JP6742326B2 - コイルコーティング方法 - Google Patents
コイルコーティング方法 Download PDFInfo
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- JP6742326B2 JP6742326B2 JP2017542036A JP2017542036A JP6742326B2 JP 6742326 B2 JP6742326 B2 JP 6742326B2 JP 2017542036 A JP2017542036 A JP 2017542036A JP 2017542036 A JP2017542036 A JP 2017542036A JP 6742326 B2 JP6742326 B2 JP 6742326B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/043—Printed circuit coils by thick film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
- B05D7/26—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials synthetic lacquers or varnishes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/50—Multilayers
- B05D7/52—Two layers
- B05D7/54—No clear coat specified
- B05D7/542—No clear coat specified the two layers being cured or baked together
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Power Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Pest Control & Pesticides (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
Claims (20)
- 連続ベルトにある連続金属帯(3)を多層コーティングするためのコイルコーティング方法であって、
前記金属帯(3)の平坦面(4)上に、ローラ塗布を用いて硬化性ポリマー下塗り(9)を塗布し、硬化させて電気絶縁性の下塗り層(10)を形成し、
前記下塗り層(10)上に、ローラ塗布を用いて硬化性ポリマーワニス(11)を塗布し、硬化させて電気絶縁性のワニス層(12)を形成し、
前記下塗り層(10)と前記ワニス層(12)の間に、少なくとも1つの導電性トラック(15)を、少なくとも一部の領域にプリントするコイルコーティング方法において、
予め硬化させた前記下塗り層(10)の一部の領域に前記導電性トラック(15)をプリントすることと、
前記導電性トラック(15)と前記硬化性ポリマーワニス(11)をウェット・オン・ウェットで塗布することと、
を特徴とするコイルコーティング方法。 - 塗布した前記硬化性ポリマー下塗り(9)を、少なくともゲル化点まで予め硬化させることを特徴とする、請求項1に記載のコイルコーティング方法。
- 前記下塗り層(10)および/または前記ワニス層(12)を、150〜300℃の基板温度で乾燥させて硬化させることを特徴とする、請求項1または2に記載のコイルコーティング方法。
- 前記下塗り層(10)を、180〜240℃の基板温度で予め硬化させることを特徴とする、請求項2または3に記載のコイルコーティング方法。
- 前記下塗り層(10)と前記ワニス層(12)を、220〜260℃の基板温度で最後に硬化させることを特徴とする、請求項3または4に記載のコイルコーティング方法。
- 前記導電性トラック(15)と前記ワニス層(12)を一緒に硬化させることを特徴とする、請求項1〜5のうちいずれか一項に記載のコイルコーティング方法。
- 前記導電性トラック(15)と前記ワニス層(12)を一緒に1つの作業工程で硬化させることを特徴とする、請求項6に記載のコイルコーティング方法。
- 前記下塗り層(10)および/または前記ワニス層(12)が、完全硬化された状態で、10〜75℃のガラス転移開始温度(Tg−Onset)を有することを特徴とする、請求項1〜7のうちいずれか一項に記載のコイルコーティング方法。
- 屋内用の金属帯(3)では、前記下塗り層(10)のTg−Onsetが10〜35℃であることを特徴とする、請求項8に記載のコイルコーティング方法。
- 屋外用の金属帯(3)では、前記下塗り層(10)のTg−Onsetが30〜75℃であることを特徴とする、請求項8に記載のコイルコーティング方法。
- 前記下塗り層(10)を3〜30μmの層厚で塗布することを特徴とする、請求項1〜10のうちいずれか一項に記載のコイルコーティング方法。
- 前記導電性トラック(15)を15μm以下の層厚で、および/または5mm未満の層幅(25)でプリントすることを特徴とする、請求項1〜11のうちいずれか一項に記載のコイルコーティング方法。
- 前記下地層(10)と前記ワニス層(12)の間に、少なくとも1つの電気部品(17)をプリントし、前記電気部品(17)と前記導電性トラック(15)が電気的に接続されることを特徴とする、請求項1〜12のうちいずれか一項に記載のコイルコーティング方法。
- 前記電気部品(17)として変換器(18)をプリントすることを特徴とする、請求項13に記載のコイルコーティング方法。
- 前記導電性トラック(15)を、ロール・ツー・ロール法を用いてプリントすることを特徴とする、請求項1〜14のうちいずれか一項に記載のコイルコーティング方法。
- 前記導電性トラック(15)を、ローラ塗布を用いてプリントすることを特徴とする、請求項15に記載のコイルコーティング方法。
- 前記導電性トラック(15)を、繰り返し模様としてプリントすることを特徴とする、請求項1〜16のうちいずれか一項に記載のコイルコーティング方法。
- 前記下塗り(9)ならびに前記硬化性ポリマーワニス(11)を化学的に架橋させることを特徴とする、請求項1〜17のうちいずれか一項に記載のコイルコーティング方法。
- 前記金属帯(3)の前記平坦面(4)に下塗り(9)を塗布する前に、変換層(5)を設けることを特徴とする、請求項1〜18のうちいずれか一項に記載のコイルコーティング方法。
