JP2018182324A - 静電放電保護構造を含む半導体デバイス - Google Patents
静電放電保護構造を含む半導体デバイス Download PDFInfo
- Publication number
- JP2018182324A JP2018182324A JP2018075914A JP2018075914A JP2018182324A JP 2018182324 A JP2018182324 A JP 2018182324A JP 2018075914 A JP2018075914 A JP 2018075914A JP 2018075914 A JP2018075914 A JP 2018075914A JP 2018182324 A JP2018182324 A JP 2018182324A
- Authority
- JP
- Japan
- Prior art keywords
- trench
- gate
- semiconductor device
- semiconductor body
- electrostatic discharge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 247
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 88
- 238000000034 method Methods 0.000 claims description 53
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 41
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 38
- 239000002019 doping agent Substances 0.000 claims description 29
- 230000008569 process Effects 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 238000000151 deposition Methods 0.000 claims description 18
- 238000002955 isolation Methods 0.000 claims description 14
- 238000000926 separation method Methods 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000002513 implantation Methods 0.000 claims description 7
- 238000007517 polishing process Methods 0.000 claims description 6
- 238000011049 filling Methods 0.000 claims description 5
- 238000001020 plasma etching Methods 0.000 claims description 5
- 238000010297 mechanical methods and process Methods 0.000 claims 1
- 230000005226 mechanical processes and functions Effects 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 21
- 239000002184 metal Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 16
- 229920005591 polysilicon Polymers 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 210000000746 body region Anatomy 0.000 description 11
- 230000015556 catabolic process Effects 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 9
- 230000008021 deposition Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000005669 field effect Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- -1 SnAu Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000005380 borophosphosilicate glass Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005360 phosphosilicate glass Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910016570 AlCu Inorganic materials 0.000 description 1
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910007637 SnAg Inorganic materials 0.000 description 1
- 229910008433 SnCU Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000002365 hybrid physical--chemical vapour deposition Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0259—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using bipolar transistors as protective elements
