JP2018515936A - 磁気ドア密封を含む、基板キャリアドアアセンブリ、基板キャリア、及び方法 - Google Patents

磁気ドア密封を含む、基板キャリアドアアセンブリ、基板キャリア、及び方法 Download PDF

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Publication number
JP2018515936A
JP2018515936A JP2017560671A JP2017560671A JP2018515936A JP 2018515936 A JP2018515936 A JP 2018515936A JP 2017560671 A JP2017560671 A JP 2017560671A JP 2017560671 A JP2017560671 A JP 2017560671A JP 2018515936 A JP2018515936 A JP 2018515936A
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JP
Japan
Prior art keywords
carrier
substrate carrier
substrate
magnetic field
door
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017560671A
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English (en)
Japanese (ja)
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JP2018515936A5 (https=
Inventor
ジョン ジェー． マゾッコー，
ジョン ジェー． マゾッコー，
ニール メリー，
ニール メリー，
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Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2018515936A publication Critical patent/JP2018515936A/ja
Publication of JP2018515936A5 publication Critical patent/JP2018515936A5/ja
Pending legal-status Critical Current

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    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05C—BOLTS OR FASTENING DEVICES FOR WINGS, SPECIALLY FOR DOORS OR WINDOWS
    • E05C19/00—Other devices specially designed for securing wings, e.g. with suction cups
    • E05C19/16—Devices holding the wing by magnetic or electromagnetic attraction
    • E05C19/166—Devices holding the wing by magnetic or electromagnetic attraction electromagnetic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1916—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2017560671A 2015-05-22 2016-04-15 磁気ドア密封を含む、基板キャリアドアアセンブリ、基板キャリア、及び方法 Pending JP2018515936A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562165555P 2015-05-22 2015-05-22
US62/165,555 2015-05-22
PCT/US2016/027801 WO2016190982A1 (en) 2015-05-22 2016-04-15 Substrate carrier door assemblies, substrate carriers, and methods including magnetic door seal

Publications (2)

Publication Number Publication Date
JP2018515936A true JP2018515936A (ja) 2018-06-14
JP2018515936A5 JP2018515936A5 (https=) 2021-04-30

Family

ID=57325191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017560671A Pending JP2018515936A (ja) 2015-05-22 2016-04-15 磁気ドア密封を含む、基板キャリアドアアセンブリ、基板キャリア、及び方法

Country Status (6)

Country Link
US (1) US10196845B2 (https=)
JP (1) JP2018515936A (https=)
KR (1) KR102319415B1 (https=)
CN (1) CN107636243A (https=)
TW (1) TWI697977B (https=)
WO (1) WO2016190982A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9694910B2 (en) 2013-02-22 2017-07-04 World View Enterprises Inc. Near-space operation systems
US9540091B1 (en) 2016-02-11 2017-01-10 World View Enterprises Inc. High altitude balloon systems and methods
US10336432B1 (en) 2017-01-09 2019-07-02 World View Enterprises Inc. Lighter than air balloon systems and methods
US10124875B1 (en) 2017-01-09 2018-11-13 World View Enterprises Inc. Continuous multi-chamber super pressure balloon
DE202017100143U1 (de) * 2017-01-12 2017-02-06 Simonswerk Gmbh Türanordnung
TWI735570B (zh) * 2017-05-09 2021-08-11 日商樂華股份有限公司 噴嘴單元、及具備噴嘴單元的環境氣體置換裝置、與環境氣體置換方法
TWI779505B (zh) * 2020-05-14 2022-10-01 台灣積體電路製造股份有限公司 光罩盒及防止光罩污染之方法
US11703754B2 (en) * 2020-05-14 2023-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Particle prevention method in reticle pod
US12009242B2 (en) * 2021-08-30 2024-06-11 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer transport container
KR102717220B1 (ko) * 2022-10-31 2024-10-15 (주)신산이엔지 웨이퍼 카세트
US12325504B2 (en) 2022-11-07 2025-06-10 World View Enterprises Inc. Magnetic ballast dispenser

