JP2018514082A - 高速通信のための集積導波管を有するパッケージ構造、半導体ウエハおよび導波管 - Google Patents
高速通信のための集積導波管を有するパッケージ構造、半導体ウエハおよび導波管 Download PDFInfo
- Publication number
- JP2018514082A JP2018514082A JP2017549028A JP2017549028A JP2018514082A JP 2018514082 A JP2018514082 A JP 2018514082A JP 2017549028 A JP2017549028 A JP 2017549028A JP 2017549028 A JP2017549028 A JP 2017549028A JP 2018514082 A JP2018514082 A JP 2018514082A
- Authority
- JP
- Japan
- Prior art keywords
- waveguide
- package
- substrate
- integrated
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/121—Hollow waveguides integrated in a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/16—Dielectric waveguides, i.e. without a longitudinal conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/087—Transitions to a dielectric waveguide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
- H01L2223/6633—Transition between different waveguide types
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
- H01L2224/171—Disposition
- H01L2224/1718—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/17181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
- H01L2924/142—HF devices
- H01L2924/1421—RF devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
- H01L2924/19031—Structure including wave guides being a strip line type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
- H01L2924/19032—Structure including wave guides being a microstrip line type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
- H01L2924/19033—Structure including wave guides being a coplanar line type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
- H01L2924/19038—Structure including wave guides being a hybrid line type
- H01L2924/19039—Structure including wave guides being a hybrid line type impedance transition between different types of wave guides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/037—Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Waveguides (AREA)
- Semiconductor Integrated Circuits (AREA)
- Waveguide Connection Structure (AREA)
- Optical Integrated Circuits (AREA)
Abstract
Description
Claims (20)
- パッケージ構造であって、
集積導波管を含むパッケージ基板と、
前記パッケージ基板に実装された第1の集積回路チップおよび第2の集積回路チップとを含み、
前記第1の集積回路チップは、第1の伝送線路−導波管変換部を使用して前記集積導波管に結合され、
前記第2の集積回路チップは、第2の伝送線路−導波管変換部を使用して前記集積導波管に結合され、
前記第1および第2の集積回路チップは、前記パッケージ基板内で前記集積導波管を使用して信号を伝送することによって通信するように構成された、パッケージ構造。 - 前記パッケージ基板は、
平面基板と、
前記平面基板の互いに対して反対側の表面上に形成された第1のメタライズ層および第2のメタライズ層とを含み、
前記第1および第2の伝送線路−導波管変換部の少なくとも一部は、前記第1および第2のメタライズ層のうちの少なくとも一方から形成され、
前記集積導波管は、
前記第1のメタライズ層からパターン形成された第1の金属板と、
前記第2のメタライズ層からパターン形成された第2の金属板と、
前記第1の金属板と前記第2の金属板との間に配置された側壁とを含み、
前記側壁は、前記第1の金属板と前記第2の金属板とを接続する、前記平面基板を貫通して形成された一連の導電性ビアを含む、請求項1に記載のパッケージ構造。 - 前記平面基板は、貼り合わされた第1の基板と第2の基板とを少なくとも含み、前記第1の基板は前記第1の伝送線路−導波管変換部の一部を形成する第1のプローブ要素と、前記第2の伝送線路−導波管変換部の一部を形成する第2のプローブ要素とを含み、前記第1および第2のプローブ要素は前記第1の基板内に形成された導電性埋め込みビアを含む、請求項2に記載のパッケージ構造。
- 前記パッケージ基板はガラス基板を含む、請求項1に記載のパッケージ構造。
- 前記パッケージ基板は高抵抗シリコン基板を含む、請求項1に記載のパッケージ構造。
- アプリケーション・ボードをさらに含み、
前記集積導波管を含む前記パッケージ基板は、前記パッケージ基板が前記アプリケーション・ボードと前記第1および第2の集積回路チップとの間のインターポーザの役割を果たすように前記アプリケーション・ボードに実装され、
前記パッケージ基板は、前記パッケージ基板を貫通して形成された複数の導電性ビアと、前記パッケージ基板の表面上に形成された配線パターンとを含み、
前記パッケージ基板の前記導電性ビアと前記配線パターンとは、前記第1の集積回路チップと前記第2の集積回路チップとの間、および前記アプリケーション・ボードと前記第1および第2の集積回路チップとの間で低周波信号をルーティングするとともに前記アプリケーション・ボードから前記第1および第2の集積回路チップに直流電力を配電するように構成された、請求項1に記載のパッケージ構造。 - アプリケーション・ボードをさらに含み、
