TW201631102A - １ｋ高溫可脫膠黏著劑 - Google Patents
１ｋ高溫可脫膠黏著劑 Download PDFInfo
- Publication number
- TW201631102A TW201631102A TW104141239A TW104141239A TW201631102A TW 201631102 A TW201631102 A TW 201631102A TW 104141239 A TW104141239 A TW 104141239A TW 104141239 A TW104141239 A TW 104141239A TW 201631102 A TW201631102 A TW 201631102A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- substrate
- carrier
- decane
- siloxane
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 64
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 74
- 239000000203 mixture Substances 0.000 claims abstract description 72
- -1 polysiloxane Polymers 0.000 claims abstract description 43
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 18
- 238000006243 chemical reaction Methods 0.000 claims abstract description 15
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 10
- 239000004971 Cross linker Substances 0.000 claims abstract description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 72
- 229920001577 copolymer Polymers 0.000 claims description 23
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 20
- 125000003118 aryl group Chemical group 0.000 claims description 19
- 229910052739 hydrogen Inorganic materials 0.000 claims description 16
- 239000001257 hydrogen Substances 0.000 claims description 16
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims description 15
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 11
- 239000003431 cross linking reagent Substances 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 9
- 125000003396 thiol group Chemical class [H]S* 0.000 claims description 8
- 239000003999 initiator Substances 0.000 claims description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 7
- 150000003254 radicals Chemical class 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 5
- 150000002431 hydrogen Chemical class 0.000 claims description 5
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Chemical group 0.000 claims description 4
- XGJOHQNIONPRMI-UHFFFAOYSA-N 4,4-diethyloxane Chemical compound CCC1(CC)CCOCC1 XGJOHQNIONPRMI-UHFFFAOYSA-N 0.000 claims description 3
- 206010073306 Exposure to radiation Diseases 0.000 claims description 3
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 claims description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000005702 oxyalkylene group Chemical group 0.000 claims description 3
- IFZHGQSUNAKKSN-UHFFFAOYSA-N 1,1-diethylhydrazine Chemical compound CCN(N)CC IFZHGQSUNAKKSN-UHFFFAOYSA-N 0.000 claims description 2
- XOQRLXHLTSYZBF-UHFFFAOYSA-N 1-decylphosphonoyldecane Chemical class CCCCCCCCCCP(=O)CCCCCCCCCC XOQRLXHLTSYZBF-UHFFFAOYSA-N 0.000 claims description 2
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 claims description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 2
- 229910000037 hydrogen sulfide Inorganic materials 0.000 claims description 2
- FAQJJMHZNSSFSM-UHFFFAOYSA-N phenylglyoxylic acid Chemical compound OC(=O)C(=O)C1=CC=CC=C1 FAQJJMHZNSSFSM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 claims 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims 1
