CN107532860B - 高性能两相冷却设备 - Google Patents

高性能两相冷却设备 Download PDF

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Publication number
CN107532860B
CN107532860B CN201680006869.4A CN201680006869A CN107532860B CN 107532860 B CN107532860 B CN 107532860B CN 201680006869 A CN201680006869 A CN 201680006869A CN 107532860 B CN107532860 B CN 107532860B
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CN
China
Prior art keywords
ground plane
thermal ground
region
wicking structure
intermediate substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201680006869.4A
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English (en)
Chinese (zh)
Other versions
CN107532860A (zh
Inventor
P.博佐尔吉
C.梅因哈特
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Pimmes Co
Original Assignee
Baode Co
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Filing date
Publication date
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Application filed by Baode Co filed Critical Baode Co
Publication of CN107532860A publication Critical patent/CN107532860A/zh
Application granted granted Critical
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081Heat exchange elements made from metals or metal alloys
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00Heat exchangers or heat exchange elements having special size, e.g. microstructures

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201680006869.4A 2015-01-22 2016-01-20 高性能两相冷却设备 Expired - Fee Related CN107532860B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562106556P 2015-01-22 2015-01-22
US62/106556 2015-01-22
PCT/US2016/013987 WO2016118545A1 (en) 2015-01-22 2016-01-20 High performance two-phase cooling apparatus

Publications (2)

Publication Number Publication Date
CN107532860A CN107532860A (zh) 2018-01-02
CN107532860B true CN107532860B (zh) 2020-05-15

Family

ID=56417662

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680006869.4A Expired - Fee Related CN107532860B (zh) 2015-01-22 2016-01-20 高性能两相冷却设备

Country Status (6)

Country Link
US (2) US10458719B2 (enExample)
EP (1) EP3247962B1 (enExample)
JP (1) JP2018503058A (enExample)
KR (1) KR102505767B1 (enExample)
CN (1) CN107532860B (enExample)
WO (1) WO2016118545A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US12385697B2 (en) 2014-09-17 2025-08-12 Kelvin Thermal Technologies, Inc. Micropillar-enabled thermal ground plane
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US10670352B2 (en) 2016-05-23 2020-06-02 Pimems, Inc. High performance two-phase cooling apparatus for portable applications
US10458331B2 (en) * 2016-06-20 2019-10-29 United Technologies Corporation Fuel injector with heat pipe cooling
US20180106553A1 (en) * 2016-10-13 2018-04-19 Pimems, Inc. Thermal module charging method
US12104856B2 (en) 2016-10-19 2024-10-01 Kelvin Thermal Technologies, Inc. Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems
JPWO2018147283A1 (ja) * 2017-02-07 2019-07-18 古河電気工業株式会社 ベーパーチャンバ
CN113720185B (zh) 2017-05-08 2024-11-15 开文热工科技公司 热管理平面
CN107809880A (zh) * 2017-06-13 2018-03-16 奇鋐科技股份有限公司 散热单元的制造方法
CN107231780A (zh) * 2017-06-13 2017-10-03 奇鋐科技股份有限公司 散热装置及其制造方法
JP6466541B2 (ja) * 2017-07-12 2019-02-06 エイジア ヴァイタル コンポーネンツ カンパニー リミテッド 放熱ユニットの製造方法
US10597286B2 (en) 2017-08-01 2020-03-24 Analog Devices Global Monolithic phase change heat sink
US10561041B2 (en) 2017-10-18 2020-02-11 Pimems, Inc. Titanium thermal module
US10962298B2 (en) 2018-09-28 2021-03-30 Microsoft Technology Licensing, Llc Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid
US10935325B2 (en) * 2018-09-28 2021-03-02 Microsoft Technology Licensing, Llc Two-phase thermodynamic system having a porous microstructure sheet with varying surface energy to optimize utilization of a working fluid
JP6560425B1 (ja) * 2018-11-09 2019-08-14 古河電気工業株式会社 ヒートパイプ
AT522831B1 (de) * 2019-08-08 2023-05-15 Dau Gmbh & Co Kg Luftwärmetauscher sowie Verfahren zu dessen Herstellung und damit ausgestatteter Elektronikaufbau
WO2021188128A1 (en) * 2020-03-18 2021-09-23 Kelvin Thermal Technologies, Inc. Deformed mesh thermal ground plane
JP7088435B2 (ja) * 2020-05-15 2022-06-21 株式会社村田製作所 ベイパーチャンバー
US11930621B2 (en) 2020-06-19 2024-03-12 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
WO2022082352A1 (zh) * 2020-10-19 2022-04-28 欧菲光集团股份有限公司 均热板及散热装置
CN112629298A (zh) * 2020-12-02 2021-04-09 东莞领杰金属精密制造科技有限公司 均热板制备的方法以及均热板
CN115915699B (zh) * 2021-08-19 2025-09-09 台湾台北科技大学 均热板及其改质制造方法
DE102022120251A1 (de) 2021-12-02 2023-06-07 Pimems, Inc. Hochleistungsfähige zweiphasen-kühleinrichtung
WO2023212236A1 (en) 2022-04-28 2023-11-02 Johnson Controls Tyco Ip Holdings, Llp Direct evaporative cooling system for data center with fan and water optimization
KR20230158286A (ko) 2022-05-11 2023-11-20 현대자동차주식회사 파워모듈용 냉각장치
FR3138943A1 (fr) * 2022-08-17 2024-02-23 Commissariat A L'energie Atomique Et Aux Energies Alternatives Caloduc à section transversale non cylindrique, comprenant un évaporateur à structure d’interface vapeur/liquide améliorée afin d’augmenter la limite d’ébullition.
DE102022131995A1 (de) 2022-12-02 2024-06-13 Gentherm Präzision SE Kühlvorrichtung für elektrochemische und elektrotechnische Bauteile
JP2025538313A (ja) 2022-12-02 2025-11-27 キャラ エルティーディー 電気化学的部品および電気工学的部品の冷却装置
DE202022106754U1 (de) 2022-12-02 2024-03-11 Gentherm Präzision SE Kühlvorrichtung für elektrochemische und elektrotechnische Bauteile

