JP2018190839A - 離脱装置 - Google Patents

離脱装置 Download PDF

Info

Publication number
JP2018190839A
JP2018190839A JP2017092481A JP2017092481A JP2018190839A JP 2018190839 A JP2018190839 A JP 2018190839A JP 2017092481 A JP2017092481 A JP 2017092481A JP 2017092481 A JP2017092481 A JP 2017092481A JP 2018190839 A JP2018190839 A JP 2018190839A
Authority
JP
Japan
Prior art keywords
outer periphery
axis direction
adhesive tape
frame
detaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017092481A
Other languages
English (en)
Japanese (ja)
Inventor
関家　一馬
Kazuma Sekiya
一馬 関家
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2017092481A priority Critical patent/JP2018190839A/ja
Priority to TW107112079A priority patent/TWI786102B/zh
Priority to CN201810397606.1A priority patent/CN108878339B/zh
Publication of JP2018190839A publication Critical patent/JP2018190839A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Surgical Instruments (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2017092481A 2017-05-08 2017-05-08 離脱装置 Pending JP2018190839A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017092481A JP2018190839A (ja) 2017-05-08 2017-05-08 離脱装置
TW107112079A TWI786102B (zh) 2017-05-08 2018-04-09 脫離裝置
CN201810397606.1A CN108878339B (zh) 2017-05-08 2018-04-28 脱离装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017092481A JP2018190839A (ja) 2017-05-08 2017-05-08 離脱装置

Publications (1)

Publication Number Publication Date
JP2018190839A true JP2018190839A (ja) 2018-11-29

Family

ID=64327218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017092481A Pending JP2018190839A (ja) 2017-05-08 2017-05-08 離脱装置

Country Status (3)

Country Link
JP (1) JP2018190839A (zh)
CN (1) CN108878339B (zh)
TW (1) TWI786102B (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634642A (ja) * 1986-06-25 1988-01-09 Hitachi Ltd ウエハ分割方法
JP2000353710A (ja) * 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3484936B2 (ja) * 1997-08-05 2004-01-06 株式会社村田製作所 チップ状部品の取扱方法および装置
JP5075013B2 (ja) * 2008-05-27 2012-11-14 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
KR20160100142A (ko) * 2015-02-13 2016-08-23 샌디스크 인포메이션 테크놀로지 (상하이) 컴퍼니, 리미티드 다이 프리필링 장치 및 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634642A (ja) * 1986-06-25 1988-01-09 Hitachi Ltd ウエハ分割方法
JP2000353710A (ja) * 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法

Also Published As

Publication number Publication date
TWI786102B (zh) 2022-12-11
CN108878339B (zh) 2024-02-06
TW201843723A (zh) 2018-12-16
CN108878339A (zh) 2018-11-23

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