- 連続的にコーティングされた金属帯(3)には、複数のコーティング層が形成されることを特徴とする、請求項1〜19のうちいずれか一項に記載のコイルコーティング方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15155824.4A EP3060031B1 (de) | 2015-02-19 | 2015-02-19 | Coil-coating-verfahren |
EP15155824.4 | 2015-02-19 | ||
PCT/EP2016/053592 WO2016131975A1 (de) | 2015-02-19 | 2016-02-19 | Coil-coating-verfahren |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018512262A JP2018512262A (ja) | 2018-05-17 |
JP6742326B2 true JP6742326B2 (ja) | 2020-08-19 |
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ID=52477704
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Application Number | Title | Priority Date | Filing Date |
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JP2017542036A Active JP6742326B2 (ja) | 2015-02-19 | 2016-02-19 | コイルコーティング方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10388455B2 (ja) |
EP (1) | EP3060031B1 (ja) |
JP (1) | JP6742326B2 (ja) |
KR (1) | KR102472269B1 (ja) |
CN (1) | CN107567721B (ja) |
AU (1) | AU2016221644B2 (ja) |
WO (1) | WO2016131975A1 (ja) |
ZA (1) | ZA201705021B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3185658A1 (de) * | 2015-12-23 | 2017-06-28 | Voestalpine Stahl GmbH | Metallband und coil-coating-verfahren |
DE102017204522A1 (de) * | 2017-03-17 | 2018-09-20 | Voestalpine Stahl Gmbh | Verfahren zur Herstellung von lackbeschichteten Elektroblechbändern und lackbeschichtetes Elektroblechband |
DE102018209553A1 (de) * | 2018-06-14 | 2019-12-19 | Voestalpine Stahl Gmbh | Verfahren zur herstellung von lackbeschichteten elektrobändern und lackbeschichtetes elektroband |
Family Cites Families (21)
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US2782131A (en) * | 1954-06-04 | 1957-02-19 | Du Pont | Methyl methacrylate lacquer coated metal article and process therefor |
US2847323A (en) * | 1955-12-01 | 1958-08-12 | Du Pont | Coated metal articles |
JPS52155679A (en) * | 1976-06-21 | 1977-12-24 | Mitsubishi Rayon Co | Plastic moulding with metallic film and method of its manufacturing |
JPS6242813A (ja) | 1985-08-21 | 1987-02-24 | Seiko Kasei Kk | 導電性キヤステイング皮膜 |
JPH02281421A (ja) * | 1989-04-21 | 1990-11-19 | Fuji Photo Film Co Ltd | 磁気記録媒体の製造方法 |
FR2814688B1 (fr) * | 2000-09-29 | 2003-06-27 | Usinor | Procede et dispositif de revetement en continu d'au moins une face d'une bande metalique par un film fluide monocouche ou multicouches en polymeres reticulable |
JP4337358B2 (ja) | 2003-02-17 | 2009-09-30 | 日立化成工業株式会社 | 積層用中間配線部材、配線板及びそれらの製造方法 |
US20060158497A1 (en) * | 2005-01-14 | 2006-07-20 | Karel Vanheusden | Ink-jet printing of compositionally non-uniform features |
WO2006076607A1 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Ink-jet printing of passive electricalcomponents |
DE102005061319A1 (de) | 2005-12-20 | 2007-06-21 | Basf Ag | Verfahren zum Aufbringen von Korrosionsschutzschichten umfassend Thioamide auf metallische Oberflächen |
