JP2018506606A - １ｋ高温用剥離可能接着剤 - Google Patents

１ｋ高温用剥離可能接着剤 Download PDF

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Publication number
JP2018506606A
JP2018506606A JP2017533859A JP2017533859A JP2018506606A JP 2018506606 A JP2018506606 A JP 2018506606A JP 2017533859 A JP2017533859 A JP 2017533859A JP 2017533859 A JP2017533859 A JP 2017533859A JP 2018506606 A JP2018506606 A JP 2018506606A
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JP
Japan
Prior art keywords
siloxane
group
substrate
peelable adhesive
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017533859A
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English (en)
Japanese (ja)
Other versions
JP2018506606A5 (enExample
Inventor
スティーブン・ハインズ
スン・チュンユー
ジアンボ・オーヤン
チェン・ジンチエン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of JP2018506606A publication Critical patent/JP2018506606A/ja
Publication of JP2018506606A5 publication Critical patent/JP2018506606A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2017533859A 2014-12-23 2015-12-08 １ｋ高温用剥離可能接着剤 Pending JP2018506606A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CNPCT/CN2014/094613 2014-12-23
PCT/CN2014/094613 WO2016101129A1 (en) 2014-12-23 2014-12-23 1k high temperature debondable adhesive
PCT/CN2015/096670 WO2016101785A1 (en) 2014-12-23 2015-12-08 1k high temperature debondable adhesive

Publications (2)

Publication Number Publication Date
JP2018506606A true JP2018506606A (ja) 2018-03-08
JP2018506606A5 JP2018506606A5 (enExample) 2018-11-08

Family

ID=56148870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017533859A Pending JP2018506606A (ja) 2014-12-23 2015-12-08 １ｋ高温用剥離可能接着剤

Country Status (7)

Country Link
US (1) US20170283671A1 (enExample)
EP (1) EP3237569A4 (enExample)
JP (1) JP2018506606A (enExample)
KR (1) KR20170099983A (enExample)
CN (1) CN107429142A (enExample)
TW (1) TW201631102A (enExample)
WO (2) WO2016101129A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107001908B (zh) * 2014-06-24 2020-06-09 汉高股份有限及两合公司 单组分uv和热固化高温可脱粘的胶粘剂
KR20190013091A (ko) * 2017-07-31 2019-02-11 다우 실리콘즈 코포레이션 이중 경화성 수지 조성물, 그로부터 형성된 경화물, 및 그러한 경화물을 포함하는 전자 장치
FR3087471B1 (fr) * 2018-10-23 2020-11-06 Saint Gobain Procede d’obtention d’un vitrage isolant
CN110256959B (zh) * 2019-05-21 2021-07-23 郝建强 可uv固化有机硅离型剂
CN110511722B (zh) * 2019-08-23 2020-10-23 复旦大学 一种耐瞬时高温柔性胶黏剂及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH039954A (ja) * 1989-05-25 1991-01-17 Loctite Corp （メタ）アクリロキシアルケニレン官能性プレポリマーの架橋
DD301304A5 (de) * 1989-06-08 1992-11-19 Jenoptik Jena Gmbh Elektronische auswerteschaltung fuer das magnetisch-induktive treffer-anzeige-verfahren
WO1995003355A1 (fr) * 1993-07-26 1995-02-02 Rhone-Poulenc Chimie Resines silicones a n×uds de reticulation thermo- ou hydro- sensibles, reversibles ou non
WO2008133138A1 (ja) * 2007-04-17 2008-11-06 Kaneka Corporation 多面体構造ポリシロキサン変性体および該変性体を用いた組成物