- H01L27/0262—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using bipolar transistors as protective elements including a PNP transistor and a NPN transistor, wherein each of said transistors has its base coupled to the collector of the other transistor, e.g. silicon controlled rectifier [SCR] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
- H01L29/7808—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a breakdown diode, e.g. Zener diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0873—Drain regions
- H01L29/0882—Disposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
面、又はc軸(a面、面法線に対して4°外れる)に沿った、他の結晶方位におけるチャネル移動度は、大幅により高い。従って、トレンチ構造Tは、第1の面101の面法線に対して0°〜45°、0°〜20°、0°〜15°、0°〜10°、又は0°〜5°の範囲内で外れた方位を有するテーパー状側壁を含んでもよい。
100 半導体本体
101 第1の面
102 第2の面
140 ウェル領域
150 ソース領域
200 誘電体層
300 多結晶シリコン層
310 静電放電保護構造
312 第1の端子領域
314 第2の端子領域
316 第1の領域
318 第2の領域
320 ゲート電極
400 分離層
500 ソースコンタクト構造
510 第1の電気コンタクト構造
600 ゲートコンタクト構造
610 第2の電気コンタクト構造
1000 トランジスタ構造
2000 半導体デバイスの製造方法
Claims (20)
- 第1の面、及び前記第1の面の反対側に第2の面を有する炭化ケイ素半導体本体と、
前記半導体本体内のトランジスタ構造と、
前記第1の面から前記半導体本体内に延在するトレンチ構造と、
前記トレンチ構造内に収容される静電放電保護構造であって、第1の端子領域及び第2の端子領域を含む静電放電保護構造と、
前記第1の面におけるソースコンタクト構造であって、前記トランジスタ構造のソース領域と、前記第1の端子領域とに電気的に接続されるソースコンタクト構造と、
前記第1の面におけるゲートコンタクト構造であって、前記トランジスタ構造のゲート電極と、前記第2の端子領域とに電気的に接続されるゲートコンタクト構造と、
を含む、半導体デバイス。 - 前記静電放電保護構造が、バックトゥーバックダイオードチェーンを構成するように交互に配置された第1の領域と、逆の導電型の少なくとも1つの第2の領域とを有する多結晶シリコン層を含む、請求項1に記載の半導体デバイス。
- 前記トレンチ構造が、それぞれがバックトゥーバックダイオードチェーンを収容する複数の縦トレンチを含む、請求項1又は2に記載の半導体デバイス。
- 前記ソースコンタクト構造及び前記ゲートコンタクト構造が、同じ相互接続層内に形成され、且つ横ギャップ分だけ互いに間隔を空け、前記縦トレンチが、前記横ギャップを埋める、請求項3に記載の半導体デバイス。
- 前記縦トレンチが、それぞれ、横平面内で前記縦トレンチの縦方向に沿った長さを有し、及びそれぞれ、横平面内の前記縦トレンチの縦方向に対して直角な幅を有し、前記長さと前記幅との比率が、5〜50の範囲内にある、請求項3又は4に記載の半導体デバイス。
- 前記縦トレンチが、互いから平均距離を有して並列に配置され、及びそれぞれが、横平面内の前記縦トレンチの縦方向に対して直角な幅を有し、前記平均距離と前記幅との比率が、0.1〜10の範囲内にある、請求項3から5の何れか一項に記載の半導体デバイス。
- 前記トレンチ構造が、多結晶シリコンで充填され、前記多結晶シリコンが、前記半導体本体の前記第1の面と平行な平面的な上面を有する、請求項1から6の何れか一項に記載の半導体デバイス。
- 前記トレンチ構造内の前記静電放電保護構造を前記半導体本体から電気的に絶縁するために、前記トレンチ構造の側壁にライニングを施す誘電体層をさらに含む、請求項1から7の何れか一項に記載の半導体デバイス。
- 前記第1の面から前記半導体本体内に延在するゲートトレンチをさらに含み、前記ゲートトレンチが、前記トランジスタ構造の前記ゲート電極を収容する、請求項1から8の何れか一項に記載の半導体デバイス。
- 前記ゲートトレンチの側壁にさらにライニングを施す前記誘電体層が、前記トランジスタ構造のゲート誘電体を構成する、請求項8又は9に記載の半導体デバイス。
- 前記ゲートトレンチ内の多結晶シリコンの正味のドーパント濃度が、前記トレンチ構造内の多結晶シリコンの正味のドーパント濃度よりも少なくとも10倍高い、請求項9又は10に記載の半導体デバイス。
- 前記トレンチ構造が、前記半導体本体においてウェル領域によって取り囲まれている、請求項1から11の何れか一項に記載の半導体デバイス。
- 前記ウェル領域が、注入ウェルである、請求項12に記載の半導体デバイス。
- 前記トレンチ構造が、前記第1の面の面法線に対して0°〜45°の範囲内で外れた方位を有するテーパー状側壁を含む、請求項1から13の何れか一項に記載の半導体デバイス。
- 前記第1の面上に分離層をさらに含み、前記ソースコンタクト構造が、前記分離層上に形成され、且つ第1の電気コンタクト構造を介して前記静電放電保護構造の前記第1の端子領域に電気的に結合され、及び前記ゲートコンタクト構造が、前記分離層上に形成され、且つ第2の電気コンタクト構造を介して、前記静電放電保護構造の前記第2の端子領域に電気的に結合されている、請求項1から14の何れか一項に記載の半導体デバイス。
- 第1の面、及び前記第1の面の反対側に第2の面を有する炭化ケイ素半導体本体と、
前記炭化ケイ素半導体本体内のトランジスタ構造と、
前記炭化ケイ素半導体本体上の静電放電保護構造であって、第1の端子領域及び第2の端子領域を含む静電放電保護構造と、
前記第1の面におけるソースコンタクト構造であって、前記トランジスタ構造のソース領域と、前記第1の端子領域とに電気的に接続されているソースコンタクト構造と、