前記第1および第2の集積回路チップの活性面が前記集積導波管を含む前記パッケージ基板に実装され、
前記アプリケーション・ボードは、前記第1および第2の集積回路チップが前記アプリケーション・ボードと前記パッケージ基板との間に配置されるように前記第1および第2の集積回路チップの不活性面に実装され、
前記第1および第2の集積回路チップは、前記第1および第2の集積回路チップのバルク基板層内に形成された貫通シリコン・ビアを含み、前記貫通シリコン・ビアは、前記アプリケーション・ボードと前記第1および第2の集積回路チップのBEOL(バック・エンド・オブ・ライン)構造との間に電気接続を与える、請求項1に記載のパッケージ構造。 - アプリケーション・ボードをさらに含み、
前記第1および第2の集積回路チップはそれぞれシリコン・オン・インシュレータ(SOI)基板を含み、前記SOI基板はBEOL(バック・エンド・オブ・ライン)構造と活性シリコン層と埋め込み酸化物層とを含み、
前記第1および第2の集積回路チップの前記埋め込み酸化物層は前記集積導波管を含む前記パッケージ基板に接着され、
前記アプリケーション・ボードは、前記第1および第2の集積回路チップが前記アプリケーション・ボードと前記パッケージ基板との間に配置されるように前記第1および第2の集積回路チップの前記BEOL構造に実装され、
前記第1および第2の伝送線路−導波管変換部の少なくとも一部が、前記活性シリコン層および前記埋め込み酸化物層の領域内に形成されたメタライズ構造を含む、請求項1に記載のパッケージ構造。 - 前記パッケージ基板は前記集積導波管が形成されたアプリケーション・ボードを含む、請求項1に記載のパッケージ構造。
- 前記パッケージ基板に実装されたアンテナ・パッケージをさらに含み、前記パッケージ基板は前記アンテナ・パッケージと前記第1および第2の集積回路チップとを接続する集積電力結合器構造を含み、前記集積電力結合器は、前記パッケージ基板内に一体的に形成された集積導波管構造を含む、請求項1に記載のパッケージ構造。
- 前記パッケージ基板に実装されたアンテナ・パッケージをさらに含み、前記パッケージ基板は前記アンテナ・パッケージと前記第1および第2の集積回路チップとを接続する集積電力分配器構造を含み、前記集積電力分配器は前記パッケージ基板内に一体的に形成された集積導波管構造を含む、請求項1に記載のパッケージ構造。
- 前記パッケージ基板に接続された導波管インターフェースをさらに含み、前記導波管インターフェースは金属導波管または誘電体導波管に結合するように構成され、前記パッケージ基板は前記導波管インターフェースを前記第1の集積回路チップと前記第2の集積回路チップのうちの少なくとも一方に接続する第2の集積導波管を含む、請求項1に記載のパッケージ構造。
- 前記第1および第2の伝送線路−導波管変換部は、マイクロストップ−導波管変換部と、コプレーナ導波管−導波管変換部と、ストリップライン−導波管変換部と、スロット給電部−導波管変換部とのうちの1つを含む、請求項1に記載のパッケージ構造。
- 前記第1の伝送線路−導波管変換部と前記第2の伝送線路−導波管部のうちの少なくとも一方が、スロット給電部−導波管変換部を含み、前記スロット給電部−導波管変換部は、
前記集積導波管の第1の金属板の縁部領域において互いに隣接してパターン形成された第1および第2のスロットを含み、
前記第1および第2のスロットの第1の長さ部分が前記第1の金属板の縁部から平行に延び、
前記第1および第2のスロットの第2の長さ部分がそれぞれの前記第1の長さ部分の端部から分岐角度で延び、
前記第1のスロットと前記第2のスロットとの間の前記第1の金属板の部分が、前記スロット給電部−導波管変換部に対して信号線接続を与え、
前記第1および第2のスロットの互いに対して反対側の前記第1の金属板の部分が、前記スロット給電部−導波管変換部に対して接地接続を与える、請求項1に記載のパッケージ構造。 - 半導体ウエハであって、
バルク基板層と、
活性シリコン層と、
前記活性層上に形成されたBEOL(バック・エンド・オブ・ライン)層と、
少なくとも部分的に前記バルク基板層内に形成された集積導波管と、
第1の伝送線路−導波管変換部と、
第2の伝送線路−導波管変換部と、
前記第1の伝送線路−導波管変換部を介して前記集積導波管に結合された第1の集積回路と、
前記第2の伝送線路−導波管変換部を介して前記集積導波管に結合された第2の集積回路とを含み、
前記半導体ウエハの前記第1および第2の集積回路は、前記集積導波管を使用して信号を伝送することによって通信するように構成された、半導体ウエハ。 - 前記集積導波管は、
第1のメタライズ層からパターン形成された第1の金属板と、
第2のメタライズ層からパターン形成された第2の金属板と、
前記第1の金属板と前記第2の金属板との間に配置された側壁とを含み、
前記第1のメタライズ層は前記BEOL層のメタライズ層を含み、
前記第2のメタライズ層は前記バルク基板層上に形成され、
前記側壁は、前記活性層と前記バルク基板とを貫通して形成されて前記第1の金属板と前記第2の金属板とを接続する一連の導電性貫通シリコン・ビアを含み、
前記第1および第2の伝送線路−導波管変換部の少なくとも一部が前記第1のメタライズ層から形成された、請求項15に記載の半導体ウエハ。 - 前記バルク基板層は高抵抗シリコン基板を含む、請求項16に記載の半導体ウエハ。
- 請求項15の半導体ウエハを含むパッケージ構造であって、前記BEOL層とパッケージ・キャリアの表面との間のマイクロ・バンプ接続部の配列を使用して前記パッケージ・キャリアの前記表面に実装された前記半導体ウエハを備える前記パッケージ・キャリアを含む、パッケージ構造。
- 請求項15に記載の半導体ウエハを含むパッケージ構造であって、前記バルク基板層とパッケージ・キャリアの表面との間のマイクロ・バンプ接続部の配列を使用して前記パッケージ・キャリアの前記表面に実装された前記半導体ウエハを備える前記パッケージ・キャリアを含み、前記バルク基板層は、前記パッケージ・キャリアと前記BEOL層との間に電気的相互接続を設けるために複数の貫通シリコン・ビアを含む、パッケージ構造。
- 導波管であって、
第1の金属板と、
第2の金属板と、
前記第1の金属板と前記第2の金属板とを接続する金属側壁と、
前記第1の金属板の縁部領域に形成されたスロット給電部−導波管変換部とを含み、
前記スロット給電部−導波管変換部は、
前記第1の金属板の前記縁部領域において互いに隣接してパターン形成された第1および第2のスロットを含み、
前記第1および第2のスロットの第1の長さ部分が前記金属板の縁部から平行に延び、
前記第1および第2のスロットの第2の長さ部分がそれぞれの前記第1の長さ部分の端部から分岐角度で延び、
前記第1のスロットと前記第2のスロットとの間の前記第1の金属板の部分が、前記スロット給電部−導波管変換部に対して信号線接続を与え、
前記第1および第2のスロットの互いに対して反対側の前記第1の金属板の部分が、前記スロット給電部−導波管変換部に対して接地接続を与える、導波管。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/662,610 US9537199B2 (en) | 2015-03-19 | 2015-03-19 | Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips |
US14/662,610 | 2015-03-19 | ||
