JP2018523261A - 金属ナノ粒子の分散物 - Google Patents
金属ナノ粒子の分散物 Download PDFInfo
- Publication number
- JP2018523261A JP2018523261A JP2017561272A JP2017561272A JP2018523261A JP 2018523261 A JP2018523261 A JP 2018523261A JP 2017561272 A JP2017561272 A JP 2017561272A JP 2017561272 A JP2017561272 A JP 2017561272A JP 2018523261 A JP2018523261 A JP 2018523261A
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- JP
- Japan
- Prior art keywords
- dispersion
- metal nanoparticles
- metal
- printing
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
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Abstract
Description
of powder)および(c)付着性増強添加剤(adhesion promo
ting additive)、の混合物を含む、支持体上への付着のための導電インク組成物を開示している(特許文献24参照)。付着性増強添加剤はポリビニリデンクロリド、ポリビニルクロリド、ポリエチレンビニルクロリド、ポリエステル、それらのコポリマーから選択されるポリマーまたは第一ジアミンであることができる。
それをもって、様々な支持体に対して改善された付着性をもつ高度に導電性の被膜またはパターンを得ることができる安定な金属ナノ粒子の分散物を提供することが本発明の目的である。この目的は、請求項1に規定される金属ナノ粒子の分散物により実現される。
定義
本明細書に使用される用語のポリマーサポート(support)および箔(foil)は、1枚以上の接着層(adhesion layers)、例えば下塗り層(subbing layers)を伴うことができる自立性の(self−supporting)ポリマー基材のシートを意味する。サポートおよび箔は通常、押し出し成形(extrusion)により製造される。
原子、セレン原子またはそれらの組み合わせ物から選択される1、2、3もしくは4個のヘテロ原子により置換された、好適には5員環もしくは6員環である。
金属ナノ粒子の分散物は、金属ナノ粒子、液体キャリアおよび付着性増強化合物を含み、付着性増強化合物が酸性ポリエステルであることを特徴とする。
金属ナノ粒子の分散物は付着性増強化合物として酸性ポリエステルを含む。酸性ポリエステルを含む金属ナノ粒子の分散物は特にITO(Indium Thin Oxide(インジウム錫酸化物))支持体上への改善された付着性を特徴として示すことが確認された。
rから市販)またはBORCHI GEN HMP−F(OMG Borchersから市販)を含む。
(a)2000〜10,000の分子量 (Mn)、20〜75のヒドロキシル価(hydroxyl number)および15〜25の酸価(acid value)をもつポリエステル、ここで該ポリエステルは
(i)ジオールとトリオールの混合物を含むポリオール成分、
(ii)アルファ−、ベータ−エチレン状不飽和ポリカルボン酸を含む多酸(polyacid)成分:
の縮合物である、並びに
(b)リン酸(phosphorus acid)、
の反応生成物である。
金属ナノ粒子の分散物は好適には、結合剤として、結合剤の総合重量に基づいて90重量%以下のビニリデンクロリドを含むビニリデンクロリド・コポリマーを含む。ビニリデンクロリドの量が結合剤の総重量に基づいて90重量%を超える時は、結合剤の結晶化度(crystallinity)が高くなり過ぎ、液体キャリア中の低い溶解度をもたらす。更なるモノマーとのビニリデンクロリドの共重合が、コポリマーを、より非晶質にさせ、従って、液体キャリア中に、更に可溶性にさせる。
に従うモノマーのようなマレイン酸または無水マレイン酸の誘導体もまた、ビニリデンクロリド・コポリマーの更なるモノマーとして使用することができる。
Lは1〜5個の炭素原子を含むアルキレン基、5までのエチレングリコール単位を含むポリエチレングリコール、または5までのプロピレングリコール単位を含むポリプロピレングリコールよりなる群から選択される結合基(linking group)を表わす]
に従うモノマーのようなコハク酸または無水コハク酸の誘導体もまた、ビニリデンクロリド・コポリマーの更なるモノマーとして使用することができる。
量に対して15重量%を超えて高すぎる時は、金属ナノ粒子の分散物の導電率が低下する傾向がある。結合剤の量が、例えば分散物の総重量に対して0.1重量%未満で、低すぎる時は、付着性の改善を認めることができない。