- 238000007334 copolymerization reaction Methods 0.000 claims 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 229920006294 polydialkylsiloxane Polymers 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- NZARHKBYDXFVPP-UHFFFAOYSA-N tetrathiolane Chemical compound C1SSSS1 NZARHKBYDXFVPP-UHFFFAOYSA-N 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 abstract description 5
- 229920001296 polysiloxane Polymers 0.000 abstract description 2
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 abstract 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract 3
- 238000006459 hydrosilylation reaction Methods 0.000 abstract 3
- 229910000077 silane Inorganic materials 0.000 abstract 3
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 31
- 239000011521 glass Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000003848 UV Light-Curing Methods 0.000 description 5
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000004580 weight loss Effects 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 238000005984 hydrogenation reaction Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 239000010409 thin film Substances 0.000 description 3
- KOHBFAGTEWFCBI-UHFFFAOYSA-N 2-prop-1-enyloxirane Chemical compound CC=CC1CO1 KOHBFAGTEWFCBI-UHFFFAOYSA-N 0.000 description 2
- ZXRUQODFAPSUNV-UHFFFAOYSA-N CC1C(OCCC1)(OC)CC Chemical compound CC1C(OCCC1)(OC)CC ZXRUQODFAPSUNV-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000003480 eluent Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- UYVWNPAMKCDKRB-UHFFFAOYSA-N 1,2,4,5-tetraoxane Chemical compound C1OOCOO1 UYVWNPAMKCDKRB-UHFFFAOYSA-N 0.000 description 1
- IANXAXNUNBAWBA-UHFFFAOYSA-N 2,2,3-trimethylundecane Chemical compound CCCCCCCCC(C)C(C)(C)C IANXAXNUNBAWBA-UHFFFAOYSA-N 0.000 description 1
- HGUFODBRKLSHSI-UHFFFAOYSA-N 2,3,7,8-tetrachloro-dibenzo-p-dioxin Chemical compound O1C2=CC(Cl)=C(Cl)C=C2OC2=C1C=C(Cl)C(Cl)=C2 HGUFODBRKLSHSI-UHFFFAOYSA-N 0.000 description 1
- OXBLVCZKDOZZOJ-UHFFFAOYSA-N 2,3-Dihydrothiophene Chemical compound C1CC=CS1 OXBLVCZKDOZZOJ-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical group C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- TVYXZOYLALGHLX-UHFFFAOYSA-N 2-prop-1-enylguanidine Chemical compound CC=CN=C(N)N TVYXZOYLALGHLX-UHFFFAOYSA-N 0.000 description 1
- GPBBNPPLBQIADY-UHFFFAOYSA-N 4,4-dimethyloxane Chemical compound CC1(C)CCOCC1 GPBBNPPLBQIADY-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- LNRIBIFTBJLRPN-UHFFFAOYSA-N C(CCCCCCCCC)[PH2]=O Chemical compound C(CCCCCCCCC)[PH2]=O LNRIBIFTBJLRPN-UHFFFAOYSA-N 0.000 description 1
- XJKCOLXPDGFOGQ-UHFFFAOYSA-N C1(=CC=CC=2C3=CC=CC=C3CC12)P(C1=CC=CC=2C3=CC=CC=C3CC12)=O Chemical class C1(=CC=CC=2C3=CC=CC=C3CC12)P(C1=CC=CC=2C3=CC=CC=C3CC12)=O XJKCOLXPDGFOGQ-UHFFFAOYSA-N 0.000 description 1
- GXBYFVGCMPJVJX-UHFFFAOYSA-N Epoxybutene Chemical compound C=CC1CO1 GXBYFVGCMPJVJX-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- AVUYXHYHTTVPRX-UHFFFAOYSA-N Tris(2-methyl-1-aziridinyl)phosphine oxide Chemical compound CC1CN1P(=O)(N1C(C1)C)N1C(C)C1 AVUYXHYHTTVPRX-UHFFFAOYSA-N 0.000 description 1
