JP2018181926A - 基板洗浄装置、基板洗浄方法および基板洗浄装置の制御方法 - Google Patents
基板洗浄装置、基板洗浄方法および基板洗浄装置の制御方法 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 227
- 238000004140 cleaning Methods 0.000 title claims abstract description 122
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 115
- 230000002093 peripheral effect Effects 0.000 claims abstract description 3
- 239000007921 spray Substances 0.000 claims description 28
- 238000011086 high cleaning Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 23
- 230000007246 mechanism Effects 0.000 description 21
- 230000008021 deposition Effects 0.000 description 18
- 239000000126 substance Substances 0.000 description 17
- 238000001035 drying Methods 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 238000005498 polishing Methods 0.000 description 8
- 230000007723 transport mechanism Effects 0.000 description 7
- 239000010949 copper Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000008155 medical solution Substances 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
【解決手段】基板を保持して回転させる基板保持回転部と、回転する前記基板に接触して前記基板を洗浄する長尺状の洗浄部材と、前記洗浄部材の長手方向に対して同じ側に配置された第1ノズルおよび第2ノズルと、を備え、前記第1ノズルは、前記基板における前記洗浄部材より前記第1ノズル側の第1領域に、前記第2ノズルより勢いよく液体を供給し、前記第2ノズルは、前記基板における前記洗浄部材より前記第2ノズル側であって、少なくとも基板の周縁部外側の領域を含む前記第1領域より広い第2領域に液体を供給する、基板洗浄装置が提供される。
【選択図】図3
Description
第1ノズルから勢いよく液体を供給することで、洗浄に用いられた液体を効率よく基板から排出でき、洗浄力が向上する。
このように第1領域および第2領域を設定することで、洗浄に用いられた液体を効率よく基板から排出できる。
これにより、液膜が保護されるとともに、第2ノズルから供給される液体が基板Wの外に向かって流れるのが妨げられない。
前記第2ノズルからの液体供給方向は、前記基板の回転方向と逆行しないのが望ましい。
前記第2ノズルからの液体供給方向と、前記洗浄部材と前記基板とが接触する位置における前記洗浄部材の回転方向と、が一致するのが望ましい。
これにより、第1ノズルから供給される液体の勢いを増すことができる。
する。ロールスポンジ308は反時計回りに回転するものとする。
301〜304 ローラ
307,308 ロールスポンジ
310,311 回転機構
315,316 洗浄液供給ノズル
317,318 薬液供給ノズル
Claims (11)
- 基板を保持して回転させる基板保持回転部と、
回転する前記基板に接触して前記基板を洗浄する長尺状の洗浄部材と、
前記洗浄部材の長手方向に対して同じ側に配置された第1ノズルおよび第2ノズルと、を備え、
前記第1ノズルは、前記基板における前記洗浄部材より前記第1ノズル側の第1領域に、前記第2ノズルより勢いよく液体を供給し、
前記第2ノズルは、前記基板における前記洗浄部材より前記第2ノズル側であって、少なくとも基板の周縁部外側の領域を含む前記第1領域より広い第2領域に液体を供給する、基板洗浄装置。 - 前記第1ノズルは単管ノズルであり、前記第2ノズルはスプレー型ノズルである、請求項1に記載の基板洗浄装置。
- 前記洗浄部材はロール型である、請求項1または2に記載の基板洗浄装置。
- 前記第1領域は、前記基板の中心近傍であり、
前記第2領域は、一端の少なくとも一部が前記第1領域の少なくとも一部と重複しており、他端が前記基板の縁まで延びている、請求項1乃至3のいずれかに記載の基板洗浄装置。 - 前記第2領域の長手方向は、前記洗浄部材の長手方向とは非平行であり、前記基板の縁に近いほど前記第2領域は前記洗浄部材と離れる、請求項1乃至4のいずれかに記載の基板洗浄装置。
