JP2018503638A5 - - Google Patents
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- JP2018503638A5 JP2018503638A5 JP2017536948A JP2017536948A JP2018503638A5 JP 2018503638 A5 JP2018503638 A5 JP 2018503638A5 JP 2017536948 A JP2017536948 A JP 2017536948A JP 2017536948 A JP2017536948 A JP 2017536948A JP 2018503638 A5 JP2018503638 A5 JP 2018503638A5
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- 229920001296 polysiloxane Polymers 0.000 claims description 60
- 125000004432 carbon atom Chemical group C* 0.000 claims description 57
- 239000000203 mixture Substances 0.000 claims description 43
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 18
- 239000000376 reactant Substances 0.000 claims description 18
- 125000003342 alkenyl group Chemical group 0.000 claims description 17
- 239000003054 catalyst Substances 0.000 claims description 17
- 125000003118 aryl group Chemical group 0.000 claims description 16
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 125000003545 alkoxy group Chemical group 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 11
- 239000000047 product Substances 0.000 claims description 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 4
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 125000005369 trialkoxysilyl group Chemical group 0.000 claims description 3
- 239000002775 capsule Substances 0.000 claims description 2
- 125000004122 cyclic group Chemical group 0.000 claims description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 239000010970 precious metal Substances 0.000 claims 1
- -1 1,3-pentadienyl Chemical group 0.000 description 21
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 229910052697 platinum Inorganic materials 0.000 description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 5
- 229910000510 noble metal Inorganic materials 0.000 description 5
- 239000002683 reaction inhibitor Substances 0.000 description 3
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 2
- 125000004973 1-butenyl group Chemical group C(=CCC)* 0.000 description 2
- 125000006039 1-hexenyl group Chemical group 0.000 description 2
- 125000004974 2-butenyl group Chemical group C(C=CC)* 0.000 description 2
- BSXVSQHDSNEHCJ-UHFFFAOYSA-N [(dimethyl-$l^{3}-silanyl)oxy-diphenylsilyl]oxy-dimethylsilicon Chemical compound C=1C=CC=CC=1[Si](O[Si](C)C)(O[Si](C)C)C1=CC=CC=C1 BSXVSQHDSNEHCJ-UHFFFAOYSA-N 0.000 description 2
- ILBWBNOBGCYGSU-UHFFFAOYSA-N [[(dimethyl-$l^{3}-silanyl)oxy-dimethylsilyl]oxy-dimethylsilyl]oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)(C)O[Si](C)(C)O[Si](C)C ILBWBNOBGCYGSU-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- PBSKJKQXYHMNKM-UHFFFAOYSA-N bis(dimethylsilyloxy)-(2-methylprop-1-enylsilyloxy)-phenylsilane Chemical compound CC(=C[SiH2]O[Si](O[SiH](C)C)(O[SiH](C)C)C1=CC=CC=C1)C PBSKJKQXYHMNKM-UHFFFAOYSA-N 0.000 description 2
- HUZZTFRRWGTVBP-UHFFFAOYSA-N bis(dimethylsilyloxy)-methyl-(2-methylprop-1-enylsilyloxy)silane Chemical compound CC(=C[SiH2]O[Si](O[SiH](C)C)(O[SiH](C)C)C)C HUZZTFRRWGTVBP-UHFFFAOYSA-N 0.000 description 2
- DSVRVHYFPPQFTI-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane;platinum Chemical compound [Pt].C[Si](C)(C)O[Si](C)(C=C)C=C DSVRVHYFPPQFTI-UHFFFAOYSA-N 0.000 description 2
- YQZRVPKVSAHQGY-UHFFFAOYSA-N bis[[dimethylsilyloxy(phenyl)silyl]oxy]-phenylsilane Chemical compound C[SiH](C)O[SiH](O[SiH](O[SiH](O[SiH](C)C)c1ccccc1)c1ccccc1)c1ccccc1 YQZRVPKVSAHQGY-UHFFFAOYSA-N 0.000 description 2
