JP2018503058A5 - - Google Patents
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- JP2018503058A5 JP2018503058A5 JP2017557275A JP2017557275A JP2018503058A5 JP 2018503058 A5 JP2018503058 A5 JP 2018503058A5 JP 2017557275 A JP2017557275 A JP 2017557275A JP 2017557275 A JP2017557275 A JP 2017557275A JP 2018503058 A5 JP2018503058 A5 JP 2018503058A5
- Authority
- JP
- Japan
- Prior art keywords
- ground plane
- thermal ground
- intermediate substrate
- wicking structure
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 170
- 229910052751 metal Inorganic materials 0.000 claims description 57
- 239000002184 metal Substances 0.000 claims description 57
- 239000010936 titanium Substances 0.000 claims description 56
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 54
- 229910052719 titanium Inorganic materials 0.000 claims description 54
- 239000007791 liquid phase Substances 0.000 claims description 28
- 239000012808 vapor phase Substances 0.000 claims description 27
- 238000004891 communication Methods 0.000 claims description 21
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 10
- 238000002955 isolation Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 description 54
- 238000000034 method Methods 0.000 description 17
- 238000012546 transfer Methods 0.000 description 17
- 238000001816 cooling Methods 0.000 description 14
- 230000005499 meniscus Effects 0.000 description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 239000012071 phase Substances 0.000 description 10
- 239000007787 solid Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- 230000008901 benefit Effects 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 9
- 239000010935 stainless steel Substances 0.000 description 9
- 238000001039 wet etching Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000001704 evaporation Methods 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000003631 wet chemical etching Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000005459 micromachining Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- -1 but not limited to Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- LWRNQOBXRHWPGE-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,4a,5,5,6,6,7,7,8,8a-heptadecafluoro-8-(trifluoromethyl)naphthalene Chemical compound FC1(F)C(F)(F)C(F)(F)C(F)(F)C2(F)C(C(F)(F)F)(F)C(F)(F)C(F)(F)C(F)(F)C21F LWRNQOBXRHWPGE-UHFFFAOYSA-N 0.000 description 1
- QIROQPWSJUXOJC-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6-undecafluoro-6-(trifluoromethyl)cyclohexane Chemical compound FC(F)(F)C1(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C1(F)F QIROQPWSJUXOJC-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006353 environmental stress Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000009022 nonlinear effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562106556P | 2015-01-22 | 2015-01-22 | |
| US62/106,556 | 2015-01-22 | ||
| PCT/US2016/013987 WO2016118545A1 (en) | 2015-01-22 | 2016-01-20 | High performance two-phase cooling apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018503058A JP2018503058A (ja) | 2018-02-01 |
| JP2018503058A5 true JP2018503058A5 (enExample) | 2020-04-16 |
Family
ID=56417662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017557275A Pending JP2018503058A (ja) | 2015-01-22 | 2016-01-20 | 高いパフォーマンスを有する２相冷却装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10458719B2 (enExample) |
| EP (1) | EP3247962B1 (enExample) |
| JP (1) | JP2018503058A (enExample) |
| KR (1) | KR102505767B1 (enExample) |
| CN (1) | CN107532860B (enExample) |
| WO (1) | WO2016118545A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9163883B2 (en) | 2009-03-06 | 2015-10-20 | Kevlin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