PCT/CN2016/073787 WO2016145960A1 (en) | 2015-03-19 | 2016-02-15 | Package structures having integrated waveguides for high speed communications between package components |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018514082A true JP2018514082A (ja) | 2018-05-31 |
JP6879925B2 JP6879925B2 (ja) | 2021-06-02 |
Family
ID=56919560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017549028A Active JP6879925B2 (ja) | 2015-03-19 | 2016-02-15 | 高速通信のための集積導波管を有するパッケージ構造、半導体ウエハおよび導波管 |
Country Status (6)
Country | Link |
---|---|
US (5) | US9537199B2 (ja) |
JP (1) | JP6879925B2 (ja) |
CN (1) | CN107431064A (ja) |
DE (1) | DE112016000846T5 (ja) |
GB (1) | GB2551298B (ja) |
WO (1) | WO2016145960A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024034303A1 (ja) * | 2022-08-10 | 2024-02-15 | 株式会社村田製作所 | 高周波モジュール、通信装置、及び高周波モジュールの製造方法 |
Families Citing this family (92)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10785911B2 (en) | 2011-12-15 | 2020-09-29 | Marion Calmer | Stalk roll with hybrid flute having a sharp edge and two blunt edges |
US8863487B2 (en) | 2012-11-30 | 2014-10-21 | Marion Calmer | Narrow row head unit |
JP6249648B2 (ja) * | 2013-06-28 | 2017-12-20 | キヤノン株式会社 | プリント回路板及び電子機器 |
US9537199B2 (en) * | 2015-03-19 | 2017-01-03 | International Business Machines Corporation | Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips |
US9443824B1 (en) * | 2015-03-30 | 2016-09-13 | Qualcomm Incorporated | Cavity bridge connection for die split architecture |
US9867294B2 (en) * | 2015-05-22 | 2018-01-09 | Ciena Corporation | Multi-width waveguides |
US9842813B2 (en) * | 2015-09-21 | 2017-12-12 | Altera Corporation | Tranmission line bridge interconnects |
US9852988B2 (en) | 2015-12-18 | 2017-12-26 | Invensas Bonding Technologies, Inc. | Increased contact alignment tolerance for direct bonding |
KR102384505B1 (ko) * | 2016-01-12 | 2022-04-08 | 삼성전자주식회사 | 칩 간 무선 통신을 제공하기 위한 방법 및 장치 |
US10613216B2 (en) * | 2016-05-31 | 2020-04-07 | Honeywell International Inc. | Integrated digital active phased array antenna and wingtip collision avoidance system |
US11309619B2 (en) * | 2016-09-23 | 2022-04-19 | Intel Corporation | Waveguide coupling systems and methods |
US10446487B2 (en) | 2016-09-30 | 2019-10-15 | Invensas Bonding Technologies, Inc. | Interface structures and methods for forming same |
US10580735B2 (en) | 2016-10-07 | 2020-03-03 | Xcelsis Corporation | Stacked IC structure with system level wiring on multiple sides of the IC die |
US10199707B2 (en) * | 2016-10-13 | 2019-02-05 | Aptiv Technologies Limited | Ball-grid-array radio-frequency integrated-circuit printed-circuit-board assembly for automated vehicles |
KR101963936B1 (ko) * | 2016-11-08 | 2019-07-31 | 한국과학기술원 | 전자파 신호 송수신 안테나 및 em-터널이 내장된 구조를 갖는 인쇄회로기판 및 그 제작 방법 |
WO2018126052A1 (en) | 2016-12-29 | 2018-07-05 | Invensas Bonding Technologies, Inc. | Bonded structures with integrated passive component |
WO2018125150A1 (en) * | 2016-12-29 | 2018-07-05 | Intel Corporation | High frequency waveguide structure |
US11165129B2 (en) | 2016-12-30 | 2021-11-02 | Intel Corporation | Dispersion reduced dielectric waveguide comprising dielectric materials having respective dispersion responses |
DE112016007565T5 (de) * | 2016-12-30 | 2019-10-02 | Intel Corporation | Mikroelektronische bauelemente, entworfen mit 3d-gestapelten, ultradünnen gehäusemodulen für hochfrequenz-kommunikationen |