前記第1の面におけるゲートコンタクト構造であって、前記トランジスタ構造のゲート電極と、前記第2の端子領域とに電気的に接続されているゲートコンタクト構造と、
を含む半導体デバイスであって、
前記静電放電保護構造が、バックトゥーバックダイオードチェーンを構成するように交互に配置された、複数の第1の領域及び逆の導電型の複数の第2の領域を含む、半導体デバイス。 - トランジスタ構造を炭化ケイ素半導体本体内に形成するステップであって、前記半導体本体が、第1の面、及び前記第1の面の反対側に第2の面を有する、ステップと、
前記第1の面から前記半導体本体内に延在するトレンチ構造を形成するステップと、
前記トレンチ構造内に収容される静電放電保護構造を形成するステップであって、前記静電放電保護構造が、第1の端子領域及び第2の端子領域を含む、ステップと、
前記第1の面にソースコンタクト構造を形成するステップであって、前記ソースコンタクト構造が、前記トランジスタ構造のソース領域及び前記第1の端子領域に電気的に接続される、ステップと、
前記第1の面にゲートコンタクト構造を形成するステップであって、前記ゲートコンタクト構造が、前記トランジスタ構造のゲート電極及び前記第2の端子領域に電気的に接続される、ステップと、
を含む、半導体デバイスの製造方法。 - 前記静電放電保護構造を形成する前記ステップが、
前記トレンチ構造が充填されるまで、前記半導体本体の前記面上に多結晶シリコンを付着させることと、
前記トレンチ構造より上に存在する多結晶シリコンを除去するために、化学機械研磨工程又はプラズマエッチング処理を実行することと、
前記トレンチ構造内に残る前記多結晶シリコン内にバックトゥーバックダイオードチェーンを形成することと、
を含む、請求項17に記載の方法。 - 前記トランジスタ構造の形成及び前記トレンチ構造の形成が、
前記第1の面から前記半導体本体内に延在するゲートトレンチ及び前記トレンチ構造を同時に形成することと、
前記トレンチ構造及び前記ゲートトレンチが充填されるまで、前記半導体本体の前記面上に多結晶シリコンを付着させることと、
前記トレンチ構造及び前記ゲートトレンチより上に存在する多結晶シリコンを除去するために、前記ゲートトレンチ内の前記多結晶シリコン及び前記トレンチ構造内の前記多結晶シリコンが互いに分離されるように、化学機械研磨工程を実行することと、
を含む、請求項17又は18に記載の方法。 - 前記多結晶シリコンを付着させることは、第1の正味のドーパント濃度を有する多結晶シリコンで前記トレンチ構造を充填し、及び前記第1の正味のドーパント濃度よりも少なくとも10倍高い第2の正味のドーパント濃度を有する多結晶シリコンで前記ゲートトレンチを充填することを含む、請求項19に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017108047.3 | 2017-04-13 | ||
DE102017108047.3A DE102017108047A1 (de) | 2017-04-13 | 2017-04-13 | Halbleitervorrichtung mit struktur zum schutz gegen elektrostatische entladung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018182324A true JP2018182324A (ja) | 2018-11-15 |
JP7207861B2 JP7207861B2 (ja) | 2023-01-18 |
Family
ID=63679155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018075914A Active JP7207861B2 (ja) | 2017-04-13 | 2018-04-11 | 静電放電保護構造を含む半導体デバイス |
Country Status (3)
Country | Link |
---|---|
US (1) | US11302781B2 (ja) |
JP (1) | JP7207861B2 (ja) |
DE (1) | DE102017108047A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7173661B2 (ja) | 2018-11-16 | 2022-11-16 | ミネベアミツミ株式会社 | 湿度検出装置 |
WO2023042508A1 (ja) * | 2021-09-15 | 2023-03-23 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016115822A1 (de) * | 2016-08-25 | 2018-03-01 | Infineon Technologies Dresden Gmbh | Halbleitervorrichtung mit einer struktur zum schutz gegen elektrostatische entladung |
DE102017105548A1 (de) * | 2017-03-15 | 2018-09-20 | Infineon Technologies Dresden Gmbh | Halbleitervorrichtung, die eine gatekontaktstruktur enthält |
US20210193805A1 (en) * | 2019-12-18 | 2021-06-24 | Monolithic Power Systems, Inc. | Lateral transistor with lateral conductive field plate over a field plate positioning layer |
JP2021136241A (ja) * | 2020-02-21 | 2021-09-13 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
CN113690276B (zh) * | 2021-07-27 | 2024-02-20 | 京东方科技集团股份有限公司 | 显示面板 |
CN113594139B (zh) * | 2021-07-30 | 2023-12-05 | 深圳市华星光电半导体显示技术有限公司 | 基板及显示面板 |