| US11988453B2 (en) | 2014-09-17 | 2024-05-21 | Kelvin Thermal Technologies, Inc. | Thermal management planes |
| US12385697B2 (en) | 2014-09-17 | 2025-08-12 | Kelvin Thermal Technologies, Inc. | Micropillar-enabled thermal ground plane |
| US11598594B2 (en) | 2014-09-17 | 2023-03-07 | The Regents Of The University Of Colorado | Micropillar-enabled thermal ground plane |
| US10670352B2 (en) | 2016-05-23 | 2020-06-02 | Pimems, Inc. | High performance two-phase cooling apparatus for portable applications |
| US10458331B2 (en) * | 2016-06-20 | 2019-10-29 | United Technologies Corporation | Fuel injector with heat pipe cooling |
| US20180106553A1 (en) * | 2016-10-13 | 2018-04-19 | Pimems, Inc. | Thermal module charging method |
| US12104856B2 (en) | 2016-10-19 | 2024-10-01 | Kelvin Thermal Technologies, Inc. | Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems |
| JPWO2018147283A1 (ja) * | 2017-02-07 | 2019-07-18 | 古河電気工業株式会社 | ベーパーチャンバ |
| CN113720185B (zh) | 2017-05-08 | 2024-11-15 | 开文热工科技公司 | 热管理平面 |
| CN107809880A (zh) * | 2017-06-13 | 2018-03-16 | 奇鋐科技股份有限公司 | 散热单元的制造方法 |
| CN107231780A (zh) * | 2017-06-13 | 2017-10-03 | 奇鋐科技股份有限公司 | 散热装置及其制造方法 |
| JP6466541B2 (ja) * | 2017-07-12 | 2019-02-06 | エイジア ヴァイタル コンポーネンツ カンパニー リミテッド | 放熱ユニットの製造方法 |
| US10597286B2 (en) | 2017-08-01 | 2020-03-24 | Analog Devices Global | Monolithic phase change heat sink |
| US10561041B2 (en) | 2017-10-18 | 2020-02-11 | Pimems, Inc. | Titanium thermal module |
| US10962298B2 (en) | 2018-09-28 | 2021-03-30 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid |
| US10935325B2 (en) * | 2018-09-28 | 2021-03-02 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid |
| JP6560425B1 (ja) * | 2018-11-09 | 2019-08-14 | 古河電気工業株式会社 | ヒートパイプ |
| AT522831B1 (de) * | 2019-08-08 | 2023-05-15 | Dau Gmbh & Co Kg | Luftwärmetauscher sowie Verfahren zu dessen Herstellung und damit ausgestatteter Elektronikaufbau |
| WO2021188128A1 (en) * | 2020-03-18 | 2021-09-23 | Kelvin Thermal Technologies, Inc. | Deformed mesh thermal ground plane |
| JP7088435B2 (ja) * | 2020-05-15 | 2022-06-21 | 株式会社村田製作所 | ベイパーチャンバー |
| US11930621B2 (en) | 2020-06-19 | 2024-03-12 | Kelvin Thermal Technologies, Inc. | Folding thermal ground plane |
| WO2022082352A1 (zh) * | 2020-10-19 | 2022-04-28 | 欧菲光集团股份有限公司 | 均热板及散热装置 |
| CN112629298A (zh) * | 2020-12-02 | 2021-04-09 | 东莞领杰金属精密制造科技有限公司 | 均热板制备的方法以及均热板 |
| CN115915699B (zh) * | 2021-08-19 | 2025-09-09 | 台湾台北科技大学 | 均热板及其改质制造方法 |
| DE102022120251A1 (de) | 2021-12-02 | 2023-06-07 | Pimems, Inc. | Hochleistungsfähige zweiphasen-kühleinrichtung |
| WO2023212236A1 (en) | 2022-04-28 | 2023-11-02 | Johnson Controls Tyco Ip Holdings, Llp | Direct evaporative cooling system for data center with fan and water optimization |
| KR20230158286A (ko) | 2022-05-11 | 2023-11-20 | 현대자동차주식회사 | 파워모듈용 냉각장치 |
| FR3138943A1 (fr) * | 2022-08-17 | 2024-02-23 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Caloduc à section transversale non cylindrique, comprenant un évaporateur à structure d’interface vapeur/liquide améliorée afin d’augmenter la limite d’ébullition. |
| DE102022131995A1 (de) | 2022-12-02 | 2024-06-13 | Gentherm Präzision SE | Kühlvorrichtung für elektrochemische und elektrotechnische Bauteile |
| JP2025538313A (ja) | 2022-12-02 | 2025-11-27 | キャラ エルティーディー | 電気化学的部品および電気工学的部品の冷却装置 |
| DE202022106754U1 (de) | 2022-12-02 | 2024-03-11 | Gentherm Präzision SE | Kühlvorrichtung für elektrochemische und elektrotechnische Bauteile |
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| US5179043A (en) * | 1989-07-14 | 1993-01-12 | The Texas A&M University System | Vapor deposited micro heat pipes |
