JP2018525812A - 静電チャックのための熱遮蔽 - Google Patents
静電チャックのための熱遮蔽 Download PDFInfo
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- JP2018525812A JP2018525812A JP2017566683A JP2017566683A JP2018525812A JP 2018525812 A JP2018525812 A JP 2018525812A JP 2017566683 A JP2017566683 A JP 2017566683A JP 2017566683 A JP2017566683 A JP 2017566683A JP 2018525812 A JP2018525812 A JP 2018525812A
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- Prior art keywords
- base
- electrostatic chuck
- chuck
- layer
- reflective material
- Prior art date
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- 239000000463 material Substances 0.000 claims abstract description 51
- 229920001721 polyimide Polymers 0.000 claims abstract description 36
- 239000012212 insulator Substances 0.000 claims abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000005229 chemical vapour deposition Methods 0.000 claims description 7
- 238000005240 physical vapour deposition Methods 0.000 claims description 7
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 7
- 238000005566 electron beam evaporation Methods 0.000 claims description 4
- 238000010894 electron beam technology Methods 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
- 230000009477 glass transition Effects 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- 238000000137 annealing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000007943 implant Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000002470 thermal conductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005280 amorphization Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Thermal Sciences (AREA)
Abstract
Description
[表1]
Claims (15)
- 静電チャックと、
該静電チャックより低い温度のベースと、
前記静電チャックと前記ベースとの間に配置される熱遮蔽と、を備え、
該熱遮蔽は、一面の上に、反射材料の層で覆われるポリイミド膜を備える、装置。 - 前記反射材料の層はアルミ二ウムを備える、請求項1に記載の装置。
- 前記反射材料の層は、化学気相蒸着、物理気相蒸着、プラズマ化学気相蒸着、又は、電子ビーム蒸着を用いて、前記ポリイミド膜の上に堆積される、請求項1に記載の装置。
- 前記反射材料の層は30ナノメートルと100ナノメートルとの間であり、前記ポリイミド膜の厚さは1ミルと5ミルとの間である、請求項1に記載の装置。
- 前記反射材料の層は、前記静電チャックにより近い前記ポリイミド膜の一面の上に配置される、請求項1に記載の装置。
- 前記熱遮蔽を前記ベースから分離するために、ワッシャが用いられる、請求項1に記載の装置。
- 前記熱遮蔽を前記静電チャックから分離するために、ワッシャが用いられる、請求項6に記載の装置。
- 前記熱遮蔽を前記静電チャックから分離するために、ワッシャが用いられる、請求項1に記載の装置。
- 前記静電チャック及び前記ベースは、1/16インチと1/8インチとの間の距離だけ分離される、請求項1に記載の装置。
- 静電チャックと、
該静電チャックより低い温度のベースであって、前記静電チャックから相隔たるベースと、
前記静電チャックと前記ベースとの間に配置される熱遮蔽であって、前記静電チャックに面する一面の上に、反射材料の層で覆われるポリイミド膜を備える熱遮蔽と、
前記熱遮蔽を前記静電チャック及び前記ベースから分離するワッシャと、を備える、装置。 - 前記反射材料の層はアルミ二ウムを備える、請求項10に記載の装置。
- 前記反射材料の層は、化学気相蒸着、物理気相蒸着、プラズマ化学気相蒸着、又は、電子ビーム蒸着を用いて、前記ポリイミド膜の上に堆積される、請求項10に記載の装置。
- 前記反射材料の層は30ナノメートルと100ナノメートルとの間であり、前記ポリイミド膜の厚さは1ミルと5ミルとの間である、請求項10に記載の装置。
- 静電チャックと、
該静電チャックより低い温度のベースと、
前記静電チャックと前記ベースとの間に配置される熱遮蔽であって、前記静電チャックに、より近い一面の上に、反射材料の層で覆われる熱絶縁体を備える熱遮蔽と、を備える、装置。 - 前記熱絶縁体の厚さは1ミルと5ミルとの間である、請求項14に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562186068P | 2015-06-29 | 2015-06-29 | |
US62/186,068 | 2015-06-29 | ||
PCT/US2016/036000 WO2017003646A1 (en) | 2015-06-29 | 2016-06-06 | Thermal shield for electrostatic chuck |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018525812A true JP2018525812A (ja) | 2018-09-06 |
JP2018525812A5 JP2018525812A5 (ja) | 2019-05-09 |
JP6873058B2 JP6873058B2 (ja) | 2021-05-19 |
Family
ID=57601244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017566683A Active JP6873058B2 (ja) | 2015-06-29 | 2016-06-06 | 基板を保持するための装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10157764B2 (ja) |
JP (1) | JP6873058B2 (ja) |
KR (1) | KR102465285B1 (ja) |
CN (1) | CN107810548B (ja) |
TW (1) | TWI696235B (ja) |
WO (1) | WO2017003646A1 (ja) |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61206897A (ja) * | 1985-03-11 | 1986-09-13 | 株式会社日立製作所 | 断熱材および積層方法 |
