JP2018174230A5 - - Google Patents

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Publication number
JP2018174230A5
JP2018174230A5 JP2017071573A JP2017071573A JP2018174230A5 JP 2018174230 A5 JP2018174230 A5 JP 2018174230A5 JP 2017071573 A JP2017071573 A JP 2017071573A JP 2017071573 A JP2017071573 A JP 2017071573A JP 2018174230 A5 JP2018174230 A5 JP 2018174230A5
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JP
Japan
Prior art keywords
substrate
strain
processing apparatus
unit
elastic film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2017071573A
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English (en)
Japanese (ja)
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JP6990980B2 (ja
JP2018174230A (ja
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Application filed filed Critical
Priority claimed from JP2017071573A external-priority patent/JP6990980B2/ja
Priority to JP2017071573A priority Critical patent/JP6990980B2/ja
Priority to US16/499,576 priority patent/US11969858B2/en
Priority to PCT/JP2018/000912 priority patent/WO2018179685A1/ja
Priority to SG11201908780R priority patent/SG11201908780RA/en
Priority to KR1020197030937A priority patent/KR102474471B1/ko
Priority to CN201880022273.2A priority patent/CN110476226B/zh
Priority to TW107108771A priority patent/TWI758436B/zh
Publication of JP2018174230A publication Critical patent/JP2018174230A/ja
Publication of JP2018174230A5 publication Critical patent/JP2018174230A5/ja
Publication of JP6990980B2 publication Critical patent/JP6990980B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017071573A 2017-03-31 2017-03-31 基板処理装置 Active JP6990980B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017071573A JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置
KR1020197030937A KR102474471B1 (ko) 2017-03-31 2018-01-16 기판 처리 장치
PCT/JP2018/000912 WO2018179685A1 (ja) 2017-03-31 2018-01-16 基板処理装置
SG11201908780R SG11201908780RA (en) 2017-03-31 2018-01-16 Substrate processing apparatus
US16/499,576 US11969858B2 (en) 2017-03-31 2018-01-16 Substrate processing apparatus
CN201880022273.2A CN110476226B (zh) 2017-03-31 2018-01-16 基板处理装置
TW107108771A TWI758436B (zh) 2017-03-31 2018-03-15 彈性膜、扣環及基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017071573A JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置

Publications (3)

Publication Number Publication Date
JP2018174230A JP2018174230A (ja) 2018-11-08
JP2018174230A5 true JP2018174230A5 (enExample) 2020-05-07
JP6990980B2 JP6990980B2 (ja) 2022-01-12

Family

ID=63677702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017071573A Active JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置

Country Status (7)

Country Link
US (1) US11969858B2 (enExample)
JP (1) JP6990980B2 (enExample)
KR (1) KR102474471B1 (enExample)
CN (1) CN110476226B (enExample)
SG (1) SG11201908780RA (enExample)
TW (1) TWI758436B (enExample)
WO (1) WO2018179685A1 (enExample)

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KR102629679B1 (ko) * 2018-11-09 2024-01-29 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
US20200306927A1 (en) 2019-03-29 2020-10-01 Saint Gobain Abrasives, Inc. Performance Grinding Solutions
US12226876B2 (en) 2019-04-03 2025-02-18 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
JP7523269B2 (ja) * 2020-07-13 2024-07-26 株式会社荏原製作所 基板処理装置及び音響センサ用防水装置
JP2022080370A (ja) * 2020-11-18 2022-05-30 株式会社荏原製作所 基板保持装置
WO2022187055A1 (en) * 2021-03-05 2022-09-09 Applied Materials, Inc. Machine learning for classifying retaining rings
JP7638815B2 (ja) * 2021-07-21 2025-03-04 株式会社荏原製作所 ブレークイン処理装置、およびブレークイン処理方法
TWI789926B (zh) * 2021-09-28 2023-01-11 中國砂輪企業股份有限公司 研磨系統、研磨狀態感測系統及其資料庫與方法
KR20240154574A (ko) * 2022-02-25 2024-10-25 가부시키가이샤 에바라 세이사꾸쇼 기판 연마 장치
JP7496932B2 (ja) * 2022-03-23 2024-06-07 株式会社日立ハイテク 診断装置、半導体製造装置システム、半導体装置製造システムおよび診断方法
JP7763140B2 (ja) * 2022-03-30 2025-10-31 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP2023162749A (ja) * 2022-04-27 2023-11-09 株式会社荏原製作所 弾性膜の初期化装置、研磨装置、弾性膜の初期化方法、および弾性膜の寿命判定方法
CN118636053A (zh) * 2024-08-15 2024-09-13 杭州积海半导体有限公司 气膜、cmp研磨系统及实时检测气膜性能的方法

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KR20010024969A (ko) * 1999-02-02 2001-03-26 마에다 시게루 기판파지장치 및 연마장치
JP4101403B2 (ja) * 1999-06-22 2008-06-18 株式会社荏原製作所 ウェーハ研磨装置及びウェーハ製造方法
TW436382B (en) 1999-03-12 2001-05-28 Mitsubishi Materials Corp Wafer holding head, wafer polishing apparatus, and method for making wafers
US6494765B2 (en) 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
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JP6557049B2 (ja) * 2015-04-23 2019-08-07 株式会社ディスコ 加工装置

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