本発明の金属ナノ粒子の分散物は金属ナノ粒子を含む。
金属ナノ粒子の分散物は液体キャリアを含む。
金属ナノ粒子の分散物は好適には、分散物の湿潤性(wetting properties)を最適化するために界面活性剤を含む。
本発明に従う金属ナノ粒子の分散物は式VII、VIII、IXまたはX、
Qは置換もしくは未置換の5もしくは6員の複素環式芳香環を形成するために必要な原
子を表わし、
Mはプロトン、一価のカチオン基、アルキル基、ヘテロアルキル基およびアシル基よりなる群から選択され、
R9およびR10は水素、置換もしくは未置換アルキル基、置換もしくは未置換アルケニル基、置換もしくは未置換アルキニル基、置換もしくは未置換アルカリール基、置換もしくは未置換アラルキル基、置換もしくは未置換アリールもしくはヘテロアリール基、ヒドロキシル基、チオエーテル、エーテル、エステル、アミド、アミン、ハロゲン、ケトンおよびアルデヒドよりなる群から独立して選択され、
R9およびR10は5〜7員環を形成するために必要な原子を表わすことができ、
R11〜R13は水素、置換もしくは未置換アルキル基、置換もしくは未置換アルケニル基、置換もしくは未置換アルキニル基、置換もしくは未置換アルカリール基、置換もしくは未置換アラルキル基、置換もしくは未置換アリールもしくはヘテロアリール基、ヒドロキシル基、チオール、チオエーテル、スルホン、スルホキシド、エーテル、エステル、アミド、アミン、ハロゲン、ケトン、アルデヒド、ニトリルおよびニトロ基よりなる群から独立して選択され、
R12およびR13は5〜7員環を形成するために必要な原子を表わすことができる]に従う分散物安定化合物(DSC)を含むことができる。
,4−オキサジアゾール、1−フェニル−5−メルカプトテトラゾール、5−メチル−1,2,4−トリアゾロ−(1,5−a)プリミジン(primidine)−7−オールおよびS−[5−[(エトキシカルボニル)アミノ]−1,3,4−チアジアゾール−2−イル]O−エチルチオカーボネートよりなる群から選択される。
金属ナノ粒子の分散物はポリマーの分散剤を含むことができる。
コーティングまたは印刷特性を最適化するために、そして更に、それがそのために使用される適用に応じて、前記の金属ナノ粒子の分散物に、還元剤、湿潤剤(wetting)/均展材(levelling agents)、除湿剤(dewetting agent)、レオロジー修飾剤、接着剤(adhesion agents)、粘性付与剤、保湿剤(humectants)、噴射剤、硬化剤、殺生物剤(biocides)または抗酸化剤のような添加剤を添加することができる。
ることができる化合物を金属ナノ粒子の分散物に添加することは好都合かも知れない。このような金属ナノ粒子の分散物から形成される層またはパターンの、より高い導電率および/またはより低い硬化温度が認められた。
に従う化合物を含む金属ナノ粒子の分散物を使用する時にも得ることができる。
本発明に従う金属ナノ粒子の分散物の調製は典型的には、撹拌、高剪断混合、超音速処理またはそれらの組み合わせのような均質化法(homogenization technique)を使用することによる、金属ナノ粒子への液体キャリア、ビニリデンコポリマーおよび場合により使用される添加剤の、添加を含む。
は好適には、25℃において90s-1の剪断速度で測定されて、10〜200mPa.s間、より好適には25〜150mPa.s間、最も好適には50〜100mPa.s間の粘度を有する。
金属ナノ粒子の分散物から印刷または塗布される薄層またはパターンは、従来の金属の印刷液またはコーティング液を使用して得られるものに比較して、より低い焼結温度において導電性にされることができる。従って、本発明の金属の印刷液またはコーティング液から製造される導電薄層またはパターンは、例えばPETのような、高温における熱処理に耐えることができない柔軟なサポート(support)上に塗布または印刷することができる。
および英国特許第1441591号明細書に開示されている。
層またはパターンがサポート上に適用された後に、硬化工程(curing step)とも呼ばれる焼結工程(sintering step)が実施される。この焼結工程期間中に、溶媒は蒸発し、金属粒子は一緒に焼結する。金属粒子間に一旦連続的な浸透性
(percolating)網目が形成されると、層またはパターンが導電性になる。従来の焼結は典型的には、熱を適用することにより実施される。焼結温度および時間は、使用されるサポートおよび金属層またはパターンの組成に左右される。金属層を硬化するための焼結工程は250℃未満、好適には200℃未満、より好適には180℃未満、最も好適には160℃未満の温度で実施することができる。
本発明に従う金属ナノ粒子はあらゆる知られた調製法により調製されることができる。
以下の実施例中に使用されたすべての材料は、別記されない限りALDRICH CHEMICAL Co.(ベルギー)およびACROS(ベルギー)のような、標準製造元から容易に入手可能であった。使用された水は脱イオン水であった。