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US4052529A (en) * 1976-03-03 1977-10-04 Dow Corning Corporation Radiation-curable mercaptoalkyl vinyl polydiorganosiloxanes, method of coating there with and coated article
US4558147A (en) * 1983-08-26 1985-12-10 General Electric Company Ultraviolet radiation-curable silicone release compositions
US5162389A (en) * 1983-10-26 1992-11-10 Dow Corning Corporation Fast ultraviolet radiation curing silicone composition having a high refractive index
JP2620303B2 (ja) * 1988-05-12 1997-06-11 東芝シリコーン株式会社 光ファイバー被覆用紫外線硬化型シリコーン樹脂組成物
US5585035A (en) * 1993-08-06 1996-12-17 Minnesota Mining And Manufacturing Company Light modulating device having a silicon-containing matrix
CN1388823A (zh) * 2000-08-17 2003-01-01 日本板硝子株式会社 粘结剂组合物和使用该组合物的光学装置
US20060069176A1 (en) * 2002-08-20 2006-03-30 Bowman Christopher N Polymer derived ceramic materials
EP1728829B1 (en) * 2005-06-03 2007-11-07 Shin-Etsu Chemical Co., Ltd. Addition type silicone adhesive composition
US9243083B2 (en) * 2008-04-03 2016-01-26 Henkel IP & Holding GmbH Thiol-ene cured oil-resistant polyacrylate sealants for in-place gasketing applications
US8823154B2 (en) * 2009-05-08 2014-09-02 The Regents Of The University Of California Encapsulation architectures for utilizing flexible barrier films
EP2565235B1 (en) * 2010-04-26 2014-11-19 ThreeBond Fine Chemical Co., Ltd. Photocurable silicone gel composition and application thereof
EP2657301B1 (en) * 2010-12-22 2015-03-11 Momentive Performance Materials Japan LLC Ultraviolet-curable silicone resin composition and image display device using same
JP2014509668A (ja) * 2011-03-28 2014-04-21 ヘンケル・チャイナ・カンパニー・リミテッド Ｌｅｄ封入用硬化性シリコーン樹脂
WO2013012973A2 (en) * 2011-07-19 2013-01-24 3M Innovative Properties Company Debondable adhesive article and methods of making and using the same
DE102011079687A1 (de) * 2011-07-22 2013-01-24 Wacker Chemie Ag Temporäre Verklebung von chemisch ähnlichen Substraten
CN104487492B (zh) * 2012-06-06 2017-10-24 汉高知识产权控股有限责任公司 乙烯基碳硅氧烷树脂
CN102876249B (zh) * 2012-08-31 2013-10-16 江苏创基新材料有限公司 可剥离型有机硅压敏胶粘剂的制备方法
WO2014052937A1 (en) * 2012-09-28 2014-04-03 Osram Sylvania Inc. Polycyclic polysiloxane composition and led containing same
CN104119832B (zh) * 2013-04-27 2018-02-06 东莞东阳光科研发有限公司 一种有机硅灌封胶制备方法及其应用
JP6675980B2 (ja) * 2013-11-11 2020-04-08 ダウ シリコーンズ コーポレーション Ｕｖ硬化性シリコーン組成物、その硬化生成物、及びその使用方法
US9914807B2 (en) * 2013-11-18 2018-03-13 Florida State University Research Foundation, Inc. Thiol-ene polymer metal oxide nanoparticle high refractive index composites
US9994754B2 (en) * 2014-03-27 2018-06-12 3M Innovative Properties Company Filled polydiorganosiloxane-containing compositions, and methods of using same
CN103897398B (zh) * 2014-03-27 2016-08-17 中科院广州化学有限公司南雄材料生产基地 一种硅溶胶补强的水基有机硅弹性体及其制备方法与应用
KR102335364B1 (ko) * 2014-03-27 2021-12-06 쓰리엠 이노베이티브 프로퍼티즈 캄파니 오가노보란-함유 조성물, 및 그의 사용 방법
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH039954A (ja) * 1989-05-25 1991-01-17 Loctite Corp （メタ）アクリロキシアルケニレン官能性プレポリマーの架橋
DD301304A5 (de) * 1989-06-08 1992-11-19 Jenoptik Jena Gmbh Elektronische auswerteschaltung fuer das magnetisch-induktive treffer-anzeige-verfahren
WO1995003355A1 (fr) * 1993-07-26 1995-02-02 Rhone-Poulenc Chimie Resines silicones a n×uds de reticulation thermo- ou hydro- sensibles, reversibles ou non
WO2008133138A1 (ja) * 2007-04-17 2008-11-06 Kaneka Corporation 多面体構造ポリシロキサン変性体および該変性体を用いた組成物

Also Published As

Publication number Publication date
WO2016101785A1 (en) 2016-06-30
TW201631102A (zh) 2016-09-01
EP3237569A4 (en) 2018-07-04
KR20170099983A (ko) 2017-09-01
EP3237569A1 (en) 2017-11-01
CN107429142A (zh) 2017-12-01
US20170283671A1 (en) 2017-10-05
WO2016101129A1 (en) 2016-06-30

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