- MJOQJPYNENPSSS-XQHKEYJVSA-N [(3r,4s,5r,6s)-4,5,6-triacetyloxyoxan-3-yl] acetate Chemical compound CC(=O)O[C@@H]1CO[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O MJOQJPYNENPSSS-XQHKEYJVSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- MRIZMKJLUDDMHF-UHFFFAOYSA-N cumene;hydrogen peroxide Chemical compound OO.CC(C)C1=CC=CC=C1 MRIZMKJLUDDMHF-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical group CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- VCWNAJUHTLWQQT-YRGDBDHISA-N mpma Chemical compound C([C@@]1(C(=O)C(C)=CC1[C@@]1(O)[C@H](C)[C@H]2OC(=O)CCCCCCCCCCCCC)OC)C(CO)=C[C@H]1C1[C@]2(OC(C)=O)C1(C)C VCWNAJUHTLWQQT-YRGDBDHISA-N 0.000 description 1
- 150000002923 oximes Chemical group 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/14—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/094613 WO2016101129A1 (en) | 2014-12-23 | 2014-12-23 | 1k high temperature debondable adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201631102A true TW201631102A (zh) | 2016-09-01 |
Family
ID=56148870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104141239A TW201631102A (zh) | 2014-12-23 | 2015-12-09 | １ｋ高溫可脫膠黏著劑 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20170283671A1 (enExample) |
| EP (1) | EP3237569A4 (enExample) |
| JP (1) | JP2018506606A (enExample) |
| KR (1) | KR20170099983A (enExample) |
| CN (1) | CN107429142A (enExample) |
| TW (1) | TW201631102A (enExample) |
| WO (2) | WO2016101129A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107001908B (zh) * | 2014-06-24 | 2020-06-09 | 汉高股份有限及两合公司 | 单组分uv和热固化高温可脱粘的胶粘剂 |
| KR20190013091A (ko) * | 2017-07-31 | 2019-02-11 | 다우 실리콘즈 코포레이션 | 이중 경화성 수지 조성물, 그로부터 형성된 경화물, 및 그러한 경화물을 포함하는 전자 장치 |
| FR3087471B1 (fr) * | 2018-10-23 | 2020-11-06 | Saint Gobain | Procede d’obtention d’un vitrage isolant |
| CN110256959B (zh) * | 2019-05-21 | 2021-07-23 | 郝建强 | 可uv固化有机硅离型剂 |
| CN110511722B (zh) * | 2019-08-23 | 2020-10-23 | 复旦大学 | 一种耐瞬时高温柔性胶黏剂及其制备方法 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4052529A (en) * | 1976-03-03 | 1977-10-04 | Dow Corning Corporation | Radiation-curable mercaptoalkyl vinyl polydiorganosiloxanes, method of coating there with and coated article |
| US4558147A (en) * | 1983-08-26 | 1985-12-10 | General Electric Company | Ultraviolet radiation-curable silicone release compositions |
| US5162389A (en) * | 1983-10-26 | 1992-11-10 | Dow Corning Corporation | Fast ultraviolet radiation curing silicone composition having a high refractive index |
| JP2620303B2 (ja) * | 1988-05-12 | 1997-06-11 | 東芝シリコーン株式会社 | 光ファイバー被覆用紫外線硬化型シリコーン樹脂組成物 |
| US4952711A (en) * | 1989-05-25 | 1990-08-28 | Loctite Corporation | Crosslinking of (meth) acryloxyalkenylene functional siloxane prepolymers |
| DD301304A5 (de) * | 1989-06-08 | 1992-11-19 | Jenoptik Jena Gmbh | Elektronische auswerteschaltung fuer das magnetisch-induktive treffer-anzeige-verfahren |
| FR2708272B1 (fr) * | 1993-07-26 | 1995-09-01 | Rhone Poulenc Chimie | Résines silicones à nÓoeuds de réticulation thermo- ou hydro-réversibles. |
| US5585035A (en) * | 1993-08-06 | 1996-12-17 | Minnesota Mining And Manufacturing Company | Light modulating device having a silicon-containing matrix |
| CN1388823A (zh) * | 2000-08-17 | 2003-01-01 | 日本板硝子株式会社 | 粘结剂组合物和使用该组合物的光学装置 |
| US20060069176A1 (en) * | 2002-08-20 | 2006-03-30 | Bowman Christopher N | Polymer derived ceramic materials |
| EP1728829B1 (en) * | 2005-06-03 | 2007-11-07 | Shin-Etsu Chemical Co., Ltd. | Addition type silicone adhesive composition |
| WO2008133138A1 (ja) * | 2007-04-17 | 2008-11-06 | Kaneka Corporation | 多面体構造ポリシロキサン変性体および該変性体を用いた組成物 |