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3042382A (en) * 1957-10-31 1962-07-03 Parsons C A & Co Ltd Plate type heat exchangers
US3786861A (en) 1971-04-12 1974-01-22 Battelle Memorial Institute Heat pipes
US4800956A (en) 1986-04-25 1989-01-31 Digital Equipment Corporation Apparatus and method for removal of heat from packaged element
US5179043A (en) * 1989-07-14 1993-01-12 The Texas A&M University System Vapor deposited micro heat pipes
US5520244A (en) 1992-12-16 1996-05-28 Sdl, Inc. Micropost waste heat removal system
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
US6293332B2 (en) * 1999-03-31 2001-09-25 Jia Hao Li Structure of a super-thin heat plate
US6875247B2 (en) * 2000-06-06 2005-04-05 Battelle Memorial Institute Conditions for fluid separations in microchannels, capillary-driven fluid separations, and laminated devices capable of separating fluids
CN2580604Y (zh) * 2002-10-16 2003-10-15 徐惠群 抗高压应力及可弯曲的板式热管
US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
TW577969B (en) * 2003-07-21 2004-03-01 Arro Superconducting Technolog Vapor/liquid separated heat exchanging device
JP2005077052A (ja) * 2003-09-03 2005-03-24 Hitachi Metals Ltd 平面型ヒートパイプ
CA2574200A1 (en) * 2004-07-21 2006-01-26 Xiao Huang Hybrid wicking materials for use in high performance heat pipes
US7718552B2 (en) 2005-04-04 2010-05-18 The Regents Of The University Of California Nanostructured titania
US20090056917A1 (en) 2005-08-09 2009-03-05 The Regents Of The University Of California Nanostructured micro heat pipes
JP2007113864A (ja) * 2005-10-21 2007-05-10 Sony Corp 熱輸送装置及び電子機器
SG142174A1 (en) * 2006-10-11 2008-05-28 Iplato Pte Ltd Method for heat transfer and device therefor
JP2008153423A (ja) * 2006-12-18 2008-07-03 Yaskawa Electric Corp ベーパチャンバおよびそれを用いた電子装置
US8356657B2 (en) * 2007-12-19 2013-01-22 Teledyne Scientific & Imaging, Llc Heat pipe system
WO2010036442A1 (en) * 2008-07-21 2010-04-01 The Regents Of The University Of California Titanium-based thermal ground plane
US20220228811A9 (en) 2008-07-21 2022-07-21 The Regents Of The University Of California Titanium-based thermal ground plane
CN101655328A (zh) * 2008-08-19 2010-02-24 何昆耀 平板式回路热导装置及其制造方法
JP4737285B2 (ja) 2008-12-24 2011-07-27 ソニー株式会社 熱輸送デバイス及び電子機器
US20100175856A1 (en) * 2009-01-12 2010-07-15 Meyer Iv George Anthony Vapor chamber with wick structure of different thickness and die for forming the same
US9163883B2 (en) * 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
US20110024085A1 (en) * 2009-07-28 2011-02-03 Huang Yu-Po Heat pipe and method for manufacturing the same
CN102042777B (zh) * 2009-10-15 2013-06-05 富准精密工业(深圳)有限公司 平板式热管
CN102042776A (zh) * 2009-10-16 2011-05-04 富准精密工业(深圳)有限公司 回路热管
TW201127266A (en) * 2010-01-20 2011-08-01 Pegatron Corp Vapor chamber and manufacturing method thereof
US20120031587A1 (en) * 2010-08-05 2012-02-09 Kunshan Jue-Choung Electronics Co., Ltd. Capillary structure of heat plate
KR20120065575A (ko) * 2010-12-13 2012-06-21 한국전자통신연구원 압출로 제작되는 박막형 히트파이프
WO2012106326A1 (en) 2011-01-31 2012-08-09 The Regents Of The University Of California Using millisecond pulsed laser welding in mems packaging
KR20140029633A (ko) * 2012-08-29 2014-03-11 한국전자통신연구원 모세관력이 향상된 방열소자 및 그 제조방법
JP2014214985A (ja) * 2013-04-26 2014-11-17 富士通株式会社 蒸発器、冷却装置及び電子装置
US20150122460A1 (en) * 2013-11-06 2015-05-07 Asia Vital Components Co., Ltd. Heat pipe structure

Also Published As

Publication number Publication date
KR102505767B1 (ko) 2023-03-06
CN107532860A (zh) 2018-01-02
US10458719B2 (en) 2019-10-29
WO2016118545A1 (en) 2016-07-28
EP3247962A4 (en) 2018-08-29
JP2018503058A (ja) 2018-02-01
EP3247962B1 (en) 2019-07-10
US20200003500A1 (en) 2020-01-02
US11215403B2 (en) 2022-01-04
US20160216042A1 (en) 2016-07-28
EP3247962A1 (en) 2017-11-29
KR20170103900A (ko) 2017-09-13

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Effective date of registration: 20190923

Address after: California, USA

Applicant after: Baode Co.

Address before: California, USA

Applicant before: Pi Micro Electro Mechanical Systems

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Effective date of registration: 20210914

Address after: California, USA

Patentee after: Pimmes Co.

Address before: California, USA

Patentee before: Baode Co.

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200515

CF01 Termination of patent right due to non-payment of annual fee