- LDKSTCHEYCNPDS-UHFFFAOYSA-L carbon monoxide;dichloroplatinum Chemical compound O=C=[Pt](Cl)(Cl)=C=O LDKSTCHEYCNPDS-UHFFFAOYSA-L 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- VWSUTYVJSOOALR-UHFFFAOYSA-N dimethylsilyloxy-[dimethylsilyloxy(phenyl)silyl]oxy-phenylsilane Chemical compound C[SiH](O[SiH](O[SiH](O[SiH](C)C)C1=CC=CC=C1)C1=CC=CC=C1)C VWSUTYVJSOOALR-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- LTFTWJYRQNTCHI-UHFFFAOYSA-N hex-1-yn-3-ol Chemical compound CCCC(O)C#C LTFTWJYRQNTCHI-UHFFFAOYSA-N 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 125000005394 methallyl group Chemical group 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- RMZSTOAGUSEJFY-UHFFFAOYSA-N methyl-[methyl(phenyl)silyl]oxy-phenylsilane Chemical compound C=1C=CC=CC=1[SiH](C)O[SiH](C)C1=CC=CC=C1 RMZSTOAGUSEJFY-UHFFFAOYSA-N 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- SMCLTAARQYTXLW-UHFFFAOYSA-N 1,1-diphenylprop-2-yn-1-ol Chemical compound C=1C=CC=CC=1C(C#C)(O)C1=CC=CC=C1 SMCLTAARQYTXLW-UHFFFAOYSA-N 0.000 description 1
- QKJJSXGDSZZUKI-UHFFFAOYSA-N 1-ethynylcycloheptan-1-ol Chemical compound C#CC1(O)CCCCCC1 QKJJSXGDSZZUKI-UHFFFAOYSA-N 0.000 description 1
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- DHAPUKCAOFQTIT-UHFFFAOYSA-N 1-ethynylcyclooctan-1-ol Chemical compound C#CC1(O)CCCCCCC1 DHAPUKCAOFQTIT-UHFFFAOYSA-N 0.000 description 1
- LQMDOONLLAJAPZ-UHFFFAOYSA-N 1-ethynylcyclopentan-1-ol Chemical compound C#CC1(O)CCCC1 LQMDOONLLAJAPZ-UHFFFAOYSA-N 0.000 description 1
- DGLJYEKNUTVPAE-UHFFFAOYSA-N 2,4,6-triethyl-2,4,6-trimethyl-1,3,5,2,4,6-trioxatrisilinane Chemical compound CC[Si]1(C)O[Si](C)(CC)O[Si](C)(CC)O1 DGLJYEKNUTVPAE-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- XXWIEGOAVMLISY-UHFFFAOYSA-N 3,4,4-trimethylpent-1-yn-3-ol Chemical compound CC(C)(C)C(C)(O)C#C XXWIEGOAVMLISY-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- OWRXWSVBJIIORE-UHFFFAOYSA-N 3,7,11-trimethyldodec-1-yn-3-ol Chemical compound CC(C)CCCC(C)CCCC(C)(O)C#C OWRXWSVBJIIORE-UHFFFAOYSA-N 0.000 description 1
- GLUAVDCIQXLRRJ-UHFFFAOYSA-N 3-ethylhex-1-yn-3-ol Chemical compound CCCC(O)(CC)C#C GLUAVDCIQXLRRJ-UHFFFAOYSA-N 0.000 description 1
- PUNRPAWKFTXZIW-UHFFFAOYSA-N 3-ethylpent-1-yn-3-ol Chemical compound CCC(O)(CC)C#C PUNRPAWKFTXZIW-UHFFFAOYSA-N 0.000 description 1
- XWEVMQJXCXXZPU-UHFFFAOYSA-N 3-methyldec-1-yn-3-ol Chemical compound CCCCCCCC(C)(O)C#C XWEVMQJXCXXZPU-UHFFFAOYSA-N 0.000 description 1
- DTGUZRPEDLHAAO-UHFFFAOYSA-N 3-methylhex-1-yn-3-ol Chemical compound CCCC(C)(O)C#C DTGUZRPEDLHAAO-UHFFFAOYSA-N 0.000 description 1
- CSNWKQHTZXPWJS-UHFFFAOYSA-N 4-ethynyl-2,6-dimethylheptan-4-ol Chemical compound CC(C)CC(O)(C#C)CC(C)C CSNWKQHTZXPWJS-UHFFFAOYSA-N 0.000 description 1
- NTNUBJHPRAMQPC-UHFFFAOYSA-N 5-methylhex-1-yn-3-ol Chemical compound CC(C)CC(O)C#C NTNUBJHPRAMQPC-UHFFFAOYSA-N 0.000 description 1
- MMZVVJGCZZAWBN-UHFFFAOYSA-N 9-ethynylfluoren-9-ol Chemical compound C1=CC=C2C(O)(C#C)C3=CC=CC=C3C2=C1 MMZVVJGCZZAWBN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- GKPOMITUDGXOSB-UHFFFAOYSA-N but-3-yn-2-ol Chemical compound CC(O)C#C GKPOMITUDGXOSB-UHFFFAOYSA-N 0.000 description 1
- 125000002933 cyclohexyloxy group Chemical group C1(CCCCC1)O* 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical compound CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000005561 phenanthryl group Chemical group 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 229960003986 tuaminoheptane Drugs 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/070578 WO2016112487A1 (en) | 2015-01-13 | 2015-01-13 | Organopolysiloxane prepolymer and curable organopolysiloxane composition comprising same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018503638A JP2018503638A (ja) | 2018-02-08 |
