JP2018193608A - めっき装置 - Google Patents
めっき装置 Download PDFInfo
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- JP2018193608A JP2018193608A JP2017219484A JP2017219484A JP2018193608A JP 2018193608 A JP2018193608 A JP 2018193608A JP 2017219484 A JP2017219484 A JP 2017219484A JP 2017219484 A JP2017219484 A JP 2017219484A JP 2018193608 A JP2018193608 A JP 2018193608A
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- Prior art keywords
- plating
- regions
- shielding
- anode
- plating apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
10 めっき槽
20 ジグ
30 アノード
50 第2遮蔽部
100、200、300 第1遮蔽部
110 フレーム
120、120′ 隔壁
130、130′ 貫通領域
150 遮蔽部材
Claims (10)
- めっき液を収容し、カソード電極に接続されるめっき対象物が投入されるめっき槽と、
前記めっき槽内に前記めっき対象物に向いて配置されるアノードと、
前記めっき対象物と前記アノードとの間に配置され、複数の貫通領域が形成されたフレーム及び前記複数の貫通領域に選択的に挿入される複数の遮蔽部材を備えた第1遮蔽部と、
を含むめっき装置。 - 前記フレームには、隔壁により前記複数の貫通領域が分割され、
前記複数の遮蔽部材は、前記複数の貫通領域に挿入される複数のブロックを含む請求項1に記載のめっき装置。 - 前記フレームには、前記複数の貫通領域が格子構造で形成される請求項2に記載のめっき装置。
- 前記隔壁により、前記複数の貫通領域が多角形または円形に分割される請求項2に記載のめっき装置。
- 前記フレームには、面積の異なる前記複数の貫通領域が形成され、
前記複数の遮蔽部材は、前記複数の貫通領域に対応して互いに大きさが異なって形成される請求項1から請求項4のいずれか1項に記載のめっき装置。 - 前記フレームには、同一の面積の前記複数の貫通領域が形成され、
前記複数の遮蔽部材のうちの少なくとも1つは、内部に貫通ホールが形成された請求項1から請求項4のいずれか1項に記載のめっき装置。 - 前記複数の遮蔽部材は、前記フレームに嵌め合い結合により結合される請求項1から請求項6のいずれか1項に記載のめっき装置。
- 前記第1遮蔽部は、前記めっき対象物に対して領域毎に電流の流れを差別化する請求項1から請求項7のいずれか1項に記載のめっき装置。
- 前記アノードと前記第1遮蔽部との間に配置され、選択的に貫通部が形成された第2遮蔽部をさらに含む請求項1から請求項8のいずれか1項に記載のめっき装置。
- 前記アノードから前記めっき対象物への電流の流れは、
前記第2遮蔽部により、前記めっき対象物の全面に均一に分散され、
前記第1遮蔽部により、前記めっき対象物の領域毎に差別化される請求項9に記載のめっき装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170061211A KR20180126312A (ko) | 2017-05-17 | 2017-05-17 | 도금장치 |
KR10-2017-0061211 | 2017-05-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018193608A true JP2018193608A (ja) | 2018-12-06 |
JP6601979B2 JP6601979B2 (ja) | 2019-11-06 |
Family
ID=64570024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017219484A Active JP6601979B2 (ja) | 2017-05-17 | 2017-11-14 | めっき装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6601979B2 (ja) |
KR (1) | KR20180126312A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019014955A (ja) * | 2017-07-11 | 2019-01-31 | 株式会社荏原製作所 | レギュレーションプレート、アノードホルダ、及び基板ホルダ |
CN115244223A (zh) * | 2020-02-28 | 2022-10-25 | 塞姆西斯科有限责任公司 | 用于对基底进行化学和/或电解表面处理的工艺流体及电流的分配系统 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS537543A (en) * | 1976-07-12 | 1978-01-24 | Fujitsu Ltd | Plating method |
JPS53146721U (ja) * | 1977-04-26 | 1978-11-18 | ||
JPS54116519U (ja) * | 1978-02-03 | 1979-08-15 | ||
JP2002054000A (ja) * | 2000-08-02 | 2002-02-19 | Nitto Denko Corp | 基板の電解めっき方法 |
JP2002302799A (ja) * | 2001-04-05 | 2002-10-18 | Sumitomo Metal Mining Co Ltd | 電気めっき方法および電気めっき方法で用いる遮へい板 |
JP2005029863A (ja) * | 2003-07-10 | 2005-02-03 | Ebara Corp | めっき装置 |
JP2007231315A (ja) * | 2006-02-28 | 2007-09-13 | Casio Comput Co Ltd | めっき装置およびめっき方法 |
US20120292195A1 (en) * | 2011-05-19 | 2012-11-22 | Lee Ui Hyoung | Apparatus and method for electroplating for semiconductor substrate |
KR20130033821A (ko) * | 2011-09-27 | 2013-04-04 | 삼성전기주식회사 | 도금설비용 차폐장치 |
KR20140147956A (ko) * | 2013-06-20 | 2014-12-31 | 대덕전자 주식회사 | 전기도금장치 |
-
2017
- 2017-05-17 KR KR1020170061211A patent/KR20180126312A/ko active Search and Examination
- 2017-11-14 JP JP2017219484A patent/JP6601979B2/ja active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS537543A (en) * | 1976-07-12 | 1978-01-24 | Fujitsu Ltd | Plating method |
JPS53146721U (ja) * | 1977-04-26 | 1978-11-18 | ||
JPS54116519U (ja) * | 1978-02-03 | 1979-08-15 | ||
JP2002054000A (ja) * | 2000-08-02 | 2002-02-19 | Nitto Denko Corp | 基板の電解めっき方法 |
JP2002302799A (ja) * | 2001-04-05 | 2002-10-18 | Sumitomo Metal Mining Co Ltd | 電気めっき方法および電気めっき方法で用いる遮へい板 |
JP2005029863A (ja) * | 2003-07-10 | 2005-02-03 | Ebara Corp | めっき装置 |
JP2007231315A (ja) * | 2006-02-28 | 2007-09-13 | Casio Comput Co Ltd | めっき装置およびめっき方法 |
US20120292195A1 (en) * | 2011-05-19 | 2012-11-22 | Lee Ui Hyoung | Apparatus and method for electroplating for semiconductor substrate |
KR20130033821A (ko) * | 2011-09-27 | 2013-04-04 | 삼성전기주식회사 | 도금설비용 차폐장치 |
KR20140147956A (ko) * | 2013-06-20 | 2014-12-31 | 대덕전자 주식회사 | 전기도금장치 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019014955A (ja) * | 2017-07-11 | 2019-01-31 | 株式会社荏原製作所 | レギュレーションプレート、アノードホルダ、及び基板ホルダ |
US11268207B2 (en) | 2017-07-11 | 2022-03-08 | Ebara Corporation | Regulation plate, anode holder, and substrate holder |
US11686009B2 (en) | 2017-07-11 | 2023-06-27 | Ebara Corporation | Regulation plate, anode holder, and substrate holder |
CN115244223A (zh) * | 2020-02-28 | 2022-10-25 | 塞姆西斯科有限责任公司 | 用于对基底进行化学和/或电解表面处理的工艺流体及电流的分配系统 |
Also Published As
Publication number | Publication date |
---|---|
JP6601979B2 (ja) | 2019-11-06 |
KR20180126312A (ko) | 2018-11-27 |
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