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| US6227287B1 (en) * | 1998-05-25 | 2001-05-08 | Denso Corporation | Cooling apparatus by boiling and cooling refrigerant |
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| CN2580604Y (zh) * | 2002-10-16 | 2003-10-15 | 徐惠群 | 抗高压应力及可弯曲的板式热管 |
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| TW577969B (en) * | 2003-07-21 | 2004-03-01 | Arro Superconducting Technolog | Vapor/liquid separated heat exchanging device |
| JP2005077052A (ja) * | 2003-09-03 | 2005-03-24 | Hitachi Metals Ltd | 平面型ヒートパイプ |
| CA2574200A1 (en) * | 2004-07-21 | 2006-01-26 | Xiao Huang | Hybrid wicking materials for use in high performance heat pipes |
| US7718552B2 (en) | 2005-04-04 | 2010-05-18 | The Regents Of The University Of California | Nanostructured titania |
| US20090056917A1 (en) | 2005-08-09 | 2009-03-05 | The Regents Of The University Of California | Nanostructured micro heat pipes |
| JP2007113864A (ja) * | 2005-10-21 | 2007-05-10 | Sony Corp | 熱輸送装置及び電子機器 |
| SG142174A1 (en) * | 2006-10-11 | 2008-05-28 | Iplato Pte Ltd | Method for heat transfer and device therefor |
| JP2008153423A (ja) * | 2006-12-18 | 2008-07-03 | Yaskawa Electric Corp | ベーパチャンバおよびそれを用いた電子装置 |
| US8356657B2 (en) * | 2007-12-19 | 2013-01-22 | Teledyne Scientific & Imaging, Llc | Heat pipe system |
| WO2010036442A1 (en) * | 2008-07-21 | 2010-04-01 | The Regents Of The University Of California | Titanium-based thermal ground plane |
| US20220228811A9 (en) | 2008-07-21 | 2022-07-21 | The Regents Of The University Of California | Titanium-based thermal ground plane |
| CN101655328A (zh) * | 2008-08-19 | 2010-02-24 | 何昆耀 | 平板式回路热导装置及其制造方法 |
| JP4737285B2 (ja) | 2008-12-24 | 2011-07-27 | ソニー株式会社 | 熱輸送デバイス及び電子機器 |
| US20100175856A1 (en) * | 2009-01-12 | 2010-07-15 | Meyer Iv George Anthony | Vapor chamber with wick structure of different thickness and die for forming the same |
| US9163883B2 (en) * | 2009-03-06 | 2015-10-20 | Kevlin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
| US20110024085A1 (en) * | 2009-07-28 | 2011-02-03 | Huang Yu-Po | Heat pipe and method for manufacturing the same |
| CN102042777B (zh) * | 2009-10-15 | 2013-06-05 | 富准精密工业(深圳)有限公司 | 平板式热管 |
| CN102042776A (zh) * | 2009-10-16 | 2011-05-04 | 富准精密工业(深圳)有限公司 | 回路热管 |
| TW201127266A (en) * | 2010-01-20 | 2011-08-01 | Pegatron Corp | Vapor chamber and manufacturing method thereof |
| US20120031587A1 (en) * | 2010-08-05 | 2012-02-09 | Kunshan Jue-Choung Electronics Co., Ltd. | Capillary structure of heat plate |
| KR20120065575A (ko) * | 2010-12-13 | 2012-06-21 | 한국전자통신연구원 | 압출로 제작되는 박막형 히트파이프 |
| WO2012106326A1 (en) | 2011-01-31 | 2012-08-09 | The Regents Of The University Of California | Using millisecond pulsed laser welding in mems packaging |
| KR20140029633A (ko) * | 2012-08-29 | 2014-03-11 | 한국전자통신연구원 | 모세관력이 향상된 방열소자 및 그 제조방법 |
| JP2014214985A (ja) * | 2013-04-26 | 2014-11-17 | 富士通株式会社 | 蒸発器、冷却装置及び電子装置 |
| US20150122460A1 (en) * | 2013-11-06 | 2015-05-07 | Asia Vital Components Co., Ltd. | Heat pipe structure |
-
2016
- 2016-01-19 US US15/000,460 patent/US10458719B2/en active Active
- 2016-01-20 KR KR1020177022093A patent/KR102505767B1/ko active Active
- 2016-01-20 EP EP16740619.8A patent/EP3247962B1/en active Active
- 2016-01-20 JP JP2017557275A patent/JP2018503058A/ja active Pending
- 2016-01-20 WO PCT/US2016/013987 patent/WO2016118545A1/en not_active Ceased
- 2016-01-20 CN CN201680006869.4A patent/CN107532860B/zh not_active Expired - Fee Related
-
2019
- 2019-08-16 US US16/543,428 patent/US11215403B2/en active Active
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