DE102021121138B3 (de) | 2021-08-13 | 2023-02-02 | Infineon Technologies Ag | Halbleitervorrichtungen und verfahren zum herstellen einer halbleitervorrichtung |
US20230110825A1 (en) * | 2021-09-27 | 2023-04-13 | International Business Machines Corporation | Electrostatic discharge diode having dielectric isolation layer |
US11967639B2 (en) * | 2022-01-26 | 2024-04-23 | Infineon Technologies Ag | SCR structure for ESD protection in SOI technologies |
CN114914295B (zh) * | 2022-06-30 | 2023-05-02 | 电子科技大学 | 一种具有优良正反向导通特性的umos器件 |
CN116055595B (zh) * | 2022-08-03 | 2023-10-20 | 荣耀终端有限公司 | 中框及移动终端 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001257349A (ja) * | 2000-03-09 | 2001-09-21 | Sanyo Electric Co Ltd | Mosfetの保護装置 |
JP2002373988A (ja) * | 2001-06-14 | 2002-12-26 | Rohm Co Ltd | 半導体装置およびその製法 |
JP2006100494A (ja) * | 2004-09-29 | 2006-04-13 | Nec Electronics Corp | 縦型mosfet |
JP2009522784A (ja) * | 2005-12-28 | 2009-06-11 | ビシェイ−シリコニクス | トレンチポリシリコンダイオード |
JP2010050156A (ja) * | 2008-08-19 | 2010-03-04 | Denso Corp | 半導体装置 |
JP2013033931A (ja) * | 2011-06-08 | 2013-02-14 | Rohm Co Ltd | 半導体装置およびその製造方法 |
US20150294966A1 (en) * | 2014-04-14 | 2015-10-15 | Infineon Technologies Dresden Gmbh | Semiconductor Device with Electrostatic Discharge Protection Structure |
JP2016178197A (ja) * | 2015-03-19 | 2016-10-06 | 新電元工業株式会社 | 半導体装置及び半導体装置の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002535839A (ja) | 1999-01-15 | 2002-10-22 | インフィネオン テクノロジース アクチエンゲゼルシャフト | 半導体素子に対するエッジ終端部、エッジ終端部を有するショットキー・ダイオードおよびショットキー・ダイオードの製造方法 |
JP2002141507A (ja) * | 2000-10-31 | 2002-05-17 | Mitsubishi Electric Corp | 半導体装置とその製造方法 |
US7511357B2 (en) | 2007-04-20 | 2009-03-31 | Force-Mos Technology Corporation | Trenched MOSFETs with improved gate-drain (GD) clamp diodes |
TWI441335B (zh) * | 2009-04-10 | 2014-06-11 | Anpec Electronics Corp | 溝渠式半導體元件及其製作方法 |
US8004009B2 (en) | 2009-05-18 | 2011-08-23 | Force Mos Technology Co., Ltd. | Trench MOSFETS with ESD Zener diode |
DE102013108518B4 (de) | 2013-08-07 | 2016-11-24 | Infineon Technologies Ag | Halbleitervorrichtung und verfahren zum herstellen derselben |
US9543208B2 (en) * | 2014-02-24 | 2017-01-10 | Infineon Technologies Ag | Method of singulating semiconductor devices using isolation trenches |
-
2017
- 2017-04-13 DE DE102017108047.3A patent/DE102017108047A1/de active Pending
-
2018
- 2018-04-11 JP JP2018075914A patent/JP7207861B2/ja active Active
- 2018-04-12 US US15/951,918 patent/US11302781B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001257349A (ja) * | 2000-03-09 | 2001-09-21 | Sanyo Electric Co Ltd | Mosfetの保護装置 |
JP2002373988A (ja) * | 2001-06-14 | 2002-12-26 | Rohm Co Ltd | 半導体装置およびその製法 |
JP2006100494A (ja) * | 2004-09-29 | 2006-04-13 | Nec Electronics Corp | 縦型mosfet |
JP2009522784A (ja) * | 2005-12-28 | 2009-06-11 | ビシェイ−シリコニクス | トレンチポリシリコンダイオード |
