JP2018525834A5 - - Google Patents

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Publication number
JP2018525834A5
JP2018525834A5 JP2018507627A JP2018507627A JP2018525834A5 JP 2018525834 A5 JP2018525834 A5 JP 2018525834A5 JP 2018507627 A JP2018507627 A JP 2018507627A JP 2018507627 A JP2018507627 A JP 2018507627A JP 2018525834 A5 JP2018525834 A5 JP 2018525834A5
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JP
Japan
Prior art keywords
support surface
processing tool
applied pressure
chuck
machine
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JP2018507627A
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English (en)
Japanese (ja)
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JP7032307B2 (ja
JP2018525834A (ja
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Priority claimed from PCT/US2016/046335 external-priority patent/WO2017030867A2/en
Publication of JP2018525834A publication Critical patent/JP2018525834A/ja
Publication of JP2018525834A5 publication Critical patent/JP2018525834A5/ja
Application granted granted Critical
Publication of JP7032307B2 publication Critical patent/JP7032307B2/ja
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JP2018507627A 2015-08-14 2016-08-10 チャック表面の決定論的な仕上げのための方法 Active JP7032307B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562205643P 2015-08-14 2015-08-14
US62/205,643 2015-08-14
PCT/US2016/046335 WO2017030867A2 (en) 2015-08-14 2016-08-10 Method for deterministic finishing of a chuck surface

Publications (3)

Publication Number Publication Date
JP2018525834A JP2018525834A (ja) 2018-09-06
JP2018525834A5 true JP2018525834A5 (cg-RX-API-DMAC7.html) 2019-09-19
JP7032307B2 JP7032307B2 (ja) 2022-03-08

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ID=58050895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018507627A Active JP7032307B2 (ja) 2015-08-14 2016-08-10 チャック表面の決定論的な仕上げのための方法

Country Status (4)

Country Link
US (1) US10953513B2 (cg-RX-API-DMAC7.html)
EP (1) EP3334564B1 (cg-RX-API-DMAC7.html)
JP (1) JP7032307B2 (cg-RX-API-DMAC7.html)
WO (1) WO2017030867A2 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3334560B1 (en) * 2015-08-14 2023-09-13 M Cubed Technologies Inc. Method for removing contamination from a chuck surface
WO2019154630A1 (en) * 2018-02-06 2019-08-15 Asml Netherlands B.V. System, device and method for reconditioning a substrate support
NL2023396A (en) * 2018-07-27 2020-01-31 Asml Netherlands Bv Tool for modifying a support surface

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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JPH0936070A (ja) 1995-07-21 1997-02-07 Nippon Steel Corp 半導体ウエハの研磨装置
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US6439986B1 (en) 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
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US6991524B1 (en) * 2000-07-07 2006-01-31 Disc Go Technologies Inc. Method and apparatus for reconditioning digital discs
US20030045208A1 (en) * 2001-09-06 2003-03-06 Neidrich Jason M. System and method for chemical mechanical polishing using retractable polishing pads
US20040116058A1 (en) * 2002-12-13 2004-06-17 Eastman Kodak Company Sub-aperture compliant toroidal polishing element
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JP4756583B2 (ja) 2005-08-30 2011-08-24 株式会社東京精密 研磨パッド、パッドドレッシング評価方法、及び研磨装置
JP5099476B2 (ja) 2006-12-28 2012-12-19 株式会社ニコン 清掃装置及び清掃システム、パターン形成装置、清掃方法及び露光方法、並びにデバイス製造方法
JP5018249B2 (ja) 2007-06-04 2012-09-05 株式会社ニコン クリーニング装置、クリーニング方法、露光装置、及びデバイス製造方法
JP2009060035A (ja) 2007-09-03 2009-03-19 Shinko Electric Ind Co Ltd 静電チャック部材、その製造方法及び静電チャック装置
JP2009160700A (ja) 2008-01-08 2009-07-23 Disco Abrasive Syst Ltd 研磨装置
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
KR20110039308A (ko) 2008-07-01 2011-04-15 어플라이드 머티어리얼스, 인코포레이티드 모듈형 기부 플레이트 반도체 연마기 구조체
JP2010153407A (ja) 2008-12-23 2010-07-08 Nikon Corp 清掃方法及び装置、並びに露光方法及び装置
US8588956B2 (en) 2009-01-29 2013-11-19 Tayyab Ishaq Suratwala Apparatus and method for deterministic control of surface figure during full aperture polishing
NL2004153A (en) 2009-02-24 2010-08-25 Asml Netherlands Bv Lithographic apparatus, a method for removing material of one or more protrusions on a support surface, and an article support system.
US20100330890A1 (en) 2009-06-30 2010-12-30 Zine-Eddine Boutaghou Polishing pad with array of fluidized gimballed abrasive members
JP2012028697A (ja) * 2010-07-27 2012-02-09 Toshiba Corp 洗浄装置、方法
US10035237B2 (en) * 2011-11-02 2018-07-31 The Boeing Company Robotic end effector including multiple abrasion tools
WO2013113569A1 (en) 2012-02-03 2013-08-08 Asml Netherlands B.V. Substrate holder and method of manufacturing a substrate holder
JP6085152B2 (ja) 2012-11-22 2017-02-22 日本特殊陶業株式会社 真空チャック
CN105359258B (zh) * 2013-07-02 2018-09-25 富士纺控股株式会社 研磨垫及其制造方法
JP6109010B2 (ja) 2013-08-14 2017-04-05 株式会社ディスコ 研削装置
JP2014128877A (ja) 2014-03-03 2014-07-10 Femutekku:Kk 表面加工装置及び方法
US10875153B2 (en) * 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
CN107206567B (zh) 2014-11-23 2020-12-29 M丘比德技术公司 晶片针钉卡盘制造和修理

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