銀被膜の導電率
銀被膜の表面抵抗(SER)は、四点の同一線上(collinear)プローブを使用して測定した。表面またはシート抵抗は以下の式:
SER=(π/ln2)*(V/I)
[式中、
SERは(Ω/□で表される層の表面抵抗である;
πはほぼ3.14に等しい数学の定数である;
ln2はほぼ0.693に等しい、値2の自然対数に等しい数学の定数である;
Vは四点プローブ測定装置の電圧計により測定される電圧である;
Iは四点プローブ測定装置により測定されるソース電流である]
により計算された。
を使用して、銀のバルクの導電性の百分率として導電率を計算することにより決定した。
異なる支持体上への銀被膜の付着性を、ASTM D3359に従うテープ試験により評価した。評価は0(非常に良好な付着性)から5(非常に低い付着性)までの採点をもたらす。
78.0gの酸化銀を275.0gのペンタン酸および401.0gの2−ピロリドンを含む1lの反応器に、撹拌しながら緩徐に添加した。混合物の温度は25℃に維持した。
銀インクSI−01〜SI−03を、透明溶液が得られるまで、撹拌しながら、表1の銀以外の成分と一緒に混合することにより調製した。次に銀ナノ粒子の分散物NPD−01を透明溶液に添加し、次に高剪断均質化を実施した。
Claims (15)
- 金属ナノ粒子、液体キャリア、および付着性増強化合物を含み、付着性増強化合物が酸性ポリエステルであることを特徴とする、金属ナノ粒子の分散物。
- 酸性ポリエステルが15〜150mg KOH/gの酸価(acid value)をもつ、請求項1記載の金属ナノ粒子の分散物。
- 酸性ポリエステルが分枝状ポリエステルである、請求項1または2に記載の金属ナノ粒子の分散物。
- ポリエステルがトリメチロールプロパンとアジピン酸との重縮合物(polycondensate)である、前記請求項のいずれかに記載の金属ナノ粒子の分散物。
- 酸性ポリエステルの量が分散物の総量に対して0.01〜10.0重量%間である、前記請求項のいずれかに記載の金属ナノ粒子の分散物。
- 更に結合剤を含み、ここで、結合剤が結合剤の総重量に基づいて90重量%以下のビニリデンクロライドを含むビニリデンクロライド・コポリマーである、前記請求項のいずれかに記載の金属ナノ粒子の分散物。
- ビニリデンコポリマーの量が分散物の総量に対して0.25〜5.0重量%である、前記請求項のいずれかに記載の金属ナノ粒子の分散物。
- 分散物の総重量に対して0.01〜0.1重量%間の無機酸、または、金属ナノ粒子の分散物から形成される金属層またはパターンの硬化期間中にそのような酸を生成することができる化合物を更に含む、前記請求項のいずれかに記載の金属ナノ粒子の分散物。
- 液体キャリアが高沸点溶媒(HBS)である、前記請求項のいずれかに記載の金属ナノ粒子の分散物。
- HBSが2−フェノキシ−エタノール、プロピレン−カーボネート、n−ブタノール、ガンマ−ブチロ−ラクトン、ジメチルスルホキシド、2−ブトキシエタノール、ジプロピレングリコールメチルエーテルアセテート、メチルイソブチルケトン、プロピレングリコールモノメチルエーテルアセテートからなる群から選択される、請求項9記載の金属ナノ粒子の分散物。
- 支持体(substrate)上に請求項1〜10のいずれかで規定される金属ナノ粒子の分散物を適用する工程と、それに続く焼結工程を含む、金属層またはパターンを調製する方法。
- 支持体が、紙の支持体、ガラスの支持体、プライマー層を伴うもしくは伴わないポリマーの支持体、または、ポリマーサポートもしくはガラスサポート上のITO層である、請求項11記載の方法。
- 金属ナノ粒子の分散物が凹版印刷、スクリーン印刷、フレキソ印刷、オフセット印刷、インクジェット印刷またはグラビアオフセット印刷から選択される印刷法により支持体上に適用される、請求項11または12記載の方法。
- 焼結が30分以下の期間、200℃以下の温度で実施される、請求項11〜13のいず
れかに記載の方法。 - 焼結が熱または光またはNIR硬化により実施される、請求項11〜14のいずれかに記載の方法。
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IL247113B (en) * | 2016-08-04 | 2018-02-28 | Copprint Tech Ltd | Formulations and processes for making a high conductivity copper pattern |
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WO2019215068A1 (en) | 2018-05-08 | 2019-11-14 | Agfa-Gevaert Nv | Conductive inks |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62500408A (ja) * | 1984-10-09 | 1987-02-19 | エアコン インコ−ポレ−テツド | 可撓性コ−ティング |
