JP2018517308A5 - - Google Patents
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- JP2018517308A5 JP2018517308A5 JP2018512474A JP2018512474A JP2018517308A5 JP 2018517308 A5 JP2018517308 A5 JP 2018517308A5 JP 2018512474 A JP2018512474 A JP 2018512474A JP 2018512474 A JP2018512474 A JP 2018512474A JP 2018517308 A5 JP2018517308 A5 JP 2018517308A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- time required
- transfer system
- robot
- carry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Description
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510270081.1 | 2015-05-24 | ||
CN201510270081.1A CN106292194B (zh) | 2015-05-24 | 2015-05-24 | 硅片传输系统 |
PCT/CN2016/082790 WO2016188371A1 (zh) | 2015-05-24 | 2016-05-20 | 硅片传输系统 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018517308A JP2018517308A (ja) | 2018-06-28 |
JP2018517308A5 true JP2018517308A5 (ja) | 2019-09-26 |
JP6592591B2 JP6592591B2 (ja) | 2019-10-16 |
Family
ID=57393753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018512474A Active JP6592591B2 (ja) | 2015-05-24 | 2016-05-20 | シリコンウエハ搬送システム |
Country Status (8)
Country | Link |
---|---|
US (1) | US10254661B2 (ja) |
EP (1) | EP3306397B1 (ja) |
JP (1) | JP6592591B2 (ja) |
KR (1) | KR102050004B1 (ja) |
CN (1) | CN106292194B (ja) |
SG (1) | SG11201709649XA (ja) |
TW (1) | TWI644768B (ja) |
WO (1) | WO2016188371A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109240043B (zh) * | 2018-09-20 | 2021-06-15 | 矽电半导体设备(深圳)股份有限公司 | 自动光刻机 |
CN111354668B (zh) * | 2018-12-24 | 2023-09-29 | 上海微电子装备(集团)股份有限公司 | 硅片传输系统及方法 |
WO2020167956A1 (en) * | 2019-02-14 | 2020-08-20 | Persimmon Technologies Corporation | Modular material handling robot platform |
US10867822B1 (en) | 2019-07-26 | 2020-12-15 | Yaskawa America, Inc. | Wafer pre-alignment apparatus and method |
CN110828357A (zh) * | 2019-11-21 | 2020-02-21 | 江苏索尔思通信科技有限公司 | 一种手动上光阻上片载具 |
CN111252536B (zh) * | 2020-03-11 | 2022-02-22 | 上海御微半导体技术有限公司 | 一种物料传输装置 |
CN114077162A (zh) * | 2020-08-12 | 2022-02-22 | 苏州源卓光电科技有限公司 | 一种光刻系统、基片交接系统及曝光方法 |
CN114791691A (zh) * | 2021-01-25 | 2022-07-26 | 苏州源卓光电科技有限公司 | 一种全自动曝光机 |
WO2023165701A1 (de) | 2022-03-03 | 2023-09-07 | Ev Group E. Thallner Gmbh | Vorrichtung und verfahren zum fixieren eines substrates |
CN114888983A (zh) * | 2022-05-31 | 2022-08-12 | 杭州中为光电技术有限公司 | 硅片自动倒角清洗一体化设备 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2517669B2 (ja) * | 1989-05-24 | 1996-07-24 | キヤノン株式会社 | 露光装置 |
US5376862A (en) * | 1993-01-28 | 1994-12-27 | Applied Materials, Inc. | Dual coaxial magnetic couplers for vacuum chamber robot assembly |
JP3200285B2 (ja) * | 1994-06-29 | 2001-08-20 | キヤノン株式会社 | 基板搬送装置 |
US5800018A (en) * | 1995-12-30 | 1998-09-01 | Colombo; John P | Nonslip travel pillow |
JP3632812B2 (ja) * | 1997-10-24 | 2005-03-23 | シャープ株式会社 | 基板搬送移載装置 |
JP4821074B2 (ja) * | 2001-08-31 | 2011-11-24 | 東京エレクトロン株式会社 | 処理システム |