- 前記第1領域および前記第2領域は、回転する前記基板が前記洗浄部材に接触した後の領域に位置する、請求項1乃至5のいずれかに記載の基板洗浄装置。
- 前記第2ノズルからの液体供給方向は、前記基板の回転方向と逆行しない、請求項1乃至6のいずれかに記載の基板洗浄装置。
- 前記第2ノズルからの液体供給方向と、前記洗浄部材と前記基板とが接触する位置における前記洗浄部材の回転方向と、が一致する、請求項7に記載の基板洗浄装置。
- 前記第1ノズルは、アタッチメントを介して液体供給源からの配管に接続され、
前記アタッチメントにおける液体が通る孔の径は、前記配管の径より小さい、請求項1乃至8のいずれかに記載の基板洗浄装置。 - 基板を保持して回転させることと、
前記基板に接触して前記基板を長尺状の洗浄部材で洗浄すること、
第1ノズルから前記基板における第1領域に液体を供給しつつ、第2ノズルから前記基板における第2領域に液体を供給することと、を含み、
前記第1領域および前記第2領域は、前記洗浄部材の長手方向に対して同じ側であり、
前記第2領域は、前記第1領域より広く、
前記第1ノズルは、前記第2ノズルより勢いよく液体を供給する、基板洗浄方法。 - 基板洗浄装置を制御する方法であって、
基板を保持して回転させることと、
前記基板に接触して前記基板を長尺状の洗浄部材で洗浄させること、
第1ノズルから前記基板における第1領域に液体を供給しつつ、第2ノズルから前記基板における第2領域に液体を供給させることと、を含み、
前記第1領域および前記第2領域は、前記洗浄部材の長手方向に対して同じ側であり、
前記第2領域は、前記第1領域より広く、
前記第1ノズルは、前記第2ノズルより勢いよく液体を供給する、基板洗浄装置の制御方法。
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JP2017075076A JP6877221B2 (ja) | 2017-04-05 | 2017-04-05 | 基板洗浄装置、基板洗浄方法および基板洗浄装置の制御方法 |
TW107109582A TWI765989B (zh) | 2017-04-05 | 2018-03-21 | 基板清洗裝置、基板清洗方法及基板清洗裝置之控制方法 |
KR1020180037988A KR102525018B1 (ko) | 2017-04-05 | 2018-04-02 | 기판 세정 장치, 기판 세정 방법 및 기판 세정 장치의 제어 방법 |
US15/944,654 US10985037B2 (en) | 2017-04-05 | 2018-04-03 | Substrate cleaning apparatus, substrate cleaning method, and control method of substrate cleaning apparatus |
CN201810298844.7A CN108695210B (zh) | 2017-04-05 | 2018-04-04 | 基板清洗装置、基板清洗方法以及基板清洗装置的控制方法 |
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CN112934493A (zh) * | 2019-12-10 | 2021-06-11 | 盛美半导体设备(上海)股份有限公司 | 双头喷嘴结构、清洗设备及清洗方法 |
CN112992733B (zh) * | 2021-02-08 | 2022-03-11 | 江苏亚电科技有限公司 | 一种用于晶圆加工的刷洗装置 |
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JP2015201627A (ja) * | 2014-04-01 | 2015-11-12 | 株式会社荏原製作所 | 洗浄装置及び洗浄方法 |
JP2016009768A (ja) * | 2014-06-25 | 2016-01-18 | 株式会社Screenホールディングス | 基板処理装置、治具、およびティーチング方法 |
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JP5775383B2 (ja) * | 2011-06-30 | 2015-09-09 | 株式会社荏原製作所 | 基板洗浄方法 |
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JP2016009768A (ja) * | 2014-06-25 | 2016-01-18 | 株式会社Screenホールディングス | 基板処理装置、治具、およびティーチング方法 |
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US10985037B2 (en) | 2021-04-20 |
KR102525018B1 (ko) | 2023-04-25 |
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TW201838016A (zh) | 2018-10-16 |
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