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03215960A (ja) * 1990-01-22 1991-09-20 Ebara Corp 容器開閉機構
JPH0637176A (ja) * 1992-05-21 1994-02-10 Ebara Corp 保管箱の防塵装置及びその着脱機構
JPH06198160A (ja) * 1992-05-19 1994-07-19 Ebara Corp 真空容器並びに該真空容器を用いた真空処理方法及び装置
JP2003229476A (ja) * 2002-01-30 2003-08-15 Chi Mei Electronics Corp 摩擦を生じないドア部材を有する基板収納容器
US20090272743A1 (en) * 2008-05-01 2009-11-05 Meulen Peter Van Der Substrate container sealing via movable magnets
JP2010502001A (ja) * 2006-08-18 2010-01-21 ブルックス オートメーション インコーポレイテッド 低減容量キャリア、搬送機、積載ポート、緩衝装置システム
JP2010263185A (ja) * 2009-05-08 2010-11-18 Gugeng Precision Industrial Co Ltd ウェーハキャリア
JP2011181930A (ja) * 2004-04-18 2011-09-15 Entegris Inc ウエハー容器をパージする方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5398481A (en) * 1992-05-19 1995-03-21 Ebara Corporation Vacuum processing system
US6336567B1 (en) 1997-06-13 2002-01-08 Kakizaki Manufacturing Co., Ltd. Magnetic secured container closure with release by movement of magnetic member
US20070140822A1 (en) 2005-12-16 2007-06-21 Applied Materials, Inc. Methods and apparatus for opening and closing substrate carriers
CN101370616B (zh) 2006-01-11 2011-04-27 应用材料股份有限公司 一种基材载件、一种装载端口以及一种清洗基材载件的方法
US20070175792A1 (en) 2006-02-02 2007-08-02 Barry Gregerson Magnetic seal for wafer containers
KR101772600B1 (ko) * 2007-05-17 2017-08-29 브룩스 오토메이션 인코퍼레이티드 측면 개방형 기판 캐리어 및 로드 포트
JP5516968B2 (ja) * 2010-06-08 2014-06-11 独立行政法人産業技術総合研究所 連結搬送システム
JP5881956B2 (ja) * 2011-02-28 2016-03-09 株式会社日立国際電気 基板処理装置、半導体装置の製造方法およびウェーハホルダ
US10115616B2 (en) 2013-07-18 2018-10-30 Applied Materials, Inc. Carrier adapter insert apparatus and carrier adapter insert detection methods
WO2015023591A1 (en) 2013-08-12 2015-02-19 Applied Materials, Inc Substrate processing systems, apparatus, and methods with factory interface environmental controls

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03215960A (ja) * 1990-01-22 1991-09-20 Ebara Corp 容器開閉機構
JPH06198160A (ja) * 1992-05-19 1994-07-19 Ebara Corp 真空容器並びに該真空容器を用いた真空処理方法及び装置
JPH0637176A (ja) * 1992-05-21 1994-02-10 Ebara Corp 保管箱の防塵装置及びその着脱機構
JP2003229476A (ja) * 2002-01-30 2003-08-15 Chi Mei Electronics Corp 摩擦を生じないドア部材を有する基板収納容器
JP2011181930A (ja) * 2004-04-18 2011-09-15 Entegris Inc ウエハー容器をパージする方法
JP2010502001A (ja) * 2006-08-18 2010-01-21 ブルックス オートメーション インコーポレイテッド 低減容量キャリア、搬送機、積載ポート、緩衝装置システム
US20090272743A1 (en) * 2008-05-01 2009-11-05 Meulen Peter Van Der Substrate container sealing via movable magnets
JP2010263185A (ja) * 2009-05-08 2010-11-18 Gugeng Precision Industrial Co Ltd ウェーハキャリア

Also Published As

Publication number Publication date
US20160340947A1 (en) 2016-11-24
KR20180010249A (ko) 2018-01-30
WO2016190982A1 (en) 2016-12-01
US10196845B2 (en) 2019-02-05
CN107636243A (zh) 2018-01-26
TW201703176A (zh) 2017-01-16
TWI697977B (zh) 2020-07-01
KR102319415B1 (ko) 2021-10-28

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