JP2010050156A (ja) * | 2008-08-19 | 2010-03-04 | Denso Corp | 半導体装置 |
JP2013033931A (ja) * | 2011-06-08 | 2013-02-14 | Rohm Co Ltd | 半導体装置およびその製造方法 |
US20150294966A1 (en) * | 2014-04-14 | 2015-10-15 | Infineon Technologies Dresden Gmbh | Semiconductor Device with Electrostatic Discharge Protection Structure |
JP2016178197A (ja) * | 2015-03-19 | 2016-10-06 | 新電元工業株式会社 | 半導体装置及び半導体装置の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7173661B2 (ja) | 2018-11-16 | 2022-11-16 | ミネベアミツミ株式会社 | 湿度検出装置 |
WO2023042508A1 (ja) * | 2021-09-15 | 2023-03-23 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
US20180301537A1 (en) | 2018-10-18 |
DE102017108047A1 (de) | 2018-10-18 |
US11302781B2 (en) | 2022-04-12 |
JP7207861B2 (ja) | 2023-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7207861B2 (ja) | 静電放電保護構造を含む半導体デバイス | |
US10541327B2 (en) | Semiconductor device comprising a trench structure | |
US10629676B2 (en) | Semiconductor device with cell trench structures and recessed contacts and method of manufacturing a semiconductor device | |
US11121248B2 (en) | Semiconductor device | |
US20220285550A1 (en) | Semiconductor Device Having Contact Trenches Extending from Opposite Sides of a Semiconductor Body | |
US9396997B2 (en) | Method for producing a semiconductor component with insulated semiconductor mesas | |
US9837498B2 (en) | Stripe-shaped electrode structure including a main portion with a field electrode and an end portion terminating the electrode structure | |
CN107195628B (zh) | 半导体器件 | |
US6373100B1 (en) | Semiconductor device and method for fabricating the same | |
JP3981028B2 (ja) | 半導体装置 | |
US10418358B2 (en) | Semiconductor device having an electrostatic discharge protection structure | |
US8134219B2 (en) | Schottky diodes | |
CN106024856B (zh) | 包括平面栅极和沟槽场电极结构的半导体器件 | |
CN111129123A (zh) | 接触场板蚀刻的组合蚀刻停止层、集成芯片及其形成方法 | |
KR101345893B1 (ko) | 바이어스 웰을 갖는 고전압 저항 | |
US10741541B2 (en) | Method of manufacturing a semiconductor device | |
US11133300B2 (en) | Semiconductor device | |
US11133385B2 (en) | Semiconductor device | |
CN113437022A (zh) | 用于源极向下竖直半导体器件的结构和方法 | |
US11177360B2 (en) | Semiconductor device | |
US20230010333A1 (en) | Integrated chip with good thermal dissipation performance | |
CN117317011A (zh) | 一种功率半导体器件及其制作方法 | |
JP4825688B2 (ja) | 半導体装置の製造方法 | |
CN116805629A (zh) | 半导体器件和制造半导体器件的方法 | |
CN117317012A (zh) | 一种半导体器件及其制作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210407 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220614 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220908 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20221206 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230105 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7207861 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |