JP2018503058A - 高いパフォーマンスを有する2相冷却装置 - Google Patents
高いパフォーマンスを有する2相冷却装置 Download PDFInfo
- Publication number
- JP2018503058A JP2018503058A JP2017557275A JP2017557275A JP2018503058A JP 2018503058 A JP2018503058 A JP 2018503058A JP 2017557275 A JP2017557275 A JP 2017557275A JP 2017557275 A JP2017557275 A JP 2017557275A JP 2018503058 A JP2018503058 A JP 2018503058A
- Authority
- JP
- Japan
- Prior art keywords
- ground plane
- thermal ground
- wicking structure
- region
- intermediate substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562106556P | 2015-01-22 | 2015-01-22 | |
| US62/106,556 | 2015-01-22 | ||
| PCT/US2016/013987 WO2016118545A1 (en) | 2015-01-22 | 2016-01-20 | High performance two-phase cooling apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018503058A true JP2018503058A (ja) | 2018-02-01 |
| JP2018503058A5 JP2018503058A5 (enExample) | 2020-04-16 |
Family
ID=56417662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017557275A Pending JP2018503058A (ja) | 2015-01-22 | 2016-01-20 | 高いパフォーマンスを有する2相冷却装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10458719B2 (enExample) |
| EP (1) | EP3247962B1 (enExample) |
| JP (1) | JP2018503058A (enExample) |
| KR (1) | KR102505767B1 (enExample) |
| CN (1) | CN107532860B (enExample) |
| WO (1) | WO2016118545A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021229961A1 (ja) * | 2020-05-15 | 2021-11-18 | 株式会社村田製作所 | ベイパーチャンバー |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9163883B2 (en) | 2009-03-06 | 2015-10-20 | Kevlin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
| US11988453B2 (en) | 2014-09-17 | 2024-05-21 | Kelvin Thermal Technologies, Inc. | Thermal management planes |
| US12385697B2 (en) | 2014-09-17 | 2025-08-12 | Kelvin Thermal Technologies, Inc. | Micropillar-enabled thermal ground plane |
| US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
| US10670352B2 (en) | 2016-05-23 | 2020-06-02 | Pimems, Inc. | High performance two-phase cooling apparatus for portable applications |
| US10458331B2 (en) * | 2016-06-20 | 2019-10-29 | United Technologies Corporation | Fuel injector with heat pipe cooling |
| US20180106553A1 (en) * | 2016-10-13 | 2018-04-19 | Pimems, Inc. | Thermal module charging method |
| US12104856B2 (en) | 2016-10-19 | 2024-10-01 | Kelvin Thermal Technologies, Inc. | Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems |
| JPWO2018147283A1 (ja) * | 2017-02-07 | 2019-07-18 | 古河電気工業株式会社 | ベーパーチャンバ |
| CN113720185B (zh) | 2017-05-08 | 2024-11-15 | 开文热工科技公司 | 热管理平面 |
| CN107809880A (zh) * | 2017-06-13 | 2018-03-16 | 奇鋐科技股份有限公司 | 散热单元的制造方法 |
| CN107231780A (zh) * | 2017-06-13 | 2017-10-03 | 奇鋐科技股份有限公司 | 散热装置及其制造方法 |
| JP6466541B2 (ja) * | 2017-07-12 | 2019-02-06 | エイジア ヴァイタル コンポーネンツ カンパニー リミテッド | 放熱ユニットの製造方法 |
| US10597286B2 (en) | 2017-08-01 | 2020-03-24 | Analog Devices Global | Monolithic phase change heat sink |
| US10561041B2 (en) | 2017-10-18 | 2020-02-11 | Pimems, Inc. | Titanium thermal module |
| US10962298B2 (en) | 2018-09-28 | 2021-03-30 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid |
| US10935325B2 (en) * | 2018-09-28 | 2021-03-02 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid |
| JP6560425B1 (ja) * | 2018-11-09 | 2019-08-14 | 古河電気工業株式会社 | ヒートパイプ |
| AT522831B1 (de) * | 2019-08-08 | 2023-05-15 | Dau Gmbh & Co Kg | Luftwärmetauscher sowie Verfahren zu dessen Herstellung und damit ausgestatteter Elektronikaufbau |
| WO2021188128A1 (en) * | 2020-03-18 | 2021-09-23 | Kelvin Thermal Technologies, Inc. | Deformed mesh thermal ground plane |
| US11930621B2 (en) | 2020-06-19 | 2024-03-12 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
| WO2022082352A1 (zh) * | 2020-10-19 | 2022-04-28 | 欧菲光集团股份有限公司 | 均热板及散热装置 |
| CN112629298A (zh) * | 2020-12-02 | 2021-04-09 | 东莞领杰金属精密制造科技有限公司 | 均热板制备的方法以及均热板 |
| CN115915699B (zh) * | 2021-08-19 | 2025-09-09 | 台湾台北科技大学 | 均热板及其改质制造方法 |
| DE102022120251A1 (de) | 2021-12-02 | 2023-06-07 | Pimems, Inc. | Hochleistungsfähige zweiphasen-kühleinrichtung |
| WO2023212236A1 (en) | 2022-04-28 | 2023-11-02 | Johnson Controls Tyco Ip Holdings, Llp | Direct evaporative cooling system for data center with fan and water optimization |
| KR20230158286A (ko) | 2022-05-11 | 2023-11-20 | 현대자동차주식회사 | 파워모듈용 냉각장치 |
| FR3138943A1 (fr) * | 2022-08-17 | 2024-02-23 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Caloduc à section transversale non cylindrique, comprenant un évaporateur à structure d’interface vapeur/liquide améliorée afin d’augmenter la limite d’ébullition. |
| DE102022131995A1 (de) | 2022-12-02 | 2024-06-13 | Gentherm Präzision SE | Kühlvorrichtung für elektrochemische und elektrotechnische Bauteile |
| JP2025538313A (ja) | 2022-12-02 | 2025-11-27 | キャラ エルティーディー | 電気化学的部品および電気工学的部品の冷却装置 |
| DE202022106754U1 (de) | 2022-12-02 | 2024-03-11 | Gentherm Präzision SE | Kühlvorrichtung für elektrochemische und elektrotechnische Bauteile |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005077052A (ja) * | 2003-09-03 | 2005-03-24 | Hitachi Metals Ltd | 平面型ヒートパイプ |
| JP2007113864A (ja) * | 2005-10-21 | 2007-05-10 | Sony Corp | 熱輸送装置及び電子機器 |
| JP2008153423A (ja) * | 2006-12-18 | 2008-07-03 | Yaskawa Electric Corp | ベーパチャンバおよびそれを用いた電子装置 |
| US20110024085A1 (en) * | 2009-07-28 | 2011-02-03 | Huang Yu-Po | Heat pipe and method for manufacturing the same |
| US20110120674A1 (en) * | 2008-07-21 | 2011-05-26 | The Regents Of The University Of California | Titanium-based thermal ground plane |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3042382A (en) * | 1957-10-31 | 1962-07-03 | Parsons C A & Co Ltd | Plate type heat exchangers |
| US3786861A (en) | 1971-04-12 | 1974-01-22 | Battelle Memorial Institute | Heat pipes |
| US4800956A (en) | 1986-04-25 | 1989-01-31 | Digital Equipment Corporation | Apparatus and method for removal of heat from packaged element |
| US5179043A (en) * | 1989-07-14 | 1993-01-12 | The Texas A&M University System | Vapor deposited micro heat pipes |
| US5520244A (en) | 1992-12-16 | 1996-05-28 | Sdl, Inc. | Micropost waste heat removal system |
| US6227287B1 (en) * | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
| US6293332B2 (en) * | 1999-03-31 | 2001-09-25 | Jia Hao Li | Structure of a super-thin heat plate |
| US6875247B2 (en) * | 2000-06-06 | 2005-04-05 | Battelle Memorial Institute | Conditions for fluid separations in microchannels, capillary-driven fluid separations, and laminated devices capable of separating fluids |
| CN2580604Y (zh) * | 2002-10-16 | 2003-10-15 | 徐惠群 | 抗高压应力及可弯曲的板式热管 |
| US7836597B2 (en) * | 2002-11-01 | 2010-11-23 | Cooligy Inc. | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system |
| TW577969B (en) * | 2003-07-21 | 2004-03-01 | Arro Superconducting Technolog | Vapor/liquid separated heat exchanging device |
| CA2574200A1 (en) * | 2004-07-21 | 2006-01-26 | Xiao Huang | Hybrid wicking materials for use in high performance heat pipes |
| US7718552B2 (en) | 2005-04-04 | 2010-05-18 | The Regents Of The University Of California | Nanostructured titania |
| US20090056917A1 (en) | 2005-08-09 | 2009-03-05 | The Regents Of The University Of California | Nanostructured micro heat pipes |
| SG142174A1 (en) * | 2006-10-11 | 2008-05-28 | Iplato Pte Ltd | Method for heat transfer and device therefor |
| US8356657B2 (en) * | 2007-12-19 | 2013-01-22 | Teledyne Scientific & Imaging, Llc | Heat pipe system |
| US20220228811A9 (en) | 2008-07-21 | 2022-07-21 | The Regents Of The University Of California | Titanium-based thermal ground plane |
| CN101655328A (zh) * | 2008-08-19 | 2010-02-24 | 何昆耀 | 平板式回路热导装置及其制造方法 |
| JP4737285B2 (ja) | 2008-12-24 | 2011-07-27 | ソニー株式会社 | 熱輸送デバイス及び電子機器 |
| US20100175856A1 (en) * | 2009-01-12 | 2010-07-15 | Meyer Iv George Anthony | Vapor chamber with wick structure of different thickness and die for forming the same |
| US9163883B2 (en) * | 2009-03-06 | 2015-10-20 | Kevlin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
| CN102042777B (zh) * | 2009-10-15 | 2013-06-05 | 富准精密工业(深圳)有限公司 | 平板式热管 |
| CN102042776A (zh) * | 2009-10-16 | 2011-05-04 | 富准精密工业(深圳)有限公司 | 回路热管 |
| TW201127266A (en) * | 2010-01-20 | 2011-08-01 | Pegatron Corp | Vapor chamber and manufacturing method thereof |
| US20120031587A1 (en) * | 2010-08-05 | 2012-02-09 | Kunshan Jue-Choung Electronics Co., Ltd. | Capillary structure of heat plate |
| KR20120065575A (ko) * | 2010-12-13 | 2012-06-21 | 한국전자통신연구원 | 압출로 제작되는 박막형 히트파이프 |
| WO2012106326A1 (en) | 2011-01-31 | 2012-08-09 | The Regents Of The University Of California | Using millisecond pulsed laser welding in mems packaging |
| KR20140029633A (ko) * | 2012-08-29 | 2014-03-11 | 한국전자통신연구원 | 모세관력이 향상된 방열소자 및 그 제조방법 |
| JP2014214985A (ja) * | 2013-04-26 | 2014-11-17 | 富士通株式会社 | 蒸発器、冷却装置及び電子装置 |
| US20150122460A1 (en) * | 2013-11-06 | 2015-05-07 | Asia Vital Components Co., Ltd. | Heat pipe structure |
-
2016
- 2016-01-19 US US15/000,460 patent/US10458719B2/en active Active
- 2016-01-20 KR KR1020177022093A patent/KR102505767B1/ko active Active
- 2016-01-20 EP EP16740619.8A patent/EP3247962B1/en active Active
- 2016-01-20 JP JP2017557275A patent/JP2018503058A/ja active Pending
- 2016-01-20 WO PCT/US2016/013987 patent/WO2016118545A1/en not_active Ceased
- 2016-01-20 CN CN201680006869.4A patent/CN107532860B/zh not_active Expired - Fee Related
-
2019
- 2019-08-16 US US16/543,428 patent/US11215403B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005077052A (ja) * | 2003-09-03 | 2005-03-24 | Hitachi Metals Ltd | 平面型ヒートパイプ |
| JP2007113864A (ja) * | 2005-10-21 | 2007-05-10 | Sony Corp | 熱輸送装置及び電子機器 |
| JP2008153423A (ja) * | 2006-12-18 | 2008-07-03 | Yaskawa Electric Corp | ベーパチャンバおよびそれを用いた電子装置 |
| US20110120674A1 (en) * | 2008-07-21 | 2011-05-26 | The Regents Of The University Of California | Titanium-based thermal ground plane |
| US20110024085A1 (en) * | 2009-07-28 | 2011-02-03 | Huang Yu-Po | Heat pipe and method for manufacturing the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021229961A1 (ja) * | 2020-05-15 | 2021-11-18 | 株式会社村田製作所 | ベイパーチャンバー |
| JPWO2021229961A1 (enExample) * | 2020-05-15 | 2021-11-18 | ||
| JP7088435B2 (ja) | 2020-05-15 | 2022-06-21 | 株式会社村田製作所 | ベイパーチャンバー |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102505767B1 (ko) | 2023-03-06 |
| CN107532860A (zh) | 2018-01-02 |
| US10458719B2 (en) | 2019-10-29 |
| WO2016118545A1 (en) | 2016-07-28 |
| EP3247962A4 (en) | 2018-08-29 |
| EP3247962B1 (en) | 2019-07-10 |
| CN107532860B (zh) | 2020-05-15 |
| US20200003500A1 (en) | 2020-01-02 |
| US11215403B2 (en) | 2022-01-04 |
| US20160216042A1 (en) | 2016-07-28 |
| EP3247962A1 (en) | 2017-11-29 |
| KR20170103900A (ko) | 2017-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11215403B2 (en) | High performance two-phase cooling apparatus | |
| JP2018503058A5 (enExample) | ||
| KR20210132620A (ko) | 휴대형 애플리케이션을 위한 고성능 2-페이즈 냉각 장치 | |
| US11859914B2 (en) | High performance two-phase cooling apparatus | |
| US12382610B2 (en) | Vapor chamber and electronic device | |
| KR20210058909A (ko) | 티타늄 열적 모듈 | |
| CN110476033B (zh) | 均热板 | |
| JP6597892B2 (ja) | ループヒートパイプ及びその製造方法並びに電子機器 | |
| CN113720185B (zh) | 热管理平面 | |
| WO2017203574A1 (ja) | ループヒートパイプ及びその製造方法並びに電子機器 | |
| CN218583848U (zh) | 均热板以及电子设备 | |
| JP7148889B2 (ja) | ベーパーチャンバ、電子機器およびベーパーチャンバ用金属シート | |
| JP7244375B2 (ja) | ベーパーチャンバー | |
| JP7788093B2 (ja) | ベーパーチャンバおよび電子機器 | |
| JP7452615B2 (ja) | ベーパーチャンバ、電子機器、及びベーパーチャンバ用シート | |
| US20250123058A1 (en) | Multilayer high aspect ratio microchannel device | |
| JP7336416B2 (ja) | ループ型ヒートパイプ | |
| WO2022025259A1 (ja) | 熱伝導部材 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181029 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190913 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191007 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20200107 |
|
| A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20200309 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200824 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20210322 |