JP2006519291A (ja) * | 2003-01-29 | 2006-08-24 | パレレック インコーポレイテッド | 改良された接着性を有する高導電率インク |
JP2011093962A (ja) * | 2009-10-27 | 2011-05-12 | Ishihara Sangyo Kaisha Ltd | 金属インキ並びにそれを用いた金属含有膜及びその製造方法 |
JP2012521493A (ja) * | 2009-03-24 | 2012-09-13 | イッサム リサーチ ディべロップメント カンパニー オブ ザ ヘブライ ユニバーシティー オブ エルサレム,リミテッド | 低温におけるナノ粒子の焼結プロセス |
WO2014096075A1 (en) * | 2012-12-18 | 2014-06-26 | Ppg Industries Ohio, Inc. | A coating composition |
WO2015000891A1 (en) * | 2013-07-04 | 2015-01-08 | Agfa-Gevaert | A metallic nanoparticle dispersion |
WO2015023370A1 (en) * | 2013-08-16 | 2015-02-19 | Henkel IP & Holding GmbH | Submicron silver particle ink compositions, process and applications |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1234755A (en) | 1967-09-28 | 1971-06-09 | Agfa Gevaert Nv | Photographic film |
GB1441591A (en) | 1972-07-17 | 1976-07-07 | Agfa Gevaert | Process for adhering hydrophilic layers to dimensionally stable polyester film support |
US4546544A (en) | 1984-06-28 | 1985-10-15 | Warner-Lambert Company | One-piece disposable razor with blade protector latched releasably to razor |
JPH09286936A (ja) | 1996-04-22 | 1997-11-04 | Sumitomo Metal Mining Co Ltd | 透明導電膜形成用塗布液、これを用いた透明導電膜及びその形成方法 |
US7108894B2 (en) | 1998-09-30 | 2006-09-19 | Optomec Design Company | Direct Write™ System |
US7045015B2 (en) | 1998-09-30 | 2006-05-16 | Optomec Design Company | Apparatuses and method for maskless mesoscale material deposition |
US20030020768A1 (en) | 1998-09-30 | 2003-01-30 | Renn Michael J. | Direct write TM system |
JPWO2004096470A1 (ja) | 2003-04-28 | 2006-07-13 | 住友金属鉱山株式会社 | 銀微粒子コロイド分散液の製造方法と銀微粒子コロイド分散液および銀導電膜 |
WO2005037465A1 (ja) | 2003-10-20 | 2005-04-28 | Harima Chemicals, Inc. | 乾燥粉末状の金属微粒子ならびに金属酸化物微粒子とその用途 |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
WO2006076603A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electrical conductors |
CN101137730B (zh) * | 2005-03-11 | 2011-11-16 | 东洋油墨制造株式会社 | 导电性油墨、导电电路及非接触性介质 |
JP2009535497A (ja) | 2006-04-12 | 2009-10-01 | ナノマス テクノロジーズ インコーポレイテッド | ナノ粒子、その製造方法、およびその用途 |
DE102006017696A1 (de) | 2006-04-15 | 2007-10-18 | Bayer Technology Services Gmbh | Verfahren zur Herstellung von Metallpartikeln, hieraus hergestellte Metallpartikel und deren Verwendung |
