JP2018195725A5 - - Google Patents

Download PDF

Info

Publication number
JP2018195725A5
JP2018195725A5 JP2017098913A JP2017098913A JP2018195725A5 JP 2018195725 A5 JP2018195725 A5 JP 2018195725A5 JP 2017098913 A JP2017098913 A JP 2017098913A JP 2017098913 A JP2017098913 A JP 2017098913A JP 2018195725 A5 JP2018195725 A5 JP 2018195725A5
Authority
JP
Japan
Prior art keywords
inspection
inspection system
temperature
substrate
temperature measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017098913A
Other languages
English (en)
Japanese (ja)
Other versions
JP6785186B2 (ja
JP2018195725A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2017098913A external-priority patent/JP6785186B2/ja
Priority to JP2017098913A priority Critical patent/JP6785186B2/ja
Priority to PCT/JP2018/007834 priority patent/WO2018211775A1/ja
Priority to CN201880033005.0A priority patent/CN110709972B/zh
Priority to KR1020197037215A priority patent/KR102311129B1/ko
Priority to US16/613,376 priority patent/US11378610B2/en
Priority to TW107116543A priority patent/TWI749227B/zh
Publication of JP2018195725A publication Critical patent/JP2018195725A/ja
Publication of JP2018195725A5 publication Critical patent/JP2018195725A5/ja
Publication of JP6785186B2 publication Critical patent/JP6785186B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017098913A 2017-05-18 2017-05-18 検査システムおよび検査システムにおける温度測定方法 Active JP6785186B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2017098913A JP6785186B2 (ja) 2017-05-18 2017-05-18 検査システムおよび検査システムにおける温度測定方法
US16/613,376 US11378610B2 (en) 2017-05-18 2018-03-01 Inspection system and temperature measuring method for inspection system
CN201880033005.0A CN110709972B (zh) 2017-05-18 2018-03-01 检查系统和检查系统中的温度测定方法
KR1020197037215A KR102311129B1 (ko) 2017-05-18 2018-03-01 검사 시스템 및 검사 시스템에 있어서의 온도 측정 방법
PCT/JP2018/007834 WO2018211775A1 (ja) 2017-05-18 2018-03-01 検査システムおよび検査システムにおける温度測定方法
TW107116543A TWI749227B (zh) 2017-05-18 2018-05-16 檢查系統及檢查系統中之溫度測定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017098913A JP6785186B2 (ja) 2017-05-18 2017-05-18 検査システムおよび検査システムにおける温度測定方法

Publications (3)

Publication Number Publication Date
JP2018195725A JP2018195725A (ja) 2018-12-06
JP2018195725A5 true JP2018195725A5 (enExample) 2020-02-20
JP6785186B2 JP6785186B2 (ja) 2020-11-18

Family

ID=64273738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017098913A Active JP6785186B2 (ja) 2017-05-18 2017-05-18 検査システムおよび検査システムにおける温度測定方法

Country Status (6)

Country Link
US (1) US11378610B2 (enExample)
JP (1) JP6785186B2 (enExample)
KR (1) KR102311129B1 (enExample)
CN (1) CN110709972B (enExample)
TW (1) TWI749227B (enExample)
WO (1) WO2018211775A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10811290B2 (en) * 2018-05-23 2020-10-20 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for inspection stations
JP7153556B2 (ja) * 2018-12-28 2022-10-14 東京エレクトロン株式会社 温度測定部材、検査装置及び温度測定方法
KR102663130B1 (ko) * 2019-09-12 2024-05-07 양쯔 메모리 테크놀로지스 씨오., 엘티디. 열 표시자를 갖는 기판을 포함하는 전자 구성요소
KR102720570B1 (ko) * 2019-12-24 2024-10-21 에스케이하이닉스 주식회사 반도체 테스트 시스템 및 방법
US11262401B2 (en) * 2020-04-22 2022-03-01 Mpi Corporation Wafer probe station
JP7677727B2 (ja) 2021-02-26 2025-05-15 東京エレクトロン株式会社 検査装置及び温度制御方法
CN114814543A (zh) * 2022-04-22 2022-07-29 上海晶岳电子有限公司 一种电源管理芯片抗温度冲击测试系统及其测试方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3995800B2 (ja) * 1998-06-03 2007-10-24 セイコーインスツル株式会社 半導体装置の検査方法
JP4267112B2 (ja) * 1998-11-25 2009-05-27 東京エレクトロン株式会社 温度測定方法および温度測定装置
JP2001024204A (ja) 1999-07-06 2001-01-26 Canon Inc 太陽電池モジュールの検査装置ならびに検査方法
JP4548817B2 (ja) 2002-10-18 2010-09-22 東京エレクトロン株式会社 プローブ装置
JP4343151B2 (ja) * 2004-08-11 2009-10-14 東京エレクトロン株式会社 加熱プレートの温度測定方法、基板処理装置及び加熱プレートの温度測定用のコンピュータプログラム
JP2010027729A (ja) * 2008-07-16 2010-02-04 Elpida Memory Inc プローブ装置及びそれを用いた半導体ウェハの検査方法
KR101209503B1 (ko) * 2008-11-10 2012-12-07 고쿠리츠다이가쿠호진 도호쿠다이가쿠 반도체 웨이퍼의 온도 제어 장치 및 온도 제어 방법
JP2011192867A (ja) * 2010-03-16 2011-09-29 Hitachi High-Technologies Corp プロキシミティ露光装置、プロキシミティ露光装置のステージ温度制御方法、及び表示用パネル基板の製造方法
JP5528998B2 (ja) * 2010-12-15 2014-06-25 株式会社アドバンテスト 試験装置
JP5952645B2 (ja) * 2012-06-06 2016-07-13 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
JP6333112B2 (ja) * 2014-08-20 2018-05-30 東京エレクトロン株式会社 ウエハ検査装置
JP6406221B2 (ja) * 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法

