JP2018512262A - コイルコーティング方法 - Google Patents
コイルコーティング方法 Download PDFInfo
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- 238000000576 coating method Methods 0.000 title claims abstract description 82
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- 239000002966 varnish Substances 0.000 claims abstract description 52
- 239000011248 coating agent Substances 0.000 claims abstract description 39
- 238000007761 roller coating Methods 0.000 claims abstract description 6
- 229920000642 polymer Polymers 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000005096 rolling process Methods 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 81
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- 229910001297 Zn alloy Inorganic materials 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000002508 contact lithography Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009429 electrical wiring Methods 0.000 description 2
- 150000007530 organic bases Chemical class 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- 241001163841 Albugo ipomoeae-panduratae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010382 chemical cross-linking Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
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- 238000000465 moulding Methods 0.000 description 1
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- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
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- 238000005507 spraying Methods 0.000 description 1
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- 230000008646 thermal stress Effects 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/043—Printed circuit coils by thick film techniques
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
- B05D7/26—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials synthetic lacquers or varnishes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/50—Multilayers
- B05D7/52—Two layers
- B05D7/54—No clear coat specified
- B05D7/542—No clear coat specified the two layers being cured or baked together
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Power Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Pest Control & Pesticides (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims (20)
- 連続ベルトにある連続金属帯(3)を多層コーティングするためのコイルコーティング方法であって、
前記金属帯(3)の平坦面(4)上に、ローラ塗布を用いて硬化性ポリマー下塗り(9)を塗布し、硬化させて電気絶縁下塗り層(10)を形成し、
この下塗り層(10)上に、ローラ塗布を用いて硬化性ポリマーワニス(11)を塗布し、硬化させて電気絶縁ワニス層(12)を形成し、
このとき、下塗り層(10)とワニス層(12)の間に、少なくとも1つの少なくとも導電性のトラック(15)を、少なくとも一部の領域にプリントするコイルコーティング方法において、
前記予備硬化させた下塗り層(10)の一部の領域に前記伝導性トラック(15)をプリントすることと、
伝導性トラック(15)とワニス(11)をウェット・オン・ウェットで塗布することと
を特徴とするコイルコーティング方法。 - 前記塗布した下塗り(9)を、少なくともゲル化点まで予備硬化させることを特徴とする、請求項1に記載のコイルコーティング方法。
- 下塗り層(10)および/またはワニス層(12)を、150〜300℃の基板温度で乾燥させて硬化させることを特徴とする、請求項1または2に記載のコイルコーティング方法。
- 前記下塗り層(10)を、180〜240℃の基板温度で予備硬化させることを特徴とする、請求項2または3に記載のコイルコーティング方法。
- 下塗り層(10)とワニス層(12)を、220〜260℃の基板温度で最終硬化させることを特徴とする、請求項3または4に記載のコイルコーティング方法。
- 前記伝導性トラック(15)とワニス層(12)を一緒に硬化させることを特徴とする、請求項1〜5のうちいずれか一項に記載のコイルコーティング方法。
- 前記伝導性トラック(15)とワニス層(12)を一緒に1つの作業工程で硬化させることを特徴とする、請求項6に記載のコイルコーティング方法。