US7651032B2 (en) * | 2005-06-22 | 2010-01-26 | Smurfit-Stone Container Enterprises, Inc. | Methods and systems for in-line RFID transponder assembly |
EP1767849A1 (de) * | 2005-09-23 | 2007-03-28 | Alcan Technology & Management Ltd. | Leuchteinrichtung |
MX2008013443A (es) * | 2006-04-26 | 2009-03-10 | Basf Se | Metodo para la aplicacion de capas resistentes a la corrosion a las superficies metalicas. |
US20090236979A1 (en) | 2008-03-24 | 2009-09-24 | Air Products And Chemicals, Inc. | Organic Electroluminescent Device and the Method of Making |
JP2010132736A (ja) * | 2008-12-03 | 2010-06-17 | Toyo Ink Mfg Co Ltd | 導電性インキおよび導電性被膜 |
FR2942169B1 (fr) * | 2009-02-13 | 2011-04-01 | Arjo Wiggins Fine Papers Ltd | Feuille imprimable multicouche a toucher doux ou soyeux et son procede de fabrication |
JP2012051164A (ja) * | 2010-08-31 | 2012-03-15 | Fujifilm Corp | インクジェット記録媒体及び画像形成方法 |
WO2012073329A1 (ja) | 2010-11-30 | 2012-06-07 | トヨタ自動車株式会社 | 重ね塗工装置と両面塗工装置,電極板の製造方法,および,電池の製造方法 |
JP5677911B2 (ja) * | 2011-08-19 | 2015-02-25 | 富士フイルム株式会社 | 導電パターン、その形成方法、プリント配線板及びその製造方法 |
EP2745657A4 (en) * | 2011-08-19 | 2015-04-29 | Fujifilm Corp | CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURING THEREFOR, PCB AND MANUFACTURING METHOD THEREFOR |
DE102011121165A1 (de) | 2011-12-16 | 2013-06-20 | Thyssenkrupp Steel Europe Ag | Metallisches Bauelement oder Flacherzeugnis mit photovoltaisch wirksamer Beschichtung, Verfahren zu dessen Herstellung und aus solchen, miteinander elektrisch verschalteten Bauelementen gebildete Verkleidung |
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2015
- 2015-02-19 EP EP15155824.4A patent/EP3060031B1/de active Active
-
2016
- 2016-02-19 JP JP2017542036A patent/JP6742326B2/ja active Active
- 2016-02-19 WO PCT/EP2016/053592 patent/WO2016131975A1/de active Application Filing
- 2016-02-19 AU AU2016221644A patent/AU2016221644B2/en active Active
- 2016-02-19 CN CN201680010992.3A patent/CN107567721B/zh active Active
- 2016-02-19 KR KR1020177022811A patent/KR102472269B1/ko active IP Right Grant
- 2016-02-19 US US15/552,472 patent/US10388455B2/en active Active
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2017
- 2017-07-24 ZA ZA2017/05021A patent/ZA201705021B/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2018512262A (ja) | 2018-05-17 |
AU2016221644B2 (en) | 2020-07-02 |
KR102472269B1 (ko) | 2022-11-29 |
US10388455B2 (en) | 2019-08-20 |
US20180247763A1 (en) | 2018-08-30 |
CN107567721B (zh) | 2020-04-28 |
WO2016131975A1 (de) | 2016-08-25 |
KR20170118738A (ko) | 2017-10-25 |
AU2016221644A1 (en) | 2017-10-05 |
EP3060031A1 (de) | 2016-08-24 |
EP3060031B1 (de) | 2017-05-31 |
CN107567721A (zh) | 2018-01-09 |
ZA201705021B (en) | 2019-05-29 |
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