US6778258B2 (en) * | 2001-10-19 | 2004-08-17 | Asml Holding N.V. | Wafer handling system for use in lithography patterning |
SG102718A1 (en) | 2002-07-29 | 2004-03-26 | Asml Holding Nv | Lithography tool having a vacuum reticle library coupled to a vacuum chamber |
US6826451B2 (en) * | 2002-07-29 | 2004-11-30 | Asml Holding N.V. | Lithography tool having a vacuum reticle library coupled to a vacuum chamber |
JP3674864B2 (ja) * | 2003-03-25 | 2005-07-27 | 忠素 玉井 | 真空処理装置 |
US20050194096A1 (en) * | 2003-08-29 | 2005-09-08 | Crossing Automation, Inc. | Method and apparatus for semiconductor processing |
JP2006272526A (ja) * | 2005-03-30 | 2006-10-12 | Nidec Sankyo Corp | 搬送用ロボットのハンド及びそのハンドを有する搬送用ロボット |
US7604449B1 (en) * | 2005-06-27 | 2009-10-20 | Kla-Tencor Technologies Corporation | Equipment front end module |
KR20070005796A (ko) | 2005-07-06 | 2007-01-10 | 삼성전자주식회사 | 반도체 노광 설비 |
KR101384440B1 (ko) * | 2005-10-19 | 2014-04-10 | 가부시키가이샤 니콘 | 물체의 반출입 방법 및 반출입 장치, 노광 방법 및 노광장치와 디바이스 제조 방법 |
JP4660434B2 (ja) * | 2006-07-21 | 2011-03-30 | 株式会社安川電機 | 搬送機構およびそれを備えた処理装置 |
JP2008251754A (ja) * | 2007-03-29 | 2008-10-16 | Nikon Corp | 基板搬送方法及び装置、並びに露光方法及び装置 |
TWI478272B (zh) | 2007-08-15 | 2015-03-21 | 尼康股份有限公司 | A positioning device, a bonding device, a laminated substrate manufacturing device, an exposure device, and a positioning method |
CN101158866A (zh) * | 2007-10-24 | 2008-04-09 | 上海微电子装备有限公司 | 用于硅片传输系统的服务器架构以及信息交换方法 |
TWI394224B (zh) | 2009-02-24 | 2013-04-21 | Intevac Inc | 載送及處理基板之裝置與方法 |
JP5336885B2 (ja) * | 2009-03-03 | 2013-11-06 | 東京エレクトロン株式会社 | 基板搬送装置及び基板搬送方法 |
KR20110016639A (ko) * | 2009-08-12 | 2011-02-18 | 주식회사 아토 | 기판처리장치 |
CN102347261B (zh) * | 2010-08-02 | 2015-12-02 | 北京中科信电子装备有限公司 | 一种硅片传输系统布局结构 |
US9186799B2 (en) * | 2011-07-13 | 2015-11-17 | Brooks Automation, Inc. | Compact direct drive spindle |
JP5601331B2 (ja) | 2012-01-26 | 2014-10-08 | 株式会社安川電機 | ロボットハンドおよびロボット |
CN103424991B (zh) * | 2012-05-15 | 2015-09-30 | 上海微电子装备有限公司 | 一种硅片直线交换装置及方法 |
CN103531502B (zh) * | 2012-07-03 | 2016-12-21 | 上海微电子装备有限公司 | 一种工件台装置 |
CN103984208B (zh) * | 2013-02-07 | 2016-03-02 | 上海微电子装备有限公司 | 掩模版传输系统 |
JP2014216519A (ja) * | 2013-04-26 | 2014-11-17 | 株式会社ディスコ | 加工装置及びウエーハの輸送方法 |
TWM481113U (zh) | 2014-01-28 | 2014-07-01 | Wen-Yang Chen | 具有內崁式真空防洩穩定吸取晶圓片之機械手臂葉板 |
CN204303792U (zh) * | 2015-01-12 | 2015-04-29 | 北京七星华创电子股份有限公司 | 多腔室堆栈式晶圆处理设备 |
-
2015
- 2015-05-24 CN CN201510270081.1A patent/CN106292194B/zh active Active
-
2016
- 2016-05-20 WO PCT/CN2016/082790 patent/WO2016188371A1/zh active Application Filing
- 2016-05-20 SG SG11201709649XA patent/SG11201709649XA/en unknown
- 2016-05-20 US US15/576,070 patent/US10254661B2/en active Active
- 2016-05-20 EP EP16799259.3A patent/EP3306397B1/en active Active
- 2016-05-20 KR KR1020177036282A patent/KR102050004B1/ko active IP Right Grant
- 2016-05-20 JP JP2018512474A patent/JP6592591B2/ja active Active
- 2016-05-24 TW TW105116090A patent/TWI644768B/zh active
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