| JP2018503638A5 true JP2018503638A5 (OSRAM) | 2018-03-22 |
Family
ID=56405097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017536948A Pending JP2018503638A (ja) | 2015-01-13 | 2015-01-13 | オルガノポリシロキサンプレポリマーおよびそれを含有する硬化性オルガノポリシロキサン組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9994681B2 (OSRAM) |
| EP (1) | EP3245256A4 (OSRAM) |
| JP (1) | JP2018503638A (OSRAM) |
| TW (1) | TW201630983A (OSRAM) |
| WO (1) | WO2016112487A1 (OSRAM) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106414609A (zh) * | 2014-01-17 | 2017-02-15 | 汉高股份有限及两合公司 | 用于光学半导体装置的可固化组合物 |
| EP3719096A4 (en) * | 2017-12-01 | 2021-08-25 | Dow Toray Co., Ltd. | CURING ORGANOPOLYSILOXANE RELEASE AGENT COMPOSITION FOR THERMAL PAPER, THERMAL PAPER AND THERMAL RECORDING LABEL SHEET |
| CN113785026B (zh) * | 2019-12-02 | 2022-12-09 | 美国陶氏有机硅公司 | 用于制备防粘涂料的组合物 |
| CN112812304B (zh) * | 2021-01-07 | 2023-05-12 | 天津德高化成光电科技有限责任公司 | 一种预聚体、含有该预聚体的封装树脂及封装树脂的应用 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3892643A (en) * | 1973-05-02 | 1975-07-01 | Hitachi Ltd | Thermally curable compositions and process for curing said compositions |
| JPS5741483B2 (OSRAM) * | 1973-05-02 | 1982-09-03 | ||
| US4374986A (en) * | 1981-08-03 | 1983-02-22 | Olin Corporation | Selected siloxane adducts of tris(2-hydroxyethyl)isocyanurate |
| US5204408A (en) * | 1989-03-28 | 1993-04-20 | Shin-Etsu Chemical Co., Ltd. | Modified silicone vulcanization activator |
| US5101029A (en) * | 1989-04-27 | 1992-03-31 | Siemens Aktiengesellschaft | Isocyanurate-containing organosilicon compounds |
| CN101125925B (zh) * | 2000-12-27 | 2013-06-12 | 株式会社钟化 | 固化剂、可固化组合物、光学材料用组合物、光学材料及其应用 |
| JP4267404B2 (ja) | 2003-08-22 | 2009-05-27 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 光学材料用硬化性組成物 |
| JP4479882B2 (ja) * | 2003-11-20 | 2010-06-09 | 信越化学工業株式会社 | 砲弾型発光半導体装置 |
| JPWO2006057218A1 (ja) * | 2004-11-24 | 2008-06-05 | 株式会社カネカ | 硬化性組成物およびその硬化性組成物により封止、被覆された半導体装置 |
| JP4578338B2 (ja) * | 2005-06-30 | 2010-11-10 | 株式会社カネカ | 硬化性組成物及びその硬化物 |
| JP5367962B2 (ja) * | 2007-07-12 | 2013-12-11 | 株式会社カネカ | 硬化性組成物 |
| KR101796065B1 (ko) * | 2007-11-09 | 2017-11-10 | 가부시키가이샤 가네카 | 변성 폴리오르가노실록산 조성물, 변성 폴리오르가노실록산 화합물, 및 경화성 조성물 |
| JP5705416B2 (ja) | 2008-04-11 | 2015-04-22 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 半導体用硬化性シリコーン組成物及びそれを用いた半導体装置 |
| JP5188928B2 (ja) | 2008-10-24 | 2013-04-24 | 株式会社Ａｄｅｋａ | ケイ素含有硬化性組成物 |
| JP5223618B2 (ja) * | 2008-11-20 | 2013-06-26 | 信越化学工業株式会社 | 有機ケイ素化合物 |
| JP2010265374A (ja) * | 2009-05-14 | 2010-11-25 | Shin-Etsu Chemical Co Ltd | イソシアヌル環含有末端ハイドロジェンポリシロキサン |
| CN102471580B (zh) | 2009-07-15 | 2014-06-18 | 株式会社钟化 | 光学材料用固化性组合物 |
| JP5545862B2 (ja) * | 2009-11-04 | 2014-07-09 | 信越化学工業株式会社 | イソシアヌル環含有末端ビニルポリシロキサン |
| JP2012082303A (ja) * | 2010-10-08 | 2012-04-26 | Kaneka Corp | 硬化性組成物 |
| JP2012107096A (ja) * | 2010-11-16 | 2012-06-07 | Kaneka Corp | 熱伝導性硬化性樹脂組成物及び硬化性樹脂成形体 |
| JP2013144763A (ja) * | 2012-01-16 | 2013-07-25 | Shin-Etsu Chemical Co Ltd | 半導体封止用熱硬化性樹脂組成物及び該組成物で封止された半導体装置 |
| JP5931503B2 (ja) * | 2012-02-27 | 2016-06-08 | 信越化学工業株式会社 | 白色熱硬化性シリコーン組成物及び該組成物の硬化物からなる白色発光ダイオード用光反射材料 |
-
2015
- 2015-01-13 WO PCT/CN2015/070578 patent/WO2016112487A1/en not_active Ceased
- 2015-01-13 EP EP15877407.5A patent/EP3245256A4/en not_active Withdrawn
- 2015-01-13 JP JP2017536948A patent/JP2018503638A/ja active Pending
- 2015-12-18 TW TW104142606A patent/TW201630983A/zh unknown
-
2017
- 2017-07-12 US US15/647,648 patent/US9994681B2/en not_active Expired - Fee Related
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