US10276909B2 (en) * | 2016-12-30 | 2019-04-30 | Invensas Bonding Technologies, Inc. | Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein |
US10468736B2 (en) | 2017-02-08 | 2019-11-05 | Aptiv Technologies Limited | Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition |
US10629577B2 (en) | 2017-03-16 | 2020-04-21 | Invensas Corporation | Direct-bonded LED arrays and applications |
US10784191B2 (en) | 2017-03-31 | 2020-09-22 | Invensas Bonding Technologies, Inc. | Interface structures and methods for forming same |
US10658739B2 (en) * | 2017-05-04 | 2020-05-19 | Mellanox Technologies, Ltd. | Wireless printed circuit board assembly with integral radio frequency waveguide |
US10199336B2 (en) * | 2017-05-24 | 2019-02-05 | Advanced Semiconductor Engineering, Inc. | Antenna package device |
US11211345B2 (en) * | 2017-06-19 | 2021-12-28 | Intel Corporation | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same |
US11204411B2 (en) * | 2017-06-22 | 2021-12-21 | Infineon Technologies Ag | Radar systems and methods of operation thereof |
DE102017214871A1 (de) | 2017-08-24 | 2019-02-28 | Astyx Gmbh | Übergang von einer Streifenleitung auf einen Hohlleiter |
US11527696B2 (en) * | 2017-10-05 | 2022-12-13 | Google Llc | Low footprint resonator in flip chip geometry |
US10811754B2 (en) * | 2017-10-13 | 2020-10-20 | Commscope Technologies Llc | Power couplers and related devices having antenna element power absorbers |
CN107994341B (zh) * | 2017-11-08 | 2021-08-13 | 湖北三江航天险峰电子信息有限公司 | 一种天线馈电结构 |
KR102028714B1 (ko) * | 2017-12-06 | 2019-10-07 | 삼성전자주식회사 | 안테나 모듈 및 안테나 모듈 제조 방법 |
US11169326B2 (en) | 2018-02-26 | 2021-11-09 | Invensas Bonding Technologies, Inc. | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects |
CN110401008B (zh) * | 2018-04-25 | 2022-02-25 | 华为技术有限公司 | 带有封装天线的封装架构及通信设备 |
US11329359B2 (en) | 2018-05-18 | 2022-05-10 | Intel Corporation | Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities |
US11424196B2 (en) * | 2018-06-01 | 2022-08-23 | Analog Devices, Inc. | Matching circuit for integrated circuit die |
US11462480B2 (en) * | 2018-06-27 | 2022-10-04 | Intel Corporation | Microelectronic assemblies having interposers |
US11387533B2 (en) * | 2018-07-11 | 2022-07-12 | Infineon Technologies Ag | Semiconductor package with plastic waveguide |
US10749237B2 (en) | 2018-07-31 | 2020-08-18 | Semiconductor Components Industries, Llc | Substrate integrated waveguide and method for manufacturing the same |
US11515291B2 (en) | 2018-08-28 | 2022-11-29 | Adeia Semiconductor Inc. | Integrated voltage regulator and passive components |
US10373901B1 (en) * | 2018-09-26 | 2019-08-06 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method thereof |
US11515611B2 (en) * | 2018-10-17 | 2022-11-29 | Metawave Corporation | Transition in a multi-layer substrate between a substrate integrated waveguide portion and a coplanar waveguide portion |
CN111193087A (zh) * | 2018-11-14 | 2020-05-22 | 日本电产株式会社 | 波导装置以及信号发生装置 |
US10992017B2 (en) * | 2018-11-15 | 2021-04-27 | Intel Corporation | Semiconductor package comprising chiplets disposed on a substrate which are electromagnetically coupled by dielectric waveguides and a computing networks formed therefrom |