| US9243083B2 (en) * | 2008-04-03 | 2016-01-26 | Henkel IP & Holding GmbH | Thiol-ene cured oil-resistant polyacrylate sealants for in-place gasketing applications |
| US8823154B2 (en) * | 2009-05-08 | 2014-09-02 | The Regents Of The University Of California | Encapsulation architectures for utilizing flexible barrier films |
| EP2565235B1 (en) * | 2010-04-26 | 2014-11-19 | ThreeBond Fine Chemical Co., Ltd. | Photocurable silicone gel composition and application thereof |
| EP2657301B1 (en) * | 2010-12-22 | 2015-03-11 | Momentive Performance Materials Japan LLC | Ultraviolet-curable silicone resin composition and image display device using same |
| JP2014509668A (ja) * | 2011-03-28 | 2014-04-21 | ヘンケル・チャイナ・カンパニー・リミテッド | Ｌｅｄ封入用硬化性シリコーン樹脂 |
| WO2013012973A2 (en) * | 2011-07-19 | 2013-01-24 | 3M Innovative Properties Company | Debondable adhesive article and methods of making and using the same |
| DE102011079687A1 (de) * | 2011-07-22 | 2013-01-24 | Wacker Chemie Ag | Temporäre Verklebung von chemisch ähnlichen Substraten |
| CN104487492B (zh) * | 2012-06-06 | 2017-10-24 | 汉高知识产权控股有限责任公司 | 乙烯基碳硅氧烷树脂 |
| CN102876249B (zh) * | 2012-08-31 | 2013-10-16 | 江苏创基新材料有限公司 | 可剥离型有机硅压敏胶粘剂的制备方法 |
| WO2014052937A1 (en) * | 2012-09-28 | 2014-04-03 | Osram Sylvania Inc. | Polycyclic polysiloxane composition and led containing same |
| CN104119832B (zh) * | 2013-04-27 | 2018-02-06 | 东莞东阳光科研发有限公司 | 一种有机硅灌封胶制备方法及其应用 |
| JP6675980B2 (ja) * | 2013-11-11 | 2020-04-08 | ダウ シリコーンズ コーポレーション | Ｕｖ硬化性シリコーン組成物、その硬化生成物、及びその使用方法 |
| US9914807B2 (en) * | 2013-11-18 | 2018-03-13 | Florida State University Research Foundation, Inc. | Thiol-ene polymer metal oxide nanoparticle high refractive index composites |
| US9994754B2 (en) * | 2014-03-27 | 2018-06-12 | 3M Innovative Properties Company | Filled polydiorganosiloxane-containing compositions, and methods of using same |
| CN103897398B (zh) * | 2014-03-27 | 2016-08-17 | 中科院广州化学有限公司南雄材料生产基地 | 一种硅溶胶补强的水基有机硅弹性体及其制备方法与应用 |
| KR102335364B1 (ko) * | 2014-03-27 | 2021-12-06 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 오가노보란-함유 조성물, 및 그의 사용 방법 |
| US9834679B2 (en) * | 2014-08-01 | 2017-12-05 | Momentive Performance Materials Inc. | Thermally stable, high refractive index curable silicone compositions |
-
2014
- 2014-12-23 WO PCT/CN2014/094613 patent/WO2016101129A1/en not_active Ceased
-
2015
- 2015-12-08 KR KR1020177020546A patent/KR20170099983A/ko not_active Withdrawn
- 2015-12-08 JP JP2017533859A patent/JP2018506606A/ja active Pending
- 2015-12-08 WO PCT/CN2015/096670 patent/WO2016101785A1/en not_active Ceased
- 2015-12-08 EP EP15871854.4A patent/EP3237569A4/en not_active Withdrawn
- 2015-12-08 CN CN201580070441.1A patent/CN107429142A/zh active Pending
- 2015-12-09 TW TW104141239A patent/TW201631102A/zh unknown
-
2017
- 2017-06-22 US US15/629,804 patent/US20170283671A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016101785A1 (en) | 2016-06-30 |
| EP3237569A4 (en) | 2018-07-04 |
| KR20170099983A (ko) | 2017-09-01 |
| JP2018506606A (ja) | 2018-03-08 |
| EP3237569A1 (en) | 2017-11-01 |
| CN107429142A (zh) | 2017-12-01 |
| US20170283671A1 (en) | 2017-10-05 |
| WO2016101129A1 (en) | 2016-06-30 |
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