- 前記下塗り層(10)および/またはワニス層(12)が、完全硬化された状態で、10〜75℃のガラス転移開始温度(Tg−Onset)を有することを特徴とする、請求項1〜7のうちいずれか一項に記載のコイルコーティング方法。
- 屋内の金属帯(3)では、前記下塗り層(10)のTg−Onsetが10〜35℃であることを特徴とする、請求項8に記載のコイルコーティング方法。
- 屋外の金属帯(3)では、前記下塗り層(10)のTg−Onsetが30〜75℃であることを特徴とする、請求項9に記載のコイルコーティング方法。
- 下塗り層(10)を3〜30μmの層厚で塗布することを特徴とする、請求項1〜10のうちいずれか一項に記載のコイルコーティング方法。
- 前記導電性トラック(15)を15μm以下の層厚で、および/または5mm未満の層幅(25)でプリントすることを特徴とする、請求項1〜11のうちいずれか一項に記載のコイルコーティング方法。
- 下地層(10)とワニス層(12)の間に、少なくとも1つの電気部品(17)をプリントし、前記電気部品(17)と前記伝導性トラック(15)が電気的に接続されることを特徴とする、請求項1〜12のうちいずれか一項に記載のコイルコーティング方法。
- 電気部品(17)として変換器(18)をプリントすることを特徴とする、請求項13に記載のコイルコーティング方法。
- 前記導電性トラック(15)を、ロール・ツー・ロール法を用いてプリントすることを特徴とする、請求項1〜14のうちいずれか一項に記載のコイルコーティング方法。
- 前記導電性トラック(15)を、ローラ塗布を用いてプリントすることを特徴とする、請求項15に記載のコイルコーティング方法。
- 前記導電性トラック(15)を、リピートとしてプリントすることを特徴とする、請求項1〜16のうちいずれか一項に記載のコイルコーティング方法。
- 前記下塗り(9)ならびに前記ワニス(11)を化学的に架橋させることを特徴とする、請求項1〜17のうちいずれか一項に記載のコイルコーティング方法。
- 前記金属帯(3)の前記平坦面(4)に下塗り(9)を塗布する前に、変換層(5)を設けることをを特徴とする、請求項1〜18のうちいずれか一項に記載のコイルコーティング方法。
- 連続的にコーティングした金属帯(3)を複数の層にコーティングすることを特徴とする、請求項1〜19のうちいずれか一項に記載のコイルコーティング方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15155824.4A EP3060031B1 (de) | 2015-02-19 | 2015-02-19 | Coil-coating-verfahren |
EP15155824.4 | 2015-02-19 | ||
PCT/EP2016/053592 WO2016131975A1 (de) | 2015-02-19 | 2016-02-19 | Coil-coating-verfahren |
Publications (2)
Publication Number | Publication Date |
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JP2018512262A true JP2018512262A (ja) | 2018-05-17 |
JP6742326B2 JP6742326B2 (ja) | 2020-08-19 |
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Application Number | Title | Priority Date | Filing Date |
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JP2017542036A Active JP6742326B2 (ja) | 2015-02-19 | 2016-02-19 | コイルコーティング方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10388455B2 (ja) |
EP (1) | EP3060031B1 (ja) |
JP (1) | JP6742326B2 (ja) |
KR (1) | KR102472269B1 (ja) |
CN (1) | CN107567721B (ja) |
AU (1) | AU2016221644B2 (ja) |
WO (1) | WO2016131975A1 (ja) |
ZA (1) | ZA201705021B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021526448A (ja) * | 2018-06-14 | 2021-10-07 | フェストアルピネ シュタール ゲーエムベーハーVoestalpine Stahl Gmbh | ラッカーコートされた電気ストリップを製造する方法及びラッカーコートされた電気ストリップ |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3185658A1 (de) * | 2015-12-23 | 2017-06-28 | Voestalpine Stahl GmbH | Metallband und coil-coating-verfahren |
DE102017204522A1 (de) * | 2017-03-17 | 2018-09-20 | Voestalpine Stahl Gmbh | Verfahren zur Herstellung von lackbeschichteten Elektroblechbändern und lackbeschichtetes Elektroblechband |
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Also Published As
Publication number | Publication date |
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AU2016221644A1 (en) | 2017-10-05 |
KR102472269B1 (ko) | 2022-11-29 |
JP6742326B2 (ja) | 2020-08-19 |
CN107567721A (zh) | 2018-01-09 |
WO2016131975A1 (de) | 2016-08-25 |
KR20170118738A (ko) | 2017-10-25 |
CN107567721B (zh) | 2020-04-28 |
US10388455B2 (en) | 2019-08-20 |
AU2016221644B2 (en) | 2020-07-02 |
ZA201705021B (en) | 2019-05-29 |
EP3060031A1 (de) | 2016-08-24 |
US20180247763A1 (en) | 2018-08-30 |
EP3060031B1 (de) | 2017-05-31 |
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