US11557545B2 (en) * | 2018-12-04 | 2023-01-17 | Qorvo Us, Inc. | Monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shielding |
US10749268B2 (en) * | 2018-12-14 | 2020-08-18 | GM Global Technology Operations LLC | Aperture-coupled microstrip antenna array |
DE102019102784A1 (de) * | 2019-02-05 | 2020-08-06 | Infineon Technologies Ag | Halbleitervorrichtungen mit Radar-Halbleiterchip und zugehörige Herstellungsverfahren |
USD1023700S1 (en) | 2019-02-12 | 2024-04-23 | Calmer Holding Company, Llc | Stalk roll |
US11901281B2 (en) | 2019-03-11 | 2024-02-13 | Adeia Semiconductor Bonding Technologies Inc. | Bonded structures with integrated passive component |
US11605603B2 (en) * | 2019-03-22 | 2023-03-14 | Intel Corporation | Microelectronic package with radio frequency (RF) chiplet |
US11728290B2 (en) * | 2019-03-22 | 2023-08-15 | Intel Corporation | Waveguide fan-out |
US11527808B2 (en) * | 2019-04-29 | 2022-12-13 | Aptiv Technologies Limited | Waveguide launcher |
DE102019115307A1 (de) * | 2019-06-06 | 2020-12-10 | Infineon Technologies Ag | Halbleitervorrichtungen mit planaren wellenleiter-übertragungsleitungen |
CN110473789A (zh) * | 2019-07-25 | 2019-11-19 | 成都嘉纳海威科技有限责任公司 | 一种用于射频系统三维集成的封装结构及其设计方法 |
US11399428B2 (en) | 2019-10-14 | 2022-07-26 | International Business Machines Corporation | PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication |
US11658378B2 (en) | 2019-10-14 | 2023-05-23 | International Business Machines Corporation | Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB) |
DE102019217735A1 (de) * | 2019-11-18 | 2021-05-20 | Vega Grieshaber Kg | Radarchip mit einer Hohlleitereinkopplung |
DE102019217736A1 (de) * | 2019-11-18 | 2021-05-20 | Vega Grieshaber Kg | Radarchip mit einer Hohlleitereinkopplung |
US11762200B2 (en) | 2019-12-17 | 2023-09-19 | Adeia Semiconductor Bonding Technologies Inc. | Bonded optical devices |
CN111146549B (zh) * | 2020-01-14 | 2021-04-20 | 电子科技大学 | 基于耦合结构的接地共面波导功率分配/合成网络 |
IT202000001822A1 (it) | 2020-01-30 | 2021-07-30 | St Microelectronics Srl | Circuito integrato e dispositivo elettronico comprendente una pluralita' di circuiti integrati accoppiati elettricamente tramite un segnale di sincronizzazione instradato attraverso il circuito integrato |
IT202000001819A1 (it) * | 2020-01-30 | 2021-07-30 | St Microelectronics Srl | Circuito integrato e dispositivo elettronico comprendente una pluralita' di circuiti integrati accoppiati elettricamente tramite un segnale di sincronizzazione |
CN111313134B (zh) * | 2020-02-29 | 2021-09-10 | 西安理工大学 | 一种采用tsv技术的增强耦合型三维发夹滤波器 |
DE102020203971A1 (de) * | 2020-03-26 | 2021-09-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Hochfrequenzanordnung mit zwei miteinander verbundenen Hochfrequenzkomponenten |
TW202217377A (zh) | 2020-07-06 | 2022-05-01 | 新加坡商光子智能私人有限公司 | 積體電路中介層、系統、裝置、製造積體電路中介層的方法、以及用於從多個節點向目的地傳輸資訊的方法與系統 |
US11555828B2 (en) * | 2020-07-07 | 2023-01-17 | Micron Technology, Inc. | Testing probe system for testing semiconductor die, multi-channel die having shared pads, and related systems and methods |
DE102020122073A1 (de) | 2020-08-24 | 2022-02-24 | Infineon Technologies Ag | Vorrichtungen mit koax-ähnlichen elektrischen Verbindungen und Verfahren zu deren Herstellung |
US11901270B2 (en) * | 2020-09-02 | 2024-02-13 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package |