US7635504B2 (en) * | 2006-05-05 | 2009-12-22 | E. I. Du Pont De Nemours And Company | Curable white inkjet ink |
DE102007037079A1 (de) | 2006-10-25 | 2008-04-30 | Bayer Materialscience Ag | Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen |
WO2008111484A1 (ja) | 2007-03-15 | 2008-09-18 | Dic Corporation | 凸版反転印刷用導電性インキ |
CN101678460B (zh) | 2007-05-16 | 2012-07-04 | Dic株式会社 | 含银纳米结构体的制造方法和含银纳米结构体 |
EP2030706B1 (fr) | 2007-08-31 | 2010-11-10 | Metalor Technologies International S.A. | Procédé de préparation de nanoparticules d'argent |
US8887658B2 (en) | 2007-10-09 | 2014-11-18 | Optomec, Inc. | Multiple sheath multiple capillary aerosol jet |
US20090142482A1 (en) | 2007-11-30 | 2009-06-04 | Xerox Corporation | Methods of Printing Conductive Silver Features |
DE102008023882A1 (de) | 2008-05-16 | 2009-11-19 | Bayer Materialscience Ag | Druckbare Zusammensetzung auf Basis von Silberpartikeln zur Erzeugung elektrisch leitfähiger Beschichtungen |
JP2011526054A (ja) | 2008-06-12 | 2011-09-29 | ナノマス テクノロジーズ インコーポレイテッド | 導電性インクおよびペースト |
WO2009157393A1 (ja) | 2008-06-23 | 2009-12-30 | Dic株式会社 | 反転印刷用導電性インキ |
US8361350B2 (en) | 2008-12-10 | 2013-01-29 | Xerox Corporation | Silver nanoparticle ink composition |
BRPI1006198B1 (pt) * | 2009-03-16 | 2020-02-18 | Dow Global Technologies Llc | Processo para produzir uma dispersão e dispersão |
KR101651915B1 (ko) * | 2009-09-14 | 2016-08-29 | 한화케미칼 주식회사 | 금속 나노입자 수계 분산액의 제조방법 |
JP5623861B2 (ja) * | 2010-10-14 | 2014-11-12 | 株式会社東芝 | 金属ナノ粒子分散組成物 |
ES2453217T3 (es) | 2010-12-21 | 2014-04-04 | Agfa-Gevaert | Dispersión que contiene nanopartículas metálicas, de óxido de metal o de precursor de metal |
EP2694603B1 (en) * | 2011-04-05 | 2016-11-02 | Allnex Belgium, S.A. | Radiation curable compositions |
US20120301647A1 (en) | 2011-05-23 | 2012-11-29 | Ppg Industries Ohio, Inc. | Phosphatized polyesters and coating compositions containing the same |
ES2496440T3 (es) | 2011-12-21 | 2014-09-19 | Agfa-Gevaert | Dispersión que contiene nanopartículas metálicas, de óxido de metal o de precursor de metal, un dispersante polimérico y un agente térmicamente escindible |