JPH05190464A (ja) * | 1992-01-16 | 1993-07-30 | Toshiba Corp | 気相成長装置 |
JPH0671797A (ja) * | 1992-08-29 | 1994-03-15 | Dainichi Kasei Kogyo Kk | 断熱材 |
JPH1187481A (ja) * | 1997-06-27 | 1999-03-30 | Applied Materials Inc | 熱伝達レギュレータパッドを有する静電チャック |
JP2000044345A (ja) * | 1998-07-24 | 2000-02-15 | Ngk Insulators Ltd | 窒化アルミニウム質焼結体、耐蝕性部材、金属埋設品および半導体保持装置 |
JP2002506279A (ja) * | 1998-03-05 | 2002-02-26 | エフエスアイ インターナショナル インコーポレイテッド | 低熱容量で、熱伝導性の加熱プレートを含む加熱/冷却装置 |
JP2002064133A (ja) * | 2000-03-30 | 2002-02-28 | Ibiden Co Ltd | 支持容器および半導体製造・検査装置 |
JP2008527694A (ja) * | 2004-12-30 | 2008-07-24 | ラム リサーチ コーポレイション | 基板を空間的かつ時間的に温度制御するための装置 |
JP2009076689A (ja) * | 2007-09-20 | 2009-04-09 | Tokyo Electron Ltd | 基板処理装置及びそれに用いる基板載置台 |
JP2012028428A (ja) * | 2010-07-21 | 2012-02-09 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
JP2012142333A (ja) * | 2010-12-28 | 2012-07-26 | Canon Anelva Corp | 基板熱処理装置 |
JP2012519236A (ja) * | 2009-02-27 | 2012-08-23 | アプライド マテリアルズ インコーポレイテッド | 真空を中絶させることなくペデスタルの表面から残留物を除去するin−situプラズマ洗浄 |
US20140159325A1 (en) * | 2012-12-11 | 2014-06-12 | Applied Materials, Inc. | Substrate support assembly having metal bonded protective layer |
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US20050211385A1 (en) | 2001-04-30 | 2005-09-29 | Lam Research Corporation, A Delaware Corporation | Method and apparatus for controlling spatial temperature distribution |
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2016
- 2016-06-06 US US15/174,160 patent/US10157764B2/en active Active
- 2016-06-06 KR KR1020187002442A patent/KR102465285B1/ko active IP Right Grant
- 2016-06-06 CN CN201680038069.0A patent/CN107810548B/zh active Active
- 2016-06-06 WO PCT/US2016/036000 patent/WO2017003646A1/en active Application Filing
- 2016-06-06 JP JP2017566683A patent/JP6873058B2/ja active Active
- 2016-06-21 TW TW105119384A patent/TWI696235B/zh active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS61206897A (ja) * | 1985-03-11 | 1986-09-13 | 株式会社日立製作所 | 断熱材および積層方法 |
JPH05190464A (ja) * | 1992-01-16 | 1993-07-30 | Toshiba Corp | 気相成長装置 |
JPH0671797A (ja) * | 1992-08-29 | 1994-03-15 | Dainichi Kasei Kogyo Kk | 断熱材 |
JPH1187481A (ja) * | 1997-06-27 | 1999-03-30 | Applied Materials Inc | 熱伝達レギュレータパッドを有する静電チャック |
JP2002506279A (ja) * | 1998-03-05 | 2002-02-26 | エフエスアイ インターナショナル インコーポレイテッド | 低熱容量で、熱伝導性の加熱プレートを含む加熱/冷却装置 |
JP2000044345A (ja) * | 1998-07-24 | 2000-02-15 | Ngk Insulators Ltd | 窒化アルミニウム質焼結体、耐蝕性部材、金属埋設品および半導体保持装置 |
JP2002064133A (ja) * | 2000-03-30 | 2002-02-28 | Ibiden Co Ltd | 支持容器および半導体製造・検査装置 |
JP2008527694A (ja) * | 2004-12-30 | 2008-07-24 | ラム リサーチ コーポレイション | 基板を空間的かつ時間的に温度制御するための装置 |
JP2009076689A (ja) * | 2007-09-20 | 2009-04-09 | Tokyo Electron Ltd | 基板処理装置及びそれに用いる基板載置台 |
JP2012519236A (ja) * | 2009-02-27 | 2012-08-23 | アプライド マテリアルズ インコーポレイテッド | 真空を中絶させることなくペデスタルの表面から残留物を除去するin−situプラズマ洗浄 |
JP2012028428A (ja) * | 2010-07-21 | 2012-02-09 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
JP2012142333A (ja) * | 2010-12-28 | 2012-07-26 | Canon Anelva Corp | 基板熱処理装置 |
US20140159325A1 (en) * | 2012-12-11 | 2014-06-12 | Applied Materials, Inc. | Substrate support assembly having metal bonded protective layer |
Also Published As
Publication number | Publication date |
---|---|
KR20180014437A (ko) | 2018-02-08 |
TWI696235B (zh) | 2020-06-11 |
CN107810548B (zh) | 2022-03-15 |
CN107810548A (zh) | 2018-03-16 |
KR102465285B1 (ko) | 2022-11-09 |
JP6873058B2 (ja) | 2021-05-19 |
TW201717311A (zh) | 2017-05-16 |
US20160379861A1 (en) | 2016-12-29 |
US10157764B2 (en) | 2018-12-18 |
WO2017003646A1 (en) | 2017-01-05 |
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