US11362436B2 (en) | 2020-10-02 | 2022-06-14 | Aptiv Technologies Limited | Plastic air-waveguide antenna with conductive particles |
US11757166B2 (en) | 2020-11-10 | 2023-09-12 | Aptiv Technologies Limited | Surface-mount waveguide for vertical transitions of a printed circuit board |
CN112397477B (zh) * | 2020-11-17 | 2023-03-21 | 成都仕芯半导体有限公司 | 毫米波芯片封装系统 |
US11749883B2 (en) | 2020-12-18 | 2023-09-05 | Aptiv Technologies Limited | Waveguide with radiation slots and parasitic elements for asymmetrical coverage |
US11901601B2 (en) | 2020-12-18 | 2024-02-13 | Aptiv Technologies Limited | Waveguide with a zigzag for suppressing grating lobes |
US11681015B2 (en) * | 2020-12-18 | 2023-06-20 | Aptiv Technologies Limited | Waveguide with squint alteration |
US11626668B2 (en) | 2020-12-18 | 2023-04-11 | Aptiv Technologies Limited | Waveguide end array antenna to reduce grating lobes and cross-polarization |
US11502420B2 (en) | 2020-12-18 | 2022-11-15 | Aptiv Technologies Limited | Twin line fed dipole array antenna |
US11444364B2 (en) | 2020-12-22 | 2022-09-13 | Aptiv Technologies Limited | Folded waveguide for antenna |
US20230420396A1 (en) * | 2020-12-23 | 2023-12-28 | Intel Corporation | Device-to-device communication system, packages, and package system |
KR20220096262A (ko) * | 2020-12-30 | 2022-07-07 | 코닝 인코포레이티드 | 유리 기판에 기초한 SIW(Substrate integrated waveguide) 및 이를 포함하는 EPA(Electromagnetic Phased Array) |
US11668787B2 (en) | 2021-01-29 | 2023-06-06 | Aptiv Technologies Limited | Waveguide with lobe suppression |
US11721905B2 (en) | 2021-03-16 | 2023-08-08 | Aptiv Technologies Limited | Waveguide with a beam-forming feature with radiation slots |
US11616306B2 (en) | 2021-03-22 | 2023-03-28 | Aptiv Technologies Limited | Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board |
CN113078431B (zh) * | 2021-03-26 | 2022-03-15 | 电子科技大学 | 一种宽带高平坦度太赫兹片间互连结构 |
FI20215481A1 (en) * | 2021-04-26 | 2022-10-27 | Teknologian Tutkimuskeskus Vtt Oy | High frequency electrical module |
US11973268B2 (en) | 2021-05-03 | 2024-04-30 | Aptiv Technologies AG | Multi-layered air waveguide antenna with layer-to-layer connections |
US11962085B2 (en) | 2021-05-13 | 2024-04-16 | Aptiv Technologies AG | Two-part folded waveguide having a sinusoidal shape channel including horn shape radiating slots formed therein which are spaced apart by one-half wavelength |
US20220406725A1 (en) * | 2021-06-17 | 2022-12-22 | Intel Corporation | Glass package core with planar structures |
US11616282B2 (en) | 2021-08-03 | 2023-03-28 | Aptiv Technologies Limited | Transition between a single-ended port and differential ports having stubs that match with input impedances of the single-ended and differential ports |
FR3127642B1 (fr) * | 2021-09-28 | 2024-04-19 | Commissariat Energie Atomique | Microcircuit à guide d’onde intégré |
CN114709579B (zh) * | 2022-04-06 | 2022-12-09 | 南京大学 | 一种片上集成太赫兹功能芯片的波导封装 |
CN116931167A (zh) * | 2022-04-08 | 2023-10-24 | 南京光智元科技有限公司 | 转接板、光芯片封装、计算加速器及其制造方法 |
WO2024090990A1 (ko) * | 2022-10-25 | 2024-05-02 | 삼성전자 주식회사 | 배선을 포함하는 전자 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013126099A (ja) * | 2011-12-14 | 2013-06-24 | Sony Corp | 導波路およびこれを備えたインターポーザ基板ならびにモジュールおよび電子機器 |
US20140154999A1 (en) * | 2012-12-03 | 2014-06-05 | Broadcom Corporation | Waveguide for intra-package data transfer |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07221223A (ja) | 1994-02-03 | 1995-08-18 | Mitsubishi Electric Corp | 半導体装置,及び混成集積回路装置 |