ES2485308T3 (es) | 2011-12-21 | 2014-08-13 | Agfa-Gevaert | Dispersión que contiene nanopartículas metálicas, de óxido de metal o de precursor de metal, un dispersante polimérico y un aditivo de sinterización |
EP2671927B1 (en) | 2012-06-05 | 2021-06-02 | Agfa-Gevaert Nv | A metallic nanoparticle dispersion |
US20140186596A1 (en) * | 2012-12-28 | 2014-07-03 | Dip-Tech Ltd. | Ink |
EP2781562B1 (en) | 2013-03-20 | 2016-01-20 | Agfa-Gevaert | A method to prepare a metallic nanoparticle dispersion |
US9839961B2 (en) | 2013-07-04 | 2017-12-12 | Agfa Gevaert | Metallic nanoparticle dispersion |
WO2015000932A1 (en) | 2013-07-04 | 2015-01-08 | Agfa-Gevaert | A method of preparing a conductive metallic layer or pattern |
-
2015
- 2015-05-27 EP EP15169397.5A patent/EP3099146B1/en active Active
-
2016
- 2016-05-25 CN CN201680030162.7A patent/CN107636055B/zh active Active
- 2016-05-25 WO PCT/EP2016/061756 patent/WO2016189016A1/en active Application Filing
- 2016-05-25 US US15/575,993 patent/US20180155566A1/en not_active Abandoned
- 2016-05-25 KR KR1020177034179A patent/KR102117538B1/ko active IP Right Grant
- 2016-05-25 JP JP2017561272A patent/JP6524265B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62500408A (ja) * | 1984-10-09 | 1987-02-19 | エアコン インコ−ポレ−テツド | 可撓性コ−ティング |
JP2006519291A (ja) * | 2003-01-29 | 2006-08-24 | パレレック インコーポレイテッド | 改良された接着性を有する高導電率インク |
JP2012521493A (ja) * | 2009-03-24 | 2012-09-13 | イッサム リサーチ ディべロップメント カンパニー オブ ザ ヘブライ ユニバーシティー オブ エルサレム,リミテッド | 低温におけるナノ粒子の焼結プロセス |
JP2011093962A (ja) * | 2009-10-27 | 2011-05-12 | Ishihara Sangyo Kaisha Ltd | 金属インキ並びにそれを用いた金属含有膜及びその製造方法 |
WO2014096075A1 (en) * | 2012-12-18 | 2014-06-26 | Ppg Industries Ohio, Inc. | A coating composition |
WO2015000891A1 (en) * | 2013-07-04 | 2015-01-08 | Agfa-Gevaert | A metallic nanoparticle dispersion |
WO2015023370A1 (en) * | 2013-08-16 | 2015-02-19 | Henkel IP & Holding GmbH | Submicron silver particle ink compositions, process and applications |
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US20180155566A1 (en) | 2018-06-07 |
EP3099146B1 (en) | 2020-11-04 |
JP6524265B2 (ja) | 2019-06-05 |
KR102117538B1 (ko) | 2020-06-02 |
CN107636055A (zh) | 2018-01-26 |
KR20170139666A (ko) | 2017-12-19 |
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