Similar Documents

Publication Publication Date Title
JP2018195725A5 (enExample)
EP3685440A4 (en) 3D SEMICONDUCTOR COMPONENT, STRUCTURE AND PROCESS
EP3521932A4 (en) MEASURING SYSTEM, SUBSTRATE PROCESSING SYSTEM AND DEVICE MANUFACTURING METHOD
EP3467877A4 (en) ELECTRONIC DEVICE BASED ON A TWIN-DIMENSIONAL SEMICONDUCTOR AND METHOD OF MANUFACTURING THEREOF
EP3588539A4 (en) SEMICONDUCTOR SUBSTRATE, ELECTRONIC DEVICE, METHOD OF INSPECTING A SEMICONDUCTOR SUBSTRATE, AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
EP3444842A4 (en) ARRAY SUBSTRATE AND PRODUCTION METHOD THEREFOR, SENSOR AND DETECTING DEVICE
EP3723120A4 (en) CIRCUIT BOARD, SEMICONDUCTOR COMPONENT AND METHOD FOR MANUFACTURING A CIRCUIT BOARD
EP3486638A4 (en) INSPECTION PROCESS, INSPECTION / REPORTING METHOD, MANUFACTURING METHOD WITH THE INSPECTION METHOD, INSPECTION DEVICE AND MANUFACTURING DEVICE
EP3645048A4 (en) MULTISPECIFIC ANTIBODIES AND THE METHOD OF MANUFACTURING AND USING THEREOF
EP3242319A4 (en) THIN-LAYER TRANSISTOR AND PRODUCTION PROCESS THEREFOR, AND ARRAY SUBSTRATE AND PRODUCTION METHOD THEREFOR
EP3355110A4 (en) ARRAY SUBSTRATE, MANUFACTURING METHOD AND DISPLAY DEVICE
IL267092B1 (en) Metrology apparatus, lithographic system, and method of measuring a structure
EP3467591A4 (en) BRAND DETECTION APPARATUS, BRAND DETECTION METHOD, MEASURING APPARATUS, EXPOSURE APPARATUS, EXPOSURE METHOD AND DEVICE MANUFACTURING METHOD
EP3767379A4 (en) DISPLAY SUBSTRATE, MANUFACTURING PROCESS, DISPLAY PANEL AND DISPLAY DEVICE
EP3340312A4 (en) THIN-LAYER TRANSISTOR AND METHOD OF MANUFACTURING THEREOF, ARRAY SUBSTRATE AND PRODUCTION METHOD THEREFOR AND DISPLAY DEVICE
EP3642880A4 (en) DISPLAY SUBSTRATE, DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY SUBSTRATE
EP3622558A4 (en) DISPLAY SUBSTRATE, DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY SUBSTRATE
EP4086955A4 (en) Semiconductor structure having stacked units and manufacturing method therefor, and electronic device
EP3444845A4 (en) METHOD FOR PRODUCING A DISPLAY SUBSTRATE, DISPLAY SUBSTRATE AND DISPLAY DEVICE
HUE058162T2 (hu) Hõvezetõ anyagösszetétel, félvezetõ eszköz, eljárás a félvezetõ eszköz elõállítására, és eljárás hõnyelõ lemez rögzítésére
EP3546622A4 (en) NITRIDE SUBSTRATE SUBSTRATE, MANUFACTURING METHOD AND SEMICONDUCTOR ELEMENT
EP3321653A4 (en) SEMICONDUCTOR ELEMENT, DYNAMIC MEASUREMENT DEVICE AND METHOD FOR PRODUCING A SEMICONDUCTOR ELEMENT
EP3761373A4 (en) THIN FILM TRANSISTOR AND ITS MANUFACTURING PROCESS, MATRIX SUBSTRATE AND ELECTRONIC DEVICE
EP3731279A4 (en) SUBSTRATE AND METHOD OF MANUFACTURING THEREFORE AND ELECTRONIC DEVICE
HUE055522T2 (hu) Szerkezet szubsztrátum szállítására, ilyen szerkezet szubsztrátumhordozójához hozzáillesztett felvevõlemezzel ellátott kezelõszerkezet és eljárás szubsztrátum processzálására ilyen szerkezetet használva a szubsztrátum szállítására, valamint kezelõberen...