US6175287B1 (en) | 1997-05-28 | 2001-01-16 | Raytheon Company | Direct backside interconnect for multiple chip assemblies |
EP0961321B1 (en) | 1998-05-29 | 2008-03-05 | Kyocera Corporation | High-frequency module |
US6967347B2 (en) | 2001-05-21 | 2005-11-22 | The Regents Of The University Of Colorado | Terahertz interconnect system and applications |
KR100626647B1 (ko) * | 2003-11-06 | 2006-09-21 | 한국전자통신연구원 | 비아를 이용한 도파관 필터 |
US7183653B2 (en) * | 2003-12-17 | 2007-02-27 | Intel Corporation | Via including multiple electrical paths |
US7557758B2 (en) * | 2007-03-26 | 2009-07-07 | Broadcom Corporation | Very high frequency dielectric substrate wave guide |
US8032089B2 (en) | 2006-12-30 | 2011-10-04 | Broadcom Corporation | Integrated circuit/printed circuit board substrate structure and communications |
US7809329B2 (en) | 2007-01-31 | 2010-10-05 | Broadcom Corporation | Shared RF bus structure |
EP2258022A4 (en) * | 2008-03-18 | 2012-10-31 | Shi Cheng | SUBSTRATE INTEGRATED WAVEGUIDE |
US8253231B2 (en) * | 2008-09-23 | 2012-08-28 | Marvell International Ltd. | Stacked integrated circuit package using a window substrate |
SG171479A1 (en) * | 2009-11-17 | 2011-06-29 | Sony Corp | Signal transmission channel |
FR2953651B1 (fr) * | 2009-12-07 | 2012-01-20 | Eads Defence & Security Sys | Dispositif de transition hyperfrequence entre une ligne a micro-ruban et un guide d'onde rectangulaire |
JP5493801B2 (ja) * | 2009-12-14 | 2014-05-14 | 富士通株式会社 | 信号変換器及び高周波回路モジュール |
US9666635B2 (en) * | 2010-02-19 | 2017-05-30 | Synaptics Incorporated | Fingerprint sensing circuit |
US8536718B2 (en) * | 2010-06-24 | 2013-09-17 | Stats Chippac Ltd. | Integrated circuit packaging system with trenches and method of manufacture thereof |
US9123737B2 (en) | 2010-09-21 | 2015-09-01 | Texas Instruments Incorporated | Chip to dielectric waveguide interface for sub-millimeter wave communications link |
JP2012089997A (ja) | 2010-10-18 | 2012-05-10 | Sony Corp | 信号伝送装置、電子機器、及び、信号伝送方法 |
CN103650235B (zh) * | 2011-07-04 | 2015-03-25 | 华为技术有限公司 | 耦合布置 |
US20130265733A1 (en) | 2012-04-04 | 2013-10-10 | Texas Instruments Incorporated | Interchip communication using an embedded dielectric waveguide |
US9537199B2 (en) * | 2015-03-19 | 2017-01-03 | International Business Machines Corporation | Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips |
-
2015
- 2015-03-19 US US14/662,610 patent/US9537199B2/en active Active
- 2015-06-25 US US14/750,033 patent/US9531052B2/en active Active
-
2016
- 2016-02-15 DE DE112016000846.5T patent/DE112016000846T5/de active Pending
- 2016-02-15 GB GB1714391.8A patent/GB2551298B/en active Active
- 2016-02-15 JP JP2017549028A patent/JP6879925B2/ja active Active
- 2016-02-15 WO PCT/CN2016/073787 patent/WO2016145960A1/en active Application Filing
- 2016-02-15 CN CN201680015950.9A patent/CN107431064A/zh active Pending
- 2016-07-28 US US15/222,230 patent/US10056672B2/en active Active
- 2016-07-28 US US15/222,169 patent/US10033081B2/en active Active
- 2016-07-28 US US15/222,119 patent/US10038232B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013126099A (ja) * | 2011-12-14 | 2013-06-24 | Sony Corp | 導波路およびこれを備えたインターポーザ基板ならびにモジュールおよび電子機器 |
