理装置および基板処理方法

Country Status (3)

Country Link
JP (1) JP2019046986A (zh)
TW (1) TWI700740B (zh)
WO (1) WO2019044129A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11355366B2 (en) 2018-08-30 2022-06-07 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for shuttered wafer cleaning

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008159728A (ja) * 2006-12-22 2008-07-10 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2010080819A (ja) * 2008-09-29 2010-04-08 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JP2012204559A (ja) * 2011-03-25 2012-10-22 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2013030613A (ja) * 2011-07-28 2013-02-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2013030612A (ja) * 2011-07-28 2013-02-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040101948A (ko) * 2004-05-31 2004-12-03 (주)케이.씨.텍 표면세정용 승화성 고체입자 분사용 노즐 및 이를 이용한 세정방법
JP4767138B2 (ja) * 2006-09-13 2011-09-07 大日本スクリーン製造株式会社 基板処理装置、液膜凍結方法および基板処理方法
JP6612632B2 (ja) * 2016-01-26 2019-11-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008159728A (ja) * 2006-12-22 2008-07-10 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2010080819A (ja) * 2008-09-29 2010-04-08 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JP2012204559A (ja) * 2011-03-25 2012-10-22 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2013030613A (ja) * 2011-07-28 2013-02-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2013030612A (ja) * 2011-07-28 2013-02-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
TWI700740B (zh) 2020-08-01
WO2019044129A1 (ja) 2019-03-07
TW201921470A (zh) 2019-06-01

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