CN107636243A - 包括磁性门密封件的基板载体门组件、基板载体和方法 - Google Patents

包括磁性门密封件的基板载体门组件、基板载体和方法 Download PDF

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Publication number
CN107636243A
CN107636243A CN201680028525.3A CN201680028525A CN107636243A CN 107636243 A CN107636243 A CN 107636243A CN 201680028525 A CN201680028525 A CN 201680028525A CN 107636243 A CN107636243 A CN 107636243A
Authority
CN
China
Prior art keywords
carrier
magnetic field
door
substrate
substrate carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680028525.3A
Other languages
English (en)
Chinese (zh)
Inventor
约翰·J·马佐科
尼尔·玛利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN107636243A publication Critical patent/CN107636243A/zh
Pending legal-status Critical Current

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05C—BOLTS OR FASTENING DEVICES FOR WINGS, SPECIALLY FOR DOORS OR WINDOWS
    • E05C19/00—Other devices specially designed for securing wings, e.g. with suction cups
    • E05C19/16—Devices holding the wing by magnetic or electromagnetic attraction
    • E05C19/166—Devices holding the wing by magnetic or electromagnetic attraction electromagnetic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1916—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201680028525.3A 2015-05-22 2016-04-15 包括磁性门密封件的基板载体门组件、基板载体和方法 Pending CN107636243A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562165555P 2015-05-22 2015-05-22
US62/165,555 2015-05-22
PCT/US2016/027801 WO2016190982A1 (en) 2015-05-22 2016-04-15 Substrate carrier door assemblies, substrate carriers, and methods including magnetic door seal

Publications (1)

Publication Number Publication Date
CN107636243A true CN107636243A (zh) 2018-01-26

Family

ID=57325191

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680028525.3A Pending CN107636243A (zh) 2015-05-22 2016-04-15 包括磁性门密封件的基板载体门组件、基板载体和方法

Country Status (6)

Country Link
US (1) US10196845B2 (https=)
JP (1) JP2018515936A (https=)
KR (1) KR102319415B1 (https=)
CN (1) CN107636243A (https=)
TW (1) TWI697977B (https=)
WO (1) WO2016190982A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9694910B2 (en) 2013-02-22 2017-07-04 World View Enterprises Inc. Near-space operation systems
US9540091B1 (en) 2016-02-11 2017-01-10 World View Enterprises Inc. High altitude balloon systems and methods
US10336432B1 (en) 2017-01-09 2019-07-02 World View Enterprises Inc. Lighter than air balloon systems and methods
US10124875B1 (en) 2017-01-09 2018-11-13 World View Enterprises Inc. Continuous multi-chamber super pressure balloon
DE202017100143U1 (de) * 2017-01-12 2017-02-06 Simonswerk Gmbh Türanordnung
TWI735570B (zh) * 2017-05-09 2021-08-11 日商樂華股份有限公司 噴嘴單元、及具備噴嘴單元的環境氣體置換裝置、與環境氣體置換方法
TWI779505B (zh) * 2020-05-14 2022-10-01 台灣積體電路製造股份有限公司 光罩盒及防止光罩污染之方法
US11703754B2 (en) * 2020-05-14 2023-07-18 Taiwan Semiconductor Manufacturing Company Ltd. Particle prevention method in reticle pod
US12009242B2 (en) * 2021-08-30 2024-06-11 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer transport container
KR102717220B1 (ko) * 2022-10-31 2024-10-15 (주)신산이엔지 웨이퍼 카세트
US12325504B2 (en) 2022-11-07 2025-06-10 World View Enterprises Inc. Magnetic ballast dispenser

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5398481A (en) * 1992-05-19 1995-03-21 Ebara Corporation Vacuum processing system
TW518649B (en) * 2002-01-30 2003-01-21 Chi Mei Optoelectronics Corp Substrate container with non-friction door element
US20090272743A1 (en) * 2008-05-01 2009-11-05 Meulen Peter Van Der Substrate container sealing via movable magnets
CN101683650A (zh) * 2004-04-18 2010-03-31 安堤格里斯公司 一种清洗晶片容器的方法
TW201040091A (en) * 2009-05-08 2010-11-16 Gudeng Prec Industral Co Ltd Wafer container with the magnetic latch

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03215960A (ja) * 1990-01-22 1991-09-20 Ebara Corp 容器開閉機構
JP3347812B2 (ja) * 1992-05-19 2002-11-20 株式会社荏原製作所 真空容器並びに該真空容器を用いた真空処理方法
JPH0637176A (ja) * 1992-05-21 1994-02-10 Ebara Corp 保管箱の防塵装置及びその着脱機構
US6336567B1 (en) 1997-06-13 2002-01-08 Kakizaki Manufacturing Co., Ltd. Magnetic secured container closure with release by movement of magnetic member
US20070140822A1 (en) 2005-12-16 2007-06-21 Applied Materials, Inc. Methods and apparatus for opening and closing substrate carriers
CN101370616B (zh) 2006-01-11 2011-04-27 应用材料股份有限公司 一种基材载件、一种装载端口以及一种清洗基材载件的方法
US20070175792A1 (en) 2006-02-02 2007-08-02 Barry Gregerson Magnetic seal for wafer containers
KR20090053915A (ko) * 2006-08-18 2009-05-28 브룩스 오토메이션 인코퍼레이티드 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템
KR101772600B1 (ko) * 2007-05-17 2017-08-29 브룩스 오토메이션 인코퍼레이티드 측면 개방형 기판 캐리어 및 로드 포트
JP5516968B2 (ja) * 2010-06-08 2014-06-11 独立行政法人産業技術総合研究所 連結搬送システム
JP5881956B2 (ja) * 2011-02-28 2016-03-09 株式会社日立国際電気 基板処理装置、半導体装置の製造方法およびウェーハホルダ
US10115616B2 (en) 2013-07-18 2018-10-30 Applied Materials, Inc. Carrier adapter insert apparatus and carrier adapter insert detection methods
WO2015023591A1 (en) 2013-08-12 2015-02-19 Applied Materials, Inc Substrate processing systems, apparatus, and methods with factory interface environmental controls

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5398481A (en) * 1992-05-19 1995-03-21 Ebara Corporation Vacuum processing system
TW518649B (en) * 2002-01-30 2003-01-21 Chi Mei Optoelectronics Corp Substrate container with non-friction door element
CN101683650A (zh) * 2004-04-18 2010-03-31 安堤格里斯公司 一种清洗晶片容器的方法
US20090272743A1 (en) * 2008-05-01 2009-11-05 Meulen Peter Van Der Substrate container sealing via movable magnets
TW201040091A (en) * 2009-05-08 2010-11-16 Gudeng Prec Industral Co Ltd Wafer container with the magnetic latch

Also Published As

Publication number Publication date
US20160340947A1 (en) 2016-11-24
KR20180010249A (ko) 2018-01-30
JP2018515936A (ja) 2018-06-14
WO2016190982A1 (en) 2016-12-01
US10196845B2 (en) 2019-02-05
TW201703176A (zh) 2017-01-16
TWI697977B (zh) 2020-07-01
KR102319415B1 (ko) 2021-10-28

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Application publication date: 20180126