US20140154999A1 (en) * | 2012-12-03 | 2014-06-05 | Broadcom Corporation | Waveguide for intra-package data transfer |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024034303A1 (ja) * | 2022-08-10 | 2024-02-15 | 株式会社村田製作所 | 高周波モジュール、通信装置、及び高周波モジュールの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US10033081B2 (en) | 2018-07-24 |
WO2016145960A1 (en) | 2016-09-22 |
US9537199B2 (en) | 2017-01-03 |
US20160336282A1 (en) | 2016-11-17 |
US20160336637A1 (en) | 2016-11-17 |
DE112016000846T5 (de) | 2017-11-09 |
GB2551298A (en) | 2017-12-13 |
CN107431064A (zh) | 2017-12-01 |
US9531052B2 (en) | 2016-12-27 |
US10056672B2 (en) | 2018-08-21 |
GB201714391D0 (en) | 2017-10-25 |
US20160336638A1 (en) | 2016-11-17 |
US10038232B2 (en) | 2018-07-31 |
US20160276727A1 (en) | 2016-09-22 |
US20160276729A1 (en) | 2016-09-22 |
JP6879925B2 (ja) | 2021-06-02 |
GB2551298B (en) | 2018-04-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6879925B2 (ja) | 高速通信のための集積導波管を有するパッケージ構造、半導体ウエハおよび導波管 | |
US11658390B2 (en) | Wireless communications package with integrated antenna array | |
US10103450B2 (en) | Integration of area efficient antennas for phased array or wafer scale array antenna applications | |
JP6639859B2 (ja) | 切替え可能送受信フェーズド・アレイ・アンテナ | |
US9196951B2 (en) | Millimeter-wave radio frequency integrated circuit packages with integrated antennas | |
CN108172564B (zh) | 一种毫米波天线与硅基组件三维集成封装 | |
US9985346B2 (en) | Wireless communications package with integrated antennas and air cavity | |
US8018384B2 (en) | Method and apparatus for packaging an integrated chip and antenna | |
KR101702717B1 (ko) | 밀리미터파 회로 보드를 위한 시스템 및 방법 | |
US20230335524A1 (en) | Integrated circuit and electronic device comprising a plurality of integrated circuits electrically coupled through a synchronization signal | |
GB2499792A (en) | Electronic device comprising an electronic die, a substrate integrated waveguide (SIW) and a flip-chip ball grid array package | |
JP5728101B1 (ja) | Mmic集積回路モジュール | |
US20220416393A1 (en) | Waveguide interconnects for semiconductor packages and related methods | |
JP7067640B2 (ja) | 電磁バンドギャップ構造、及び、パッケージ構造 | |
EP4346007A1 (en) | Contactless multi-drop and broadcast bidirectional communication system | |
CN112397477B (zh) | 毫米波芯片封装系统 | |
US20240154320A1 (en) | Antenna apparatus employing coplanar waveguide interconnect between rf components | |
US20230240001A1 (en) | Wiring Board and Signal Connecting Structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171012 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181023 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20191031 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191203 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20200227 |
|
RD12 | Notification of acceptance of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7432 Effective date: 20200306 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20200306 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200502 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201110 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201209 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210420 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210430 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6879925 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |